KR20040073934A - A method for adhesion of film and an apparatus thereof - Google Patents

Abstract

PURPOSE: An apparatus and a method for adhering film are provided to smoothly adhering film on a substrate without a gap and to avoid the generation of a crease or a vapor. CONSTITUTION: A film adhering apparatus comprises a resist film roll(1) of a film(2A) consisting of a cover film layer(2a), an adhesive resist film layer(2b) and a base film layer(2c), a winding roll(3) recovering the cover film layer peeled from the film by a separator bar(4), a gap roll(5) having a position adjuster for adjusting the tension of a film(2B) consisting of the resist film and the base film, and a film return member(6) moving upward and downward by the rotation of a ball screw(12).

Description

Film bonding method and apparatus therefor {A METHOD FOR ADHESION OF FILM AND AN APPARATUS THEREOF}

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a film bonding method and an apparatus thereof, and in particular, pressurizes a film having a two-layer structure of an adhesive film layer and a base film layer by a pressing roll positioned on a conveyance path of a substrate from the base film layer side. The present invention relates to a method and an apparatus for adhering the adhesive film layer side to a substrate surface to be adhered to the substrate.

Conventionally, the film is removed from the film roll, and the continuous film is cut in the width direction to form a sheet of film (hereinafter abbreviated as film) in a shape to be bonded, and the film is adhered to the substrate surface by a pair of pressing rolls. As described in Japanese Patent Application Laid-Open No. 3-16906, the tip of the film is held by a tip holding member such as a vacuum plate and adhered to the substrate. After the tip holding member is evacuated, the film is rolled with both pressing rolls. And bonding the film to the substrate while conveying the substrate on the conveying path surface comprising the plurality of conveying rolls by rotating the positive-compression roll by sandwiching the substrate, and at the end of the bonding, the film suction member (vacuum bar) The back end portion of the film is held by an end holding member such as) to adhere to the substrate.

According to the prior art, when the front end or the rear end of the film is adhered to the substrate, and the middle part between the front end and the rear end of the film is adhered to the substrate, the members to be bonded tend to be different, and therefore, it is easy to cause a difference in the pressing force. There was a step in the front end or the rear end of the adhered film, which hindered the subsequent processing on the substrate.

For example, if the film is a resist film, there is a problem that the light amount is changed due to the step and a line is generated when the exposure is performed.

In addition, since the holding member of the film rear end does not enter the space between the substrate and the pressing roll, the holding of the film rear end stops and releases freely before the end position of adhesion, so that adhesion of the film rear end is disturbed and wrinkles or bubbles are likely to occur. .

It is therefore an object of the present invention to provide a film bonding method and apparatus capable of adhering flatly onto a substrate without generating a step from the leading end portion to the rear end portion of the film.

Another object of the present invention is to provide a film bonding method and an apparatus capable of adhering on a substrate from the front end to the rear end of the film without generating wrinkles or bubbles.

1 is a schematic cross-sectional view showing a film bonding apparatus according to one embodiment of the present invention;

FIG. 2 is a view for explaining a film rear end holding part and a tip holding part of FIG. 1; FIG.

FIG. 3 is a flow chart for explaining an operation procedure in the film bonding apparatus of FIG. 1;

It is a schematic sectional drawing which shows the film bonding apparatus which is another embodiment of this invention.

A feature of the method of the present invention which achieves the above object is that a film having a two-layer structure of an adhesive film layer and a base film layer is to be bonded by a pressing roll positioned on a conveyance path of a substrate from the base film layer side. A film bonding method in which a pressure-sensitive adhesive film layer side is adhered to a substrate surface bonded to the substrate by applying pressure to a tip portion of a film of a shape to be bonded, and the tip portion is applied to both outer peripheral surfaces of the pressing roll. The film of the shape to be bonded is conveyed to a board | substrate by making the electrostatic force rotate, and the said tip part is matched with the adhesion start position of a board | substrate, and the said film of the shape to be bonded is made It adheres to the surface, and the rear end of the film of the shape to be bonded is also charged, and the said rear end is Maintaining the electrostatic force acting between both on the outer peripheral surface of the pressing roll, the whole of the shape of the film to be bonded from the leading end to the rear end is bonded to the substrate by the rotation of the pressing roll, and the rotating The press roll has a static elimination at an upstream position of the press roll holding the tip portion by the outer circumferential surface of the press roll.

In addition, a feature of the apparatus of the present invention which achieves the above object is that a film having a two-layer structure of an adhesive film layer and a base film layer is to be adhered to a crimping roll located on a conveyance path of a substrate from the base film layer side. A film bonding apparatus for attaching a pressure-sensitive adhesive film layer side to a substrate surface for adhering the adhesive film layer to the substrate, comprising: a pressing roll having a function of holding the film in the shape to be bonded at a constant power, and the shape to be bonded A film front end holding member for holding the front end of one film and receiving the front end on the outer circumferential surface of the pressing roll, and a rear end of the film having the shape to be bonded, and holding the rear end on the outer circumferential surface of the pressing roll. An electric charge is applied to the front and rear ends of the film back end holding member and the film to be bonded. And means for static eliminating the pressing roll at an upstream position of the pressing roll which holds the front end and the rear end by the outer circumferential surface of the pressing roll when the pressing roll is rotating. At the outer peripheral surface thereof, the tip portion is held at constant power, the film having the shape to be bonded is conveyed to the substrate by the rotation of the pressing roll, and the tip portion is aligned with the bonding start position of the substrate. The film having the shape to be bonded is adhered to the surface of the substrate, and the rear end is held from the front end by the electrostatic force on the outer circumferential surface of the pressing roll that is also static electricityed, and the rear end is rotated by the pressing roll. It is to adhere | attach the whole film which made the shape to want to adhere | attach to to a board | substrate.

According to the present invention, since the pressing member is not changed only by the pressing roll, the film of the shape to be bonded to the substrate can be adhered to the substrate flatly without generating a step.

In addition, since the press roll is static-discharged, the press roll does not charge with the same kind of charge as the charge given to the film even when the charge is applied to the film, so that the electrostatic repulsive force between the press roll and the film is reduced. This does not occur, and the whole film of the said shape to be adhere | attached can be hold | maintained and adhere | attached on a board | substrate with a crimping roll from a film front end part to a rear end part, and wrinkles and a bubble are not generated.

1 is a schematic cross-sectional view of a film bonding apparatus according to an embodiment of the present invention.

In Fig. 1, reference numeral 1 denotes a cover film layer (hereinafter referred to as “layer”) 2a and a resist film layer having adhesiveness (it is an adhesive film layer, hereinafter referred to as “layer”) 2b and a base film. A layer (hereinafter, "layer" is omitted) is a film roll of a film 2A composed of a three-layer configuration of 2c, and the film 2A is a cover film 2a and a resist film from the inside on the film roll 1. (2b) and the base film (2c) are rolled up in order. 3 is a roll-up roll which collect | recovers the cover film 2a which peels with the separator bar 4 from the film 2A. The drive device (for example, a motor) of the film roll 1 and the reel roll 3 is provided with the function which can adjust the torque of a motor according to the remaining amount of the film 2A in the film roll 1. The tension of the film 2A is made constant and conveyed.

5 is a step roll, and the step roll 5 is used to adjust the tension (back tension) of the film 2B having a two-layer structure using the resist film 2b and the base film 2c after the cover film 2a is peeled off. Positioner is installed.

6 denotes the tip holding member 7 of the film 2B, the air cylinder 8 for moving the tip holding member 7 up and down, the rear holding member 9 of the film 2B, and the tip holding member 7; It is a film conveying member having an air cylinder 10 for moving the rear stage holding member 9 to the left and right during vertical movement, and the film conveying member 6 is rotated up and down by the rotation of the ball screw 12 directly connected to the servomotor 11. It is supposed to move.

As shown in Fig. 2, the tip holding member 7 has a vacuum chamber divided into several parts, and an upper surface (left side in Fig. 1) has suction holes, and the vacuum chamber communicates with the vacuum pump via an intermediate valve. The tip of the film 2B is sucked from the top surface of the tip holding member 7. In addition, if a pressure sensor for monitoring the vacuum state is provided and the suction position of the film 2B is shifted due to some reason, and the film is not positioned on the upper surface of the suction hole, the vacuum pressure is lowered. Adsorption can be monitored.

The rear end holding member 9 also has suction holes in the vacuum chamber and the upper surface (left side in Fig. 1) in the same manner as the front end holding member 7, and a pressure sensor for monitoring the vacuum state is provided for any cause. If the adsorption position of the film 2B is shifted and the film 2B is not located on the upper surface (the left side in Fig. 1) where the adsorption holes are located, the vacuum pressure decreases to monitor the adsorption state of the film 2B. Can be. The suction holes are arranged to be orthogonal to the film conveying direction, and the size of the suction holes gradually decreases with respect to the direction of the step roll 5 from the side of the pressing roll 14 described later, and the rear end of the film 2B is the rear end. When the upper surface of the holding member 9 is slid and conveyed, the vacuum is gradually broken to make it possible to hold and hold to the rear end of the film 2B. Moreover, the groove | channel is provided in the width direction (direction perpendicular | vertical to the paper surface of FIG. 1) orthogonal to the conveyance direction of the film 2B, and the film 2B is cut | disconnected in the width direction by the cutter 13 (refer FIG. 1). It is used as a cutter tray when doing so.

The cutter 13 is attached to the film conveying member 6 via an air cylinder (not shown) so as to be movable in a direction perpendicular to the conveying direction of the film 2B (left and right directions in FIG. 1), When the film 2B is not cut off, it is possible to retract to the left side in FIG. 1. The cutting speed of the film 2B adjusts the moving speed of the cutter 13 so that the film conveying member 6 is completed during the moving time from the cutting position of the film 2B to the film holding position to the film tip receiving position. It is being made possible.

The upper surface (left side in FIG. 1) 6 of the rear end holding member 9 becomes a contact plane with respect to the outer circumferential surface portion of the left side of the pressing roll 14 in FIG. 1, and at the time of vertical movement of the front end holding member 7. It moves to the left-right direction in FIG. 1 with the air cylinder 10 so that it may not interfere. In addition, in the tip retaining member 7, the stopper member is provided so that the up-down direction can be driven by the air cylinder 8, and the position of contact with the pressing roll 14 in the open state, which will be described later, can be adjusted. have.

Thus, the film conveying member 6 carries out the servo motor 11 in parallel with the contact plane with respect to the outer periphery of the crimping roll 14, the film 2B supplied from the film roll 1 via the step roll 5. ), It is conveyed to the vicinity of the press roll 14 correctly (from the upward direction of FIG. 1 downward), and the film 2B is cut | disconnected in the width direction with the cutter 13 during conveyance.

Each pressing roll 14 which makes a pair is in the up-and-down direction of the conveyance path comprised by the some conveyance roller 15, and the conveyance roller 15 conveys the board | substrate PB which the conveyance roller 15 conveys toward the right side from the left of a figure. It is arranged to be movable so as to be sandwiched from.

The vertical movement (opening and closing) of each pressing roll 14 is performed with the air cylinder which abbreviate | omits illustration. Although not shown, the sensor which detects the front-end | tip of the board | substrate PB in conveyance is installed between the crimping roll 14 and the conveyance roller 15 of the entrance side (left side of FIG. 1). The conveyance roller 15 can convey and stop to the arbitrary position under the crimping roll 14 from the position which detected the front-end | tip of the board | substrate PB currently conveyed.

The press roll 14 consists of a silicone rubber coated on the roll main body and its outer peripheral surface. There is a heater inside the roll body. As described later, the pressing roll 14 adsorbs (electrostatically adsorbs) the film 2B with electrostatic force, conveys the substrate 2 to the substrate PB, pressurizes the adhesive, and the surface temperature of the silicone rubber in the pressing roll 14 is adhered. Is controlled by an internal heater so that the resist film 2b is maintained at a temperature range at which the softening starts. Moreover, when the surface temperature of the silicone rubber in the crimping roll 14 is more than the temperature which the resist film 2b softens, it maintains below the temperature which the said base film layer deform | transforms, such as expansion | contraction and slack.

An electrode 16 is provided on the left side of the pressing roll 14, and is connected to the electrostatic generator 17. When a high voltage is applied to the electrode 16 from the electrostatic generator 17, the film 2B conveyed to the right side of the electrode 16 is charged and charged, and the tip of the film 2B is electrostatic (coulomb). ) Close to the surface of the right pressing roll (14). Since the dustproof cover 18 is provided so as to surround the pressing roll 14 and the electrode 16 on the right side, dust or the like does not adhere to the film 2B charged by the electrode.

An antistatic device 19 is disposed on the right side of the pressing roll 14 in the dustproof cover 18. When charge (for example, negative charge) is applied to the film 2B from the electrode 16 and the film 2B is sequentially adhered to the plurality of substrates PB on the conveyance path by the pressing roll 14, A high voltage having the same polarity as that of the charge applied to the film 2B from the electrode 16 is charged on the silicon rubber surface in the pressing roll 14. Then, a repulsive force acts between the charge applied to the front end or the rear end of the film 2B and the charge collected on the silicon rubber surface in the press roll 14, and the film 2B is placed on the surface of the press roll 14 (silicone rubber). You will not be able to come in close contact with the front and rear ends.

Therefore, the self-discharge type antistatic brush is provided for the antistatic device 19 to rapidly lower the voltage of the pressing roll 14. Moreover, an ionizer may be used together with a self-discharge type antistatic brush, and only an ionizer may be provided. These ionizers produce low charges (that is, reverse polarities with charges collected on the surface of the silicone rubber in the pressing roll 14) from the charges applied to the front and rear ends of the film 2B. It is possible to effectively perform static elimination even for a large voltage. In the use of the ionizer, a wide range can be discharged by providing an air blower when ions are released, and the substrate surface after adhesion can also be discharged simultaneously. The static elimination device 19 is always provided at the upstream position of the outer circumferential surface in the compression roll 14 which holds the leading end portion and the rear end portion of the film 2B with respect to the rotational direction of the pressing roll 14, thereby always providing the same compression roll. By maintaining the surface state, the film 2B can be stably electrostatically adsorbed.

20 is a film holding | maintenance, the back end of the cut film 2B is hold | maintained by suction adsorption, and the film 2B adhere | attaches the outer peripheral surface of the press roll 14 by the electrode 16 of the left side of the press roll 14. Keep film trailing until The film holding bar 20 is disposed close to the outer circumference of the pressing roll 14, and is parallel to the contact plane of the pressing roll 14 (the surface where the film 2B becomes the tangential direction of the pressing roll 14). It does not need to be a shape similar to the space in the upstream side vicinity of a board | substrate conveyance direction from the contact of a crimping roll outer periphery and a board | substrate conveyance surface. Moreover, in order to avoid interference with the front end holding member 7, the film holding bar 20 is made to retract upward of the press roll 14 at the time of the front end of the film 2B.

21 is a second pressing roll which maintains the surface temperature at the same temperature as the surface temperature of the pressing roll 14, and if necessary, pressurizes from the side of the base film 2c and the resist film 2b and the substrate PB. ) Is to increase the degree of adhesion. When the temperature of the surface of the second pressing roll 21 is set to be equal to or higher than the surface temperature of the pressing roll 14, the resist film 2b is maintained at a temperature at which the resist film 2b is not eluted with heat, and the resist film 2b eluted. The second press roll 21 whose surface is dirty by the staining does not soil the subsequent substrate PB, or the thickness of the resist film 2b is reduced so that the photolithographic treatment in the subsequent step is not performed. do.

Reference numeral 23 is a control device for controlling the film bonding device, and includes a memory (RAM) for storing data such as the adhesion length of the film 2B, a motor constant for driving the device, and the like, and a memory for storing a software program relating to film bonding ( A built-in ROM, a monitor screen 24 for displaying data such as the adhesion length of the film 2B, a motor constant for driving the device, and a memory (RAM) data for the control device 23; (25) is attached.

The software program relating to film bonding is a program for executing the operating steps of the apparatus, an operation screen program for setting data on the monitor screen 24, and the like.

In addition, although not shown in figure, the board | substrate PB is conveyed by the conveyance roll 15 in the state heated beforehand to the crimping roll 14 at the temperature similar to the surface temperature in the crimping roll 14 beforehand. I'm coming.

As the preheating means, radiant heating by an infrared heater, electrothermal heating by a roll heater, or the like is used.

Next, operation | movement of a film bonding apparatus is demonstrated according to the flow shown in FIG.

At the start of the operation, the film adhesion operation shown in Step 100 (hereinafter abbreviated as "S") is prepared. As the film bonding operation preparation S 100, the film 2A is taken out from the film roll 1 manually, handed to the separator bar 4, and the step roll 5, and the cover film 2a is peeled off. The peeled cover film 2a is wound up by the reel roll 3.

The film 2B, which has been peeled off from the cover film 2a and becomes two layers, is drawn out to the tip of the tip holding member 7 and the rear holding member 9 in which the top surface positions are arranged as shown in FIG. And vacuum suction on the upper surface of the rear stage holding member 9. The step roll 5 is moved to the upper position shown in FIG. 1, and the film roll 1 and the take-up roll 3 rotate the motor (not shown) to make the tension of the film 2A constant.

The cutter 8 is moved in the width direction of the film 2B while allowing the cutter 8 to pass through the groove portion of the rear end holding member 9, and the film 2B is cut in the width direction. The vacuum adsorption of the rear end holding member 9 which has been adsorbing the film 2B is stopped, and the debris of the film 2B on the rear end holding member 9 is discarded. At this time, the film 2B is vacuum-adsorbed on the tip holding member 7 in a state where the film 2B is pushed out from the tip of the tip holding member 7 onto the rear holding member 9 by about 10 mm. This completes the film sticking operation preparation S100, and then proceeds to the film sorghum processing S200.

In the film sorghum processing (S200), it is attached to the film conveying member 6, it drives by the cylinder 10, and the rear stage holding member 9 is retracted to the right as shown in FIG. Moreover, the film holding bar 20 is also retracted to the upper side of the crimping roll 14. Thereafter, the ball screw 12 is rotated with the servomotor 11 to move the film conveying member 6 in parallel with the tangent plane with respect to the outer circumference of the pressing roll 14 (moving downward in FIG. 1). At this time, the pair of pressing rolls 14 are open and are in a state heated by an internal heater.

And the air cylinder so that the front-end | tip of the film 2B becomes the contact point of the upper press roll 14 (the front-end position of the film 2B in the case where the film 2B becomes the tangential direction of the press roll 14). The tip holding member 7 is moved to (8). Here, a high voltage is applied from the electrostatic generator 17 to the electrode 16 so that the tip of the film 2B of about 10 mm that is pushed out of the tip holding member 7 between the electrode 16 and the pressing roll 14. The part is charged.

When the tip end portion of the film 2B is electrostatically adsorbed to the grounded pressing roll 14, the application of the high voltage to the electrode 16 is stopped from the electrostatic generator 17, and the vacuum suction of the tip holding member 7 is stopped. It stops and opens the adsorption holding of the film 2B. In this case, the tip of the film 2B is transported in parallel with the contact plane of the pressing roll 14 (the surface where the film 2B becomes the tangential direction of the pressing roll 14), thereby crimping the roll with a uniform electrostatic attraction force without wrinkles. We can hand over to (14).

After the delivery of the film 2B, the pressing roll 14 starts rotation in the conveying path direction of the substrate PB constituting the conveying roller 15, and conveys the adsorbed film 2B downward. At the same time as the start of conveyance, the motor torque force of the drive device of the film roll 1 and the take-up roll 3 is weakened, and the step roll 5 is moved downward. By moving the step | step roll 5 in synchronization with a film conveyance speed, the back tension (tension) of the film 2B is weakened and the conveyance of the film 2B by the crimping roll 14 is assisted.

In general, the electrostatic adsorption force of the film 2B by the pressing roll 14 is proportional to the large voltage, and the large voltage is proportional to the adsorption area of the pressing roll 14 and the film 2B. The pressing roll 14 is only at the front end of the film 2B, and has a weak large voltage, that is, a weak electrostatic adsorption force, and the film conveyance is unstable immediately after the film transfer to the pressing roll 14, so that the film 2B ) Back tension is reduced to facilitate the conveyance of the film 2B to the substrate PB side by the rotation of the pressing roll 14.

On the contrary, as the film winding angle by the press roll 14 becomes large, and the adsorption area of the press roll 14 and the film 2B increases, electrostatic adsorption force becomes strong and the holding | maintenance of the film 2B is stabilized. The step roll 5 is film tension adjusting means which can weaken the back tension of the film 2B, and can move up and down by an actuator etc. (not shown).

When the film 2B is adhered to the substrate surface, the step roll 3 is positioned on the upper side, and the step roll 5 is moved when the film 2B is conveyed to the bottom of the press roll 14 by the pressing roll 14. Move down. At this time, by moving the step roll 5 in synchronization with the conveying speed of the film 2B, the back tension of the film 2B can be weakened and the conveyance of the film 2B by the pressing roll 14 can be assisted.

In addition, when a fixed guide roll that cannot move in place of the step roll 5 is used, the film roll 1 and the take-up roll 4 are rotated in the unwinding direction by the driving device (for example, a motor). The back tension of the film 2B may be weakened, and the conveyance of the film 2B by the pressing roll 14 may be assisted.

An encoder (not shown) provided with the main shaft of the pressing roll 14 whether the tip of the film 2B has reached the center of the lower surface of the upper pressing roll 14 by the rotation of the pressing roll 14. It confirmed with the number of pulses from, and the crimping roll 14 stops rotation in the place which could be confirmed.

Moreover, immediately before the start of conveyance of the film 2B by the upper press roll 14, the adsorption of the film 2B by the tip holding member 7 is stopped, and the film 2B by the upper press roll 14 is stopped. After returning the front end holding member 7 to the air cylinder 8 in the upward direction during conveyance, the rear end holding member 9 is moved to the left to return to the initial state. Lined up with the holding member 7, it returns to the conveyance position of the film 2B. Thereafter, the film conveying member 6 is moved by the servomotor 11 to the cutting position of the film 2B.

Substrate positioning processing (S300) is simultaneously performed during film transfer processing (S200).

The substrate positioning process S300 or the substrate PB is preheated to a temperature approximately equal to the surface temperature of the pressing roll 14, and moves to the conveying roll 15 from the left side to the right side in FIG. 1. In this case, the movement amount is detected by a sensor (not shown), and the film adhesion start position of the front end portion of the substrate PB coincides with the front end of the film 2B located at the center of the lower surface of the upper press roll 14. At this point, the movement of the substrate PB is stopped once.

Thereafter, film bonding (S400) is performed.

In the film bonding process (S400), the upper and lower pressing rolls 14 move up and down in the direction of the substrate PB, and the substrates PB are sandwiched and held by both the pressing rolls 14 (nip) to the substrate PB. The tip of the film 2B is thermocompressed. Moreover, the step roll 5 is returned to the initial state (upper part of FIG. 1), and the relaxation of the film 2B is prevented between the step roll 5 and the crimping roll 14. As shown in FIG. At this time, the back tension of the film roll 1 may be strengthened once, and the relaxation of the film 2B may be prevented.

Next, the film holding bar 20 is moved between the electrode 16 and the pressing roll 14, which becomes the film rear end receiving position on the pressing roll 14, and after completion of movement, the left side of the film holding bar 20 The film 2B positioned at is gently vacuum-adsorbed by the film holding bar 20. Thereafter, both of the pressing rolls 14 are rotated while holding and niping the substrate 14, and the substrate 14 is conveyed to the right side, and the film holding bar 20 is pressed while sliding the film 2B. The film 2B on the roll 14 is thermocompression-bonded to the board | substrate 14.

The film holding bar 20 may be a surface treated with PTFE (polytetrafluoroethylene) or molded into engineering plastic (MC nylon) so that the film 2B is easily slid. Since the substrate PB is preheated, the resist film 2b does not lose heat when it comes into contact with the substrate PB. The substrate PB is maintained in a slightly softened state, and the substrate PB is heated by pressurizing the pressing roll 14. It is adhered to the upper surface of.

Moreover, the film cutting process (S500) is performed while the film conveyance member 6 of the film bonding process (S400) moves to the pressing roll 14 side.

In the film cutting process (S500), the film conveying member 6 gradually moves in the direction of the pressing roll 14 immediately before the position of the rear end of the film 2B passes over the cutting groove of the rear end holding member 9. It starts and synchronizes with the rotational speed of the crimping roll 14. As shown in FIG. During film thermocompression bonding (adhesion), the film portion which becomes the rear end of the film adhesion amount set in advance passes through the cutting groove of the rear end holding member 9 by the front end holding member 7 and the rear end holding member 9. The film 2B is adsorbed and held. The determination of whether the position which becomes the rear end of the film 2B passed on the cutting groove is confirmed by the number of pulses from the encoder provided in the main shaft of the film roll 1, the crimping roll 14, or the like.

In the film cutting, the film conveying member 6 moves the cutter 13 in the width direction during the moving time to the film tip receiving position to cut the film 2B. The widths of the films 2B and 2A coincide with the widths to be adhered to the substrate PB, and the widths of the films 2B and 2A coincide with the lengths to be adhered to the substrate PB by cutting by the cutter 13 and adhere to the surface of the substrate. It becomes the shape that we want to do.

After cutting the film 2B, the rear end holding member 9 moves to the right while adsorbing and holding the rear end of the film 2B to evacuate, but the film 2B is moved to the substrate PB side by the pressing roll 14. Since it is conveyed, it falls while sliding the upper surface of the rear end holding member 9, and is weakly vacuum-suctioned by only the film holding bar 20. As shown in FIG.

Just before the rear end of the film 2B slides on the film holding bar 20 and falls off, a high voltage is applied to the electrode 16 by the electrostatic generator 17 again, so that the film on the film holding bar 20 An electric charge is applied to the rear end of 2B), and the rear end of the film 2B is electrostatically adsorbed to the pressing roll 14 sequentially from the location moved from the film holding bar 20 to the pressing roll 14.

When the rear end of the film 2B passes the electrode 16, the application of the high voltage to the electrode 16 is stopped from the electrostatic generator 17, and the film holding bar 20 moves upward of the pressing roll 14. Evade.

Thereby, it is possible to hold | maintain the back end of the film 2B to the last, and to receive it to the crimping roll 14, and the back end of the film 2B does not sag over the board | substrate PB, but is a rear end from the front end of the film 2B. It is possible to adhere to the substrate PB while giving a constant tensile force.

Here, the relationship between adhesion of the film 2B by the press roll 14 to the board | substrate PB and the surface temperature in the press roll 14 is demonstrated.

The surface temperature of the pressing roll 14 is maintained at a temperature range where the resist film 2b starts to soften, and at this temperature, the film 2B is pressed from the base film 2c side to the pressing roll 14. When pressurized by the board | substrate PB by this, the resist film 2b is heated by the press roll 14, it softens a little and improves adhesiveness, and adheres and adheres to the board | substrate PB.

In order to satisfy the functions required for the resist films 2b and the base film 2c, in general, the softening start temperature of the resist film 2b constituting the film 2B is the deformation start temperature in the base film 2c. Although lower, in order to improve the adhesiveness of the resist film 2b with respect to the board | substrate PB, when the surface temperature of the crimping roll 14 is set to the temperature which starts the deformation | transformation of the base film 2c, the crimping roll 14 When the front end of the film 2B is picked up and electrostatically adsorbed from the front end holding member 7, the front end of the film 2B is deformed, stretched or swelled by heat, and the contact area with the pressing roll 14 is reduced. It falls, and it becomes impossible to maintain the electrostatic attraction force sufficient for conveyance. Even when the step roll 5 is moved to the pressing roll 14 side to loosen the back tension, the tip of the film 2B is peeled off from the pressing roll 14.

As such, the surface temperature of the pressing roll 14 is a temperature range such that the resist film 2b necessary for bonding the resist film 2b to the substrate PB starts softening, and the base film 2c is used. This deformation can be prevented, and furthermore, the pressing roll 14 can reliably adsorb and hold the tip of the film 2B to convey it to the substrate PB to perform the original function imposed on the pressing roll 14. It was.

Since the resist film 2b is slightly softened during the heat pressurization in which the pressing roll 14 adheres the film 2B to the substrate PB, the printed wiring film is somewhat present on the surface of the substrate PB. Even if there are irregularities, close contact without leaving bubbles.

Although the conveyance roller 15 rotates and conveys it to the downstream, the board | substrate 14 which crimped | bonded the film of the shape which wants to adhere to the surface of the board | substrate PB is conveyed to the downstream, In the meantime, there exists a 2nd press roll 21, and this crimping | compression-bonding is carried out. The roll 21 maintains the surface temperature at the same temperature as the surface temperature of the pressing roll 14, and heat-pressurizes the resist film 2b again through the base film 2c to obtain a close contact with the substrate PB. To increase.

The base film 2c is heated by the pressing roll 21, but the resist film 2b is not eluted, so that the surface of the base film 2c is kept flat and subjected to photolithography in a subsequent step. It does not cause optical obstacles such as refraction.

According to the specifications of the film 2A (2B) to be used, if the heating pressure by the ultra-short pressing roll 14 is sufficient, the pressing roll 21 stops heating and makes it remain in the open state, making it necessary. What is necessary is just to operate the press roll 21 accordingly.

Then, it is judged whether or not the new substrate PB is loaded next in the determination processing of whether or not it is finished, and if there is a next substrate PB, the process returns to the film transfer processing S200, and the processing operation described above. Repeat.

As described above, the front end portion and the rear end portion of the film are reliably adsorbed by the press roll 14 without causing the base film 2c to deform, and the whole roll from the front end to the rear end of the film of a shape to be bonded is rolled. Since it adhere | attaches on the surface of the board | substrate PB by (14), there is no step | step etc. in the bonded film, and it is a flat finish. Moreover, wrinkles and bubbles do not occur at the front end or the rear end of the film bonded to the substrate PB.

The film bonding apparatus is destaticating the silicone rubber surface of the pressing roll 14 by the antistatic device 19 located upstream with respect to the electrode 16 during the rotation of the pressing roll 14, and the pressing roll 14 The surface of the film 2B can be electrostatically adsorbed by maintaining the same surface state with potential. In addition, if the surface of the board | substrate PB with which the film was adhere | attached by the antistatic device 19 at the same time, you may not need to carry out an antistatic process later. In the antistatic device 19, the film holding bar 20 may also be charged when the film holding bar 20 is positioned above the pressing roll 14.

When the board | substrate PB is not conveyed continuously and a board | substrate standby state has arisen, the pressing roll 14 may be rotated and the silicon rubber surface may be always static-discharged.

In the above-described embodiment, the mechanism and method for adhering the film to the upper surface of the substrate PB have been described. However, when the film is to be adhered to the lower surface of the substrate PB, as shown in FIG. By arrange | positioning the same mechanism as the mechanism below the conveyance path, adhesion | attachment to the lower surface of a board | substrate becomes possible.

In Fig. 4, those having the same function and the same function as those shown in Fig. 1 are denoted by the same reference numerals.

In the embodiment of FIG. 4, the pressing roll 21 is brought close to the pressing roll 14 and heated and pressed by the pressing roll 21 while the surface temperature of the substrate PB is not lowered, thereby saving power. .

In embodiment in FIG. 1 or FIG. 4, the film holding bar 20 is abbreviate | omitted and the tip | tip which made the water supply to the press roll 14 of the rear end in the film 2B approach the press roll 14 vicinity. The holding member 9 may be used. In this case, since the rear end holding member 9 is located outside the dustproof cover 18 and is hardly affected by the charge application from the electrode 16, it is not necessary to perform static elimination.

In addition, in embodiment in FIG. 1 or FIG. 4, the sensor which detects the surface potential of the crimping roll 14 is attached to the crimping roll 14, and when the electric potential of more than a desired electric potential is reached, the static electricity elimination apparatus 19 will operate | move. Thus, power saving may be achieved.

In addition, only when the front end and the rear end of the film are delivered to the press roll 14, the film may not be electrostatically adsorbed, but static electricity may be charged to the entire surface of the film and adsorbed onto the press roll.

Moreover, similarly to the means which made the film adsorb | suck to the crimping roll 14, you may charge and hold | maintain a film by the static electricity and adsorb | suck to the front end holding member 7 and the rear end holding member 9, for example.

As explained above, according to this invention, it can adhere | attach on a board | substrate flatly without generating a level | step difference from the front end part to the rear end part of a film.

Moreover, according to this invention, it can adhere | attach on a board | substrate from the front-end | tip of a film to a rear end, without generating a wrinkle or a bubble.

Claims (11)

In the film bonding method of adhering the adhesive film layer side to a board | substrate by pressing the film of the shape which wants to adhere which has a 2-layered constitution of an adhesive film layer and a base film layer by a press roll from the base film layer side, Charge is applied to the tip of the film of the shape to be bonded to maintain the tip at an electrostatic force acting between the outer peripheral surface of the pressing roll, and the film of the shape to be bonded is rotated by the rotation of the pressing roll. The substrate is conveyed to the substrate to match the tip of the substrate to the bonding start position, and the film of the shape to be bonded is adhered to the surface of the substrate, and the rear end of the film of the shape to be bonded is charged to provide a charge. Maintained by the electrostatic force acting between both on the outer peripheral surface of the pressing roll, the whole film of the shape to be bonded from the leading end to the rear end is bonded to the substrate by the rotation of the pressing roll and rotated The pressing roll is the pressing holding the front end and the rear end by the outer peripheral surface of the pressing roll A film sticking method characterized in that the antistatic (除 電) at the upstream location. The method of claim 1, The tip of the film of the shape to be bonded is held by the outer circumferential surface of the pressing roll, and applied to the film of the shape to be bonded while the film of the shape to be bonded is conveyed to the substrate by the rotation of the pressing roll. The film bonding method characterized in that the tension is weakened. The method of claim 1, The pressure bonding roll is a film bonding method characterized in that the temperature of the surface is maintained at a temperature range such that the adhesive film layer starts softening. The method of claim 1, And the surface temperature of the pressing roll is maintained below a temperature at which the base film layer deforms. The method of claim 1, After adhering the entire film of the shape to be bonded to the substrate by the rotation of the pressing roll, the surface temperature is again raised to a temperature at which the adhesive film layer does not elute at a temperature equal to or higher than the surface temperature of the pressing roll. And pressing the substrate from the side of the base film layer with the second pressing roll held to increase the adhesion between the adhesive film layer and the substrate. The method of claim 1, The tip of the film of the shape to be bonded is matched to the starting position of the substrate by the rotation of the pressing roll to the substrate heated to the same temperature as the surface temperature of the pressing roll in advance. A film bonding method comprising adhering a film of a shape to the surface of the substrate. To the film bonding apparatus which presses the film of the shape which wants to have a two-layered constitution of an adhesive film layer and a base film layer by the press roll located in the conveyance path of a board | substrate from a base film layer side, and adhere | attaches an adhesive film layer side to the said board | substrate. In Holding the tip end of the pressing roll having a function of holding the film in the shape to be bonded at a constant power and the film in the shape to be bonded, and holding the tip at the outer circumferential surface of the pressing roll. A film rear end holding member for holding the member and the rear end of the film in the shape to be bonded and receiving the rear end in the outer circumferential surface of the pressing roll, and the front end and the rear end of the film in the shape to be bonded. Means for imparting the pressure and the means for static eliminating the pressing roll at an upstream position of the pressing roll which holds the front end and the rear end by the outer circumferential surface of the pressing roll when the pressing roll is rotating. The pressing roll maintains the tip portion at a static electric power on the outer peripheral surface of the static elimination, conveys a film having a shape to be bonded to the substrate by the rotation of the pressing roll, and the tip portion is attached to the starting position of the substrate. At the same time, the film having the shape to be bonded is adhered to the surface of the substrate, and the rear end is held by the electrostatic force on the outer circumferential surface of the pressing roll, which is also static discharged, and the rotation of the pressing roll The whole film | membrane made into the said shape to adhere | attach from the front-end | tip part to the said back | tip part is adhere | attached on a board | substrate, The film bonding apparatus characterized by the above-mentioned. The method of claim 7, wherein The means for static elimination is at least one of an antistatic brush and an ionizer film bonding apparatus. The method of claim 7, wherein The pressure bonding roll maintains the surface temperature at a temperature range where the adhesive film layer starts softening. The method of claim 7, wherein And the surface temperature of the pressing roll is maintained below a temperature at which the base film layer deforms. The method of claim 7, wherein 2nd press roll which maintained the temperature of the surface in the downstream of the said press roll in the conveyance path of the said board | substrate at the temperature more than the temperature of the same grade as the surface temperature of the said press roll, in which the said adhesive film layer does not elute. And pressurizing the substrate from the base film layer side with the second pressing roll to increase the adhesion between the adhesive film layer and the substrate.