CN104752283B - Flip-chip device - Google Patents
Flip-chip device Download PDFInfo
- Publication number
- CN104752283B CN104752283B CN201510159819.7A CN201510159819A CN104752283B CN 104752283 B CN104752283 B CN 104752283B CN 201510159819 A CN201510159819 A CN 201510159819A CN 104752283 B CN104752283 B CN 104752283B
- Authority
- CN
- China
- Prior art keywords
- chip
- wafer
- carrier
- suction nozzle
- rotating
- Prior art date
Links
- 239000000969 carriers Substances 0.000 claims abstract description 45
- 238000004458 analytical methods Methods 0.000 claims description 6
- 230000000875 corresponding Effects 0.000 claims description 6
- 238000003384 imaging method Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 5
- 230000001105 regulatory Effects 0.000 claims description 4
- 229920000297 Rayon Polymers 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 280000992371 Prism On companies 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 34
- 238000010521 absorption reactions Methods 0.000 description 3
- 238000000034 methods Methods 0.000 description 3
- 238000010586 diagrams Methods 0.000 description 2
- 238000005516 engineering processes Methods 0.000 description 2
- 239000000463 materials Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006011 modification reactions Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001276 controlling effects Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Abstract
Description
Technical field
The present invention relates to integrated antenna package, grouping system technical field, more particularly to a kind of flip-chip device.
Background technology
After wafer cuts into multiple chips, upside-down mounting bond techniques need to be carried out, or sorted according to its appearance characteristics.
Referring to accompanying drawing 1, the wafer carrying body 101 and chip of Conventional flip device are arranged in parallel by carrier 102, chip pickup Suction nozzle 104,105 is arranged in rotating disk 103, is rotated after nozzle pick chip to top by the suction nozzle on horizontal arm for taking material 107 106 access chip, and are examined respectively to the chip position on wafer and by the position on carrier by camera 109, camera 110 Survey, and adjust the state of suction nozzle 106 in real time, movement is moved horizontally to suction nozzle 106 to horizontal feeding on shifting axle 108 than 107 Chip is by the top chip of carrier 102.
This structure is in arranged in parallel by carrier 102 with chip because of wafer carrying body 101, is taken up too much space, and horizontal Shifting axle has larger movement travel, causes to produce larger error in motion, and make production efficiency relatively low.
The content of the invention
In order to solve the above-mentioned technical problem, the present invention provides a kind of flip-chip device, by wafer carrying body and chip by Carrier side arranged on opposite sides, centre realize the pickup, transmission and installation of chip using two sets of rotational structures.
The present invention adopts the technical scheme that：
A kind of flip-chip device, including wafer carrying body and chip be by carrier, it is characterized in that, the wafer carrying body and Chip sets two rotating mechanisms by carrier side arranged on opposite sides, in the wafer carrying body and chip between by carrier, and described two The line of the pivot of individual rotating mechanism and the wafer carrying body and chip are vertical by carrier, are set on the rotating mechanism At least two suction nozzle bodies, the suction nozzle of the suction nozzle body are movably arranged.
Further, prism is also set up on each rotating mechanism, is set and the prism in the flipped device Corresponding camera, the camera enter by the prism to the chip on the wafer and by the chip mounting location on carrier Row imaging analysis obtain positional information, and the defects of chip surface can be checked.
Further, the wafer carrying body and chip are arranged that the wafer carrying body is above, described by carrier up and down Chip stand under load body is located at lower section, and the upper wafer of the wafer carrying body is fixed by viscose glue.
Further, camera, chip rotation of the camera on suction nozzle are installed in the horizontal level of bottom rotating mechanism Imaging analysis are carried out to chip to during horizontal level, the defects of obtaining the positional information before chip installation, and check chip surface.
Further, the suction nozzle body includes regulating member, and the regulating member is by the chip on suction nozzle and corresponding suction Alignment is adjusted in mouth or chip carrier, and has drive mechanism driving suction nozzle linear motion.
Further, the wafer carrying body and chip are arranged on respective motion by carrier, the fitness machine The lower section that suction nozzle is moved to by wafer and by carrier of structure, the motion move what is be made up of the prism and camera Image system control is realized.
Further, the suction nozzle body on each rotating mechanism is 2 to 4.
The beneficial effects of the invention are as follows：
（1）Two groups of rotating mechanisms realize the turn-over operation during the packing of chip；
（2）The wafer carrying body and chip set face-to-face is compact-sized by carrier, and movement travel is short, reduces error Source and improve encapsulation or the efficiency of separation；
（3）Suction nozzle body and visual mechanisms can conveniently adjust the deviation of chip, improve chip packing quality.
Brief description of the drawings
Accompanying drawing 1 is flip-chip mechanism structure schematic diagram of the prior art；
Accompanying drawing 2 is flip-chip mechanism structure schematic diagram of the invention.
Label in accompanying drawing is respectively：
1. wafer carrying body；2. chip is by carrier；
3. rotating mechanism；4. rotating mechanism；
5. camera；6. camera；
7. prism；8. prism；
9. suction nozzle body；10. suction nozzle body；
11. suction nozzle body；12. suction nozzle body；
13. camera；101. wafer carrying body；
102. chip is by carrier；103. rotating disk；
104. suction nozzle；105. suction nozzle；
106. suction nozzle；107. arm for taking material；
108. move horizontally axle；109. camera；
110. camera.
Embodiment
Flip-chip device of the present invention is elaborated below in conjunction with the accompanying drawings.
Referring to accompanying drawing 2, flip-chip device includes wafer carrying body 1 and chip by carrier 2, wafer carrying body 1 and chip By 2 face-to-face spread configuration of carrier, set-up mode can be horizontally disposed or vertical arrangement.When horizontally disposed, wafer carrying body 1 It can be fixedly installed on the table by carrier 2 with chip, when arranging vertically, chip is fixed on the table by carrier 2, wafer Supporting body 1 is fixed on top by support.Wafer carrying body 1 and chip can be exchanged both positions by carrier 2.
In wafer carrying body 1 and chip, two rotating mechanisms 3,4, the rotation of two rotating mechanisms 3,4 are set between by carrier 2 The line for turning center is vertical by carrier 2 with wafer carrying body 1 and chip.At least two are set to inhale on each rotating mechanism 3,4 Nozzle mechanism 9,10,11,12, the quantity of suction nozzle body 9,10,11,12 are generally 2 to 4, the suction nozzle on two rotating mechanisms 3,4 The position of mechanism 9,10,11,12 and quantity are corresponding, when the work of two rotating mechanisms 3,4 rotates, suction nozzle body 9 thereon, 10th, 11,12 merged within cycle time positioned at relative position, the suction nozzle body on two rotating mechanisms is in meeting point to chip Implement transfer.By the wafer carrying body and chip arranged up and down exemplified by by carrier, the transfer process of chip is the whirler of top Suction nozzle body 9,10 on structure 3 from wafer carrying body 1 after absorption chip, with the suction nozzle body 11 on the rotating mechanism 4 of lower section, 12 are merged, and chip is transferred to the suction nozzle body 11,12 of lower section, and in transfer process, chip is implemented turn-over upside-down mounting.
Suction nozzle on two suction nozzle bodies can realize that axial movement and radial direction are finely tuned by controlling, and regulative mode can use existing Have in technology and mechanical adjusting means or digital control type adjusting means.
Prism 7,8 is also set up on each rotating mechanism, the camera 5,6 corresponding with prism is set in flipped device, Camera 5,6 carries out imaging analysis by the chip position on 7,8 pairs of wafers of prism, and camera 13 is additionally provided with flipped device, right Chip position before installation carries out imaging analysis, and the defects of check chip surface.The control unit of flipped device is according to camera Position image-forming information control rotating mechanism and suction nozzle body to adjust position and the state of chip in real time.
Wafer carrying body 1 and chip are arranged in respective transport mechanism by carrier 2, will according to the motion of transport mechanism Chip on wafer is moved to above suction nozzle, will be moved to by chip mounting location on carrier below suction nozzle.Control unit passes through The motion of motion is realized in the image system control of prism and camera composition.
Below by the wafer carrying body and chip arranged up and down exemplified by by carrier, to the work of the flip-chip device of the present invention Make that flow is as follows, wafer carrying body is moved with certain speed, and two rotating mechanisms are in the same direction or opposite direction turns It is dynamic, the rotating mechanism of top by suction nozzle body from absorption chip on wafer carrying body, when continuing to go to some position and lower section The suction nozzle body of rotating mechanism merge, lower section suction nozzle body completes from absorption chip on the suction nozzle body of top, at this moment chip Turn-over, lower section suction nozzle body go to chip by carrier positions, chip are arranged on into chip by carrier.Chip a position After being covered with, chip is transmitted by carrier to finished product direction.
It the above is only the preferred embodiment of the present invention, it is noted that for those skilled in the art, Without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications also should be regarded as this hair Bright protection domain.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510159819.7A CN104752283B (en) | 2015-04-07 | 2015-04-07 | Flip-chip device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510159819.7A CN104752283B (en) | 2015-04-07 | 2015-04-07 | Flip-chip device |
| PCT/CN2015/081754 WO2016161703A1 (en) | 2015-04-07 | 2015-06-18 | Device for flip-chip mounting chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104752283A CN104752283A (en) | 2015-07-01 |
| CN104752283B true CN104752283B (en) | 2018-02-13 |
Family
ID=53591772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510159819.7A CN104752283B (en) | 2015-04-07 | 2015-04-07 | Flip-chip device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104752283B (en) |
| WO (1) | WO2016161703A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200152491A1 (en) * | 2017-04-11 | 2020-05-14 | Muehlbauer GmbH & Co. KG | Component receiving device with optical sensor |
| CN108155124A (en) * | 2017-12-25 | 2018-06-12 | 北京中电科电子装备有限公司 | A kind of chip attachment device and method |
| CN110444498A (en) * | 2018-05-03 | 2019-11-12 | 苏州艾科瑞思智能装备股份有限公司 | A kind of long range precisely quickly takes cored sheet devices |
| CN109588036A (en) * | 2018-11-30 | 2019-04-05 | 江门市三兴照明科技有限公司 | A kind of lamp bead mounting device |
| TWI709727B (en) * | 2019-08-12 | 2020-11-11 | 京元電子股份有限公司 | Ic chip appearance inspection module |
| CN111524851A (en) * | 2020-04-30 | 2020-08-11 | 甬矽电子(宁波)股份有限公司 | Chip flip-chip apparatus, system and method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1613146A (en) * | 2002-01-07 | 2005-05-04 | 先进系统自动化有限公司 | Flip chip bonder and method therefor |
| CN100481318C (en) * | 2004-02-16 | 2009-04-22 | 米尔鲍尔股份公司 | Electronic component testing and rotating device and method |
| CN204632732U (en) * | 2015-04-07 | 2015-09-09 | 嘉兴景焱智能装备技术有限公司 | Flip-chip device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10203601A1 (en) * | 2002-01-30 | 2003-08-14 | Siemens Ag | Chip removal device, chip removal system, placement system and method for removing chips from a wafer |
| US6861608B2 (en) * | 2002-05-31 | 2005-03-01 | Texas Instruments Incorporated | Process and system to package residual quantities of wafer level packages |
| JP4616719B2 (en) * | 2005-07-20 | 2011-01-19 | 富士通フロンテック株式会社 | IC chip mounting method |
| CH698718B1 (en) * | 2007-01-31 | 2009-10-15 | Oerlikon Assembly Equipment Ag | A device for mounting a flip chip on a substrate. |
| CN102201357B (en) * | 2011-04-19 | 2013-04-17 | 上海微松工业自动化有限公司 | Equipment for extracting, turning and setting wafer-level packaged microchip |
-
2015
- 2015-04-07 CN CN201510159819.7A patent/CN104752283B/en active IP Right Grant
- 2015-06-18 WO PCT/CN2015/081754 patent/WO2016161703A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1613146A (en) * | 2002-01-07 | 2005-05-04 | 先进系统自动化有限公司 | Flip chip bonder and method therefor |
| CN100481318C (en) * | 2004-02-16 | 2009-04-22 | 米尔鲍尔股份公司 | Electronic component testing and rotating device and method |
| CN204632732U (en) * | 2015-04-07 | 2015-09-09 | 嘉兴景焱智能装备技术有限公司 | Flip-chip device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104752283A (en) | 2015-07-01 |
| WO2016161703A1 (en) | 2016-10-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105798609B (en) | Limit switch kludge | |
| CN102495528B (en) | Double-workpiece-table same-phase rotation exchange method and device based on follow-up rotation-resisting mechanisms | |
| US8037996B2 (en) | Transfer apparatus for handling electronic components | |
| KR20050100604A (en) | Electronic component placement machine and electronic component placement method | |
| CN101673665B (en) | Substrate processing apparatus | |
| CN104137667B (en) | Component mounter | |
| CN102528353A (en) | Full-automatic multi-station welding system | |
| CN103964359B (en) | All-in-one is rolled in filling | |
| JP6552947B2 (en) | Packaging machine and packaging method | |
| CN102294591A (en) | Automatic expansion bolt assembling machine | |
| CN104349603A (en) | Patch pasting method and device for patch head of patch pasting machine | |
| CN102543801A (en) | Die bonder | |
| CN105619055B (en) | A kind of new magnet assembling tool for stitching | |
| CN105150536B (en) | A kind of travel mechanism of printing head and the 3D printer with the travel mechanism | |
| TW201635399A (en) | Flip chip bonding device | |
| CN202310550U (en) | Rotary swing-type seedling transplanting device for dry field potting seedling transplanter | |
| CN102683233B (en) | Die bonder | |
| CN104400782B (en) | For the open-close type manipulator of the accurate pick-and-place of fritter rule material | |
| CN103157606B (en) | Fruit weighing and sorting system | |
| US8640614B2 (en) | Work transfer apparatus for press machine, and work transfer unit | |
| CN202244163U (en) | Electronic component feeding device for braider and full-automatic braider comprising electronic component feeding device | |
| CN206296719U (en) | Possess self-feeding and the reclaimer device of upender | |
| JP6243756B2 (en) | Spout mounting bag supply method and apparatus | |
| CN108190565B (en) | Leather shell machine | |
| CN107134422A (en) | Chip bonding device and method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |