SG11201804995UA - Automatic deskew using design files or inspection images - Google Patents

Automatic deskew using design files or inspection images

Info

Publication number
SG11201804995UA
SG11201804995UA SG11201804995UA SG11201804995UA SG11201804995UA SG 11201804995U A SG11201804995U A SG 11201804995UA SG 11201804995U A SG11201804995U A SG 11201804995UA SG 11201804995U A SG11201804995U A SG 11201804995UA SG 11201804995U A SG11201804995U A SG 11201804995UA
Authority
SG
Singapore
Prior art keywords
image
international
nagar
review
deskew
Prior art date
Application number
SG11201804995UA
Inventor
Arpit Jain
Arpit Yati
Thirupurasundari Jayaraman
Raghavan Konuru
Rajasekhar Kuppa
Hema Prasad
Saiyashwanth Momula
Arun Lobo
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201804995UA publication Critical patent/SG11201804995UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T3/00—Geometric image transformations in the plane of the image
    • G06T3/60—Rotation of whole images or parts thereof
    • G06T3/608—Rotation of whole images or parts thereof by skew deformation, e.g. two-pass or three-pass rotation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical or photographic arrangements associated with the tube
    • H01J37/222—Image processing arrangements associated with the tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G01N2223/6116—Specific applications or type of materials patterned objects; electronic devices semiconductor wafer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Quality & Reliability (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
  • Testing Of Coins (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property -, Organization MD 1111101110101011111 HO 11111 01110111001101101101110111110 ill OEN International Bureau ... .jd (10) International Publication Number (43) International Publication Date ..... .....!;,' WO 2017/136359 Al 10 August 2017(10.08.2017) WIPO I PCT (51) International Patent Classification: jasekhar; 1065 Alta Mira Drive #A, Santa Clara, Califor- HO1L 21/66 (2006.01) HO1L 21/67 (2006.01) nia 95051 (US). PRASAD, Hema; C208 Ceebros Belvedere, School Main Road, Kumarasamy Nagar Main (21) International Application Number: Road, Sholinganallur, Chennai 600119 (IN). MOMULA, PCT/US2017/015880 Saiyashwanth; 17-117/1, Sri Nagar Colony, Nagarkur- (22) International Filing Date: nool, Mahabubnagar, Telangana 509209 (IN). LOBO, 31 January 2017 (31.01.2017) Arun; 'Empire' Kalpana Road, Kankanady Post, Man- galore, Karnataka 575002 (IN). (25) Filing Language: English (74) Agents: MCANDREWS, Kevin et al.; KLA-TENCOR (26) Publication Language: English CORPORATION, Legal Department, One Technology (30) Priority Data: Drive, Milpitas, California 95035 (US). 201641004030 4 February 2016 (04.02.2016) IN (81) Designated States (unless otherwise indicated, for every 62/309,623 17 March 2016 (17.03.2016) US kind of national protection available): AE, AG, AL, AM, 15/258,546 7 September 2016 (07.09.2016) US AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, (71) Applicant: KLA-TENCOR CORPORATION [US/US]; BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, Legal Department, One Technology Drive, Milpitas, Cali- DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, fornia 95035 (US). HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, (72) Inventors: JAIN, Arpit; 203-A Paramount, 8 Gyan Park, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, Telephone Nagai, Indore, Madhya Pradesh 452016 (IN). NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, _ YATI, Arpit; 1/480 Vardan Khand, Gonti Nagar, Luc- RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, — _ know, Uttar Pradesh 226010 (IN). JAYARAMAN, Thiru- TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, purasundari; Apt 9J, West Block, SIS Merdian,7, Gangai ZA, ZM, ZW. Nagar, Velacherry 100 Feet Bypass Road, Chennai 600042 KONURU, Raghavan; 40-814-6, Srinivasa Nagar, (84) Designated States (unless otherwise indicated, for every = (IN). Kurnool, Andra Pradesh 518004 (IN). KUPPA, Ra- kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, [Continued on next page] Title: AUTOMATIC DESKEW USING DESIGN FILES OR INSPECTION IMAGES = (54) = 100 (57) : Deskew for image review, such as SEM review, aligns in- spection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a re- view tool can align a file of the wafer, such as a design file or an inspection = = = lin image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool, and gen- erate a deskew transform of coordinates of the alignment sites of the file and - = 102 105 coordinates of alignment sites of the image from the review tool. The image of the wafer may not contain defects. = = 111061137j = 108 = 103 \. 11 11 in cr) cr) ,—, 104 FIG. 1 IN ,—, © ei O WO 2017/136359 Al MIDEDIM01101 DIVIIMOID1301110011011111111111111111111111111111111111 TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, Published: TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, DE, LT, SE, GA, with international search 21(3)) report (Art. GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
SG11201804995UA 2016-02-04 2017-01-31 Automatic deskew using design files or inspection images SG11201804995UA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
IN201641004030 2016-02-04
US201662309623P 2016-03-17 2016-03-17
US15/258,546 US10204416B2 (en) 2016-02-04 2016-09-07 Automatic deskew using design files or inspection images
PCT/US2017/015880 WO2017136359A1 (en) 2016-02-04 2017-01-31 Automatic deskew using design files or inspection images

Publications (1)

Publication Number Publication Date
SG11201804995UA true SG11201804995UA (en) 2018-08-30

Family

ID=59498278

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201804995UA SG11201804995UA (en) 2016-02-04 2017-01-31 Automatic deskew using design files or inspection images

Country Status (8)

Country Link
US (1) US10204416B2 (en)
EP (1) EP3411900A4 (en)
KR (1) KR102438822B1 (en)
CN (1) CN108604560B (en)
IL (1) IL260414B (en)
SG (1) SG11201804995UA (en)
TW (1) TWI725117B (en)
WO (1) WO2017136359A1 (en)

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* Cited by examiner, † Cited by third party
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US10522376B2 (en) * 2017-10-20 2019-12-31 Kla-Tencor Corporation Multi-step image alignment method for large offset die-die inspection
US10572991B2 (en) * 2017-11-07 2020-02-25 Kla-Tencor Corporation System and method for aligning semiconductor device reference images and test images
US11049745B2 (en) * 2018-10-19 2021-06-29 Kla Corporation Defect-location determination using correction loop for pixel alignment
US11450012B2 (en) * 2019-10-31 2022-09-20 Kla Corporation BBP assisted defect detection flow for SEM images
US11798138B2 (en) * 2020-07-07 2023-10-24 Applied Materials Israel Ltd. Reconstruction of a distorted image of an array of structural elements of a specimen
US20220059316A1 (en) * 2020-08-19 2022-02-24 Kla Corporation Scanning Electron Microscope Image Anchoring to Design for Array
CN113390879A (en) * 2021-04-22 2021-09-14 广州超音速自动化科技股份有限公司 Coating measurement, correction and flaw detection method and system

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US5479252A (en) 1993-06-17 1995-12-26 Ultrapointe Corporation Laser imaging system for inspection and analysis of sub-micron particles
US5847821A (en) 1997-07-10 1998-12-08 Advanced Micro Devices, Inc. Use of fiducial marks for improved blank wafer defect review
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Also Published As

Publication number Publication date
EP3411900A1 (en) 2018-12-12
CN108604560A (en) 2018-09-28
KR20180101726A (en) 2018-09-13
TWI725117B (en) 2021-04-21
WO2017136359A1 (en) 2017-08-10
KR102438822B1 (en) 2022-08-31
US20170228866A1 (en) 2017-08-10
IL260414A (en) 2018-10-31
IL260414B (en) 2021-08-31
CN108604560B (en) 2020-01-07
US10204416B2 (en) 2019-02-12
TW201740480A (en) 2017-11-16
EP3411900A4 (en) 2019-08-14

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