JPH11129698A - Method for laminating - Google Patents

Abstract

PROBLEM TO BE SOLVED: To rapidly laminate a transfer layer on a base plate without irregular film thickness without bulging-out to the plate with high positional accuracy. SOLUTION: A lengthy laminated film 1 having a transfer layer and a cover film sequentially formed on a base film is unwound from a film winding portion 2, and introduced into a treating unit 3 between base plates in the state with the cover film. In the unit 3, heating bars are disposed to match an interval of the plates so that the interval coincides with an interval of the continuously introduced plates and a width of a non-laminated portion of a plate end. The heating bar is pressed against the cover film, and a resist layer is melted and separated at the bar as a boundary. The cover film is continuously wound by a cover winder 4. The film is continuously sent to a laminating roll. The plate to be transferred with the resist is sent to a base plate preheating unit, heated to a desired temperature by a preheater 7, uniformly heated, sent to a laminating unit, laminated by a pair of laminating rolls 10, 11, and the base film is rapidly released from the plate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for continuously laminating a transfer layer on a substrate from a long laminated film in which a transfer layer and a cover film are sequentially formed on a base film.

[0002]

2. Description of the Related Art Conventionally, various methods have been proposed for laminating a transfer layer formed on a base film onto a substrate. For example, JP-A-3-205134 discloses that
First, the leading end side of the laminated film to be laminated is cut perpendicularly to the supply direction of the laminated film, and the leading end of the laminated film is pressed against the leading end in the substrate carrying direction. Is laminated on the substrate while supplying. After positioning and cutting the rear end of the laminated film according to the length of the substrate,
A method of laminating while supporting the rear end of the laminated film is disclosed. When the laminated film is laminated by this method, there is a problem that a transfer layer, an intermediate layer, and the like from the cut portion of the laminated film flow on the substrate by heat flow and adhere as dirt on the substrate. Further, since the laminated film is cut in accordance with the front end and the rear end of the substrate, and the laminated film is laminated, the tension of the laminated film fluctuates. Furthermore, it is difficult to increase the speed due to temporary stop during the laminating operation to laminate after laminating the top end of the laminated film, and it is necessary to peel off the base film after lamination in the next process, which is a problem in productivity. There is.

[0003] As another method, Japanese Patent Laid-Open Publication No.
There is a method disclosed in Japanese Patent Application Publication No. 40-240. First cover fill
After the film is peeled off, a cut is made in the interface between the transfer layer to be bonded and the transfer layer not to be bonded at the front end and the rear end of the substrate with a cutter, and the cut is aligned with the substrate and laminated. At this time, the laminating roller does not perform the pressing operation at the interval between the substrate and the substrate, which are unnecessary portions of the laminate, that is, the leading and trailing ends of the substrate. After such a laminating operation is continuously repeated to laminate the transfer layer on the substrate, the base film is continuously peeled off from the substrate. At this time, the peeling of the base film is performed while leaving only a necessary portion of the transfer layer from the cut front end and the rear end. Further, a method is disclosed in which the photosensitive layer at the portion between the substrates can be removed in advance.

[0004] In this method, the laminate has a thickness of about 0.5-0.
In the case of low-speed operation of 8 m / min, it is possible to prevent the transfer layer from adhering to the roll and to contaminate it between the substrates, but high-speed lamination that frequently controls ON and OFF of the pressure roll. In operation (1-3 m / min), the tension of the laminated film frequently fluctuates, and the positional deviation of the laminated film deteriorates the positional accuracy of the laminate, thereby deviating from the set positions of the front and rear ends of the substrate. You. As a result, when the substrate film is peeled off, a cut is made on the edge of the substrate, so that the transfer layer on the peeled surface becomes difficult to peel off, or the transfer layer on the substrate surface that requires pressure bonding is peeled off.
In addition, since the laminated film tension during lamination varies during ON / OFF control of the pressure roll, a problem of easily causing wrinkles and uneven film thickness on the transfer layer surface of the pressed substrate tends to occur.

[0005]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems and to provide a transfer layer at a necessary portion in a substrate surface excluding a front end portion and a rear end portion of a substrate, without wrinkles and accurately. It is another object of the present invention to provide a laminating method capable of laminating at a high speed, improving the production efficiency, and obtaining a substrate free from protrusions such as a transfer layer which is a cause of generation of foreign matter on the substrate.

[0006]

According to the present invention, there is provided a laminating method, wherein a transfer layer and a cover film are formed on a base film on a substrate which is continuously supplied and arranged at a predetermined interval. A method for continuously laminating a transfer layer from a long laminated film formed in order, a step of continuously sending out the long laminated film, a distance between a continuously supplied substrate and a substrate, and a substrate end. A step of pressing a position corresponding to the width of the unlaminated portion of the cover film from above the cover film with a heating bar to separate the transfer layer, a step of continuously peeling the cover film, and leaving a predetermined interval continuously supplied. Laminating the transfer layer on the substrate placed in a manner such that the position of the unlaminated portion of the substrate end and the position of the transfer layer separated by the heating bar are aligned, and the base film is continuously peeled off. Process And wherein the Rukoto.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a laminating apparatus for performing a laminating method of a dry film resist as a transfer layer. This laminating apparatus comprises a substrate transport section, a substrate preheating section, a laminating section, a film-substrate processing section, a film unwinding section, a base film continuous peeling section, and a cover film continuous peeling section.

A series of laminating steps will be described with reference to the drawings. The film to be laminated is a long laminated film 1 in which a transfer layer and a cover film are sequentially formed on a base film. The film is unwound from a film unwinding unit 2 and is processed between substrates in a state with a cover film. Guided to part 3. The details of the inter-substrate processing unit are shown in FIG. The inter-substrate processing unit is functionally composed of two parts. One is
A part that smoothes the end face of the resist. The other is that the resist in the region corresponding to the substrate end and the region corresponding to the distance between the substrate and the substrate is such that the resist to be laminated on the substrate is laminated inside the predetermined substrate end. And a portion for exposing the resist so as not to adhere to a region where transfer of the resist is not required, such as a laminating roller. In the part for smoothing the end face of the resist, the heating bar 21 is arranged in accordance with the interval between the substrates, and this interval corresponds to the interval between the continuously input substrates and the width of the unlaminated portion of the substrate end. .

In the resist end surface smoothing process, as shown in FIG. 3, a heating bar (heated metallic thin plate having a sharp tip) 21 is pressed from above the cover film of the film 1 with the cover film. At this time, the shape of the tip of the heating bar 21 cuts a cover film or a base film,
It shall be rounded so as not to be damaged. The temperature of the heating bar varies depending on the materials of the base film, the transfer layer and the cover film.
C is desirable. With a pressure of about 1 to 10 seconds, the resist layer is melted and separated from the heating bar, and the separated resist interface (end face) becomes smooth. At this time, the cover film and the base film excluding the resist layer are not damaged so as to cause a trouble in continuous winding. At the same time as the resist end surface smoothing process, exposure is performed on the resist surface in a region surrounded by the heating bar. Exposure is performed on the resist layer through a cover film as shown in FIG. 4, and ultraviolet rays (depending on the resist;
(50-450 nm). After irradiation, the resist undergoes a curing reaction due to photopolymerization, and the adhesion of the resist is significantly impaired. As a result, the exposed resist film surface is wound up without being attached to the substrate and the laminating roll while being attached to the base film after lamination. When the base film is wound up and peeled, the resist is separated on the base film side and the substrate side, respectively, and the separated interface (resist end face).
Is smooth because a surface previously melt-separated by a heating bar appears.

The film that has passed through the inter-substrate processing step is continuously wound by a cover winding machine 4. 5 is a stopper and 6 is a tension roll. The film is continuously sent to a laminating roll unit. On the other hand, the substrate on which the resist is to be transferred is sent to a substrate preheating unit, and is heated by a preheater (such as a far-infrared heater) 7 to a desired temperature (depending on the type of resist, generally 40 to 40).
100 ° C). By heating, the substrate is uniformly heated to the upper and lower surfaces and sent to the laminating section. The position of the substrate is always controlled by the tip position control sensor 8 or the like, and as shown in FIG.
Is laminated so that the substrate exactly matches the part.
At the time of lamination, tension control is given by the tension roll 9 so that a constant film tension is always applied regardless of the presence or absence of the substrate. Thereby, the embedding property into the unevenness of the film becomes uniform in the plane.

The laminate is made up of a pair of laminate rolls 1.
This is performed according to 0 and 11. Reference numeral 12 denotes a transport roll. After lamination, the base film is peeled immediately from the substrate.
At this time, the base film is peeled off from the substrate while the temperature of the substrate is almost close to the roll temperature. As the temperature is closer to the roll temperature, the releasability is improved.
A resist film having a structure described in JP-A-222 is desirable for continuous peeling. The base film can be peeled off by a method of directly winding it off from the laminating roll 10 as shown in FIG. 1 or a method of peeling it off via a peeling guide after lamination. However, it is desirable that the peeling angle at the time of peeling be at least 30 ° or more with respect to the substrate surface. The roll for winding the peeled-off base film is driven by a point-and-shoot control roll so that the tension is always constant, and the winding is wound in the winding direction.

The wound base film is wound with the resist of the inter-substrate processing portion remaining without being transferred to the substrate side. In addition, a resist is internally applied to the substrate side so that the resist comes to the inside of the substrate at an interface melted and separated by the heating bar in the processing between the substrates. The resist exposed in the substrate processing remains on the substrate film side without being transferred onto the substrate, so that the end of the resist comes inside the film. Since the interface is melted and separated by the heating bar, it is smooth and does not scatter such as resist cuttings. In addition,
Since it is not necessary to cut the resist and cover film on the film, a continuous lamination can be performed even when the transfer layer of the resist or the like and / or the cover film is too thin to make the cut. The base film is a polyethylene terephthalate film or the like and the thickness is 30 to 1
00 μm, the transfer layer is a photosensitive material or the like, and the thickness is 0.1 to
A cover film stretched polyethylene having a thickness of 50 to 50 μm can be used. In the case of a long laminated film in which a transfer layer and a cover film are sequentially formed on a base film, the base film / transfer layer / cover film only needs to be formed in this order, and other layers are interposed therebetween. ,
For example, a cushion layer or the like may be appropriately formed between the base film and the transfer layer.

The above lamination method can be applied to the field of laminating a transfer layer such as a dry film such as a printed board and a color filter.

[0014]

According to the laminating method of the present invention, it is possible to laminate a transfer layer such as a resist on a substrate with high positional accuracy, without unevenness in the thickness of the transfer layer, and continuously at a high speed.

[Brief description of the drawings]

FIG. 1 is a schematic diagram illustrating a laminating apparatus according to the present invention.

FIG. 2 is a side view showing details of an inter-substrate processing unit used in the laminating apparatus of the present invention.

FIG. 3 is a sectional view showing a state of a resist end surface smoothing process.

FIG. 4 is a sectional view showing a state of selective curing of a resist.

FIG. 5 is a cross-sectional view showing a state of a film laminated on a substrate.

[Explanation of symbols]

 1. Long laminated film 2. 2. Film unwinding section 4. Inter-substrate processing unit Stopper 6. Tension roll 7. Preheating heater 8. 8. Tip position control sensor Tension roll 10. Laminate roll 11. Laminate roll 12. Transport roll 13. Winding roll 21. Heating bar 22. Cover winder

Claims (1)

[Claims] 1. A transfer layer is continuously formed from a long laminated film in which a transfer layer and a cover film are sequentially formed on a base film for a substrate which is continuously supplied and arranged at a predetermined interval. A step of continuously feeding out a long laminated film, and covering a position corresponding to an interval between continuously supplied substrates and a width of a non-laminated portion of an end portion of the substrate. A step of separating the transfer layer by pressing with a heating bar from above the film, a step of continuously peeling the cover film, and a step of applying the transfer layer to a substrate which is continuously supplied and arranged at a predetermined interval. A laminating step in which the position of the unlaminated portion is aligned with the position of the transfer layer separated by a heating bar, and a step of continuously peeling off the base film.