KR100537471B1 - A film adherence method and apparatus - Google Patents

Abstract

TECHNICAL FIELD This invention relates to a film sticking method and its apparatus. Specifically, It is related with the method and the apparatus which stick the film of the shape which wants to stick to the surface of a board | substrate with a press roll.

In the present invention, as the pressing roll 13, the film 2b is held on the outer circumferential surface by electrostatic adsorption or adhesion, and the tip portion of the film 2b is pressed from the film tip holding member 5 by the pressing roll 13. To the outer circumferential surface of the substrate to hold the tip portion on the outer circumferential surface of the pressing roll 13, and to convey the film 2b to the substrate 14 side by rotation of the pressing roll 13 so that the tip portion of the substrate 14 is rotated. The film 2b is attached to the surface of the substrate 14 at the same time as the attachment start position, and the rear end of the film 2b is pressed from the film rear end holding member 6 to the outer circumference of the pressing roll 13 and pressed. The rear end portion is held around the outer side of the roll 13 to attach all of the film 2b to the substrate 14 by the rotation of the pressing roll 13.

Description

Film attaching method and its device {A FILM ADHERENCE METHOD AND APPARATUS}

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a film attaching method and an apparatus thereof, and more particularly, to a method and apparatus for attaching a film having a shape to be attached to a surface of a substrate by a pressing roll.

In the past, a film is removed from a film roll, and a continuous film is cut in the width direction, and the film is attached to the substrate surface by a pair of compression rolls as a film (hereinafter referred to as a film). A transport path holding the tip portion by a tip holding member such as a vacuum plate and attaching it to the substrate, and after the tip holding member is evacuated, sandwiching the film and the substrate with both pressing rolls and rotating the pressing rolls to form the substrate with a plurality of transfer rolls. Bonding the film to the substrate while conveying the planar shape, at the end of the pasting, retains the rear end portion of the film again with a terminal holding member such as a film bar, and attaches the rear end portion of the film onto the substrate. (See Japanese Patent Application Laid-Open No. 3-16906).

According to the above prior art, in the case where the front end or the rear end of the film is attached to the substrate and the middle part between the front end and the rear end of the film is attached to the substrate, there is a tendency to cause a difference in the pressing force because the members to be attached are different from each other. There was a step in the front end or the rear end of, which hindered the subsequent substrate processing.

For example, if the film is a resist film, there is a problem in that the light amount is changed by a step and a line is generated when the exposure is performed.

Moreover, since the holding member of the film rear end was not put in the space between the substrate and the pressing roll, the holding of the film rear end was stopped and released freely before the end position of attachment, so that the attachment of the film rear end was disturbed and wrinkles and bubbles were likely to occur.

It is therefore an object of the present invention to provide a film attaching method and apparatus capable of flatly adhering onto a substrate without generating a step from the front end to the rear end of the film.

Another object of the present invention is to provide a film attaching method and apparatus for attaching a film from a leading end to a rear end of a film without generating wrinkles or bubbles.

A feature of the method of the present invention which achieves the above object is a film attaching method for cutting a film continuous from a film roll and attaching a film of a shape desired to be attached to the surface of the substrate to the surface of the substrate by a pressing roll. In the above, the tip end of the film of the shape to be pasted to the outer circumferential surface of the pressing roll by holding the film on the outer circumferential surface by electrostatic adsorption or adhesion as the pressing roll, and the rotation of the pressing roll The film of the shape to be pasted is conveyed to a board | substrate, the said front-end part is made to match with the attachment start position of a board | substrate, the film of the shape to be pasted is affixed on the surface of a board | substrate, and the rear end of the film of the shape to be pasted is also crimped. The mold to be pasted from the leading end to the rear end while maintaining the outer circumferential surface of the roll By all of the film to the rotation of the press roll it is attached to the substrate.

In addition, a feature of the present invention which achieves the above object is that the film is attached to a film formed by cutting a film continuous from a film roll into a shape that is desired to be attached to the surface of the substrate by a pressing roll. An apparatus, comprising: a squeeze roll for holding the film in the shape to be pasted on the outer circumferential surface by electrostatic adsorption or adhesion, and a tip portion of the film in the shape to be pasted to hold the tip to the outer circumferential surface of the squeezing roll. And a film end holding member for receiving the film tip holding member and a film rear end holding member for holding the rear end of the film in the shape desired to be attached and receiving the rear end on the outer circumferential surface of the pressing roll. The shape of the shape to be attached is maintained by the rotation of the pressing roll while maintaining the tip portion at its outer circumferential surface. The film is conveyed to the substrate to match the tip to the attachment start position of the substrate, and at the same time, the film having the shape to be attached is attached to the surface of the substrate, and the rear end is also maintained on the outer circumferential surface of the pressing roll. It is to stick all the films in the said shape to stick to the board | substrate from the said front end part to the said back end part by rotation of a crimping roll.

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According to the present invention, since the pressing member is not changed with only the pressing rolls, the film having the shape to be attached to the substrate can be attached to the substrate flatly without generating a step.

Furthermore, since all the films of the said shape to be stuck are stuck to a board | substrate with a crimping roll from a film front end part to a rear end part, wrinkles and a bubble are not generated.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing of the film sticking apparatus which becomes one Embodiment of this invention.

In order to convey the film 2 from the film roll 1, and to convey the continuous film 2 to the conveyance path side of the board | substrate 14 which comprises the several conveyance roller 15, it is the lower side of the film roll 1 There exists a guide roll 3 in this, and the cover film 2a is peeled off and it changes direction as the film 2b here. The roll roll 4 is adjacent to the film roll 1, and the cover film 2a peeled off with the guide roll 3 is wound up.

The film 2 is formed of three layers of the cover film 2a, the resist film 2c shown in FIG. 4, and the base film 2d, and the cover film 2a and the resist film from the inside as the film roll 1 (2c), the base film (2d) is wound in order.

The drive device (for example, a motor) of the film roll 1 and the take-up roll 4 is provided with the function which adjusts a torque according to the remaining film quantity, and makes the tension of the film 2 constant and conveys it.

Under the guide roll 3, a film leading holding member (hereinafter referred to as a front end holding member) 5 and a film trailing holding member (hereinafter, referred to as the front end holding member) which suction and hold the front end and the rear end of the film 2b and convey them to the left side of the drawing. And a cutter 8 for cutting the film 2b in the width direction.

As shown in FIG. 3, inside the tip holding member 5, the vacuum chambers 5a to 5e and the upper surface of the film 2b are arranged in the longitudinal direction (left and right direction of the drawing in the conveying direction) of the film 2b and the film 2b. ), There are suction holes communicating with each of the vacuum chambers 5a to 5e and arranged in the width direction of each column, and each of the vacuum chambers 5a to 5e communicates with the vacuum source via a common intermediate valve (not shown). It is supposed to adsorb. The tip retaining member 5 has a trapezoidal shape in which a cross section extending at an acute angle with a flat top surface is cut off from the bottom of the tip portion, and a vacuum chamber (near the tip of the sorghum) is used in order to suppress the bending (curl) of the film 2b. 5e) and a suction hole are provided.

A pressure sensor for monitoring the vacuum state is provided in the piping between each of the vacuum chambers 5a to 5e and the common intermediate valve. The suction position of the film 2b is shifted due to some reason, and the film 2b is placed on the upper surface of the suction hole. When this position is not located, the vacuum pressure falls and the adsorption state of the film 2b is monitored.

Like the front end holding member 5, the rear end holding member 6 also has vacuum chambers 6a to 6e therein and adsorption holes on the upper surface thereof, and vacuum chambers 6a to 6c on the upstream side and vacuum chambers 6d and 6e on the downstream side. Are connected to a common vacuum source by individual valves.

A pressure sensor for monitoring the vacuum state is provided in each of the piping between the upstream vacuum chambers 6a to 6c and the individual valves and the piping between the downstream vacuum chambers 6d and 6e and the individual valves. When the adsorption position of a film shifts by the cause and a film is not located in the upper surface of an adsorption hole, the adsorption state of a film is monitored because the vacuum pressure fell.

The rear end holding member 6 also has a trapezoidal shape in which the upper surface is elongated at an acute angle by cutting the lower end of the tip portion, and the vacuum chamber 6e and the suction hole are provided near the sorghum tip, and the vacuum chambers 6a to 6c are provided. The piping system is separated, and sufficient tensile force acts on the film 2b to the end of the millet (the millet will be described later) to the pressing roll 13 (FIG. 1) of the rear end part in the film 2b.

In addition, the rear end holding member 6 has a groove 6T in a width direction (direction perpendicular to the ground in Fig. 1) orthogonal to the conveying direction (left side in Fig. 1) of the film 2b on the upper surface between the vacuum chambers 6a and 6b. ), And functions as a cutter tray when the film is cut in the width direction by the cutter (8). By cutting the film 2b in the width direction with the cutter 8, the film 2b is in a shape to be attached to the substrate.

The cutter 8 is provided with an air cylinder (not shown) in the film conveying member 11 so as to be movable in the vertical direction, and when not cutting (cutting in the width direction) of the film 2b, Fig. 1 We assume mechanism to be able to retreat upwards.

Returning to FIG. 1, the film conveying member 11 fixes the air cylinder 12, and is screwed with the ball screw 10 which rotates with the servomotor 9, and is shown by the servomotor 9, FIG. Move left and right in direction.

The rear end holding member 6 is engaged with the air cylinder 12 via a connecting member (not shown), and the pair of pressing rolls 13 are moved vertically to the conveying path side to sandwich the substrate 14. It moves vertically to the air cylinder 12 to be the same position as the outermost maximum position of the.

Moreover, the film conveying member 11 fixes the air cylinder 7, and the front end holding member 5 also moves the rear end holding member 6 in the vertical direction to the air cylinder 12 so that the rear end holding member 6 can be moved from the front side. ) Is retracted, the air cylinder 7 moves to the pressing roll 13 side, and the front end of the film 2b is received on the pressing roll 13 (sorghum will be described later).

In addition, although the front end holding member 5 was not shown in figure, the stopper member is provided so that the approach position adjustment with respect to a pair of crimping roll opened in the direction away from the conveyance path side of the board | substrate 14 is attained.

The pair of pressing rolls 13 are above and below the conveying path of the substrate 14 constituting the plurality of conveying rollers 15, and the substrates 14 conveyed from the left side to the right side of each conveying roller 15 in the drawing. ) Is arranged to be movable so as to be fitted from the vertical direction. Up and down movement is performed by the air cylinder, but illustration is omitted.

The pressing roll 13 is made of a silicone rubber coated on the roll body and its outer circumferential surface. There is a heater inside the roll body.

That is, the press roll 13 is a structure which coat | covered the metal roll main body and the outer peripheral side about 1.2 mm in thickness with the rubber (silicone rubber etc.) excellent in heat resistance. Further, a cylindrical heater is provided on the central axis side of the metal roll main body, and a jacket in which liquid such as water or oil is enclosed is formed concentrically on the outer circumference of the heater. By energizing and heating a heater, the jacket on the outer periphery side can be heated, and the whole roll can be heated uniformly. In addition, the compression roll 13 is configured to hold the film 20 by electrostatic adsorption. However, when silicone rubber is used on the rubber covering the outer circumference, the electrical resistance increases, but the thickness is about 1.2 mm, so the electrostatic adsorption It doesn't matter. In addition, when the conductive rubber is used as the heat resistant rubber, the electrostatic adsorption effect is increased.

The sensor 26 which detects the front-end | tip of the board | substrate 14 in conveyance is provided between the crimping roll 13 and the conveyance roller 15 of an inlet side, and the control apparatus 23 demonstrated later is the sensor 26. The control of the conveyance roller 15 which conveys and stops the board | substrate 14 to the predetermined position under the crimping roll 13 based on the signal which detected the front end of the board | substrate 14 is carried out.

At least the upper pressing roll 13 is grounded, and the upper electrode 16 is provided as a pressing roll charging means, and the electrode 16 is connected to the electrostatic generator 17.

When a high voltage is applied to the electrode 16 from the electrostatic generator 17, the film 2b conveyed to the lower side of the electrode 16 is charged, and the front end portion of the film 2b is squeezed by a coulomb force. (13) It adheres to the surface. The dustproof cover 18 is provided so that the upper compression roll 13 and the electrode 16 may be enclosed. For this reason, dust etc. do not adhere to the film 2b charged by the electrode.

The control unit 23 for controlling the operation of the apparatus includes a monitor screen 24 for displaying data such as the film attachment length, a motor constant for driving the apparatus, a memory for storing data or programs, and a data input unit. The keyboard 25 is attached. It also includes a program for executing the operating steps of the apparatus (described later in accordance with Fig. 2), an operation screen program for setting data on the monitor, and the like.

The data setting in the control device 23 will be described below.

As shown in FIG. 4, the attachment length (length to stick to the surface of a board | substrate) L of the film 2b, arbitrary positions in the board | substrate 14 (for example, distance S from the board | substrate tip Ep) Position] is the attachment condition data. Moreover, as shown in FIG. 5, the distance g from the origin position Q of the film conveying member 11 to the film receiving position (the initial position of conveyance of the crimping roll) W to the crimping roll 13, and the crimping roll ( Circumferential distance r from the conveyance initial position W of the 13 to the position P where the pressing roll 13 inserts the board | substrate 14, and starts bonding of the film 2b, The board | substrate 14 in conveyance Position where the substrate 14 is inserted into the pressing roll 13 from the position E of the sensor 26 that detects the tip of the sensor 26 and the bonding of the film 2b starts (the tip position of the film 2b) (P). The conveyance condition data, such as the distance k for board | substrate positioning, is set.

From the above setting data, the distance d from the origin position Q to the film cutting position [the rear end position of the film 2b] (D) by the cutter 8 and the substrate conveyance distance Z by the conveying roller 15 ) Is automatically set by the control unit 23 by performing the following operation.

d = (g + r)-L

Z = k + s

About setting of this cutting position D, an address is given to each position between the distance g from the origin position Q to the film delivery position W to the crimping roll 13, When the distance d is determined, the address of the position corresponding to the distance d is calculated so that the cutter 8 moves directly to the position of the corresponding address without returning to the origin position Q. FIG.

For the addressing, if the addressing with the sign of-from the origin position Q toward the guide roll 3 side is made, the guide roll from the origin position Q even if the attachment length L of the film 2b is long. The position toward the (3) side can be a film cutting position D by the cutter 8.

In the case of moving cutting with the cutter 8 while moving the film 2b, the cutting start position of the cutter 8, that is, the standby position, is cut in the moving speed of the film 2b and the width direction of the cutter 8. It is good to set it as the upstream point which was inverted from the speed and the cutting distance (width of the film 2b).

Next, the operation of the film attaching apparatus will be described according to the flow shown in FIG.

First, the film attachment operation preparation of step (hereinafter referred to as "S") 100 is performed.

As a preparation for performing a film sticking operation, the film 2 is taken out from the film roll 1 manually, it is handed to the guide roll 3, and the cover film 2a is peeled off. The peeled cover film 2a is wound around the reel roll 4. The film 2b from which the cover film 2a is peeled off is drawn out to the front end of the rear end holding member 6 and vacuum-absorbed on the upper surfaces of the front end holding member 5 and the rear end holding member 6.

At this time, the film roll 1 and the rewind roll 4 operate the motor (drive device) which is not shown in figure, and make the tension of the film 2b constant.

The cutter 8 is moved in the width direction of the film 2b while allowing the cutter 8 to pass through the groove (groove 6T in FIG. 3) of the rear end holding member 6, thereby moving the film 2b in the width direction. Cut. The vacuum suction is stopped by closing the valve of the piping system of the rear end holding member 6 that has been adsorbing the film 2b, and the scab of the film 21 on the rear end holding member 6 is discarded.

At this time, on the tip holding member 5, the film 2b is vacuum-absorbed in the state which pushed out about 10 mm from the tip of the tip holding member 5 (refer FIG. 3).

In this step, the above-described attachment condition data (attachment length L, distance S), conveyance condition data (distance g, circumference distance r), distance d or substrate by the conveying roller 15 The control device 23 is inputted from the keyboard 25 while referring to the setting screen such as the conveying distance Z or the number of substrates to which the film 2b is attached on the setting condition while referring to the setting screen displayed on the monitor screen 24. It is stored in the storage means of the memory. In addition, the number of substrates is automatically counted down each time a processing is finished by the processing program.

This completes the film attachment operation preparation (S100), and then proceeds to film sorghum processing (S200) of FIG.

In the film feed processing S200, as shown in FIG. 6, the ball screw 10 is rotated by the servomotor 9, and the film 2b on the tip holding member 5 is crimped upward by the film conveying member 11. It is moved in parallel to maintain the same height as the top of the outer circumference of the roll (13). During this movement, the rear end holding member 6 is retracted downward by driving the cylinder 12 provided in the film conveying member 11.

At this time, the pair of pressing rolls 13 are open and are in a state heated by an internal heater. And the front end holding member 5 is moved again with the air cylinder 7 so that the front-end | tip of the film 2b may become the uppermost position of the upper press roll 13. When the tip of the film 2b is positioned at the top of the upper press roll 13, a high voltage is applied from the electrostatic generator 17 to the electrode 16 provided above the upper press roll 13 and the electrode A tip portion of the film 2b of about 10 mm that is between the 16 and the pressing roll 13 and pushed out from the tip holding member 5 is charged. After the tip portion of the film 2b is held by electrostatic adsorption on the outer circumferential surface of the pressing roll 13, the application of the high voltage from the electrostatic generator 17 to the electrode 16 is stopped.

By conveying the film 2b to the pressing roll 13 side by the tip holding member 5, the pressing roll 13 can be fed with a uniform suction force without causing wrinkles to occur at the tip portion of the film 2b.

After the delivery of the film 2b, the pressing roll 13 starts the rotation in the direction of the conveying path of the substrate 14 constituted by the conveying roller 15, and the tip 2 before the conveyed film 2b is conveyed downward. The film 2b starts to be conveyed downward with the rotation of the pressing roll 13 by opening the valve in the piping system on the holding member 5 side and releasing the vacuum suction of the film 2b. In the place of the guide roll 3, the cover film 2a is peeled off in accordance with the winding-up of the film 2, and the cover film 2a is wound up by the rewind roll 4. As shown in FIG.

By the number of pulses from the encoder provided in the compression roll 13 which did not show whether the tip of the film 2b reached the center of the lower surface in the upper compression roll 13 by the rotation of the compression roll 13, It confirms and the rotation of the crimping roll 13 is stopped in the place which could be confirmed.

In this case, the press roll 13 starts rotation to the conveyance path direction of the board | substrate 14 comprised from the conveyance roller 15, and the board | substrate (2b) which adsorbed-held and held the board | substrate 14 is sandwiched (pinched) and conveyed by the distance r (the half circumference of the outer periphery in the crimping roll 13) to the position P which starts bonding of the film 2b.

In addition, after the tip holding member 5 is returned to the air cylinder 7 while the film 2b is being conveyed, the rear holding member 6 that has been retracted is raised to line up with the tip holding member 5 so as to be lined up with the film 2b. Return to the return position of.

Thereafter, the film conveying member 11 is retracted and moved by the servomotor 9 in order to cut the film 2b in the width direction so as to have a required length.

Thereafter, in order to cut the film 2b in the width direction with the cutter 8, the cutting position D direction of the film 2b is obtained from the origin position Q obtained by the above-described first equation according to the attachment film size L. The rear end holding member 6 serving as the cutter 8 or the pedestal is moved by the servomotor 9 via the film conveying member 11 at a position corresponding to the distance d. As described above, the cutter 8 waits at the address corresponding to the cutting position directly without returning to the origin position Q as described above.

Substrate positioning process (S300) is performed simultaneously in film feed processing (S200).

The board | substrate 14 moves to the conveyance roll 15 from the left side to the right direction of FIG. In this case, when the front end of the board | substrate 14 in conveyance is detected by the sensor 26, the movement amount of the board | substrate 14 is calculated from the rotation amount of the conveyance roll 15, and the film attachment start position of a board | substrate front end is the upper press roll 13 The movement of the board | substrate 14 is stopped once in the place corresponded with the front-end | tip of the film 2b located in the lowest part in the process.

That is, the conveyance roller 15 detects the tip Ep (refer FIG. 4) of the board | substrate 14 by the sensor 26 during conveyance, and from the mounting position E (refer FIG. 5) of the sensor 26 is conveyed. Substrate conveyance distance Z which adds the distance k for board | substrate positioning to the board | substrate positioning position P by the crimping roll 13 from the board | substrate front end of an attachment condition to the position of distance s (described above). The substrate 14 is transported so that the substrate tip Ep is positioned at the position of Equation 2), that is, the substrate 14 is positioned at the attachment starting position P of the substrate 14 and the film 2b. Stop.

Then, the film adhesion process (S400) shown in FIG. 2 is performed.

In the film bonding process S4OO, the upper and lower press rolls 13 move in the direction of the substrate 14 as shown in FIG. 1 to hold and nip the substrates 14 with both press rolls 13, 14) is thermocompression-bonded to the tip of the film 2b. At this time, when the film 2b is loosely formed between the guide rolls 3 and the pressing rolls 13 by the catenary (Note: one of the curves shown by the formula), the film roll 1 Back tension may be strengthened to eliminate the looseness of the film 2b. Next, the film 2b on the upper end of the front end holding member 5 and the rear end holding member 6 is held by vacuum suction, and the film conveying member 11 is rolled up in synchronization with the rotation of the pressing roll 13. Move to the (13) side. Both press rolls 13 rotate and hold the board | substrate 14, thermocompression-bonding the film 2b to the board | substrate 14 with the upper press roll 13, conveying the board | substrate 14 to the right. The thermocompression amount controls the rotation amount of the pressing roll 13 with the controller 23 according to the film adhesion size (film adhesion amount L).

The film cut process (S500) shown in FIG. 2 is performed during the movement to the upper side pressing 13 side of the film conveyance member 11 in the film adhesion process (S400).

In the film cut process (S500), in the film conveying member 11 during a movement, the film 2b in the upper part of the front end holding member 5 and the rear end holding member 6 is vacuum-sucked, and the cutter 8 is carried out. Is moved in the width direction to cut (movement cut) the film 2b. By this cutting, the film 2b being attached to the substrate 14 becomes the required length to adhere to the substrate 14.

In the film cut process (S500), there is no relative speed relationship between the moving speed of the cutter 8 in the width direction and the moving speed of the film conveying member 11, and the film conveying member 11 is in close proximity to the pressing roll 13. The cutter 8 speed is adjusted to complete the cutting operation.

After cutting of the film 2b, as shown in FIG. 7, the rear end holding member 6 was moved to the same height as the uppermost outer periphery of the press roll 13 closed by the air cylinder 12 which can be moved vertically. Further, the tip of the rear end holding member 6 is moved to the top and bottom position of the outer circumference of the pressing roll 13 by the film conveying member 11, and then high voltage is applied to the electrode 16 again.

At this time, the rear end of the film 2b is squeezed from the adsorption hole column side communicating with the vacuum chamber 6a of the rear end holding member 6 toward the adsorption hole column side communicating with the vacuum chamber 6e. Is returned. The pressure of each of the vacuum chambers 6a to 6e gradually approaches the atmospheric pressure because the film 2b opens the intake hole row in accordance with its conveyance.

Each of the vacuum chambers 6a to 6e is divided into valves in the piping system between the vacuum chambers 6a to 6c and the vacuum chambers 6d and 6e, and the valves on the vacuum chambers 6a to 6c which are at atmospheric pressure by monitoring the degree of vacuum with a pressure sensor. Since the vacuum chamber 6d, 6e side does not become atmospheric pressure at all, it is possible to hold the rear end of the film 2b to the last, and to feed it to the pressing roll 13, so that the rear end of the film 2b is closed. Since it does not hang down and passes to the back end of the film 2b securely to the back end of the film 2b reliably, and after it is transported to the rear end of the substrate 14 by electrostatic adsorption, the film 2b to be pasted Not only can it be attached with constant tensile force at all times, but it does not cause wrinkles or bubbles.

After returning to the board | substrate 14 of the film 2b by the crimping roll 13, after returning to the board | substrate 2b of the film 2b, after returning the front-end | tip holding member 5 to the air cylinder 7, it was evacuated. The rear end holding member 6 is raised to the air cylinder 12 to return to the initial state, and the rear end holding member 6 is lined up horizontally with the front end holding member 5 to return to the initial position of conveyance of the film 2b. The cutter 8 returns to the cutting start position after retracting upward in FIG. 1.

At the time of bonding (during crimping), the film 2b has a two-layer structure of a base film and a resist, and is configured such that the resist surface comes to face the substrate 14. That is, the base film side is electrostatically absorbed and wound on the pressing roll 13. When the film 2b is wound, the pressing roll 13 is heated, and the film 2b is also heated by this heat. For this reason, the resist on a base film melts and it will be in the state which has moderate viscosity. The film 2b is in close contact with the substrate 14 by thermocompression bonding the film 2b to the substrate 14 with the pressing roll 13. At this time, since the adhesion force (adhesive force) of the film 2b and the substrate 14 is larger than the electrostatic attraction force acting between the film 2b and the compression roll 13, the film 2b is simply peeled off from the compression roll 13. Lose.

The substrate 14 that has been thermally compressed is transported to the downstream side by rotating the conveying roller 15, and is checked in S600 to determine whether the substrate 14 is to be processed. S200), the process returns to the substrate positioning process S300, and the above-described process is repeated.

In the case of returning to the film feed processing (S200), from the operation of moving the tip holding member 5 to the air cylinder 7 so that the top end of the film 2b is at the top position W of the pressing roll 13. Repeat.

Since the attachment of the film 2b to the substrate 14 is carried out only with the pressing roller 13, no difference in adhesion force occurs depending on the position, and since the outer circumferential surface of the pressing roller 13 is cylindrical and there are no irregularities, the substrate The film 2b pasted on (14) is flat and has no step, and does not cause inconvenience in post-treatment to the substrate 14.

Moreover, since lamination | stacking and cutting of a film are performed based on detection of the front-end | tip of a board | substrate, it does not cause a delay in cutting | disconnection, and can cut | disconnect to length to cut.

Moreover, since the cutting position of a film can be set freely, it can also stick only to the center part of a board | substrate in a frame shape, without sticking a film around a board | substrate.

In film sorghum processing (S200), the position (P) at which the film 2b electrostatically adsorbed by the pressing roll 13 is inserted into the lower pressing roll 13 from the top W position of the upper pressing roll 13. And the film 2b is heated by the internal heater of the crimping roll 13. When the deformation | transformation of the film 2b by heat is considered, you may turn off the power supply of the internal heater of the crimping roll 13, or you may not install a heater.

In order to obtain a stronger tensile force to the film 2b in the rear stage holding member 6, the number of adsorption holes may be increased, or each of the rows of adsorption holes may be divided into a vacuum chamber.

As shown in FIG. 8, in some of the front end holding member 5 and the rear end holding member 6, it is set as the electrostatic adsorption means 27 and 28 which adsorb | suck the film which embeds the electrode in a plastic composite board. By applying a voltage, the film may be held and conveyed by a combination of vacuum adsorption and electrostatic adsorption, or the adsorption may be performed by electrostatic adsorption so as to switch the adsorption position by a switch.

The holding | maintenance of the film 2b by the press roll 13 is not limited to electrostatic adsorption, It can be set as the adhesive holding which formed the outer peripheral surface of the press roll 13 by the adhesive substance.

In the pressure-sensitive adhesive roll 13, the film 2b is formed by the difference between the adhesive force against the base film 2d in the film 2b of the pressing roll 13 and the adhesive force against the substrate 14 of the resist film 2c. ) Is peeled off from the pressing roll 13 and attached to the substrate 14 by the pressing roll 13. In this case, the film 2b holds not only the front end portion and the rear end portion but also the entire surface by the pressing roll 13.

In the embodiment of FIG. 1, the cutter 8 is located above the downstream side of the crimping roll 13 in the conveying path of the substrate, and even when debris is generated when the film 2b is cut by the cutter 8, the substrate ( Since it does not fall onto 14, there is no contamination of the substrate 14.

If the front end or the rear end of the film 2b is carried out with respect to the outer circumferential surface of the pressing roll 13, the receiving position may not be the uppermost portion of the pressing roll 13.

FIG. 9: shows the film sticking apparatus which is another embodiment which provided the heater roll 29 newly to the film sticking apparatus of FIG.

The heater roll 29 is above and below the conveyance path comprised by the some conveyance roller 15 similarly to the crimping roll 13, and the conveyance roller 15 conveys the board | substrate 14 which conveys toward the right side from the left of the figure. It is arrange | positioned so that a movement is possible from the up-down direction. The vertical movement of the heater roll 29 according to the conveyance of the board | substrate 14 is performed with the air cylinder not shown in figure.

The board | substrate 14 which fully crimped the film 2b with the crimping roll 13 based on the operation | flow flow of the film adhesion shown in FIG. 2 is conveyed by the conveyance roll 15 to the downstream side.

In this case, the movement amount of the board | substrate 14 is detected by the sensor which is not shown in figure, and a movement stops once in the place where the film attachment start position is located in the center of the lower surface in the upper heater roll 29. FIG. Here, the upper and lower heater rolls 29 move in the direction of the substrate 14, and the substrate 14 is sandwiched by the heater roll 29 to nip and thermocompress. Thereafter, both the heater rolls 29 are rotated with the substrate 14 sandwiched and held (nip), and are conveyed to the downstream with the conveying roll 15.

In this embodiment, it press-bonds at normal temperature in the crimping roll 13, and this crimping | compression-bonding is performed in the heater roll 27, and the film 2b deform | transforms during conveyance of the film 2b by the crimping roll 13. Can be avoided.

It is a schematic sectional drawing which shows the film sticking apparatus which is another embodiment.

In this embodiment, in embodiment shown in FIG. 1, the nozzle 31 is provided in the position which receives the front-end | tip part of the film 2b to the crimping roll 13, ie, the electrode 16 vicinity, and the film ( The second electrode 32 is provided as a charging means at a position where the rear end of 2b is attached to the substrate by the pressing roll 13, that is, in the vicinity of the transport path of the substrate 14, so that the second electrode 32 is an electrostatic generator ( 17).

When the tip end of the film 2b is delivered to the pressing roll 13, clean gas is blown out from the nozzle 31 on the tip end of the film 2b. In this case, when a high voltage is applied from the electrostatic generator 17 to the electrode 16, the amount of charge that flows out of the electrode 16 toward the film 2b is increased by the clean gas flow ejected from the nozzle 31. The tip end of the film 2b is sufficiently charged so that the tip end of the film 2b to the pressing roll 13 is smoothed, and the adhesion to the pressing roll 13 of the tip end of the film 2b is improved by blowing gas. .

In addition, the second electrode 32 applies a high voltage to the second electrode 32 from the electrostatic generator 17 when attaching the rear end of the film 2b to the substrate with the pressing roll 13.

The rear end of the film 2b is discharged while the charge charged by the electrode 16 is being transported from the substrate 14 side by the pressing roll 13 to the second electrode 32 even though the holding force may be reduced. As a result, the rear end portion of the film 2b is charged again, and there is a sufficient charge amount, so that the film is not peeled from the outer circumferential surface of the pressing roll 13 during bonding while being in close contact with the outer circumferential surface of the pressing roll 13. It can be more firmly attached to the rear end of 2b) without generating wrinkles or bubbles. Moreover, you may perform charging of the film 2b by the 2nd electrode 32 with respect to the front-end | tip part of the film 2b.

The nozzle 31 and the second electrode 32 need not be installed at the same time, and may be performed separately.

In the above-mentioned embodiment, although the film 2b was attached to the upper surface of the board | substrate 14, when it is desired to stick a film also to the lower surface of the board | substrate 14, the film roll 1 below the conveyance path | route of the board | substrate 14 is carried out. What is necessary is just to provide the film conveyance member 11 containing the cutter 8, and an electrode etc. symmetrically as a crimping roll charging means. In addition, when using an adhesive type | mold crimping roll, an electrode is unnecessary.

Next, another embodiment will be described with reference to FIG. 11.

In the embodiment of Fig. 11, a film is attached to a circular semiconductor wafer.

The film 2 is stuck between the film roll 1 and the reel roll 4, and in the figure, the left side is an upstream side, and the right side is a downstream side.

On the conveyance path of the film 2 from the film roll 1 to the take-up roll 4, the film half cutter mechanism 33, the film position monitoring camera 34, the electrostatic adsorption-type or adhesive-type pressing roll ( 13), the semiconductor wafer position monitoring camera 35 is provided. The electrostatic adsorption crimping roll 13 incorporates an electrode as a charging means inside the roll.

The film 2 has a three-layer structure of a base film, a resist film and a cover film from above. The film half cutter mechanism 33 receives the pedestal 33a from the lower side of the film 2, and cuts the entire thickness of the base film and the resist film in a circle from the upper side of the film 2 to the cutter 33b. A part of the cover film may be cut but the entire thickness is not cut. Therefore, the base film and the resist film wound in a circular shape constitute a film 2b having a shape (circular shape) to be attached to the semiconductor wafer 36, and on the downstream side of the film half cutter mechanism 33, it is placed on the cover film. It is.

From the device design, the position of the tip of the film 2b to be pasted (shaped) and the bottom of the lower pressing roll 13 to be pasted at the time of half cutting the film half cutter mechanism 33 in a circle (in the shape) The distance from the position corresponded to the position W shown in FIG. 4 which accepts the position of the front-end | tip part of the film 2b can be grasped. And it is understood from the moving speed of the film 2 that the tip of the film 2b has reached a position corresponding to the position W of Fig. 4 which receives the position of the tip of the film 2b to be shaped (shaped). The pressing roll 13 rotates there, and the tip end of the film 2b can be held and conveyed at the bonding start position (position P in FIG. 4) of the film 2b of the semiconductor wafer 36. .

The semiconductor wafer 36 is inserted between the pressing rolls 13 from the downstream side by a robot hand known in the semiconductor manufacturing field (not shown). The film position monitoring camera 34 monitors the position of the film 2b in the shape (circle) to be attached, and the semiconductor wafer position monitoring camera 35 monitors the position of the semiconductor wafer 36 on the robot hand, and the robot The hand is operated to adjust the position of the semiconductor wafer 36 so as to coincide with the desired position of the film 2b and the lower surface of the semiconductor wafer 36.

The film 2 passes through the lower side of the lower pressing roll 13 to add up the moving speed of the film 2 and the circumferential speed of the pressing roll 13, and the film 2b is peeled off from the cover film 2a and is lowered. It is held by the electrostatic adsorption or adhesion to the pressing roll 13 to reach the lower surface of the wafer 36, and at the same time passes through the pressing roll 13 to perform the attachment. The wafer 36, which has passed between the pressing rolls 13 and completed the attachment of the film 2b, is accepted by a robot hand (not shown) and temporarily stored in a storage cassette or the like.

In this embodiment, the film 2 itself functions as the front end holding member and the rear end holding member of the film 2b to be attached shown in FIG. 1, and the structure is simplified.

Also in this embodiment, only the pressing roll 13 attaches the film 2b to the wafer 36, no wrinkles or bubbles are generated after adhesion, and there are no lines due to the different pressing members.

The press roll 13 does not contact a resist film, and the press roll 13 does not become dirty with a resist.

Although the said embodiment demonstrated that the electrode 16 (charging means) shown in FIG. 1 was built in the crimping roll 13, when it is desired to stop the embedding in the crimping roll 13, the crimping roll shown by the dotted line in FIG. What is necessary is just to install the thing equivalent to the electrode 16 in the upstream position of (13).

The embodiment of Fig. 11 indicates that the shape to be pasted may be of any shape such as a circle, but the embodiment of Fig. 11 can be used even when the film is to be rectangularly attached to the substrate as shown in Fig. 1.

As described above, according to the present invention, the film can be flatly attached onto the substrate without generating a step from the front end portion to the rear end portion of the film.

Moreover, according to this invention, it can stick on a board | substrate from the front-end | tip of a film to a rear end, without generating wrinkles and an air bubble.

1 is a schematic cross-sectional view showing a film attachment device that is an embodiment of the present invention;

FIG. 2 is a flow chart for explaining an operation procedure in the film attaching device of FIG. 1;

3 is a view showing the rear end holding member and the front end holding member in the film attaching apparatus of FIG. 1 when the film attaching operation preparation of FIG. 2 is completed;

4 is a view for explaining the dimensions and positional relationship of the film to be attached to the substrate;

5 is a diagram for explaining setting of film attachment in the film attachment device of FIG. 1;

FIG. 6 is a view showing a situation such as a film front end holding member or the like in the film attaching device of FIG. 1 in the film water treatment of FIG. 2; FIG.

FIG. 7 is a view showing a situation of a film rear end holding member or the like in the film attaching device of FIG. 1 in the film attaching process of FIG. 2; FIG.

8 is a view showing a configuration in which the electrostatic adsorption means is used for part of the film front end holding member and the rear end holding member in the film attaching apparatus of FIG. 1;

9 is a schematic cross-sectional view showing a film attachment device that is another embodiment of the present invention;

10 is a schematic cross-sectional view showing a main part of a film attachment device which is still another embodiment of the present invention;

It is a schematic sectional drawing which shows the principal part of the film sticking apparatus which is still another embodiment of this invention.

Claims (16)

In the film sticking method of cutting the film continuous from a film roll, and attaching the film of the shape which wants to stick to the surface of a board | substrate to the surface of a board | substrate with a pressing roll, By holding the film on the outer circumferential surface by electrostatic adsorption or adhesion as a squeeze roll, the tip portion of the film of the shape to be pasted is held on the outer circumferential surface of the squeeze roll, and the roll is rotated by the squeezing roll. While conveying the film of the shape to a board | substrate and making the said front-end | tip correspond to the attachment start position of a board | substrate, the said film of the shape to be attached is affixed on the surface of a board | substrate, and the rear end of the film of the shape to be attached also has A film attaching method, characterized in that the film is held on the outer circumferential surface and attached to the substrate by rotating the crimping roll with all the films of the shape to be pasted from the front end to the rear end. delete The method of claim 1, The film which clamps the said board | substrate with the said crimping roll and starts crimping | compression-bonding by the control apparatus to the attachment start position of the said film on a film conveyance path | route, and attaches to this board | substrate of the upstream of the said film conveyance path | route from this position. The film sticking method of setting a film cutting unit value in the position which corresponds to the length to cut | disconnect, and carrying out a film and cutting a film into the said board | substrate, making it cut | disconnect to a length to cut. The method of claim 1, The position at which the substrate is sandwiched by the pressing roll to start bonding is set by the controller to the position where the film is attached on the film conveying path, and the head of the substrate is located at an upstream position of the substrate conveying path from this position. A position is detected and the said board | substrate is conveyed from this detection position to the attachment start position of the said board | substrate and a film. The method of claim 1, The tip end of the film is held on the outer circumferential surface of the pressing roll from the film front end holding member whose tip is held in a shape protruding from the film tip holding member, and the end portion is sucked to the outer circumferential surface of the pressing roll, and the film The rear end of the film is passed from the film rear end holding member to the outer circumferential surface of the pressing roll, and the rear end portion is sucked to the outer circumferential surface of the pressing roll to rotate all the films from the front end to the rear end by the rotation of the pressing roll. The film attaching method, characterized in that attached to the substrate by the rotation of the pressing roll. The method of claim 1, A pressing roll is provided at each of the upper and lower positions of the conveying path surface of the substrate, and each pressing roll moves in the direction of the substrate, and the substrate is conveyed in the downstream direction while the substrate is attached to the substrate by rotation by sandwiching the substrate. . In the film sticking apparatus which cuts the continuous film from a film roll, and attaches the film made into the shape which wants to stick to the surface of the board | substrate on a board | substrate conveyance path | route to the surface of a board | substrate with a press roll, It is provided with a pressing roll for holding the film on the outer peripheral surface by electrostatic adsorption or adhesion, The pressing roll retains at least the leading end of the film in the outer circumferential surface thereof in the shape to be pasted, and conveys the film in the desired shape to the substrate side by rotation of the pressing roll to attach the leading end to the substrate. At the same time as the start position, the film of the shape to be pasted is attached to the surface of the substrate, and the rear end of the film to be pasted to the outer circumferential surface of the pressing roll is also held. A film attaching apparatus, wherein all of the films of the shape to be pasted up to the end are attached to the substrate by rotation of the pressing roll. The method of claim 7, wherein The pressing roll is provided with an electrode for electrostatically charging the film, the film bonding apparatus, characterized in that for holding and holding the charged film by the pressing roll. The method of claim 7, wherein Further, the tip end portion of the film having a shape to be pasted is held, the film tip holding member receiving the tip end at the outer circumferential surface of the pressing roll, and the rear end portion of the film having the shape to be pasted are held, and the rear end is crimped. A film attaching apparatus, comprising: a film rear end holding member which is received on an outer circumferential surface of a roll. The method of claim 7, wherein The pressing roll is located on the film transport path and the substrate transport path, Cutting position setting means for setting the film cutting position at a position corresponding to the length of the film to be attached to the substrate on the upstream side of the film conveying path from the position at which the substrate and the film by the pressing roll on the film conveying path are attached; Means for cutting the film extracted from the film roll to a length desired to be attached to the surface of the substrate based on the cutting position data set in the cutting position setting means; Detection means provided at an upstream position from the crimping roll on the substrate conveyance path and detecting a head position of the substrate; And a means for conveying the substrate from the installation position of the detection means on the substrate transport path to the attachment start position of the substrate and the cut film. The method of claim 9, The film rear end holding member has a plurality of suction holes in the film holding surface portion, the suction holes arranged in the width direction of the film communicate with a common vacuum source by separate valves, and each valve is closed in accordance with the conveyance of the film. Film attachment device, characterized in that made to operate. The method of claim 9, The film rear-end holding member functions as a base of the cutting edge portion in the cutting means for cutting the film released from the film roll in the width direction to form a film of a shape that is intended to be attached to the substrate. The film is positioned between the film tip holding member and the pressing roll when the cutting means is cut in the width direction, and the film tip holding member is configured to retract when the tip tip is received by the pressing roll. Attachment device. The method of claim 9, And the film front end holding member and the film rear end holding member are provided with electrostatic adsorption means for holding the front end or the rear end of the cut film, respectively. The method of claim 8, A nozzle for blowing clean gas is provided at the tip of the film in the shape of the shape to be attached near the electrode. The method of claim 8, And a second electrode which electrostatically charges the rear end portion of the film in the shape of the shape to be pasted in the vicinity of the substrate transport path. delete