JP2008159913A - Tape transfer device, method and program thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent jamming and improve accuracy in tape transfer dimensions, in a tape transfer device. <P>SOLUTION: The tape transfer device is provided with a guide 33 for guiding a tape 41, a pull-out arm 36 and a held substrate 35. The pull-out arm 36 sucks the tape 41 on the guide 33 at the initial position, and pulls it out, up to the held substrate toward the longitudinal direction of the tape. The pulled out tape 41 is sucked and fixed on the held substrate 35. After the completion of cutting of the tape 41 by using a cutter 60, the pull-out arm 36 is restored to the initial position. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a structure of a tape transport device, a tape transport method, and a program.

  As one of the semiconductor device manufacturing processes, there is a die bonding process in which the semiconductor die formed in the previous process is fixed on a lead frame or a die pad of the lead frame. For fixing the semiconductor die to a die pad or the like in the die bonding process, the bonding resin is formed on a double-sided adhesive tape, cut into pieces of a predetermined size and supplied to the die pad or the like. A method of thermocompression bonding a semiconductor die to a die pad or the like through the thermocompression tape piece is used (for example, see Patent Document 1).

  In general, a thermocompression tape is used which is formed to have a width substantially the same as the width of the semiconductor die, and the thermocompression tape piece is a device for cutting the above thermocompression tape from a reel to a predetermined size by a tape transport device. The thermocompression bonding tape that has been fed out is cut by a tape cutting device. For this reason, the dimension of the thermocompression bonding tape piece is determined by the feed amount of the tape transport device that feeds the tape to the cutting device. As such a thermocompression bonding tape transport device, one of a pair of rollers circumscribed with each other is rotationally driven, and a thermocompression bonding tape sandwiched between the rollers is sent to a cutting device, or a thermocompression bonding tape There has been proposed a conveying device that feeds a thermocompression bonding tape to a cutting device by sandwiching the tape between upper and lower claws (see, for example, Patent Documents 1 and 2).

Japanese Patent Laid-Open No. 4-199720 JP 2003-133341 A

  On the other hand, in the joining method using the thermocompression bonding tape piece, it is necessary that the dimensions of the thermocompression bonding tape substantially coincide with the dimensions of the semiconductor die in order to ensure the joining quality. When the size of the formed thermocompression tape piece is larger than the size of the semiconductor die to be joined, a second bond in which a thermocompression tape that protrudes around the semiconductor die during thermocompression bonding is formed on the lead frame. The point (lead) surface may be covered, and wiring between the semiconductor die and the lead frame by wire bonding or the like may not be possible. Conversely, the size of the thermocompression tape piece is larger than the size of the semiconductor die to be joined. This is because, if it is small, a bonding failure or the like may occur.

  Therefore, in die bonding using a thermocompression bonding tape piece, in order to ensure the bonding quality, the accuracy of the amount of feeding of the thermocompression bonding tape to the cutting device is required.

  However, in recent years, as the semiconductor device is required to be thinner, the above-mentioned thermocompression bonding tape has come to be used. Since such a thin thermocompression bonding tape has low rigidity, the tape conveying device described in Patent Documents 1 and 2 is caused by the frictional force between the surface of the cutting device and the tape when fed to the cutting device. There is a problem that the compressive force applied to the tape is larger than the buckling load of the tape, the tape is buckled, so-called jamming occurs, and the thermocompression bonding tape cannot be conveyed. Even if jamming does not occur, the tape is distorted by the compressive force applied to the tape at the time of feeding, or the shape of the formed thermocompression tape piece is distorted due to the feeding direction deviating from the longitudinal direction of the tape. There was a problem that a thermo-compression tape piece with an accurate dimension could not be formed. Such a problem is not limited to a transport device for a thermocompression bonding tape for semiconductor die bonding, but is similarly a problem in other tape transport devices that transport thin tapes.

  An object of the present invention is to prevent jamming in a tape transport device. Another object of the present invention is to improve the tape transport dimension accuracy.

  The tape transport device of the present invention is a tape transport device for transporting a tape in the longitudinal direction, a guide for guiding the tape along the longitudinal direction, and the tape on the guide is adsorbed and has a cutting unit length in the longitudinal direction. And a holding substrate that is provided adjacent to the tape drawing side of the guide and sucks and holds the tape drawn by the drawing arm. The tape transport device of the present invention further includes a control unit that performs operation control of the pull-out arm and suction control of the holding substrate, and the control unit sucks the tape on the guide by the pull-out arm. Then, a tape pulling means for pulling out on the holding substrate by a cutting unit length in the longitudinal direction, a tape sucking means for sucking and fixing the drawn tape to the holding substrate, and the pulling arm are returned to the guide. The guide is held by suction, the control unit performs suction control of the guide, and the tape suction means is used to pull out the tape. It is also preferable to adsorb and fix the tape to the guide. Further, in the tape transport device of the present invention, it is preferable that the apparatus has a cutter that cuts the tape that is sucked and fixed to the holding substrate, and the control unit is the tape that is sucked and fixed to the holding substrate. It is also preferable to have a tape cutting means for cutting the tape with the cutter, and the tape is preferably a thermocompression bonding tape.

  The tape transport method of the present invention includes a guide for guiding a tape along a longitudinal direction, a drawer arm that sucks the tape on the guide and draws the tape in the longitudinal direction, and is adjacent to the tape withdrawal side of the guide. And a holding substrate that sucks and holds the tape pulled out by the pulling arm, and pulls out the tape on the guide in a tape transport method of a tape transport device that transports the tape in the longitudinal direction. A tape pulling-out step that is sucked by an arm and drawn on the holding substrate by a cutting unit length in the longitudinal direction; a tape sucking step for sucking and fixing the drawn tape to the holding substrate; and the pulling arm on the guide And a pull-out arm returning step for returning to the position. Further, in the tape transport method of the present invention, the guide is preferably held by sucking and holding the tape, and the tape sucking step is preferably fixed by sucking and fixing the drawn tape to the guide. It is also preferable to have a tape cutting step of cutting the tape adsorbed and fixed to the tape by the cutter, and it is also preferable that the tape is a thermocompression bonding tape.

  The tape transport program according to the present invention includes a guide for guiding a tape along a longitudinal direction, a drawer arm that sucks the tape on the guide and draws the tape in the longitudinal direction of the tape, and is adjacent to the tape withdrawal side of the guide. And a holding substrate that sucks and holds the tape pulled out by the pull-out arm, and pulls out the tape on the guide in a tape transport program of a tape transport device that transports the tape in the longitudinal direction. A tape pulling program that is sucked by an arm and pulled out on the holding substrate by a cutting unit length in the longitudinal direction, a tape sucking program for sucking and fixing the pulled tape to the holding substrate, and the pulling arm on the guide A drawer arm return program The features. Further, in the tape transport program of the present invention, the guide may preferably hold the tape by suction, and the tape suction program may preferably suck and fix the drawn tape to the guide, and the holding substrate. It is also preferable to have a tape cutting program for cutting the tape adsorbed and fixed by the cutter with the cutter, and it is also preferable that the tape is a thermocompression bonding tape.

  The present invention has an effect of preventing the occurrence of jamming in the tape transport device. In addition, the present invention has an effect of improving the tape transport dimension accuracy.

  Hereinafter, an embodiment in the case where the present invention is applied to a thermocompression bonding tape transport apparatus for semiconductor die bonding used in a die bonder will be described. Before describing the embodiment of the tape transport device, the configuration of the die bonder will be described with reference to the drawings.

  As shown in FIGS. 1 and 2, the die bonder 10 is a tape application head for attaching a cut thermocompression tape piece 23 for bonding a semiconductor die onto a lead frame 22 or an already bonded semiconductor die 24. 11, a bonding head 14 for thermocompression bonding the semiconductor die 24 from above the thermocompression tape piece 23, a frame feeder 17 for supplying a lead frame to the tape attaching head 11 and the bonding head 14, A cutter 60 that cuts the thermocompression bonding tape (tape) 41 and supplies it to the tape attaching head 11 as a thermocompression bonding tape piece 23; a thermocompression bonding tape conveying device 31 that conveys the thermocompression bonding tape 41 to the cutter 60; A wafer holder 18 for holding the diced wafer is provided. In the following description, it is assumed that the lead frame 22 is fed in the X direction, the direction perpendicular to the X direction in the horizontal plane is the Y direction, and the vertical direction is the Z direction.

  The tape attachment head 11 includes a tape attachment arm 12 that can move freely in the XY plane and includes a tape suction collet 13 at the tip. In addition, a Z-direction motor that moves the tip of the tape application arm 12 in the Z direction is provided inside the tape application head 11. The tape adsorbing collet 13 at the tip of the tape adhering arm 12 is configured to be freely movable in the XYZ directions by the movement of the tape adhering head 11 in the X and Y directions and the Z direction motor.

  Similarly to the tape attachment head 11, the bonding head 14 can be freely moved in the XY plane and includes a bonding arm 15 having a bonding collet 16 at the tip. A Z-direction motor that moves the tip of the bonding arm 15 in the Z direction is provided inside the bonding head 14. The bonding collet 16 at the tip of the bonding arm 15 is configured to be freely movable in the XYZ directions by the movement of the bonding head 14 in the XY directions and the Z direction motor.

  The frame feeder 17 includes two groove-type guide rails extending in the X direction of the die bonder 10 and arranged to face each other and a lead frame transport device (not shown). A frame loader 20 for supplying the lead frame 22 to the frame feeder 17 is provided at one end of the frame feeder 17, and a frame unloader 21 for taking out the lead frame 22 after die bonding from the frame feeder 17 is provided at the other end. .

  As shown in FIG. 2, a thermocompression bonding tape conveying device 31 and a cutter 60 are provided at a position in the Y direction of the tape attaching head 11 with a frame feeder 17 interposed therebetween. The thermocompression tape conveying device 31 includes a guide 33 for guiding the thermocompression bonding tape 41, a pulling arm 36 for sucking and pulling out the thermocompression bonding tape 41, and a holding substrate 35 for sucking and holding the drawn thermocompression bonding tape 41. I have. Further, as shown in FIG. 2, the cutter 60 is provided on the opposite side of the tape attachment head 11 between the guide 33 and the holding substrate 35, and the thermocompression bonding tape 41 is cut between the guide 33 and the holding substrate 35. The thermocompression bonding tape piece 23 is configured.

  As shown in FIG. 2, a wafer holder 18 is provided at a position in the Y direction of the bonding head 14 with a frame feeder 17 interposed therebetween. The wafer holder 18 is provided with a die push-up unit 19. The die push-up unit 19 pushes up one semiconductor die 24 in the wafer held by the wafer holder 18 so as to have a height difference from other semiconductor dies 24, and the bonding collet 16 has the one semiconductor die 24. It is a device that makes it possible to adsorb.

  The bonding operation of the die bonder 10 configured as described above will be briefly described. The thermocompression bonding tape 41 drawn out from the guide 33 onto the holding substrate 35 by the thermocompression bonding tape conveying device 31 is cut by the cutter 60, and the thermocompression bonding tape piece 23 is formed on the holding substrate 35. On the other hand, the lead frame 22 supplied from the frame loader 20 is sent in the X direction by the frame feeder 17 to the position of the tape attaching head 11. When the lead frame 22 is sent, the tape adhering head 11 operates the tape adsorbing collet 13 in the XYZ directions to pick up the thermocompression bonding tape piece 23 from above the holding substrate 35, and a predetermined frame of the lead frame 22 is selected. Paste in position. The lead frame 22 to which the thermocompression tape piece 23 is attached is sent in the X direction to the position of the bonding head 14 by the frame feeder 17. When the lead frame 22 is sent, the bonding head 14 moves the bonding collet 16 in the XYZ directions to pick up the semiconductor die 24 pushed up by the die push-up unit 19 from the wafer on the wafer holder 18, and the lead frame Crimp onto the 22 thermocompression tape pieces 23. At this time, the lead frame 22 is heated and the bonding resin of the thermocompression bonding tape piece 23 melts, and the semiconductor die 24 is fixed on the lead frame 22. After the above operation is repeated and all the semiconductor dies 24 to be mounted on the lead frame 22 are mounted, the lead frame 22 to which the semiconductor die 24 is fixed is transported to the frame unloader 21 by the frame feeder 17 and is taken out to be the next semiconductor. Sent to the manufacturing process.

  An embodiment of the thermocompression bonding tape transport device 31 used for the die bonder described above will be described with reference to FIGS. 3 and 4. FIG. 3 is a detailed side view of the thermocompression bonding tape conveyance device 31 and a diagram showing a control system, and FIG. 4 is a diagram showing a plan view of the thermocompression bonding tape conveyance device 31. The directions of XYZ in FIGS. 3 and 4 are the same as the directions of XYZ described in FIGS. Moreover, the same code | symbol is attached | subjected to the site | part similar to having demonstrated in FIG. 1, FIG. 2, and description is abbreviate | omitted.

  As shown in FIGS. 3 and 4, the thermocompression tape conveying device 31 adsorbs the thermocompression tape 41 on the guide 33 and guides the thermocompression tape 41 in the longitudinal direction and pulls it out in the longitudinal direction of the tape. A drawer arm 36 and a holding substrate 35 that sucks and holds the thermocompression bonding tape 41 drawn by the drawer arm 36 are provided.

  As shown in FIGS. 3 and 4, the guide 33 includes a fixed guide pin 34a and an adjustment guide pin 34c on the guide surface for guiding the thermocompression bonding tape 41 in the longitudinal direction, and a guide plate on the upper surface of each guide pin 34a, 34c. 34b is attached. The adjustment guide pin 34c is configured to be movable in the width direction of the thermocompression bonding tape 41 in accordance with the width of the thermocompression bonding tape 41 to be conveyed. As shown in FIG. 4, the two fixed guide pins 34a and the adjustment guide pins 34c are alternately arranged on both sides of the thermocompression bonding tape 41 in the conveying direction, and are configured to guide the thermocompression bonding tape 41 in the longitudinal direction. ing. The tape guide width formed by the guide pins 34 a and 34 c is a width obtained by adding a clearance necessary for transporting the thermocompression bonding tape 41 to the width of the thermocompression bonding tape 41. Each guide pin 34a, 34c and the guide plate 34b constitute a tape passage.

  As shown in FIGS. 3 and 4A, a plurality of vent holes 42 are provided along the width and longitudinal direction of the thermocompression bonding tape 41 on the tape transport direction side of the tape path of the guide surface, respectively. A plurality of grooves 42 a are provided toward the respective air holes 42. Each groove 42 a is configured to communicate with the vent hole 42. The plurality of vent holes 42 are connected to the vent pipe 45 inside or outside the guide 33. The ventilation pipe 45 is provided with a guide ventilation source valve 48 that blocks the air flow of the ventilation pipe 45. The guide ventilation source valve 48 is connected to the guide ventilation switching valve 51 by air piping. The guide ventilation switching valve 51 is connected to the vacuum device 55 and the blower 57 by an air pipe, and is configured so that the connection between the guide ventilation source valve 48 and the vacuum device 55 or the blower 57 can be switched. In this embodiment, the guide ventilation switching valve 51 is a three-way valve, and is configured such that a guide ventilation source valve 48 is connected to one side, a vacuum device 55 is connected to the other side, and a blower 57 is connected to the other side.

  As shown in FIGS. 3 and 4A, the holding substrate 35 is provided adjacent to the drawing direction of the thermocompression bonding tape 41 of the guide 33. The adsorption surface of the thermocompression bonding tape 41 of the holding substrate 35 is substantially the same height as the height of the guide surface that guides the thermocompression bonding tape 41 of the guide 33 (position in the Z direction). A small gap of about several microns is provided between them. Similar to the guide surface of the guide 33, a plurality of vent holes 43 and grooves 43 a are provided on the suction surface of the thermocompression bonding tape 41 of the holding substrate 35. Further, the plurality of vent holes 43 are connected to the vent pipe 46 inside or outside the holding substrate 35, and the vent pipe 46 is provided with a holding substrate vent source valve 49 that blocks the air flow of the vent pipe 46. ing. The holding substrate ventilation source valve 49 is connected to the holding substrate ventilation switching valve 52 by air piping, and the holding substrate ventilation switching valve 52 is connected to the vacuum device 55 and the blower 57 by air piping, The connection with the vacuum device 55 or the blower 57 can be switched. In the present embodiment, the holding substrate ventilation switching valve 52 is a three-way valve like the guide ventilation switching valve 51.

  As shown in FIGS. 3 and 4A, the pull-out arm 36 is an arm head that can freely slide in the X direction on the arm head table 40 provided on the pull-out side of the thermocompression tape of the holding substrate 35. 37. A servo motor for driving in the X direction is attached to the arm head 37, and the arm head 37 can be driven in the X direction and the amount of movement can be controlled by the rotation angle. Yes. The servo motor for driving in the X direction may be attached to the arm head table 40 instead of the arm head 37 to drive the arm head 37 in the X direction and control the amount of movement. The driving in the X direction is not limited to the driving by the servo motor. The driving in the X direction is performed by the general-purpose motor, and the position of the arm head 37 is detected by the position detector and the general-purpose motor is feedback-controlled. May be.

  The arm head 37 is attached with a Z-direction drive mechanism 39 that moves the tip of the drawer arm 36 in the Z direction. The Z-direction drive mechanism 39 may be configured to rotate the pull-out arm 36 by a motor around the rotation center provided on the arm head 37 to move the suction nozzle 38 at the tip in the Z direction. If the suction nozzle 38 can be moved in the Z direction, the pulling arm 36 is not rotated around the rotation center so that the suction nozzle 38 moves linearly along the linear guide provided on the arm head 37 and the like. It may be configured. When configured to move in the vertical direction in a straight line, the drawer arm 36 may be driven by a linear motor or the like, or may be configured to be driven in the vertical direction by electromagnetic force. Further, it may be configured to move in the vertical direction in conjunction with a servo motor for driving in the X direction attached to the arm head 37 by a cam or the like.

  With this configuration, the tip of the drawer arm 36 can freely move in the XZ direction by the movement of the arm head 37 in the X direction and the Z direction drive mechanism 39. Further, the arm head 37 may be configured to freely slide not only in the X direction but also in the XY direction. Even when configured to be movable in the X and Y directions, the servo motor that performs driving in the X and Y directions and controls the amount of movement may be provided on the arm head 37 or on the arm head table 40. In this case, the leading end of the drawer arm 36 can be freely moved in the XYZ directions by the movement of the arm head 37 in the XY directions and the Z-direction drive mechanism 39.

  A suction nozzle 38 for sucking the thermocompression bonding tape 41 is attached to the thermocompression bonding tape side of the leading end of the drawer arm 36. The suction nozzle 38 has a flat suction surface for sucking the thermocompression bonding tape 41. FIG. 4B is a plan view of the drawer arm 36 viewed from the suction surface side. As shown in FIG. 4B, the suction surface of the suction nozzle 38 is provided with a vent hole 44 and a groove 44a. Each vent hole 44 is connected to a vent pipe 47 through an air passage provided in the drawer arm 36, and the vent pipe 47 is provided with an arm vent source valve 50 that blocks the air flow in the vent pipe 47. ing. The arm ventilation source valve 50 is connected to the arm ventilation switching valve 53 by air piping, and the arm ventilation switching valve 53 is connected to the vacuum device 55 and the blower 57 by air piping, and the arm ventilation source valve 50 and vacuum device 55 or The connection with the blower 57 can be switched. In the present embodiment, the arm ventilation switching valve 53 is a three-way valve like the guide ventilation switching valve 51. Further, the suction nozzle 38 is configured to be detachable so as to be exchanged depending on the width of the thermocompression bonding tape 41 and the size of the thermocompression bonding tape piece 23 to be formed.

  As shown in FIG. 4A, a cutter 60 is provided beside the guide 33 and the holding substrate 35. The cutter 60 includes a cutter head 63 to which a cutter blade 65 is attached and a cutter head guide 61 for guiding the cutter head 63 in the Z direction. A servo motor for driving in the Z direction is attached to the cutter head 63 so that the cutter blade 65 can be moved in the Z direction. The driving of the cutter head 63 is not limited to the servo motor, and may be driven by a driving cylinder, for example. The cutter blade 65 is attached at a position where the tip enters the gap between the guide 33 and the holding substrate 35 so that the thermocompression bonding tape 41 can be cut, and is configured to have a length greater than the width of the thermocompression bonding tape 41. ing. Further, a blade is provided on the guide-side end surface of the guide 33 on the holding substrate side so that the thermocompression bonding tape 41 can be sheared by the surface of the cutter blade 65 on the guide 33 side and the surface of the guide 33 on the holding substrate side. May be.

  As shown in FIG. 3, the thermocompression bonding tape conveyance device 31 of the present embodiment is configured such that the entire control is performed by a control unit 71 having a CPU. The arm head 37, the Z-direction drive mechanism 39, the guide ventilation source valve 48, the holding substrate ventilation source valve 49, the arm ventilation source valve 50, the guide ventilation switching valve 51, the holding substrate ventilation switching valve 52, and the arm ventilation switching valve 53 are , Arm head drive interface 77, Z direction drive mechanism interface 79, guide vent source valve interface 81, holding substrate vent source valve interface 82, arm vent source valve interface 83, guide vent switching valve interface 84, holding substrate vent switching. It is connected to the data bus 73 via a valve interface 85 and an arm ventilation switching valve interface 86. The data bus 73 is connected to the control unit 71 so that each device can be controlled by the control unit 71. The data bus 73 is connected to a storage unit 75 for storing control programs and data.

  In this embodiment, the cutter 60, the vacuum device 55, the blower 57, the tape attachment head 11, and the bonding head 14 are configured to be connected to and controlled by other control units (not shown). The operation state can be input to the control unit 71 via the data bus 73. Other control units are configured to be able to control each device in cooperation with the control unit 71. Note that a device such as the cutter 60 may be connected to the control unit 71 via each interface and configured as an integrated control unit.

  As mentioned above, although the structure of the thermocompression bonding tape conveyance apparatus 31 of this embodiment was demonstrated, hereafter, operation | movement of this embodiment is demonstrated, referring drawings. FIG. 5 is a flowchart showing the operation of the present embodiment, and FIGS. 6 to 17 are operation explanatory views showing operation states.

  As shown in FIG. 6, in the initial state before the operation of the thermocompression bonding tape conveyance device 31 of the present embodiment is started, the adsorption nozzle 38 has a ventilation hole 42 whose adsorption surface is on the tape conveyance direction side of the guide 33. The upper surface of the guide 33 is raised from the suction surface of the guide 33 upward in the Z direction, for example, by about 0.1 to 0.2 mm, and the suction surface of the suction nozzle 38 and the suction surface of the guide 33 are The thermocompression bonding tape 41 is in between. In the initial state, the guide vent valve 48, the holding substrate vent valve 49, and the arm vent valve 50 shown in FIG. 3 are all closed, and the vent holes 42, 43, 44 and the grooves 42a, 43a, There is no air flow in 44a, and the thermocompression bonding tape 41 wound around the reel 67 extends in the longitudinal direction through the tape passage constituted by the fixed guide pin 34a, the adjustment guide pin 34c, and the guide plate 34b, and its tip. Is set to a reference position in the vicinity of the end surface of the guide 33 on the holding substrate 35 side, and the thermocompression bonding tape 41 covers the vent hole 42 and the groove 42 a on the guide surface of the guide 33. Here, the reference position is the position of the cutting edge of the cutter blade 65 in the tape longitudinal direction. In the initial state, the cutter head 63 of the cutter 60 is in the raised position, and a space in which the drawer arm 36 can move is secured between the cutter blade 65 and the guide 33 and the holding substrate 35. It is in such a state.

  And when operation | movement of the thermocompression bonding tape conveyance apparatus 31 is started, as shown to step S101 of FIG. 5, the control part 71 confirms whether the adsorption nozzle 38 exists in the initial position on the guide 33, If the suction nozzle 38 is not in this initial position, a command to move the suction nozzle 38 to the initial position on the guide 33 by operating the arm head 37 and the Z-direction drive mechanism 39 is output. A command from the control unit 71 is transmitted as a control signal to the arm head 37 and the Z direction drive mechanism 39 via the arm head drive interface 77 and the Z direction drive mechanism interface 79, respectively, and is transmitted as a control signal to the arm head 37 and the Z direction. The drive mechanism 39 operates to move the suction nozzle 38 to the initial position.

  As shown in step S102 of FIG. 5 and FIG. 7, the control unit 71 outputs a command to lower the suction nozzle 38 attached to the tip of the pull-out arm 36 toward the guide surface of the guide 33 by the Z-direction drive mechanism 39. To do. In response to this command, the Z-direction drive mechanism 39 operates to lower the suction nozzle 38, and the tape drawing process is started.

  As shown in step S103 of FIG. 5, the control unit 71 outputs a command so that the arm ventilation switching valve 53 shown in FIG. This command is transmitted as a control signal to the arm ventilation switching valve 53 via the arm ventilation switching valve interface 86, the arm ventilation switching valve 53 operates, and the arm ventilation switching valve 53 is switched to the vacuum device 55 side. Then, as shown in step S104 of FIG. 5, the control unit 71 outputs a command to open the arm ventilation source valve 50 shown in FIG. This command is transmitted as a control signal to the arm ventilation source valve 50 via the arm ventilation source valve interface 83, the arm ventilation source valve 50 operates, and the arm ventilation source valve 50 is opened. Then, as shown in FIG. 7, the vacuum device 55 and the ventilation pipe 47 communicate with each other, and air is sucked from the ventilation hole 44 and the groove 44a provided in the adsorption nozzle 38, and the adsorption surface of the adsorption nozzle 38 is thermocompression bonded. The tape 41 is adsorbed.

  As shown in step S105 of FIG. 5, the control unit 71 outputs a command so that the guide ventilation switching valve 51 shown in FIG. This command is transmitted as a control signal to the guide ventilation switching valve 51 via the guide ventilation switching valve interface 84, the guide ventilation switching valve 51 operates, and the guide ventilation switching valve 51 is switched to the blower 57 side. Then, as shown in step S106 of FIG. 5, the control unit 71 outputs a command to open the guide ventilation source valve 48 shown in FIG. This command is transmitted as a control signal to the guide vent valve 48 via the guide vent valve interface 81, the guide vent valve 48 operates, and the guide vent valve 48 is opened. Then, as shown in FIG. 7, the blower 57 and the ventilation pipe 45 communicate with each other, and air is blown out from the ventilation hole 42 and the groove 42 a provided in the guide surface of the guide 33.

  As shown in step S <b> 107 of FIG. 5 and FIG. 8, the control unit 71 outputs a command to raise the suction nozzle 38 attached to the tip of the drawer arm 36 in the Z direction by the Z direction drive mechanism 39. In response to this command, the Z-direction drive mechanism 39 operates to raise the suction nozzle 38. The height of the suction nozzle 38 may be high enough to ensure a gap between the guide 33 and the holding substrate 35 when the thermocompression bonding tape is pulled out, and is, for example, about 0.1 to 0.2 mm. . The rising height can be changed according to the type and rigidity of the thermocompression bonding tape 41 or the component dimensions of each part. As shown in FIG. 8, when the suction nozzle 38 ascends by adsorbing the thermocompression bonding tape 41, air blows out from the vent hole 42 and the groove 42 a of the guide 33 and the guide surface of the guide 33 of the thermocompression bonding tape 41. Peeling from becomes easy.

  As shown in step S <b> 108 of FIG. 5 and FIG. 9, the control unit 71 outputs a command to move the suction nozzle 38 onto the holding substrate 35. In response to this command, the arm head 37 operates to move the suction nozzle 38 at the tip of the drawer arm 36 onto the holding substrate 35. The amount of movement of the arm head 37 is accurately controlled by a servo motor. As shown in FIG. 9, the suction nozzle 38 at the tip of the drawer arm 36 moves onto the holding substrate 35 with the thermocompression bonding tape 41 being sucked on the suction surface. By this operation, the suction nozzle 38 at the tip of the drawer arm 36 pulls the thermocompression bonding tape 41 onto the holding substrate. At the time of drawing, the thermocompression bonding tape 41 is guided by the guide pins 34a and 34c and the guide plate 34b provided on the guide 33, and is drawn straight in the longitudinal direction of the tape. Then, the tip of the thermocompression bonding tape 41 is drawn from the reference position of the cutting edge of the cutter blade 65 by the moving distance of the suction nozzle 38.

  In this manner, the thermocompression bonding tape 41 is pulled out and conveyed in the longitudinal direction, so that no compression force is applied to the thermocompression bonding tape 41 during the conveyance. For this reason, when the thermocompression bonding tape 41 is conveyed, the thermocompression bonding tape 41 is prevented from buckling and causing jamming and cannot be conveyed, and the thermocompression bonding tape 41 can be smoothly conveyed in the longitudinal direction. Further, since the thermocompression bonding tape 41 is not bent by the compressive force during conveyance and the movement amount of the suction nozzle 38 is high, the thermocompression bonding tape 41 has a high pulling length accuracy, It is possible to improve the conveyance dimension accuracy. Further, since the thermocompression bonding tape 41 is guided and pulled out by the guide pins 34a and 34c and the guide plate 34b, the clearance between the guide pins 34a and 34c and the thermocompression bonding tape 41 is reduced to improve the directional accuracy. However, the thermocompression bonding tape 41 does not cause jamming due to an increase in resistance when the thermocompression bonding tape passes through the guide pins 34a and 34c and the guide plate 34b, and the thermocompression bonding tape smoothly improves the direction accuracy in the conveyance. 41 can be conveyed in the longitudinal direction.

  As shown in step S109 of FIG. 5 and FIG. 9, the control unit 71 determines that the moving distance of the suction nozzle 38 is the cutting unit length of the length of one thermocompression bonding tape piece 23 formed by cutting the cutter 60. The arm head 37 is moved in the X direction so as to move to the X direction. Then, as shown in step S110 of FIG. 5, when the moving distance reaches the cutting unit length, a command to stop the movement of the arm head 37 is output. By this command, the arm head 37 stops moving. In a state where the movement of the arm head 37 is stopped, the tip of the thermocompression bonding tape 41 is drawn from the reference position of the cutting edge of the cutter blade 65 by the cutting unit length of the thermocompression bonding tape piece 23. Then, when the movement of the suction nozzle stops, the tape drawing process ends.

  When the tape drawing process is completed, the tape suction process is started. As shown in step S <b> 111 of FIG. 5, the control unit 71 outputs a command to turn the holding substrate ventilation switching valve 52 shown in FIG. 3 to the vacuum device 55 side. This command is transmitted as a control signal to the holding substrate ventilation switching valve 52 via the holding substrate ventilation switching valve interface 85, the holding substrate ventilation switching valve 52 operates, and the holding substrate ventilation switching valve 52 switches to the vacuum device 55 side. It is done. Then, as shown in step S112 of FIG. 5, the control unit 71 outputs a command to open the holding substrate ventilation source valve 49 shown in FIG. This command is transmitted as a control signal to the holding substrate ventilation source valve 49 via the holding substrate ventilation source valve interface 82, the holding substrate ventilation source valve 49 operates, and the holding substrate ventilation source valve 49 is opened. Then, as shown in FIG. 10, the vacuum device 55 and the ventilation pipe 46 communicate with each other, and air is sucked from the ventilation holes 43 and the grooves 43 a provided in the holding substrate 35. In this state, the thermocompression bonding tape 41 is adsorbed on the adsorption surface of the adsorption nozzle 38, and a gap of, for example, about 0.1 to 0.2 mm is provided between the thermocompression bonding tape 41 and the adsorption surface of the holding substrate 35. is open.

  As shown in step S <b> 113 of FIG. 5, the control unit 71 outputs a command for lowering the suction nozzle 38 attached to the tip of the drawer arm 36 toward the suction surface of the holding substrate 35 by the Z-direction drive mechanism 39. In response to this command, the Z-direction drive mechanism 39 operates to lower the suction nozzle 38. When the suction nozzle 38 is lowered to the suction surface of the holding substrate 35, the control unit 71 outputs a command to close the arm ventilation source valve 50 shown in FIG. 3 as shown in step S114 of FIG. By this command, the arm vent valve 50 is closed, and the suction of air from the vent hole 44 and the groove 44a on the suction surface of the suction nozzle 38 is stopped. Then, as shown in FIG. 11, the thermocompression bonding tape 41 is adsorbed and fixed to the adsorption surface of the holding substrate 35 in a state where the suction of air from the vent hole 44 and the groove 44 a is stopped. As shown in step S115 of FIG. 5 and FIG. 11, the control unit 71 outputs a command for switching the guide ventilation switching valve 51 shown in FIG. 3 to the vacuum device 55 side. By this command, the guide ventilation switching valve 51 is switched to the vacuum device 55 side, air is sucked from the ventilation hole 42 and the groove 42a of the guide surface of the guide 33, and the thermocompression bonding tape 41 on the guide surface is moved to the guide surface. Adsorbed and fixed. When the thermocompression bonding tape 41 is sucked and fixed to the holding substrate 35 and the guide 33, the tape sucking process ends.

  As shown in FIG. 12, when the tape adsorbing step is completed, a lowering operation command for the cutter head 63 of the cutter 60 is output by another control unit operating in cooperation with the control unit 71, and this command causes the cutter head to be moved. The tape 63 is lowered, and a tape cutting process for cutting the thermocompression bonding tape 41 with the cutter blade 65 is started. The tip of the thermocompression bonding tape 41 is drawn from the reference position, which is the position of the cutter blade 65, in the direction of the holding substrate 35 by the length of the thermocompression bonding tape piece 23. The thermocompression-bonding tape piece 23 is formed. Further, the tip end of the thermocompression bonding tape 41 after cutting becomes a reference position which is the position of the cutter blade 65.

  As shown in FIG. 13, when the cutting is completed, another control unit that operates in cooperation with the control unit 71 outputs a command to raise the cutter head 63 to the initial position. Ascend to the initial position. The tape cutting process ends when the cutter head 63 rises to the initial position.

  When the tape adsorption process and the tape cutting process are completed, the arm return process is started. As shown in step S116 of FIG. 5 and FIG. 13, the controller 71 outputs a command to switch the arm ventilation switching valve 53 shown in FIG. 3 to the blower side. By this command, the arm ventilation switching valve 53 is switched to the blower side. Then, as shown in step S117 of FIG. 5, the control unit 71 outputs a command to open the arm ventilation source valve 50 shown in FIG. By this command, the arm vent valve 50 is opened, and air blows out from the vent hole 44 and the groove 44a on the suction surface of the suction nozzle 38.

  As shown in step S118 of FIG. 5 and FIG. 13, the control unit 71 outputs a command to raise the suction nozzle 38 attached to the tip of the drawer arm 36 in the Z direction by the Z direction driving mechanism 39. In response to this command, the Z-direction drive mechanism 39 operates to raise the suction nozzle 38. At this time, since air is blown out from the air holes 44 and the grooves 44a on the suction surface of the suction nozzle 38, the suction nozzle 38 can easily be lifted away from the thermocompression bonding tape 41.

  As shown in step S119 of FIG. 5 and FIG. 14, the control unit 71 outputs a command to close the arm ventilation source valve 50 shown in FIG. By this command, the arm ventilation source valve 50 is closed, and the blowing of air from the ventilation hole 44 and the groove 44a on the suction surface of the suction nozzle 38 is stopped.

  As shown in step S <b> 120 of FIG. 5 and FIG. 14, the control unit 71 outputs a command for retracting the suction nozzle 38 from the holding substrate 35. In response to this command, the arm head 37 operates to retract the suction nozzle 38 at the tip of the pull-out arm 36 from above the holding substrate 35 in the tape feeding direction. As shown in FIG. 14, the retracted position may be on the arm head table 40. When the arm head 37 is configured to be movable in the XY directions, the retreat position is set on the holding substrate 35 in the Y direction. You may make it evacuate from.

  As shown in FIG. 15, when the drawer arm 36 is retracted, the tape adsorbing collet 13 attached to the tip of the tape adhering arm 12 controlled by another control unit is adsorbed to the thermocompression bonding tape piece 23. When the tape adsorbing collet 13 is adsorbed, the signal is sent from another control unit to the control unit 71. As shown in step S121 of FIG. 5 and FIG. 16, the control unit 71 outputs a command for switching the holding substrate ventilation switching valve 52 shown in FIG. 3 to the blower side by this signal. By this command, the holding substrate ventilation switching valve 52 is switched to the blower side, air is blown out from the ventilation holes 43 and the grooves 43a on the adsorption surface of the holding substrate 35, and the adsorption surface of the holding substrate 35 adsorbs the thermocompression bonding tape 41. Disappear. When the holding substrate 35 no longer holds the thermocompression bonding tape piece 23 by suction, as shown in FIG. 16, the other control unit operates the tape attaching arm 12 to adsorb the thermocompression bonding tape piece 23 adsorbed to the tape adsorbing collet 13. Is transferred to the lead frame 22.

  As shown in step S122 of FIG. 5, the control unit 71 outputs a command to close the holding substrate ventilation source valve 49 shown in FIG. By this command, the holding substrate ventilation source valve 49 is closed, and the blowing of air from the ventilation hole 43 and the groove 43a on the suction surface is stopped. Further, as shown in step S123 of FIG. 5, the control unit 71 outputs a command to close the guide ventilation source valve 48 shown in FIG. By this command, the guide vent main valve 48 is closed, and the adsorption and fixing of the thermocompression bonding tape 41 by the vent hole 42 and the groove 42a of the guide 33 are stopped.

  As shown in step S <b> 124 of FIG. 5 and FIG. 17, the control unit 71 outputs a command for returning the suction nozzle 38 to the initial position on the guide 33. In response to this command, the arm head 37 operates to return the suction nozzle 38 at the tip of the drawer arm 36 to the initial position on the guide 33. When the suction nozzle 38 returns to the initial position, the arm return process ends.

  As described above, the thermocompression bonding tape 41 is sucked by the suction nozzle 38 at the leading end of the pulling arm 36 and pulled out from the initial position onto the holding substrate 35 by the cutting unit length, and the pulled thermocompression bonding tape 41 is held on the holding substrate 35. The thermocompression bonding tape 41 is removed by repeatedly performing an adsorption process for adsorbing to the adsorption surface and a return process for stopping the adsorption of the thermocompression bonding tape of the adsorption nozzle 38 at the tip of the drawer arm 36 and returning the position to the initial position. It can be conveyed by the cutting unit length which is the length of the thermocompression bonding tape piece 23.

  The thermocompression bonding tape transport device 31 of this embodiment sucks the thermocompression bonding tape 41 by the suction nozzle 38 at the tip of the pulling arm 36 and pulls out the thermocompression bonding tape 41 from the initial position onto the holding substrate 35 by the cutting unit length. Since it is configured to be conveyed in the longitudinal direction, no compression force is applied to the thermocompression bonding tape 41 during conveyance. For this reason, when the thermocompression bonding tape 41 is transported, the thermocompression bonding tape 41 is prevented from buckling and jamming and cannot be transported, and the thermocompression bonding tape 41 can be transported smoothly in the longitudinal direction. Play.

  Further, the thermocompression bonding tape 41 is attracted and pulled out by the suction nozzle 38 at the tip of the drawer arm 36, and the thermocompression bonding tape 41 is not bent during conveyance, and the movement amount of the suction nozzle 38 is the servo of the arm head 37. Since it is controlled by the motor and the accuracy of the movement amount is high, it is possible to increase the accuracy of the drawing length of the thermocompression bonding tape 41 and improve the conveyance dimension accuracy of the thermocompression bonding tape. Since the thermocompression bonding tape 41 is pulled out by the cutting unit length which is the length of the thermocompression bonding tape piece 23 in the tape drawing process, the improvement of the conveyance dimensional accuracy is improved in the dimensional accuracy of the thermocompression bonding tape piece 23 to be finally formed. There is an effect that the bonding quality can be improved.

  In this embodiment, the fixed guide pin 34a, the adjustment guide pin 34c, and the guide plate 34b of the guide 33 that guides the thermocompression bonding tape 41 in the longitudinal direction are attached to the upstream side in the transport direction from the initial position of the suction nozzle 38. The tape passage is formed, and the thermocompression bonding tape 41 passing through the tape passage is sucked by the suction nozzle 38 and pulled out. For this reason, even when the clearance between the tape passage and the thermocompression bonding tape 41 is reduced so that the thermocompression bonding tape 41 is conveyed straight in the longitudinal direction, the resistance when the thermocompression bonding tape passes through the tape passage is increased. Therefore, the thermocompression bonding tape 41 does not cause jamming, and the directional accuracy in the conveyance of the thermocompression bonding tape 41 can be improved. As a result, the accuracy of the angle between the thermocompression bonding tape 41 and the cutter blade 65 can be improved, and the shape accuracy of the formed thermocompression bonding tape piece 23 can be improved.

  As described above, the thermocompression bonding tape transport device 31 of the present embodiment has the effect of preventing the occurrence of jamming in the thermocompression bonding tape transport device, and improves the transport dimensional accuracy of the thermocompression bonding tape. There is an effect that can be.

  In this embodiment, vent holes 42, 43, 44 and grooves 42a, 43a, 44a provided in the guide 33, the holding substrate 35, and the drawer arm 36, respectively, are connected to the vacuum device 55 and the blower 57, and the original valves 48, 49, 50 are provided. Through the switching valves 51, 52, 53, and by opening / closing the main valves 48, 49, 50 and switching the switching valves 51, 52, 53, the vent holes 42, 43, 44 and 42a, As described above, the air suction, blow and stop of 43a and 44a are explained. However, the air suction, blow and stop of the air holes 42, 43 and 44 and the grooves 42a, 43a and 44a are performed. If possible, the configuration is not limited to this embodiment.

  Although this embodiment demonstrated the case where the thermocompression bonding tape for semiconductor die joining of the die bonder 10 was conveyed, if it conveys a tape, it may apply not only to the die bonder 10 but to other tape conveyance apparatuses. it can.

It is an elevation which shows the structure of a die bonder. It is a top view which shows the structure of a die bonder. It is explanatory drawing which shows the structure and control system of the thermocompression-bonding tape conveying apparatus in embodiment of this invention. It is explanatory drawing which shows the plane of the thermocompression bonding tape conveyance apparatus in embodiment of this invention. It is a flowchart which shows operation | movement of the thermocompression bonding tape conveyance apparatus in embodiment of this invention. It is operation | movement explanatory drawing which shows operation | movement of the thermocompression bonding tape conveying apparatus in embodiment of this invention, Comprising: It is a figure which shows an initial state. It is operation | movement explanatory drawing which shows operation | movement of the thermocompression bonding tape conveying apparatus in embodiment of this invention, Comprising: It is a figure which shows the fall of an adsorption nozzle and adsorption | suction to a thermocompression bonding tape. It is operation | movement explanatory drawing which shows operation | movement of the thermocompression-bonding tape conveying apparatus in embodiment of this invention, Comprising: The figure which makes a suction nozzle adsorb | suck a thermocompression-bonding tape, and shows pulling up from a guide. It is operation | movement explanatory drawing which shows operation | movement of the thermocompression-bonding tape conveying apparatus in embodiment of this invention, Comprising: It is a figure which shows the drawer | drawing-out on a holding | maintenance board | substrate by the adsorption nozzle of the front-end | tip of an extraction | drawer arm adsorb | sucking a thermocompression bonding tape. It is operation | movement explanatory drawing which shows operation | movement of the thermocompression bonding tape conveying apparatus in embodiment of this invention, Comprising: It is a figure which shows adsorption | suction operation | movement of the thermocompression bonding tape of a holding substrate. It is operation | movement explanatory drawing which shows operation | movement of the thermocompression bonding tape conveyance apparatus in embodiment of this invention, Comprising: It is a figure which shows adsorption | suction to the holding substrate of the thermocompression bonding tape which adsorb | sucked to the adsorption nozzle by dropping an adsorption nozzle. It is operation | movement explanatory drawing which shows operation | movement of the thermocompression bonding tape conveying apparatus in embodiment of this invention, Comprising: It is a figure which shows the cutting | disconnection of the thermocompression bonding tape by a cutter. It is operation | movement explanatory drawing which shows operation | movement of the thermocompression-bonding tape conveying apparatus in embodiment of this invention, Comprising: It is a figure which shows the stop and raising of adsorption | suction of the thermocompression-bonding tape of an adsorption nozzle. It is operation | movement explanatory drawing which shows operation | movement of the thermocompression bonding tape conveying apparatus in embodiment of this invention, Comprising: It is a figure which shows retraction | saving from the holding | maintenance board | substrate of the adsorption | suction arm at the front-end | tip of a drawer arm. It is operation | movement explanatory drawing which shows operation | movement of the thermocompression bonding tape conveying apparatus in embodiment of this invention, Comprising: It is a figure which shows adsorption | suction of the thermocompression bonding tape piece by a tape adsorption | suction collet. It is operation | movement explanatory drawing which shows operation | movement of the thermocompression-bonding tape conveyance apparatus in embodiment of this invention, Comprising: It is a figure which shows transfer of the thermocompression-bonding tape piece by a tape adsorption | suction collet. It is operation | movement explanatory drawing which shows operation | movement of the thermocompression bonding tape conveying apparatus in embodiment of this invention, Comprising: It is a figure which shows the return to the initial position of the adsorption nozzle of the drawer | drawer arm front-end | tip.

Explanation of symbols

  10 Die Bonder, 11 Tape Attaching Head, 12 Tape Attaching Arm, 13 Tape Adsorption Collet, 14 Bonding Head, 15 Bonding Arm, 16 Bonding Collet, 17 Frame Feeder, 18 Wafer Holder, 19 Die Pushing Unit, 20 Frame Loader, 21 Frame unloader, 22 Lead frame, 23 Thermocompression tape strip, 24 Semiconductor die, 31 Thermocompression tape transport device, 33 Guide, 34a Fixed guide pin, 34b Guide plate, 34c Adjustment guide pin, 35 Holding substrate, 36 Drawer Arm, 37 Arm head, 38 Suction nozzle, 39 Z-direction drive mechanism, 40 Arm head table, 41 Thermocompression tape (tape), 42, 43, 44 Vent hole, 42a, 43a, 44a Groove, 45, 46, 47 Ventilation piping, 48 Guide ventilation valve, 49 Holding substrate ventilation valve, 50 Arm ventilation valve, 51 Guide ventilation switching valve, 52 Holding substrate ventilation switching valve, 53 Arm ventilation switching valve, 55 Vacuum device, 57 Blower 60 cutter, 61 cutter head guide, 63 cutter head, 65 cutter blade, 67 reel, 71 control unit, 73 data bus, 75 storage unit, 77 arm head drive interface, 79 Z-direction drive mechanism interface, 81 Guide vent valve interface, 82 Holding substrate vent valve interface, 83 Arm vent valve interface, 84 Guide vent switching valve interface, 85 Holding substrate vent switching valve interface, 86 Arm vent switching valve interface.

Claims (14)

In the tape transport device that transports the tape in the longitudinal direction,
A guide for guiding the tape along the longitudinal direction;
A pull-out arm that adsorbs the tape on the guide and draws out the cutting unit length in the longitudinal direction;
A holding substrate that is provided adjacent to the tape pull-out side of the guide and holds the tape pulled out by the pull-out arm;
A tape conveying device comprising: In the tape conveyance device according to claim 1,
A control unit that performs operation control of the drawer arm and suction control of the holding substrate;
The controller is
A tape pulling means for sucking the tape on the guide by a pulling arm and pulling it on the holding substrate by a cutting unit length in the longitudinal direction;
A tape adsorbing means for adsorbing and fixing the drawn tape to the holding substrate;
Drawer arm return means for returning the drawer arm onto the guide;
A tape conveying device comprising: In the tape conveyance device according to claim 2,
The guide sucks and holds the tape,
The control unit performs suction control of the guide,
The tape adsorbing means is configured to adsorb and fix the drawn tape to the guide;
Tape transport device characterized by In the tape conveyance device according to any one of claims 1 to 3,
A tape transport device comprising: a cutter that cuts the tape that is sucked and fixed to the holding substrate. In the tape conveyance device according to claim 4,
The control unit includes a tape cutting unit that cuts the tape that is sucked and fixed to the holding substrate with the cutter. In the tape conveyance device according to any one of claims 1 to 5,
The tape transport device, wherein the tape is a thermocompression bonding tape. A guide for guiding a tape along a longitudinal direction; a pull-out arm that adsorbs the tape on the guide and pulls out the tape in the longitudinal direction; and the pull-out arm provided adjacent to the tape pull-out side of the guide A holding substrate for adsorbing and holding the tape drawn by the tape, and in a tape conveying method of a tape conveying device for conveying the tape in the longitudinal direction,
The tape on the guide is sucked by a pull-out arm, and the tape is drawn out on the holding substrate by a cutting unit length in the longitudinal direction; and
A tape adsorbing step for adsorbing and fixing the drawn tape to the holding substrate;
A drawer arm return step for returning the drawer arm onto the guide;
A tape carrying method comprising: In the tape conveyance method according to claim 7,
The guide sucks and holds the tape,
The tape adsorbing step is to adsorb and fix the drawn tape to the guide;
Tape transport method characterized by the above. In the tape conveyance method according to claim 6 or 7,
The tape transport device includes a cutter that cuts the tape that is adsorbed and fixed to the holding substrate,
A tape transporting method comprising: a tape cutting step of cutting the tape fixedly attached to the holding substrate by the cutter. In the tape conveyance method according to any one of claims 7 to 9,
The tape transport method, wherein the tape is a thermocompression bonding tape. A guide for guiding a tape along a longitudinal direction; a pull-out arm that adsorbs the tape on the guide and pulls out the tape in the longitudinal direction; and the pull-out arm provided adjacent to the tape pull-out side of the guide A holding substrate for adsorbing and holding the tape drawn by the tape, and in a tape conveyance program of a tape conveyance device for conveying the tape in the longitudinal direction,
A tape drawing program for sucking the tape on the guide by a pull-out arm and pulling it on the holding substrate by a cutting unit length in the longitudinal direction;
A tape suction program for sucking and fixing the drawn tape to the holding substrate;
A drawer arm return program for returning the drawer arm onto the guide;
A tape transport program comprising: In the tape conveyance program according to claim 11,
The guide sucks and holds the tape,
The tape suction program sucks and fixes the drawn tape to the guide;
Tape transport program characterized by In the tape conveyance method according to claim 11 or 12,
The tape transport device includes a cutter that cuts the tape that is adsorbed and fixed to the holding substrate,
A tape transport program comprising: a tape cutting program for cutting the tape fixedly attached to the holding substrate by the cutter. In the tape conveyance program according to any one of claims 11 to 13,
The tape transport program, wherein the tape is a thermocompression bonding tape.

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