JP3341364B2 - Method and apparatus for adhering a patch to a planar body - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for bonding a patch to a planar body such as a printed wiring board using a three-layer film sandwiching both sides of the patch with films.

[0002]

2. Description of the Related Art There are various methods for forming an adhesive layer such as an adhesive on the surface of a planar body such as a printed wiring board. There are various methods, one of which is a method using a three-layer film. Have been. The three-layer film is a laminated film having a base film, an adhesive formed on the base film, and a protective film formed on the upper surface of the adhesive. In the above method using a three-layer film, the adhesive from which the protective film has been removed is pressure-bonded to a sheet, and then the base film is removed.

For example, as shown in FIG. 16, an adhesive film 91 from which a protective film 903 has been removed from a three-layer film 90 is thermocompression-bonded to a printed wiring board 71 by a heat roller 92 and adhered. Then, after cooling by the cooling fan 93 to completely adhere the adhesive 902, the adhesive film 91 is cut using the rotary cutter 94.

Then, as shown in FIG. 17, only the base film 901 is manually removed. Note that FIG.
In the figure, reference numeral 95 denotes a supply roller for supplying a three-layer film, reference numeral 96 denotes a removal roller for removing the protective film, reference numeral 97 denotes a transport roller, and reference numeral 98 denotes a film guide.

[0005]

However, the conventional bonding method using a three-layer film has the following problems. The first problem is that after the adhesive film is adhered, the adhesive film 91 is cut and the base film is peeled off by hand. This is a problem that a problem occurs.

That is, when the base film is peeled from the adhesive, the surface of the adhesive layer may be wrinkled or wrinkled due to the peeling force of the base film. Therefore, the exfoliation work of the base film requires careful attention and requires many man-hours.

The second problem is that when the adhesive film 91 is cut by the rotary cutter 94, chips are generated and scattered, and these are attached to the printed wiring board 71 and cause a defect of the printed wiring board. It is becoming. In high-density microfabricated printed wiring boards, the attachment of minute chips can cause defects.

Further, since the adhesive adheres to the rotary cutter 94 to make the cutting dull, there is a problem that the maintenance frequency of the rotary cutter is high. The present invention has been made in view of the above-mentioned conventional problems, and has no problem of generating chips of an adhesive film and can form an adhesive layer having a uniform surface, and is an efficient and efficient adhesive for a sheet-like body. It is intended to provide a bonding method and apparatus.

[0009]

According to a first aspect of the present invention, there is provided a three-layer film comprising a protective film, a base film, and an adhesive disposed therebetween, and the adhesive is applied to the surface of a planar body. Wherein the three-layer film is continuously supplied to a plurality of sheet bodies sequentially sent,
The masking tape is intermittently adhered on the exposed adhesive by continuously peeling off the protective film before adhering the adhesive on the sheet, and then adhering to the surface of the sheet. The adhesive is pressed together with the base film, and the masking tape is positioned on the upper peripheral surface of an adjacent portion of the plurality of planar bodies, and then the masking tape is removed from the adhesive adhered to the planar bodies. The base film is continuously peeled while it is adhered, and the peeling of the base film is performed when the boundary line of the peeling at which the base film starts peeling from the planar body is perpendicular to the direction of travel of the planar body. A method of adhering a patch to a planar body, wherein the adhesive is peeled off so as to have an inclined angle.

[0010] In the first invention, the first point of most noteworthy is that after the protective film is peeled off from the three-layer film, a masking tape is intermittently adhered on the adhesive.
After the adhesive is adhered to the sheet, the masking tape is integrally peeled off together with the base film.

In the above description, the masking tape is located at the upper peripheral edge of an adjacent portion of the continuous planar body. Therefore, as shown in FIG. 13, the length D in the traveling direction of the masking tape is twice the length C of the covering portion of the masking tape at the peripheral edge portion in the gap G between the sheet bodies sequentially sent. Make it the size you added. Note that the length C is equivalent to the length of the portion where the adhesive is not stuck on the planar body as described later.

Furthermore, for positioning between the peripheral edge on the planar body adjacent the masking tape, distance L ₀ of a masking tape and the next masking tape is planar body to the length L in the traveling direction of the planar member To the value obtained by adding the gap G between (L
₀ = L + G). Then, the masking tape is adhered to an appropriate position on the adhesive patch film in synchronization with the progress of the planar body so that the masking tape is located between the adjacent planar bodies.

[0013] In the first invention, the second point of most note is that the peeling of the base film after the adhesive is adhered is such that the boundary line of the peeling at which the base film starts peeling from the sheet is defined by the above-mentioned surface. It is to perform the inclined peeling so as to have an inclined angle with respect to a direction perpendicular to the traveling direction of the shape.

That is, the position on the planar body at which the base film starts peeling is not simultaneous in the lateral direction of the planar body (in the direction perpendicular to the traveling direction). In other words, the peeling starts at one end in the lateral direction of the sheet body, and starts peeling at the other end with a delay.

When the adhesive is pressure-bonded to the surface of the sheet, it is preferable to appropriately apply heat before or during the pressure-bonding according to the adhesive. This is because by applying heat in accordance with the properties of the adhesive, the adhesive can be more reliably adhered to the sheet. For example, when a thermoplastic adhesive is used, heating is performed so that the adhesive is suitable for application. Examples of the heating method include a method of heating a press that presses the adhesive film, and a method of heating the sheet before the adhesive is pressed.

The inclination angle of the peeling of the base film is
It is preferable that the angle is between 10 and 80 degrees with respect to the direction perpendicular to the traveling direction of the planar body. If the inclination angle is less than 10 degrees, the effect of suppressing wrinkles at the time of peeling the base film becomes weak, while if it exceeds 80 degrees, the boundary line of the peeling becomes too long and the manufacturing space for the peeling becomes large. Too bad.

According to a second aspect of the present invention, the adhesive is applied to the surface of a planar body such as a printed wiring board using a three-layer film composed of a protective film, a base film, and an adhesive disposed between the two. A bonding apparatus for bonding, the bonding apparatus including a laminator for bonding the adhesive together with a base film to a sheet, and an oblique separation of the base film from the adhesive bonded to the sheet. A laminator comprising: a supply roller for supplying a three-layer film;
It has a removal roller that removes the protective film from the three-layer film, and a pressure roller that presses the adhesive together with the base film onto the surface of the sheet, and intermittently masks the adhesive before the above-mentioned pressing. An adhesive comprising a tape attaching machine for supplying and adhering a tape, and the inclined peeling machine having a winding roller arranged to be inclined with respect to a direction perpendicular to a traveling direction of the sheet. In the bonding equipment.

In the present invention, the most remarkable thing is that
The bonding apparatus has a laminator for bonding the adhesive to the sheet together with the base film, and an inclined peeling machine for peeling the base film from the adhesive bonded to the sheet, each of the following devices. It is configured as follows.

The laminator includes a supply roller for supplying the three-layer film, a removal roller for removing the protective film from the three-layer film supplied from the supply roller, and a laminator for removing the adhesive film from which the protective film has been removed. It has a pressure roller that presses against the surface of the body and a tape applicator that intermittently applies the masking tape to the adhesive before pressing the adhesive film.

On the other hand, the inclined peeling machine has a take-up roller, and the take-up roller is arranged to be inclined with respect to a direction perpendicular to the traveling direction of the sheet. That is, as shown in FIG. 15, for example, as shown in FIG. 15, the winding roller of the base film is a line perpendicular to the traveling direction F of the planar body, that is, a so-called simultaneous traveling line on the planar body (for example, A ₁ A ₂ , A ₀ A _2). ') Is not parallel,
It has an axis B ₁ B ₂ ′ having an inclination angle θ (FIG. 15
, A ₁ A ₂ // A ₀ A ₂ ′ // B ₁ B ₂ ). The direction of the inclination angle θ of the axis B ₁ B ₂ ′ does not necessarily have to be a slope (lateral slope) in a plane parallel to the plane body, and is inclined (vertical slope) in a plane intersecting the plane body. You may.

It is preferable that an adhesive roller for cleaning the adhesive surface of the sheet is disposed in front of the laminator. Before supplying the sheet to the laminator,
This is because if the sheet is brought into contact with the pressure-sensitive adhesive roller to remove foreign substances and the adhesive surface of the sheet is cleaned, the adhesive can be bonded more reliably.

Preferably, a preheating section for preheating the sheet is provided between the adhesive roller and the laminator. Accordingly, the temperature of the sheet can be adjusted to a temperature suitable for bonding the adhesive, so that the adhesive can be more reliably adhered to the sheet.

Further, it is preferable to provide a heat treatment transport section for heating or cooling the adhesive between the laminator and the inclined peeling machine. This is because a heat treatment for stabilizing the adhesion can be performed after the adhesive is adhered to the sheet, so that a more favorable adhesive can be applied.

Further, it is preferable that the winding roller of the inclined peeling machine is arranged such that the inclined angle β of the inclined peeling is 10 to 80 degrees. When the inclination angle of the inclined peeling is smaller than 10 degrees, the effect of suppressing the wrinkles of the adhesive by the inclined peeling becomes weak,
On the other hand, if it exceeds 80 degrees, the boundary line of peeling becomes too long, and the manufacturing space for peeling becomes too large, which is not preferable.

The above-mentioned bonding method and bonding apparatus can be used, for example, in the case of the following combination of a sheet and a patch. That is, the adhesive layer is applied to the printed wiring board as a planar body (additive method), the resist agent for the etching mask, the plating mask, etc. is applied to the printed wiring board, and the photo solder is applied to the printed wiring board. It is used for attaching a resist (permanent mask). Also, when manufacturing laminated veneer, which is another technical field,
There is also the attachment of a film adhesive to the surface of each decorative plate.

[0026]

In the first aspect of the present invention, a masking tape is adhered on the adhesive before the adhesive is adhered to the sheet. Then, when the adhesive is stuck to the sheet, the masking tape is located on the upper peripheral surface of an adjacent portion of the sheet. Since the adhesive is not adhered to the portion where the masking tape is adhered, the adhesive is not adhered to the upper edges of the front and rear ends of the sheet.

Since the masking tape is adhered to the base film via the adhesive in a planar manner, when the base film is peeled off from the planar body, the masking tape is peeled off integrally with the base film.

The reason is that the bonding between the adhesive and the masking tape applied to the sheet is a linear connection. on the other hand,
The connection between the masking tape and the base film is planar. Therefore, the bonding force F ₁ between the sheet and the masking tape is obtained.
Is much smaller than the planar bonding force F ₀ between the masking tape and the base film (F ₁
{F ₀ ).

As a result, if the base film is peeled,
Adhered patch remains on each planar body, and is separated from an adjacent planar body (arrow A in FIG. 13).
reference). Therefore, there is no need to cut the base film with a cutter or the like as in the conventional method.

Since the base film can be continuously peeled off from the sheet without cutting, it can be peeled off mechanically very easily by winding it with a roller or the like. As a result, speedup and cost reduction can be achieved as compared with the conventional manual base film peeling process. In addition, the productivity can be greatly improved by automating the process by adhering to the adhesive bonding step.

Further, since it is not necessary to cut the base film with a cutter, there is no generation of chips due to the cutting, and there is no problem that the scattered chips adhere to the planar body and cause problems. And the cutter can be operated continuously for a long period of time without maintenance.

The peeling of the base film is performed by so-called slant peeling. The function and effect of the above-described inclined peeling will be described. FIG. 14A shows a conventional peeling method in which a boundary line A ₁ A ₂ of peeling is parallel to a line F ₁ F _{2 at} the front end in the traveling direction of the planar body. Is shown.

On the other hand, FIG. 14B shows an inclined peeling method according to the present invention. The planar body is conveyed at a constant delivery speed, and in the conventional parallel peeling method, the films start peeling all at once from a line F ₁ F _{2 at} the front end of the planar body. Therefore, it is considered that the peeling force is temporarily concentrated on the line F ₁ F ₂ at the front end of the planar body, and wrinkles and wrinkles are generated on the line F ₁ F _{2 on} the surface of the adhesive layer.

On the other hand, in the inclined peeling method, the boundary line A ₁ A ₂ ′ of the peeling intersects the front end line F ₁ F _{2 of the} planar body. Therefore, at some point, the front end line F ₁ F _{2 of the} planar body
At which the peeling starts at the peeling boundary line A ₁ A
It is limited to one point of intersection C with ₂ '.

Therefore, the peeling of the base film is started smoothly, and the surface of the adhesive layer does not wrinkle or wrinkle. Therefore, the surface of the adhesive layer becomes smooth and uniform. As described above, according to the first aspect of the present invention, there is no generation of chips in the adhesive film, and an efficient and efficient method of forming an adhesive layer on a planar body can form an adhesive layer having a uniform surface. A bonding method can be provided.

Next, the function and effect of the second invention will be described. The laminator in the bonding apparatus of the present invention has a supply roller, a removal roller, a pressure roller, and a tape application machine. The protective film is removed from the three-layer film supplied from the supply roller by the removal roller, and the adhesive film having the adhesive exposed on the base film can be formed.

Before the adhesive film is supplied to the pressure roller, a masking tape is adhered by a tape attaching machine. The masking tape is intermittently bonded to the surface of the sticking agent, the junction distance L ₀ slightly greater spacing than the length L of the planar body (see FIG. 13). Then, the width D of the masking tape is made slightly larger than the gap G of the adjacent planar body.

Thereafter, the adhesive film is sent out to a pressure roller and pressed on the surface of the sheet to be adhered. Since the masking tape is adhered to the surface of the adhesive with a width D at intervals of L ₀ , the adjacent upper edge of the adjacent planar body is covered with the masking tape, and the adhesive tape is covered with the adhesive tape. Is not attached (FIG. 13).

When the base film is wound by the winding roller of the inclined peeling machine, the base film is peeled off from the adhesive together with the masking tape as described above. As described above, according to the bonding apparatus of the present invention, the patch can be formed one after another on the surface of the sheet by continuously supplying the sheet and the three-layer film.

Since the present apparatus does not use a cutter for cutting the film, there is no generation of chips and there is no problem caused by chips as in the conventional apparatus. Further, since the peeling of the base film is taken up by the winding roller arranged in an inclined manner, the boundary line of the peeling of the base film has an inclination angle with respect to the direction perpendicular to the direction of travel of the sheet. That is,
The base film is subjected to inclined peeling.

Therefore, the patch adhered to the sheet is hardly wrinkled and a uniform patch layer is formed. Also,
Since the base film is peeled by winding the base film by the winding roller, the production efficiency is greatly improved as compared with the conventional base film peeling by hand.

As described above, according to the present invention, there is no generation of chips on the adhesive film, and an adhesive layer having a uniform surface can be formed. An agent bonding apparatus can be provided. A more favorable effect can be obtained by providing an adhesive roller or a preheating section in front of the laminator, providing a heat treatment transport section between the laminator and the inclined peeling machine, and setting the inclined angle of the inclined peeling to 10 to 80 degrees. This is as described above.

[0043]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A bonding method and an apparatus according to an embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 13, the bonding apparatus of the present embodiment uses a three-layer film 11 composed of a protective film 14, a base film 13, and an adhesive 12 disposed between the two, and a printed wiring board or the like. This is an adhesion device 1 for adhering the adhesive 12 to the surface 75 of the planar body 7 of FIG.

As shown in FIGS. 1 and 13, the bonding apparatus 1 includes a laminator 21 for bonding the adhesive 12 together with the base film 13 to the sheet 7, and a bonding apparatus bonded to the sheet 7. And an oblique peeling machine 27 for obliquely peeling the base film 13 from the agent 12. The above laminator 21
Is a supply roller 22 for supplying the three-layer film 11, a removing roller 23 for removing the protective film 14 from the three-layer film 11, and a pressure roller for pressing the adhesive 12 together with the base film 13 on the surface of the sheet body 7. 24.

The laminator 21 is provided with the adhesive 12
Before the pressure bonding, a masking tape machine 25 for intermittently supplying and bonding the masking tape 16 to the adhesive 12 is provided. On the other hand, the inclined peeling machine 27 has a take-up roller 28 that is arranged to be inclined with respect to the direction R (FIGS. 14 and 15) perpendicular to the traveling direction F of the planar body.

Also, as shown in FIG.
An adhesive roller 31 for cleaning the adhesive surface 75 of the sheet-like body 7 is disposed in front (inlet side) of the sheet. And
Between the adhesive roller 31 and the laminator 21, a preheating section 32 for preheating the sheet body 7 is provided.

Further, between the laminator 21 and the inclined peeling machine 27, there is provided a heat treatment transport section 33 for cooling the adhesive. The take-up roller 28 of the inclined peeling 27 is shown in FIG.
As shown in (2), it is arranged such that the inclination angle θ of the inclined separation becomes 30 degrees.

Hereinafter, each of them will be described in detail. In this example,
This is an example of an adhesive device that forms a thermoplastic adhesive layer as an adhesive on both sides of a printed wiring board as a planar body.
As shown in FIGS. 1 and 2, the bonding apparatus 1 of this embodiment includes an adhesive roller 31 for removing foreign substances on the surface of a printed wiring board, a preheating unit 32 for preheating the printed wiring board, and a printed wiring board for the laminator 21. A feeder 34 to be charged, a laminator 21 for pressing the adhesive onto the printed wiring board, and a heat treatment transport unit 33 for cooling the printed wiring board to which the adhesive has been pressed.
And an inclined peeler 27 for peeling the base film.

As shown in FIGS. 4 and 5, the adhesive roller 31 has an upper adhesive roller 311 and a lower adhesive roller 312 which are rotated in opposite directions by an actuator. The upper and lower adhesive rollers 311 and 312 are pressed in the vertical direction by an elastic member (not shown), and when a sheet is inserted between both the rollers 311 and 312, the sheet is sandwiched and sent forward by rotation. can do.

A rotatable input roller 313 is provided at the input section of the sticking roller 31. Adhesive roller 3
The surfaces of the rollers 11 and 312 are coated with highly adhesive resin or adhesive paper.
The foreign matter on the surface of the planar body sandwiched and delivered by the adhesive 12 can be removed by adhesion.

Next to the adhesive rollers 311 and 312, a preheating section 32 is provided. The preheating section 32 has a heating roll 321 provided at the rear and a normal room temperature roll 322 provided at the front. In addition, the preheating unit 32
It has a first clamp arm 323 for holding the planar body from above and below and carrying it out to the front feeder 34. The feeder 34 has a second clamp arm 341 and a rotatable feed roll 342 for holding the planar body from above and below and carrying it out to the front laminator 21.

As shown in FIGS. 6 and 8, the laminator 21 has a supply roller 22, a removal roller 23, a tape sticking machine 25, and a pressure roller 24, which are respectively arranged in a vertical pair. I have. The following will be described focusing on the upper device. A three-layer film is mounted on the supply roller 22, and the leading end of the three-layer film protective film is wound around a removing roller 23, so that the protective film can be wound in accordance with the delivery of the three-layer film. .

Below the supply roller 22, the removal roller 2 is provided.
A guide roll 211 and a guide plate 212 for guiding the adhesive film 15 from which the protective film has been removed in 3 are provided, and a tape sticking machine 25 is disposed opposite the guide plate 212. I have.

The tape attaching machine 25 includes a tape reel 25.
1 and a driver 25 for driving the tape reel 251
2 and a tape cutter (not shown) for cutting the tape to the size of the masking tape 16. The masking tape 16 cut by the tape cutter has the same width W (FIG. 14) as the three-layer film and a length D (FIG. 13) slightly larger than the gap G between the planar bodies.

The driver 252 includes the adhesive film 15.
The actuator is an actuator that presses and rotates the tape reel 251 against the adhesive film 15 and adheres the masking tape 16 in synchronization with the transmission of the tape, and is driven by the traverse motor 253 (FIGS. 2 and 7). You.

In FIGS. 2 and 7, reference numeral 254 is used.
Is a ball screw shaft for traversing the tape attaching machine 25. In the center of the laminator 21, a pressure roller 2 for holding and transporting the sheet and the adhesive film is provided.
4 are provided.

The pressure roller 24 is a heat pressure roller heated by a heater, and heat-presses the adhesive film film from above and below to a sheet-like body and sends it forward.
As shown in FIG. 6, rotatable transport rolls 215 and 216 are provided on the entrance side and the exit side of the pressure roller 24.

The vertical spacing of the pressure roller 24 can be changed by adjusting the adjuster 242. Then, in front of the laminator 21, as shown in FIGS.
1 is provided.

The heat transfer section 33 includes upper and lower water cooling rollers 331 pressed against each other by a spring pressing mechanism (not shown).
By rotating in opposite directions, the sandwiched sheet is sent out to the forward inclined peeling machine 27. Water cooling roller 3
Numeral 31 indicates that the cooling water is circulated inside to enhance the cooling effect.

As shown in FIGS. 11 and 12, the inclined peeling machine 27 is provided with a delivery roll 271 for placing and transporting a planar body,
It has a gripping roll 272 for nipping and transporting the planar body, a pair of upper and lower peeling rolls 273 for nipping the planar body and peeling the base film, and a winding roller 28 driven by a motor to wind the base film. are doing. As shown in FIG. 12, the peeling roll 273 has an inclination angle θ of 30 degrees with respect to the direction perpendicular to the direction of travel of the planar body.

The take-up roller 28 is provided with the above-mentioned peeling roll 2 so that the base film to be wound is not loosened.
In addition, an inclination angle α is further provided in the horizontal direction with respect to 73. As a result, the base film is peeled off from the right side first in the traveling direction of the planar body, and the base film on the left side is peeled off from the planar body with a delay. And take-up roller 2
At 8, the base film is wound again in the left-right parallel state. In this manner, the above-mentioned inclination angle α is determined so that the base film is wound in parallel by the winding roller 28 without slack.

Next, a description will be given of the adhesive bonding step by the present apparatus. The printed wiring board as a planar body is first inserted into the adhesive roller 31. Then, while being sandwiched between the upper and lower adhesive rollers 311 and 312 and sent out, foreign substances on the surface adhere to the adhesive rollers 311 and 312 and are removed.

Then, the printed wiring board is preheated by the heating roll 321 in the preheating section 32, and is sent out to the feeder 34 in a state where the adhesive is easily adhered. The preheated printed wiring board is gripped and conveyed by the second clamp arm 341 of the feeder 34 and reaches the pressure roller 24 of the laminator 21.

On the other hand, the protective film is removed from the three-layer film sent from the supply roller 22 by the removal roller 23.
The adhesive layer is exposed. Then, the masking tape is intermittently attached to the surface of the adhesive by the tape applying machine 25. Distance L ₀ of the masking tape is adhered to the adhered material surface is made equal to the length obtained by adding the gap G of the printed wiring plates into L of the printed circuit board (Fig. 13).

The length D of the masking tape is larger than the gap G between the printed wiring boards. Then, a masking tape is adhered in synchronization with the transport of the printed wiring board, so that the masking tape is positioned so as to straddle between the adjacent printed wiring boards.

After synchronization as described above, the printed wiring board and the adhesive film are inserted into the pressure roller 24. Then, the adhesive is thermocompression-bonded by the pressure roller 24 and the adhesive is adhered to the surface of the printed wiring board. Subsequently, the printed wiring board is sent to the heat treatment transport section 33 and cooled by the water-cooled roller 331, and the adhesive is fixed on the surface of the printed wiring board.

Thereafter, the printed wiring board sent to the inclined peeling machine 27 is wound around the winding roller 28 to peel the base film. Then, the base film is peeled off from the printed wiring board together with the masking tape, and only the adhesive remains on the surface of the printed wiring board. At this time, the peeling roll 273 and the take-up roller 28 are inclined with respect to the direction perpendicular to the traveling direction of the printed wiring board, and the base film is peeled off at an angle.

Next, the effect of this embodiment will be described. In the adhesive bonding apparatus 1 of the present embodiment, the adhesive film to which the masking tape 16 has been previously bonded is pressure-bonded to the sheet, so that the adhesive film need not be cut after the adhesive is bonded. At the same time, the peeling of the base film becomes extremely easy.

That is, by continuously winding and peeling the base film together with the masking tape, only the adhesive layer is left on the sheet. This step is extremely simple and can be performed at a higher speed than the conventional method in which the adhesive film is cut and the base film is manually peeled off. As a preliminary step, the masking tape 16 is previously adhered to the adhesive film by the tape adhering machine 25. However, this preliminary step is not a difficult step to carry out, so that the production process as a whole is greatly speeded up. Up and efficient.

Since the step of cutting the adhesive film is not required, there is no problem caused by the generation of chips as in the conventional apparatus, and the quality of the printed wiring board is improved. Further, since the peeling of the base film is performed by the inclined peeling method, quality defects such as generation of wrinkles of the adhesive due to external force accompanying the peeling hardly occur. As described above, according to this example, there is no generation of chips and the like in the adhesive film, and the adhesive layer can be formed on the sheet in an efficient manner, which can form an adhesive layer having a uniform surface. A bonding method and apparatus can be provided.

[Brief description of the drawings]

FIG. 1 is an overall front view of an adhesive bonding apparatus according to an embodiment.

FIG. 2 is a plan view of FIG. 1;

FIG. 3 is a side view of FIG. 1;

FIG. 4 is a front view of a sticking roller and a preheating unit according to the embodiment.

FIG. 5 is a plan view of FIG. 4;

FIG. 6 is a front view of the laminator according to the embodiment.

FIG. 7 is a plan view of FIG. 6;

FIG. 8 is a side view of FIG. 6;

FIG. 9 is a front view of the heat treatment transport unit of the embodiment.

FIG. 10 is a plan view of FIG. 9;

FIG. 11 is a front view of the inclined peeling machine of the embodiment.

FIG. 12 is a plan view of FIG. 11;

FIG. 13 is a schematic explanatory view of the adhesive bonding apparatus of the example.

FIG. 14 is a comparative explanatory diagram of the peeling of the base film of the embodiment (b) and the peeling of the base film by the conventional apparatus (a).

FIG. 15 is an explanatory diagram of inclined peeling according to the embodiment.

FIG. 16 is an explanatory diagram of a method of peeling a base film in a conventional adhesive bonding method.

FIG. 17 is an explanatory view of a method of peeling a base film in a conventional adhesive bonding method.

[Explanation of symbols]

 1. . . Bonding device, 11. . . 11. three-layer film, . . Adhesive, 13. . . 13. base film, . . 14. protective film, . . Adhesive film, 16. . . Masking tape, 21. . . Laminator, 22. . . Supply roller, 23. . . Removal roller, 24. . . Pressure roller, 25. . . Tape attaching machine, 27. . . 28. inclined peeling machine, . . Take-up roller, 31. . . Adhesive roller, 32. . . Preheating section, 33. . . 6. Heat treatment transport section, . . Sheet,

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-113093 (JP, A) JP-A-63-176265 (JP, A) JP-A-1-98557 (JP, A) JP-A-4- 126247 (JP, A) JP-A-1-156388 (JP, A) JP-A-58-28319 (JP, A) JP-A-3-45674 (JP, A) JP-A-6-73343 (JP, A) (58) Field surveyed (Int. Cl. ⁷ , DB name) C09J 5/00 H05K 3/06

Claims (8)

(57) [Claims] 1. A method of adhering the above-mentioned adhesive to the surface of a sheet using a three-layer film comprising a protective film, a base film, and an adhesive arranged between the two. The three-layer film is continuously supplied to a plurality of sheet bodies which are sequentially sent, and the protective film is continuously peeled off and exposed before the adhesive is adhered to the sheet body. A masking tape is intermittently adhered onto the adhesive, and then an adhesive is pressed together with the base film onto the surface of the sheet, and the masking tape is attached to the upper peripheral edge of an adjacent portion of the sheets. On the surface, then
The base film is continuously peeled from the adhesive adhered to the planar body while the masking tape is adhered, and the base film is peeled when the base film starts to peel from the planar body. A method for bonding an adhesive to a sheet-like body, characterized in that the peeling is performed so that the boundary of the sheet has an angle of inclination with respect to the direction perpendicular to the direction of travel of the sheet. 2. The method according to claim 1, wherein when the adhesive and the base film are pressure-bonded to the surface of the sheet, heat is applied before or during the pressure bonding. Bonding method. 3. The base film according to claim 1, wherein the inclination angle of the peeling of the base film is between 10 and 80 degrees with respect to the direction perpendicular to the direction of travel of the planar body. Method of bonding the adhesive to the adhesive. 4. A three-layer film comprising a protective film, a base film, and a patch disposed between the two,
What is claimed is: 1. A bonding apparatus for bonding an adhesive to the surface of a planar body such as a printed wiring board, the bonding apparatus comprising: a laminator for bonding the adhesive together with a base film to the planar body; An oblique peeling machine for obliquely peeling the base film from the adhesive adhered to the laminator, the laminator comprising: a supply roller for supplying a three-layer film; a removing roller for removing the protective film from the three-layer film; A pressure roller for pressing the adhesive together with the base film onto the surface of the sheet, and a tape attaching machine for intermittently supplying and adhering a masking tape to the adhesive prior to the pressing. ,
In addition, the above-mentioned inclined peeling machine has a winding roller that is arranged to be inclined with respect to the direction perpendicular to the direction of travel of the sheet-like body, and is a bonding device for a patch. 5. The adhesive bonding apparatus according to claim 4, wherein an adhesive roller for cleaning an adhesive surface of the planar body is disposed in front of the laminator. 6. The adhesive bonding apparatus according to claim 5, further comprising a preheating section between the adhesive roller and the laminator for preheating the planar body. 7. The adhesive bonding apparatus according to claim 4, further comprising a heat treatment transport section for heating or cooling the adhesive between the laminator and the inclined peeling machine. 8. The adhesive bonding apparatus according to claim 4, wherein the winding roller is disposed so that the inclination angle of the inclined peeling is 10 to 80 degrees.