1236965 (1) 玖、發明說明 【發明所屬之技術領域】 本發明係有關薄膜貼著方法及其裝置 有黏著性薄膜和基底薄膜層之兩層結構的 膜，藉由位於基板搬運道（路徑）的壓（ 基底薄膜層側加壓，而使黏著性薄膜層側 對基板表面貼著的方法及其裝置。 【先前技術】 先前，在於從薄膜輥（子）拉出薄膜 切斷成連續的薄膜來作成爲欲貼著形狀之 簡稱爲薄膜），而藉由一對壓注輥子（以 來貼著薄膜於基板表面時，乃構成爲如曰 3 - 1 69 06號公報所記載，藉由如真空板等 保持薄膜前端部來貼著於基板，而在迴避 ，則藉由兩（支）壓輥來挾持薄膜和基板 輥來搬運基板於複數支搬運輥所構成的搬 進行貼合薄膜於基板，而在靠近完成貼著 吸引構件（真空桿）等之終端構件再予以 薄膜後端部爲止可貼著於基板上的結構。 依據上述先前技術時，由於在貼著薄 部於基板時貼著薄膜前端部與後端部之中 所用於貼著用之構件有相異，以致加壓力 使得所貼著之薄膜前端部或後端部會產生 ，尤其有關令具 欲貼著形狀之薄 住）輥（子）從 貼著於該基板之 ，且朝寬度方向 一枚薄膜（以下 下簡稱爲壓輥） 本國專利特公平 之前端保持構件 前端保持構件後 ，並由旋轉雨壓 運路面上，同時 時，刖藉由薄膜 保持，以令直至 膜前端部或後端 間部於基板時， 容易產生差異， 階梯差（斷層狀 1236965 (2) )，而招致對於以後之處理基板會產生障礙困難。 例如薄膜爲抗蝕劑薄膜時，當實施曝光時，會在階梯 差處產生光量的變化，以致具有會產生線條之問題等。 又保持薄片後端部的保持構件，並未放入於基板和壓 輥前之空間，且在完成貼著位置之前，予以停止保持薄膜後 端部來成爲釋放之自由狀，以致貼著薄膜後端部之狀況會成 爲失控（不能控制），使得極容易產生皴紋或氣泡。 【發明內容】 爲此，本發明之目的係擬提供一種從薄膜前端部直至 後端部爲止，並不會產生階梯差而可成爲平坦地來貼著的 薄膜貼著方法及其裝置者。 又本發明之另一目的，係擬提供一種能不產生皺紋或 氣泡之狀態下，從薄膜前段部貼著薄膜直至後端部爲止的 薄膜貼著方法及其裝置者。 爲了達成上述目的，本發明之薄膜貼著方法係將具有 黏著性薄膜層和基底薄膜層之二層結構的欲貼著形狀之薄 膜，藉由位於基板搬運道（路徑）的壓住輥子從基底薄膜 層側加壓來貼著黏著性薄膜層側於擬貼著於該基板之基板 表面的薄膜貼著方法，其特徵爲： 賦予電荷於欲貼著形狀之薄膜前端部，而藉由該前端 部和該壓住輥子外周面之間所作用的靜電力來保持該前端 部，且藉由旋轉該壓住輥子來搬運該欲貼著形狀之薄膜至 基板，致使該前端部成一致於基板的貼著開始位置，同時 -6 - 1236965 (4) 始位置，同時進行貼著作成爲欲貼著形狀之薄膜於基板表 面，而該後端部也在有去除靜電的該壓住輥子外周面藉由 靜電力來保持，使得可藉由該壓住輥子之旋轉來貼著從該 前端部直至後端爲止的整個作成爲欲貼著形狀之薄膜於基 板。 依據本發明，用於貼著欲貼著形狀的薄膜於基板者， 僅使用著壓住輥子而已，並未轉換壓住構件，因而能在不 產生階梯差之狀態下來成平坦地貼著於基板上。 再者，由於壓住輥子已去除靜電，因此，即使賦予電 荷於薄膜，也不會使壓住輥子帶電有與賦予薄膜之電荷同 種類的電荷，使得不會產生靜電性之斥力（反斥力）於壓 住輥子和薄膜之間，因此，可藉由壓住輥子來從薄膜前端 部直至後端部爲止予以貼著整個欲貼著形狀的薄膜，且不 會產生皺紋或氣泡。 【實施方式】 圖1係本發明一實施形態之薄膜貼著裝置的槪略剖面 圖。 於圖1中，1係形成爲覆蓋薄膜層（以下簡稱爲覆蓋薄 膜）2a和具有黏著性之抗蝕劑薄膜層（係指黏著性薄膜層 ，以下簡稱爲抗蝕薄膜）2b，及基底薄膜層（以下簡稱爲 基底薄膜）2 c的三層結構之薄膜2 A的薄膜捲筒，薄膜2 A 係從內側覆蓋薄膜2a，抗蝕劑薄膜2b ’基底薄膜2c之順序 來捲繞於薄膜捲筒1。3係藉由分離桿4來回收從薄膜2A剝 1236965 (5) 離的覆蓋薄膜2 a用的捲取滾筒。而在驅動薄膜捲筒1及捲 取滾筒3之驅動裝置（例如馬達），則配設有可響應於薄 膜滾筒1的薄膜剩餘量來調整馬達轉矩之功能，而作成爲 可令薄膜2A張力成一定狀態來搬運。 5爲階梯差輥子，階梯差輥子5配設有可進行調整剝離 覆蓋膜2a後的由抗蝕劑薄膜2b和基底薄膜2c成爲二層結構 之薄膜2B的張力（反拉力）用之位置調整功能。 6係具備有：薄膜2B的前端保持構件7;朝上下移動前 端保持構件7的氣缸8;薄膜2B之後端保持構件9;及在朝 上下移動前端保持構件7時，可令後端保持構件9朝左右移 動的氣缸10之薄膜搬運構件，而薄膜搬運構件6係形成藉 由與伺服馬達11成直接聯結的滾珠螺桿（Ball screw) 12 之旋轉來朝上下移動。 如圖2所示，前端保持構件7內部因具有分隔爲幾個真 空室，上面（在圖1爲左側面）具有吸著孔，且藉由中間 閥來使該真空室連通於真空泵，因此，可藉由前端保持構 件7上面來吸著薄膜2B前端。又配設有監視真空狀態用之 壓力測感器，因在某種原因而使薄膜2B的吸著位置產生偏 位，致使薄膜不在於吸著孔上面之位置時，而會令真空壓 降低，因此，可藉由該壓力測感器來監視吸著薄膜的狀況 〇 後端保持構件9也與前端保持構件7同樣，具有真空室 於內部，在上面（在圖1爲左側面）有吸著孔，且配設了 監視真空狀態用的壓力測感器，作成爲在由某種原因而薄 -9- 1236965 (6) 膜2 B不在位於具有吸著孔上面（在圖1爲左側面），致使 真空壓降低時，可監視薄膜2B之吸著狀態，吸著孔係配置 成對於搬運薄膜方向成正交，吸著孔之大小則從將後述之 壓住輥子（壓輥）1 4側朝階梯差輥子5方向逐漸變爲小’ 且構成爲在於薄膜2B後段滑動搬運於後段保持構件9上面 時，可逐漸地切斷真空，使得可吸著保持直至薄膜後端 。又朝薄膜2B之搬運方向成直交的寬度方向（垂直於圖1 紙面之方向）配設有溝，而使用爲藉由刀具1 3 (參照圖1 )朝寬度方向切斷薄膜2B時的刀具接受器。 刀具1 3係藉由氣缸（省略圖示）來組裝於薄膜搬運構 件6成爲可對於薄膜2B搬運方向朝垂直方向（圖1之左右方 向）移動，且在不實施切斷時，形成爲可朝圖1中左側迴避 。至於切斷薄膜2B之切斷速度則構成爲能調整刀具1 3的移 動速度，以令薄膜搬運構件6從會成爲薄膜保持位置之薄膜 切斷位置移動至薄膜前端交給位置爲止的移動時間中予以完 成切斷。 後端保持構件9上面（在圖1爲左側面）係形成爲對於 圖1之壓住輥子14左側外周面成平面的接觸，且藉由氣缸10 來在圖1可朝左右方向移動，以令在於前端保持構件朝上下 移動時不會成爲干擾。又在前端保持構件7，也藉由氣缸8來 可朝上下方向驅動，且配設有止動構件，使得能調整與將後 述之在於打開狀態的壓住輥子14之接觸位置。 以如此，薄膜搬運構件6係藉由伺服馬達1 1與對於壓住 輥子14外周面的接觸平面成平行狀來正確地搬運從薄膜捲筒 -10- 1236965 (7) 1經由階梯差輥子5所供應之薄膜2B至壓住輥子14附近爲止（ 從圖1上方向至下方向），且在搬運中藉由刀具13朝寬度方 向切斷薄膜2B。 而成一對之各壓住輥子1 4係在於藉由複數個搬運輥子1 5 所構成的搬運道的上下，且配置成可從上下方向來挾持藉由 搬運輕子1 5從圖之左側朝右側搬運的基板P B ’並使之可移 動。 各壓住輥子1 4的上下方向移動（則進行開閉）係藉由 未圖示之氣缸來進行。雖未圖示，配設有檢測搬運中的基板 PB前端用之測感器於靠近壓住輥子14的進口側（在圖1左側 )之搬運輥子15間。而搬運輥子15可實施搬運和停止從檢測 搬運中的基板PB前端壓住輥子14下之任意位置間。 壓住輥子14係由輥子本身及塗敷於其外周面的矽橡膠 所形成。且在輥子本身內部具有加熱器。壓住輥子1 4係如將 後述藉由靜電力吸著（靜電吸著）薄膜2B來搬運至基板PB 並予以加壓貼著，但壓住輥子1 4之矽橡膠表面溫度係藉內部 加熱器來控制成能使抗鈾劑薄膜2b開始軟化之程度的溫度區 域。又壓住輥子1 4之矽橡膠表面溫度，倘若成爲會軟化抗蝕 劑薄膜2b的溫度以上時，該基底薄膜層則予以維持於會產生 伸縮或成波浪狀等變形之溫度以下。 在壓住輥子14左方，設置有電極16，且與靜電產生裝 置17連接著。當從靜電產生裝置17施加高電壓於電極16時 ，將搬運至電極16右側之薄膜2B會賦予電荷而成帶電，以 致薄膜2B前端部可由靜電（庫侖）力而緊密貼著於右側的 -11 - 1236965 (8) 壓住輕子1 4表面。而由於配5受有防塵盍1 8成包13者1右側(壓 住輥子14和電極16之狀態’因此’並不會產生附著塵埃於 藉由電極成帶電的薄膜2B° 在防塵蓋1 8內部之壓住_昆子1 4右側’配設有去除靜電 裝置1 9。當從電極1 6賦予電荷（例負的電荷）於薄膜2 B且 藉由壓住輥子14來依序貼著薄膜至搬運道上之複數片基 板P B時，就會在壓住輥子1 4的砂橡膠表面，會帶電成與從 電極1 6賦予薄膜2 B之電荷同極性的高電壓。則賦予薄膜 2 B之前端或後端的電荷和留住於壓住輥子1 4之矽橡膠表面 的電荷之間會作用斥力’使得無法緊密貼著薄膜2B的前端 或後端於壓住輥子1 4 (之矽橡膠表面）。 爲此，作爲去除靜電裝置1 9而設置有可迅速地降低壓 住輥子1 4的帶電電壓用之自放電型去除靜電電刷。又也可 對於自放電型去除靜電電刷合倂使用電離器，或也可僅設 置了電離器。而該等電離器係可放出與附予薄膜2B的前端 或後端之電荷爲反極性（亦即，與留住於壓住輥子1 4的矽 橡膠表面之電荷爲相反極性）的電荷者，因此，對於低帶 電電壓也能有效地實施去除靜電。當使用電離器時，予以 安裝能在放出電離子時吹電離子用的吹空氣器，就能去除更 廣闊範圍之區域，甚至也可同時去除貼著後的基板表面之帶 電。而去除靜電裝置19，當對於有關壓住輥子14的旋轉方向 ，配設於保持薄膜2B之前端部及後端部用的壓住輥子14外 周面之上游位置時，就可經常保持相同的壓住輥表面狀態， 使得能穩定地進行靜電吸者薄膜2B。 -12- 1236965 (9) 20爲薄膜保持桿，將藉由吸引吸著來保持已被切斷的 薄膜2 B後端部，並予以保持薄膜後端直至藉由壓住輥子1 4 左方之電極來緊密貼著薄膜2 B於壓住輥子1 4外周面爲止。 薄膜保持桿20係配置成接近於壓住輥子1 4外周，而只要形成 爲與壓住輥子14的切線平面（薄膜2B會成爲壓住輥子14之切 線方向的面）成平行之形狀即可，並不需要與從壓住輥子外 周和基板搬運面之接點至基板搬運方向上游側近旁的空間形 成爲大致相似之形狀。又薄膜保持桿20乃爲了與前端保持構 件7產生干擾，構成爲會在交給薄膜2B前端時，朝壓住輥子 14上側迴避。 2 1係維持表面溫度成與壓住輥子1 4的表面溫度相同程度 之溫度的第二壓住輥子，隨著所需要可從基底薄膜2c側加壓 來增進抗蝕劑薄膜2b和基板PB之緊密貼著度者。再者，當 第二壓住輥子2 1表面溫度作成爲壓住輥子1 4表面溫度以上時 ，就予以維持成不會使抗鈾劑薄膜2b由熱而引起熔解流出之 溫度，以令由熔解流出的抗蝕劑薄膜2b而污染表面之第二壓 住輥子2 1會污染後續的基板PB，或由於減少抗蝕劑薄膜2b 之厚度而使後製程之照相平板印刷處理無法良好地來處理。 23係控制貼著薄膜裝置用的控制裝置，內裝有記憶薄 膜貼著長度等之資料（數據）或驅動裝置用之馬達常數等用 的記憶器（RAM )，更進一步內裝記憶有關貼著薄膜之軟體 程式用的記憶器（ROM )，且附屬有用於顯示薄膜2B之貼 著長度等之資料，驅動裝置用的馬達常數等用之監視畫面24 ，輸入控制裝置23的記憶器（RAM )資料用之鍵盤25。 -13- 1236965 (10) 又有關貼著薄膜用的軟體程式係要執行本裝置之動作 過程（製程步驟）用的程式，設定資料於監視畫面24用之 操作畫面程式等者。 再者，雖未予以圖示，基板P B係作成爲在到達壓住輥 子14之前，予以預先加熱成爲與壓住輥子14表面溫度相同程 度的溫度狀態下，藉由搬運輥子1 5來搬運。 而作爲該預熱手段，將利用紅外線加熱器所產生之輻 射加熱或藉由輥子或加熱器的傳熱加熱。 接著，將依照圖3所示之流程（圖）來說明薄膜貼著裝 置的動作。 在開始動作時，將進行步驟（以下，簡稱爲「S」） 1 00所示之薄膜貼著動作準備。而作爲薄膜貼著動作準備 S 100，係以手動從薄膜捲筒1拉出薄膜2A，而交給於分離桿 4，階梯著輥子5來剝離覆蓋薄膜2a。所剝離之覆蓋薄膜2a則 以捲取滾筒3來捲取。 而剝離覆蓋薄膜2a成二層之薄膜2B係如圖1，予以拉出 到與前端保持構件7上面位置成排列的後端保持構件9前端爲 至，而在前端保持構件7及後端保持構件9之上面實施真空吸 著。階梯差輥子5係將移動於圖1所圖示的上側位置，而薄膜 捲筒1及捲取滾筒3則藉由轉動未圖示之馬達來使薄膜2 A的 張力形成爲一定。 接著，予以作成爲刀具13能成爲通過後段保持構件9之 溝部分，且朝薄膜2B寬度方向移動刀具1 3來朝寬度方向切 斷薄膜2B。而後，予以停止吸著了薄膜2B的後端保持構件9 -14- 1236965 (11) 之真空吸著，且拋棄在後端保持構件9上的薄膜2B之斷片。 而該時，在前端保持構件上，薄膜2B係成爲從前端保持構 件7前端突出約1 0mm左右於後端保持構件9的狀態被真空吸 著。形成爲如此時，就完成薄膜貼著動作準備S 1 00。接著， 會進入於薄膜交給處理S200。 在於薄膜交給處理S200，將藉由配設於薄膜搬運構件 的氣缸1 0驅動後端保持構件9，而如圖2所示朝右側迴避後端 保持構件9。又也令薄膜保持桿20朝壓住輥子14上側退避。 而後，以伺服馬達11來旋轉滾珠螺桿1 2，而使薄膜搬運構件 6朝著與對於壓住輥子14外周切線平面成平行地移動（朝圖1 下方移動）。該時，一對壓住輥子1 4係成打開（分開）著， 且形成藉由內部之加熱器所加熱的狀態。 而藉由氣缸8移動前端保持構件7來使薄膜2B前端會成 爲位於上側壓住輥子1 4的接點位置（薄膜2B在成爲壓住輥 子1 4接線方向時之薄膜2B的前端位置。並在此，從靜電產 生裝置1 7施加高電壓於電極1 6，以令在於電極1 6和壓住輥子 14間而從前端保持構件7突出約l〇mm左右之薄膜2B前端部分 成爲帶電。 當薄膜2B前端部分被靜電吸著於成接地的壓住輥子1 4 時，就停止從靜電產生裝置17施加高電壓於電極16之情事， 且停止前端保持構件7的真空吸引，而釋放薄膜2B之吸著保 持。該狀態時，令薄膜2B前端與壓住輥子1 4的切線平面（ 薄膜2B會成爲朝著壓住輥子1 4之切線方向的面）成平行地 搬運時，就能成爲不具有皺紋且藉由均勻之靜電吸著力來交 -15- 1236965 (12) 給於壓住輥子1 4。 而交給薄膜2B後，壓住輥子14會開始朝搬運輥子15所 構成的基板PB搬運道方向旋轉，並令所吸著之薄膜2B朝 下側搬運。且與搬運開始同時，予以減弱驅動薄膜捲筒1 及捲取滾筒3的驅動裝置之轉矩，又朝下側移動階梯差輥 子5。而藉由與薄膜搬運速度成同步來移動階梯差輥子5， 就可減弱薄膜2B的反張力（張力），而可輔助壓住輥子14 所進行之搬運薄膜2B。 一般言，藉由壓住輥子所形成的薄膜2B之靜電吸著力 係成比例於帶電電壓，而帶電電壓則成比例於壓住輥子1 4 和薄膜2B的吸著面積。壓住輥子14係僅吸著薄膜2B前端 部而已，因而成爲弱的帶電電壓，亦即形成爲弱小之靜電 著力，爲此，當在剛交給薄膜至壓住輥子1 4時，會令搬運 薄膜成爲不穩定狀態，因此，需要減弱薄膜2B的反張力， 以令能容易地來藉由旋轉壓住輥子1 4搬運薄膜2 B於基板 PB側。 相反地，當壓住輥子1 4所捲繞薄膜之角度變大，就會 伴隨著增大壓住輥子14和薄膜2B的吸著面積而使靜電吸著 力會變爲強大，使得保持薄膜2B會成爲穩定。階梯差輥子 5係可減弱薄膜2B之反張力的薄膜張力調整手段，可藉由 引動（致動）器（省略圖示）來朝上下移動。 當在貼著薄膜2B至基板PB表面時，階梯差輥子5會位 於上側，而在藉由壓住輥子1 4來搬運薄膜2 B於壓住輥子1 4 下下方時，階梯差輥子5則會朝下方側移動。該時，以與 -16- 1236965 (13) 薄膜2B之搬運速度成同步地移動階梯差輥子5 ’就可減弱 薄膜2B的反張力，而可輔助以壓住輥子14來搬運薄膜2B 之情事。 又在替代階梯差輥子5而使用無法移動之固定導輥時 ，也可令薄膜捲筒1及捲取輥3藉由其驅動裝置（例如馬達 )來朝繞出方向旋轉，而減弱薄膜2 B的反張力，使得可輔 助由壓住輥子14來搬運薄膜2B之情事。 至於藉由旋轉壓住輥子14來使薄膜2B前端是否已到達 上側壓住輥子1 4之下面中央乙事，係藉由來自具備於壓住 輥子1 4的主軸之編碼器（省略圖示）的脈衝數量來加以確 認，並在有確認時，就停止旋轉壓住輥子1 4。 又在藉由上側壓住輥子14來剛要開始搬運薄膜2B之， 前，予以停止以前端保持構件7所實施之吸著薄膜的情事 ，並在以上側壓住輥子14搬運薄膜2B中，藉由氣缸8來使前 端保持構件朝上方方向回歸後，令後端保持構件9朝左側移 動來恢復成初始狀態，使得迴避之後端保持構件9成爲與前 端保持構件7並列而回歸於薄膜2B的搬運位置。而後，藉由 伺服馬達11來移動薄膜搬運構件6至薄膜2B之切斷位置。 而在薄膜交給處理S200中，同時予以進行基板定位處 理 S300 。 雖爲基板定位處理S 3 00，但基板PB係預先加熱成與壓 住輥子1 4表面溫度具有相同程度的溫度，且藉由搬運輥子 1 5從圖1左側朝右側方向來移動。該時，以未圖示之測感 器檢測著移動量，且構成爲基板PB前端部的薄膜貼著開始 -17- 1236965 (14) 位置，當與位於上側壓住輥子14之下面中央的薄膜2B前端 形成一致處，就一且停止移動基板PB。 而後，進行薄膜貼著處理S400。 在薄膜貼著處理S 4 0 0，上下側之壓住輥子1 4會朝.基板 PB方向上下移動，並以兩個壓住輥子14挾持基板PB (鉗 住），且對基板P B進行熱壓著薄膜2 B前端。又令階梯差 輥子5回歸於初始狀態（圖1的上側），而在從階梯差輥子 5直至壓住輥子14爲止之間，實施防止薄膜2B產生鬆弛部分 。該時，也可一旦加強薄膜捲筒1的反張力來實施防止薄膜 2B產生鬆驰部分。 接著，移動薄膜保持桿20直至對於壓住輥子14成爲交給 薄膜後端位置的電極16和壓住輥子14之間爲止，且在完成移 動後，將以薄膜保持桿20成弱小的直空吸著來吸著位於薄膜 保持桿20左側之薄膜2B。而後，兩個壓住輥子1 4，以維持挾 持著（鉗住）基板PB的狀態予以轉動，而朝右方向搬運基 板PB，而在薄膜保持桿20則讓薄膜2B滑動之同時，令壓住 輥子14上的薄膜2B熱壓著於基板PB上。 而薄膜保持桿20乃爲使薄膜2B能滑動’可使用以PTFE (聚四氟乙烯）對於表面進行表面處理者或由工程塑膠（ MC尼龍）來成型者。基板PB因已被預熱’因而抗蝕劑薄膜 2b，當接觸於基板PB時，並不會使熱被帶走而維持稍微軟 化之狀態，且藉由壓住輥子14的加熱加壓來貼著於基板PB 上。 又在薄膜貼著處理S400之薄膜搬運構件6朝壓住輥子1 4 -18- 1236965 (15) 側移動中，會進行薄膜切斷處理S500。 在薄膜切斷處理S500時，薄膜搬運構件6會在成爲薄膜 2B後端位置通過後端保持構件9的切斷溝上之前逐漸朝壓住 輥子14方向開始移動，且成爲同步於壓住輥子14的旋轉速度 。並在薄膜墊壓著（貼著）中，而令預先設定爲會成爲薄膜 貼著之後端的薄膜部位通過後端保持構件9之切斷溝上時， 將以前端保持構件7，後端保持構件9來吸著保持薄膜2B。 而用於判斷成爲薄膜2B後端之位置時否已通過切斷溝上之 情事，則藉由來自具備於薄膜捲筒1或壓住輥子1 4的主軸等 之編碼器的脈衝數量來加以確認。 至於薄膜之切斷係在移動薄膜搬運構件6直至薄膜前端 交給位置爲止的移動時間之中，令刀具1 3朝寬度方向移動來 切斷薄膜2B。而薄膜2B ( 2A )之寬度係構成爲形成一致於 欲貼著於基板PB的寬度，因而當以刀具1 3切斷時，會成一 致於欲貼著於基板PB之寬度，使得會成爲要貼著於基板表 面的形狀。 切斷薄膜2B後，後端保持構件9係維持吸著保持薄膜2B 後端部狀態雖會朝右側移動而迴避，但薄膜2B係以壓住輥 子14來朝基板PB側搬運著，因而會滑動後端保持構件9上面 ，同時僅藉由薄膜保持桿20來成弱小地予以真空吸著保持著 〇 並在薄膜2B後端滑動薄膜保持桿20上分離之前，將藉 由靜電產生裝置1 7再度施加高電壓於電極’而賦予電荷於薄 膜保持桿20上的薄膜2B後端，並在薄膜2B後端從薄膜保持 -19- 1236965 (16) 桿20上分離而轉移到壓住輥子14之處，依序對於壓住輥子14 形成靜電吸著。 而在薄膜2B後端通過電16之時刻，予以停止從靜電產 生裝置於電極1 6的施加局電壓’且令薄膜保持桿2 0朝壓住 輥子14側迴避。 由而，可保持薄膜2B後端直至最後爲止之狀態來交給 於壓住輥子14，而且不會形成垂下薄膜2B後端於基板PB上 之狀態下，從薄膜2B前端直至後端爲止賦予一定拉力，同 時可實施貼著於基板PB。 將說明有關藉由壓住輥子14來貼著薄膜2B於基板PB和 壓住輥子1 4表面溫度之關係。 壓住輥子14的表面溫度係維持於抗蝕劑薄膜2b會開始軟 化程度的溫度區域，而以該溫度來從基底薄膜2c側藉由壓住 輥子14加壓薄膜2B於基板PB時.，抗蝕劑薄膜2b會從壓住輥 子1 4接受加熱而成爲稍微軟化，以致可增進黏著性之狀態來 緊密地貼著於基板PB。 爲了滿足抗蝕劑薄膜2b和基底薄膜2c所要求之功能，一 般，構成薄膜2B之抗蝕劑薄膜2b開始軟化溫度係低於基底 薄膜2c之開始變形溫度，但爲了增進抗蝕劑薄膜2b對於基板 PB的緊密貼著性，將令壓住輥子1 4之表面溫度形成爲基底 薄膜2c會開始變形的溫度左右時，就會在從前端保持構件7 交給薄膜2B前端於壓住輥子14並進行靜電吸著時，薄膜2B 前端會由熱而產生伸縮或成波浪狀之變形，以致會降低與壓 住輥子1 4的接觸面積，因而會成爲無法維持搬運所需之充分 -20- 1236965 (17) 的靜電吸著力。甚至操作階梯差輥子5朝壓住輥子1 4側移動 來減低反張力，也會使薄膜2B前端從壓住輥子14剝離。 爲此，將壓住輥子14之表面溫度作成爲用於貼著抗蝕 劑薄膜2b於基板PB所需要的能使抗蝕劑薄膜2b開始軟化程 度之溫度範圍，且不會使基底薄膜2c產生變形，以令壓住輥 子14可確實地吸著保持薄膜2B前端來搬運至基板PB而貼著 ，使得壓住輥子14可達成所謂賦予壓住輥子14所應具有之本 來功能。 當壓住輥子14在進行加熱加壓貼著薄膜2B於基板PB中 ，抗蝕劑薄膜2b因成爲稍微軟化，因而，基板PB表面即使 有印刷配線膜等而形成稍許凹凸，也不會留住氣泡之狀態下 成緊密地貼著。 而予以熱壓著欲貼著形狀的薄膜於基板PB表面之基板 PB，令藉由搬運輥子1 5之旋轉而搬運至下流機器，但在其 途中具有第2壓住輥子2 1，且該壓住輥子2 1係構成爲維持 表面溫度爲與壓住輥子1 4的表面溫度相同程度之溫度，並經 由基底薄膜2c更予以加熱加壓抗蝕劑薄膜2b來增進與基板PB 的緊密貼著。 基底薄膜2c雖會被壓住輥子21加熱，但抗蝕劑薄膜2b係 作成並不會熔解流出，以致基底薄膜2c表面可維持平坦性， 使得在以後製程，即使進行照相平版印刷處理，也不會引起 折射等的光學性障礙。 倘若由於所使用之薄膜2A ( 2B )的規格，而由初階段 之壓住輥子14的加熱加壓就已足夠時，就令壓住輥子21停止 -21 - 1236965 (19) P B上面用的機構和方法，但對於基板P B下面也欲貼著薄 膜時，就如圖4所示，予以配置與貼著上面之機構同樣機 構於搬運道下側，就可實施貼著於基板下面之情事。 再者，在圖4中，與圖1所示者具有相同功能和同樣功 能者，則藉由相同符號來表示。 在於圖4之實施形態，係構成爲令壓住輥子2 1靠近於壓 住輥子1 4，且在基板PB表面溫度未降低之前，藉由壓住輥 子2 1來進行加熱加壓，以意圖省電（力）化。 於圖1或圖4的實施形態，也可構成爲省略薄膜保持桿20 ，而對於交給薄膜2B後端於壓住輥子14之動作，藉由靠近 於壓住輥子14近旁的後端保持構件9來實施。該狀態時，後 端保持構件9因位於防塵蓋18外面，因而，幾乎不會受到來 自電極1 6之賦予電荷的影響，因此，即使未進行去除靜電也 不會產生任何影響。 又在圖1或圖4之實施形態，也可構成爲檢測壓住輥子14 表面電位用的測感器於壓住輥子1 4，而在成爲所期盼之電位 以上時，就能使去除靜電裝置1 9產生動作，以意圖省電化。 又也可構成爲僅在交給薄膜的前端及後端時，進行靜 電吸電，而是令薄膜整面帶有靜電來吸著於壓住輥子。 又也可構成爲與令薄膜吸著於壓住輥子1 4的手段同樣 ，藉由靜電來使薄膜帶電，而吸著保持於前端保持構件7及 後端保持構件9。 如以上所說明，依據本發明，能在從薄膜之前端部直 至後端部爲止產生階梯差（斷層狀）的狀態來成平坦地予 -23- 1236965 (20) 以貼著。 又依據本發明，能在不產生皺紋或氣泡之狀態來從薄 膜的前端部直至後端部予以貼著於基板上。 【圖式簡單說明】 圖1係顯示本發明的一實施形態之薄膜貼著裝置的槪 略剖面圖。 圖2係說明圖1之薄膜後端保持部，前端保持部用的圖 〇 圖3係說明在於圖1之薄膜貼著裝置的動作步驟用之流 程圖。 圖4係顯示本發明的另一實施形態之薄膜貼著裝置的 槪略剖面圖。 [主要 元件對 照 表 ] 1 薄 膜 捲 筒 2A 薄 膜 ( 2 a 9 2b ，2c :之三層結構） 2B 薄 膜 ( 2b 9 2c 之二 層結構） 2b 抗 蝕 劑 薄 膜 ( 層） [黏著性薄膜] 2c 基 底 薄 膜 ( 層 ) 3 捲 取 滾 筒 4 分 離 桿 5 階 梯 差 輥 子 6 薄 膜 搬 運 構 件 -24- 1236965 (21) 7 刖 端 保 持 構 件 8 氣 缸 9 後 端 保 持 構 件 10 氣 缸 11 伺 服 馬 達 12 滾 珠 螺 桿 13 刀 具 14 壓 ( 住 ) 輥 ( 子） 15 搬 運 輥 子 16 電 極 17 靜 電 產 生 裝 置 18 防 塵 蓋 19 去 ( 除 ) 靜 電 裝置 20 薄 膜 保 持 桿 2 1 第 2 壓 住 輥 子 23 控 制 裝 置 24 監 視 畫 面 25 鍵 盤 PB 基 板 -25-1236965 (1) 发明 Description of the invention [Technical field to which the invention belongs] The present invention relates to a film bonding method and a device thereof having a two-layer structure of an adhesive film and a base film layer, and is located on a substrate conveying path (path) Method and device for pressing the base film layer side to make the adhesive film layer side adhere to the substrate surface. [Previous technology] Previously, the film was pulled out from a film roll (sub) and cut into a continuous film. It is referred to as a film for the shape to be adhered, and it is constituted as described in Japanese Patent Publication No. 3-1 69 06 by a pair of injection rollers (when the film is adhered to the surface of the substrate). A plate or the like holds the front end portion of the film to adhere to the substrate, while avoiding it, the film and the substrate roller are held by two (roller) press rollers to convey the substrate to a transfer formed by a plurality of transfer rollers, and the film is bonded to the substrate. In addition, the structure that can be attached to the substrate near the end member of the suction member (vacuum rod) and so on, and then can be attached to the substrate. According to the above-mentioned prior art, since the thin portion is attached to the base When the board is pasted, the front end part of the film is different from the components used for adhesion, so that the front end part or the rear end part of the adhered film will be generated by applying pressure, especially related to the shape of the intended attachment. The thin (rolling) roller (child) is attached to the substrate, and a film (hereinafter referred to as a pressure roller) in the width direction is patented in China. On the road, at the same time, 刖 is held by the thin film, so that when the front end portion or the rear end portion of the film is on the substrate, it is easy to cause differences and step differences (stepped 1236965 (2)), which will cause the substrate to be processed in the future. Create obstacles and difficulties. For example, when the thin film is a resist film, when the exposure is performed, a change in the amount of light occurs at the step, so that there is a problem that a line is generated. The holding member that holds the rear end of the sheet is not placed in the space in front of the substrate and the pressure roller. Before the completion of the attachment position, the holding of the rear end of the film is stopped to become free. After the film is attached, The condition of the ends will become out of control (uncontrollable), making it very easy to produce streaks or bubbles. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method and device for attaching a film that can be flatly attached without causing a step difference from the front end portion to the rear end portion of the film. Still another object of the present invention is to provide a method and device for attaching a film, which can be applied from a front portion of a film to a rear end portion of the film without wrinkles or bubbles. In order to achieve the above-mentioned object, the film bonding method of the present invention is to form a film having a two-layer structure of an adhesive film layer and a base film layer into a shape to be adhered, and press the roller from the substrate by a pressing roller located on a substrate conveying path (path). A method for attaching a film by applying pressure to a film layer side to adhere an adhesive film layer to a surface of a substrate to be adhered to the substrate is characterized in that: a charge is imparted to a front end portion of a film to be attached, and the front end The front end portion is held by an electrostatic force acting between the pressing portion and the outer peripheral surface of the pressing roller, and the film to be adhered to the substrate is transferred by rotating the pressing roller, so that the front end portion is aligned with the substrate. At the same time, the starting position is -6-1236965 (4) At the same time, the starting position is applied at the same time to become a film with a shape to be attached to the surface of the substrate. The electrostatic force is maintained so that the entire film from the front end portion to the rear end can be made into a film to be attached to the substrate by the rotation of the pressing roller. According to the present invention, a person who is used to attach a film having a shape to be adhered to a substrate only uses a pressure roller and does not convert the pressure member. Therefore, it can be adhered to the substrate flatly without generating a step difference. on. Furthermore, since the static electricity has been removed by pressing the roller, even if the electric charge is imparted to the film, it will not cause the pressing roller to have the same kind of charge as the electric charge imparted to the film, so that no electrostatic repulsive force (repulsive force) is generated. Since it is held between the roller and the film, the entire shape of the film to be adhered can be adhered from the front end to the rear end of the film by pressing the roller without wrinkles or bubbles. [Embodiment] Fig. 1 is a schematic cross-sectional view of a film bonding apparatus according to an embodiment of the present invention. In FIG. 1, 1 is formed as a cover film layer (hereinafter referred to as a cover film) 2a and an adhesive resist film layer (referred to as an adhesive film layer, hereinafter referred to as a resist film) 2b, and a base film Layer (hereinafter referred to as the base film) 2 c of a three-layer film 2 A film roll, and the film 2 A is wound on the film roll in the order of covering the film 2a from the inside, the resist film 2b, and the base film 2c. The cylinder 1.3 is a take-up roller for recovering the cover film 2a separated from the film 2A by the separating lever 4. The driving device (for example, a motor) that drives the film roll 1 and the take-up drum 3 is provided with a function of adjusting the motor torque in response to the film remaining amount of the film roll 1 to make the film 2A tension Carry in a certain state. 5 is a step difference roller, and the step difference roller 5 is provided with a position adjustment function for adjusting the tension (reverse tension) of the film 2B in which the resist film 2b and the base film 2c become a two-layer structure after the cover film 2a is peeled off. . The 6 series includes: a front-end holding member 7 of the film 2B; a cylinder 8 that moves the front-end holding member 7 up and down; a rear-end holding member 9 of the film 2B; and a rear-end holding member 9 that can The film conveying member of the air cylinder 10 that moves to the left and right, and the film conveying member 6 are formed to move up and down by the rotation of a ball screw 12 that is directly coupled to the servo motor 11. As shown in FIG. 2, the inside of the front-end holding member 7 is divided into several vacuum chambers, the upper side (left side in FIG. 1) has suction holes, and the vacuum chamber is connected to a vacuum pump through an intermediate valve. The front end of the film 2B can be sucked by the upper surface of the front end holding member 7. It is also equipped with a pressure sensor for monitoring the vacuum state. For some reason, the suction position of the film 2B is deviated, so that when the film is not at the position above the suction hole, the vacuum pressure will be reduced. Therefore, the pressure sensor can be used to monitor the state of the absorbing film. Similarly to the front-end holding member 7, the rear-end holding member 9 has a vacuum chamber inside, and there is suction on the upper side (left side in FIG. 1). Hole, and equipped with a pressure sensor for monitoring the vacuum state, so that it is thin for some reason-9-1236965 (6) The membrane 2 B is not located above the suction hole (left side in Figure 1) When the vacuum pressure is reduced, the suction state of the film 2B can be monitored. The suction holes are arranged orthogonal to the direction of transporting the film. The size of the suction holes is from the side of the roller (press roller) that will be described later. It gradually becomes smaller in the direction of the step roller 5 and is configured such that when the film 2B is slid and transported on the rear stage holding member 9 at the rear stage, the vacuum can be gradually cut off so that the film can be held by suction until the rear end of the film. Further, grooves are provided in the width direction perpendicular to the transport direction of the film 2B (the direction perpendicular to the paper surface in FIG. 1), and the tool is used to receive the film when the film 2B is cut in the width direction by the cutter 1 3 (see FIG. 1). Device. The cutters 1 and 3 are assembled to the film conveying member 6 by an air cylinder (not shown) so that they can move in the vertical direction (the left-right direction in FIG. 1) with respect to the film 2B conveying direction. Avoid on the left in Figure 1. As for the cutting speed of the cutting film 2B, the moving speed of the cutter 13 can be adjusted to move the film conveying member 6 from the film cutting position which will become the film holding position to the moving time until the film front end is delivered to the position. Cut it off. The upper surface of the rear end holding member 9 (the left side in FIG. 1) is formed in flat contact with the left outer peripheral surface of the pressing roller 14 in FIG. 1, and can be moved leftward and rightward in FIG. 1 by the air cylinder 10 so that This is because the front-end holding member does not interfere when moving up and down. The front-end holding member 7 is also driven by the air cylinder 8 in the up-down direction, and a stopper member is provided so that the contact position with the pressing roller 14 which will be described later in the opened state can be adjusted. In this way, the film conveying member 6 is conveyed from the film roll -10- 1236965 (7) 1 through the step roller 5 by the servo motor 11 and the contact plane parallel to the outer peripheral surface of the pressing roller 14 in parallel. The film 2B is supplied to the vicinity of the roller 14 (from the upper direction to the lower direction in FIG. 1), and the film 2B is cut by the cutter 13 in the width direction during transportation. Each pair of pressing rollers 1 and 4 is located on the upper and lower sides of a conveying path formed by a plurality of conveying rollers 1 5, and is arranged to hold from the up and down direction by conveying lepton 15 from the left side to the right side of the figure. The substrate PB ′ is moved. Each of the pressing rollers 14 is moved in the vertical direction (opening and closing) by an air cylinder (not shown). Although not shown, a sensor for detecting the front end of the substrate PB during transportation is provided between the transportation rollers 15 near the entrance side (on the left side in FIG. 1) of the pressure roller 14. On the other hand, the conveyance roller 15 can carry out and stop the pressing of the substrate PB at any position under the roller 14 from the front end of the substrate PB during the detection and conveyance. The holding roller 14 is formed of the roller itself and silicone rubber applied to the outer peripheral surface thereof. A heater is provided inside the roller itself. The roller 1 4 is pressed to the substrate PB by electrostatic attraction (electrostatic adsorption) film 2B, which will be described later, and pressed and attached, but the temperature of the surface of the silicone rubber holding the roller 1 4 is by an internal heater. The temperature range is controlled to such an extent that the uranium-resistant film 2b can begin to soften. When the temperature of the silicone rubber surface of the roller 14 is pressed, and if the temperature is higher than the temperature at which the resist film 2b is softened, the base film layer is maintained at a temperature below the temperature at which expansion or wavy deformation occurs. An electrode 16 is provided on the left side of the pressing roller 14 and is connected to the static electricity generating device 17. When a high voltage is applied to the electrode 16 from the static electricity generating device 17, the thin film 2B carried to the right side of the electrode 16 will be charged and charged, so that the front end of the thin film 2B can be closely adhered to -11 by the electrostatic (Coulomb) force. -1236965 (8) Press the surface of Lepton 1 4. And because it is equipped with 5 dust-proof 盍 1 8 into a package of 13 to the right (the state of pressing the roller 14 and the electrode 16 'so') does not generate dust attached to the film that is charged by the electrode 2B ° in the dust cover 1 8 Internal pressure_Kunzi 1 4 The right side is equipped with a device for removing static electricity 19. When a charge (eg a negative charge) is applied from the electrode 16 to the film 2 B and the film is sequentially pressed by pressing the roller 14 When the plurality of substrates PB on the conveying path are reached, the sand rubber surface pressing the roller 14 will be charged to a high voltage with the same polarity as the charge imparted to the film 2 B from the electrode 16. Then, the front end of the film 2 B will be charged. Or a repulsive force acts between the electric charge at the rear end and the electric charge retained on the surface of the silicone rubber holding the roller 1 4 so that the front end or the rear end of the film 2B cannot be closely adhered to the roller 1 4 (the silicone rubber surface). For this purpose, a self-discharge type electrostatic brush for quickly reducing the voltage charged to the rollers 14 is provided as the static-elimination device 19. An ionizer can also be used for the self-discharge type electrostatic brush removal combination. , Or it can only be provided with an ionizer. These ionizers can The charge discharged to and from the front or rear end of the film 2B is of opposite polarity (that is, opposite to the charge retained on the surface of the silicone rubber holding the roller 14). Therefore, it is also effective for low charge voltages. Can effectively remove static electricity. When using an ionizer, install an air blower that can blow the ion when the ion is emitted, which can remove a wider area, and even remove the surface of the substrate at the same time. When the static elimination device 19 is disposed upstream of the outer peripheral surface of the pressing roller 14 for holding the front end and the rear end of the film 2B in the direction of rotation of the pressing roller 14, it can be held frequently. The same state of the surface of the pressing roller makes it possible to perform the electrostatic suction film 2B stably. -12- 12965965 (9) 20 is the film holding rod, which will hold the cut-off film 2 B by suction and suction. And hold the rear end of the film until the film 2 B is pressed against the outer peripheral surface of the roller 1 4 by pressing the electrode on the left side of the roller 1 4. The film holding lever 20 is arranged close to the roller 1 4 periphery while As long as it is formed in a shape parallel to the tangent plane of the pressing roller 14 (the film 2B will become the surface in the tangential direction of the pressing roller 14), it does not need to reach from the contact point between the outer periphery of the pressing roller and the substrate conveying surface. The space near the upstream side of the substrate conveyance direction is formed in a similar shape. The film holding lever 20 is designed to interfere with the front-end holding member 7 and is configured to avoid the upper side of the pressing roller 14 when it is handed over to the front end of the film 2B. 2 1 is a second pressing roller that maintains the surface temperature to the same degree as the surface temperature of the pressing roller 14, and can be pressurized from the base film 2c side to increase the tightness of the resist film 2b and the substrate PB as needed. In addition, when the surface temperature of the second pressing roller 21 is set to be higher than the surface temperature of the pressing roller 14, it is maintained at a temperature that does not cause the uranium-resistant film 2b to melt out due to heat. So that the second pressing roller 21, which contaminates the surface by the melted outflow of the resist film 2b, will contaminate subsequent substrates PB, or reduce the thickness of the resist film 2b and make photolithography in the subsequent process. Good management can not be handled. The 23 series control device for controlling the sticking film device is equipped with a memory (RAM) for storing the data (data) of the sticking length of the thin film or a motor constant for the driving device, etc. Membrane (ROM) for the software program of the film, and it is attached with data for displaying the film 2B's sticking length, etc., monitoring screen 24 for motor constants for driving devices, etc., and input to the memory (RAM) of the control device 23 Information for the keyboard 25. -13- 1236965 (10) The software program for attaching the film is a program for executing the operation process (process steps) of the device, and setting data in the operation screen program for monitoring screen 24. In addition, although not shown, the substrate P B is transported by the transport roller 15 before being heated to a temperature equal to the surface temperature of the pressing roller 14 before reaching the pressing roller 14. As the pre-heating means, radiation heating by an infrared heater or heating by heat transfer from a roller or a heater will be used. Next, the operation of the film sticking device will be described in accordance with the flow (picture) shown in FIG. 3. When the operation is started, the film attachment operation shown in step (hereinafter, simply referred to as "S") 100 is prepared. In preparation for film adhesion operation S100, the film 2A is manually pulled out from the film roll 1 and handed over to the separation lever 4. The cover film 2a is peeled off stepwise against the roller 5. The peeled cover film 2a is taken up by a take-up roller 3. The two-layer film 2B of the peeling cover film 2a is shown in FIG. 1, and is pulled out to the front end of the rear end holding member 9 aligned with the upper position of the front end holding member 7, and the front end holding member 7 and the rear end holding member The vacuum suction is performed on 9 or more. The step roller 5 is moved to the upper position shown in FIG. 1, and the film roll 1 and the take-up drum 3 rotate the motor (not shown) to make the tension of the film 2 A constant. Next, it is assumed that the cutter 13 can become a groove portion passing through the holding member 9 at the rear stage, and the cutter 13 is moved in the width direction of the film 2B to cut the film 2B in the width direction. Then, the vacuum suction of the rear-end holding member 9 -14- 1236965 (11) that sucked the film 2B was stopped, and the broken pieces of the film 2B on the rear-end holding member 9 were stopped. At this time, on the front-end holding member, the film 2B is vacuum-absorbed in a state where the film 2B protrudes from the front end of the front-end holding member 7 by about 10 mm to the rear-end holding member 9. When it is formed as described above, the film attachment operation preparation S 100 is completed. Then, the process proceeds to the film delivery process S200. After the film is handed over to the process S200, the rear end holding member 9 is driven by the air cylinder 10 arranged on the film conveying member, and the rear end holding member 9 is avoided to the right as shown in FIG. 2. The film holding lever 20 is also retracted toward the upper side of the pressing roller 14. Then, the ball screw 12 is rotated by the servo motor 11 to move the film conveying member 6 in parallel with the tangent plane to the outer periphery of the pressing roller 14 (moving downward in FIG. 1). At this time, the pair of pressing rollers 14 are opened (separated) and are heated by the internal heater. The front end of the film 2B is moved by the cylinder 8 to move the front end holding member 7 so that the front end of the film 2B is located at the contact position of the upper pressing roller 14 (the front position of the film 2B when the film 2B becomes the connection direction of the pressing roller 14). Therefore, a high voltage is applied to the electrode 16 from the static electricity generating device 17 so that the front end portion of the film 2B protruding from the front-end holding member 7 between the electrode 16 and the roller 14 by about 10 mm becomes charged. When the front end portion of 2B is electrostatically attracted to the grounded pressing roller 1 4, the application of high voltage to the electrode 16 from the static electricity generating device 17 is stopped, and the vacuum suction of the front end holding member 7 is stopped to release the suction of the film 2B. In this state, when the front end of the film 2B and the tangent plane of the pressing roller 14 are transported in parallel (the film 2B becomes a surface facing the tangential direction of the pressing roller 14), it can be free of wrinkles. And by the uniform electrostatic adsorption force, -15-1236965 (12) is given to the holding roller 1 4. After being handed over to the film 2B, the holding roller 14 will start toward the substrate PB conveying path formed by the carrying roller 15 Rotate and make the The moving film 2B is conveyed to the lower side. At the same time as the start of the conveyance, the torque of the driving device for driving the film roll 1 and the take-up drum 3 is reduced, and the step roller 5 is moved to the lower side. Moving the step roller 5 in synchronization with speed can reduce the back tension (tension) of the film 2B, and can assist in holding the film 2B carried by the roller 14. Generally speaking, the film 2B formed by pressing the roller The electrostatic absorbing force is proportional to the charging voltage, and the charging voltage is proportional to the holding area of the roller 1 4 and the film 2B. The pressing roller 14 is only the front end of the film 2B, and thus becomes a weak charging voltage. That is, it forms a weak electrostatic force. For this reason, when the film is just handed over to the roller 14, it will make the transporting film unstable. Therefore, it is necessary to reduce the back tension of the film 2B to make it easy. The ground is carried by the roller 1 4 to carry the film 2 B on the substrate PB side. On the contrary, when the angle of the film wound by the roller 1 4 becomes larger, the roller 14 and the film 2B are increased. Of the adsorption area The electrostatic adsorption force will become strong, so that the film 2B will be stabilized. The step roller 5 is a film tension adjustment method that can reduce the reverse tension of the film 2B. It can be driven by an actuator (not shown). Move up and down. When the film 2B is attached to the surface of the substrate PB, the step difference roller 5 will be on the upper side, and when the film 2 B is carried by pressing the roller 1 4 under and under the pressure roller 1 4, the step difference roller 5 will move to the lower side. At this time, moving the step roller 5 'in synchronization with the conveying speed of -16- 1236965 (13) film 2B can reduce the back tension of film 2B, and can assist to hold the roller 14 to handle film 2B. In addition, when a fixed guide roller that cannot be moved is used instead of the step roller 5, the film roll 1 and the take-up roller 3 can also be rotated by the driving device (such as a motor) in a winding direction, thereby weakening the film 2 B The reverse tension makes it possible to assist the process of conveying the film 2B by pressing the roller 14. As for whether the front end of the film 2B has reached the upper center of the lower roller 1 4 by pressing the roller 14 by rotation, it is determined by an encoder (not shown) provided from the main shaft of the roller 1 4. The number of pulses is used to confirm, and when there is confirmation, the rotation is stopped and the roller 1 4 is pressed. Before the film 2B is started to be conveyed by pressing the roller 14 on the upper side, the film absorbing by the front-end holding member 7 is stopped, and the film 2B is conveyed by pressing the roller 14 on the upper side. After returning the front-end holding member in the upward direction by the air cylinder 8, the rear-end holding member 9 is moved to the left to restore the initial state, so that the rear-end holding member 9 becomes side-by-side with the front-end holding member 7 and returns to the transportation of the film 2B. position. Then, the film conveying member 6 is moved to the cutting position of the film 2B by the servo motor 11. In the film handing process S200, the substrate positioning process S300 is performed at the same time. Although the substrate positioning process S 3 00 is performed, the substrate PB is heated in advance to the same temperature as the surface temperature of the pressing roller 14, and is moved from the left side to the right side in FIG. 1 by the conveying roller 15. At this time, the amount of movement is detected by a sensor (not shown), and the film at the front end portion of the substrate PB is attached to the start position -17-1236965 (14). When the 2B front end is aligned, the movement of the substrate PB is stopped at once. Thereafter, a thin film bonding process S400 is performed. When the film is attached to the film S 4 0, the upper and lower pressing rollers 14 will move up and down toward the substrate PB, and hold the substrate PB (clamp) with two pressing rollers 14 and heat press the substrate PB. At the front end of the film 2 B. The stepped roller 5 is returned to the initial state (upper side of FIG. 1), and the step 2 is implemented to prevent the film 2B from being slackened between the stepped roller 5 and the roller 14. At this time, once the back tension of the film roll 1 is strengthened, it is possible to prevent the film 2B from being slackened. Next, the film holding rod 20 is moved until the pressing roller 14 becomes the position between the electrode 16 and the pressing roller 14 that are handed over to the rear end of the film, and after the movement is completed, the film holding rod 20 is sucked with a weak straight air. Hold the film 2B on the left side of the film holding lever 20. Then, the two pressing rollers 14 are rotated to maintain the state of holding (clamping) the substrate PB, and the substrate PB is transported to the right, while the film holding rod 20 slides the film 2B while pressing The film 2B on the roller 14 is thermally pressed onto the substrate PB. The film holding rod 20 is used for sliding the film 2B. The surface can be treated with PTFE (polytetrafluoroethylene) or molded from engineering plastic (MC nylon). Since the substrate PB has been preheated, the resist film 2b does not cause the heat to be taken away and maintains a slightly softened state when contacting the substrate PB, and is affixed by heating and pressing against the roller 14. On the substrate PB. When the film conveying member 6 of the film adhering process S400 moves toward the pressing roller 1 4 -18-12 36965 (15) side, the film cutting process S500 is performed. In the film cutting process S500, the film conveying member 6 gradually moves toward the pressing roller 14 before it passes through the cutting groove of the rear-end holding member 9 at the rear end position of the film 2B, and becomes synchronized with the pressing roller 14 spinning speed. When the film pad is pressed (adhered) and the film portion that is set to be the rear end of the film passes through the cutting groove of the rear-end holding member 9 in advance, the front-end holding member 7 and the rear-end holding member 9 are used. Come to suck and hold the film 2B. When determining whether the position of the rear end of the film 2B has passed through the cut groove, it is confirmed by the number of pulses from an encoder provided on the film roll 1 or the main shaft holding the roller 14 or the like. The film is cut during the moving time of moving the film conveying member 6 to the position where the leading end of the film is moved, and the cutter 13 is moved in the width direction to cut the film 2B. The width of the film 2B (2A) is configured to be the same as the width to be adhered to the substrate PB. Therefore, when it is cut by the cutter 13, the width is to be the same as the width to be adhered to the substrate PB. Shape attached to the substrate surface. After cutting the film 2B, the rear-end holding member 9 maintains the state of holding and holding the rear end of the film 2B. Although the rear end of the film 2B moves to the right and avoids it, the film 2B is moved toward the substrate PB by pressing the roller 14 and slides. Above the rear-end holding member 9 and at the same time, it is weakly vacuum-held and held only by the thin-film holding rod 20, and it is separated by the static-electricity generating device 17 before sliding on the thin-film holding rod 20 at the rear end of the film 2B. A high voltage is applied to the electrode and a charge is applied to the rear end of the film 2B on the film holding rod 20, and the rear end of the film 2B is separated from the film holding-19-1236965 (16) The rod 20 is transferred to the place where the roller 14 is pressed In order, electrostatic pressure is formed on the rollers 14 in order. At the time when electricity 16 passes through the rear end of the film 2B, the application of the local voltage to the electrode 16 from the static electricity generating device is stopped, and the film holding rod 20 is avoided toward the pressing roller 14 side. As a result, the film 2B can be handed over to the holding roller 14 while the rear end of the film 2B is maintained, and a certain state can be provided from the front end of the film 2B to the rear end without sagging the rear end of the film 2B on the substrate PB. The pulling force can be applied to the substrate PB at the same time. The relationship between the temperature at which the film 2B is attached to the substrate PB by pressing the roller 14 and the surface of the roller 14 will be described. The surface temperature of the pressing roller 14 is maintained at a temperature region where the resist film 2b starts to soften, and when this temperature is used to press the film 2B from the base film 2c side by pressing the roller 14 to the substrate PB, the resistance The resist film 2b is softened slightly by receiving heat from the pressing rollers 14 so that the adhesive film 2b is closely adhered to the substrate PB. In order to satisfy the required functions of the resist film 2b and the base film 2c, generally, the softening temperature of the resist film 2b constituting the film 2B is lower than the starting deformation temperature of the base film 2c. When the substrate PB is tightly adhered to the surface temperature of the pressing roller 14 to a temperature at which the base film 2c starts to deform, it is transferred from the front-end holding member 7 to the front end of the film 2B to the pressing roller 14 and is carried out. When static electricity is attracted, the front end of the film 2B will be stretched or deformed by heat, which will reduce the contact area with the pressing roller 14, and it will become impossible to maintain sufficient -20- 1236965 (17 ) 'S electrostatic attraction. Even if the step roller 5 is operated to move toward the holding roller 14 to reduce the back tension, the leading end of the film 2B is peeled from the holding roller 14. For this reason, the surface temperature of the pressing roller 14 is set to a temperature range required for adhering the resist film 2b to the substrate PB to enable the resist film 2b to begin to soften without causing the base film 2c to be generated. The deformation is performed so that the pressing roller 14 can surely suck and hold the front end of the holding film 2B and carry it to the substrate PB, so that the pressing roller 14 can achieve the original function that the pressing roller 14 should have. When the roller 14 is heated and pressed to adhere the film 2B to the substrate PB, the resist film 2b is slightly softened. Therefore, even if there is a slight unevenness on the surface of the substrate PB, a printed wiring film or the like is formed, and it will not be retained. Closely adhere to the air bubbles. The substrate PB with the shape-to-be-adhered film on the surface of the substrate PB is hot-pressed, and is transported to the downstream device by the rotation of the transport roller 15, but has a second pressing roller 21 in the middle, and the pressing The holding roller 21 is configured to maintain the surface temperature at the same temperature as the surface temperature of the holding roller 14 and further heat and pressurize the resist film 2b through the base film 2c to improve the adhesion to the substrate PB. Although the base film 2c will be heated by pressing the roller 21, the resist film 2b is made and will not melt out, so that the surface of the base film 2c can maintain flatness, so that in subsequent processes, even if photolithographic processing is performed, It may cause optical obstacles such as refraction. If the heating and pressure of the pressing roller 14 at the initial stage is sufficient due to the specifications of the film 2A (2B) used, the pressing roller 21 is stopped -21-1236965 (19) PB mechanism And method, but when a film is to be attached to the lower surface of the substrate PB as shown in FIG. In addition, in FIG. 4, those having the same functions and the same functions as those shown in FIG. 1 are denoted by the same symbols. In the embodiment of FIG. 4, the pressing roller 2 1 is configured to be close to the pressing roller 14 and before the surface temperature of the substrate PB is not lowered, the pressing and pressing of the roller 21 is performed for heating and pressing, so as to save time. Electricity (force). In the embodiment of FIG. 1 or FIG. 4, the film holding lever 20 may be omitted, and for the action of passing the rear end of the film 2B to the pressing roller 14, the rear end holding member near the pressing roller 14 may be used. 9 to implement. In this state, since the rear-end holding member 9 is located outside the dust cover 18, it is hardly affected by the charge imparted from the electrode 16, and therefore, it does not have any effect even if the static electricity is not removed. In the embodiment of FIG. 1 or FIG. 4, a sensor for detecting the surface potential of the pressing roller 14 may be configured to hold the roller 14, and when the potential is higher than a desired potential, static electricity can be removed. The device 19 generates an action to save power. Alternatively, the film may be electrostatically attracted only when it is delivered to the front and rear ends of the film, and static electricity may be applied to the entire surface of the film to hold the roller. Alternatively, the film may be configured to be electrostatically charged and held on the front-end holding member 7 and the rear-end holding member 9 in the same manner as the method of causing the film to be held on the pressing roller 14. As described above, according to the present invention, it is possible to flatly apply -23- 1236965 (20) in a state where a step difference (faulty shape) occurs from the front end portion to the rear end portion of the film. According to the present invention, it is possible to attach the film from the front end portion to the rear end portion of the film without causing wrinkles or bubbles. [Brief Description of the Drawings] FIG. 1 is a schematic cross-sectional view showing a film bonding apparatus according to an embodiment of the present invention. Fig. 2 is a diagram for explaining the rear-end holding portion and front-end holding portion of the film of Fig. 1; Fig. 3 is a flow chart for explaining the operation steps of the film-adhering device of Fig. 1; Fig. 4 is a schematic cross-sectional view showing a film bonding apparatus according to another embodiment of the present invention. [Comparison of main components] 1 Film roll 2A film (2 a 9 2b, 2c: three-layer structure) 2B film (2b 9 2c two-layer structure) 2b resist film (layer) [adhesive film] 2c Base film (layer) 3 Take-up roller 4 Separation lever 5 Step roller 6 Film conveying member-24-1236965 (21) 7 End holding member 8 Cylinder 9 Back end holding member 10 Cylinder 11 Servo motor 12 Ball screw 13 Tool 14 Pressing (holding) the roller (s) 15 Transporting the roller 16 Electrode 17 Static generating device 18 Dust cover 19 Removing (removing) the static device 20 Film holding lever 2 1 2nd pressing roller 23 Control device 24 Monitoring screen 25 Keyboard PB substrate-25 -