MY186148A - Setup camera auto height alignment - Google Patents

Setup camera auto height alignment

Info

Publication number
MY186148A
MY186148A MYPI2017704544A MYPI2017704544A MY186148A MY 186148 A MY186148 A MY 186148A MY PI2017704544 A MYPI2017704544 A MY PI2017704544A MY PI2017704544 A MYPI2017704544 A MY PI2017704544A MY 186148 A MY186148 A MY 186148A
Authority
MY
Malaysia
Prior art keywords
heads
flipper
pick
height alignment
camera auto
Prior art date
Application number
MYPI2017704544A
Inventor
Kuang Eng Oh
Original Assignee
Mi Equipment M Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mi Equipment M Sdn Bhd filed Critical Mi Equipment M Sdn Bhd
Priority to MYPI2017704544A priority Critical patent/MY186148A/en
Priority to PH12018000382A priority patent/PH12018000382A1/en
Priority to TW107140968A priority patent/TWI699852B/en
Priority to KR1020180146220A priority patent/KR102128662B1/en
Publication of MY186148A publication Critical patent/MY186148A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/56—Accessories
    • G03B17/561—Support related camera accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

A method of vision assisted automatic height alignment (2) of each individual pick up heads and each individual flipper heads, comprising of steps using at least one camera (C) to capture image and measure positions of said pick up heads and flipper heads; and calculation of final travel distances for each pick up head and flipper head so that the same effective travel distance for the pick up heads and flipper heads is standardized. (Figure 5)
MYPI2017704544A 2017-11-27 2017-11-27 Setup camera auto height alignment MY186148A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
MYPI2017704544A MY186148A (en) 2017-11-27 2017-11-27 Setup camera auto height alignment
PH12018000382A PH12018000382A1 (en) 2017-11-27 2018-11-16 Setup camera auto height alignment
TW107140968A TWI699852B (en) 2017-11-27 2018-11-19 A method of vision assisted automatic height alignment of pick up head and flipper head
KR1020180146220A KR102128662B1 (en) 2017-11-27 2018-11-23 Setup camera auto height alignment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2017704544A MY186148A (en) 2017-11-27 2017-11-27 Setup camera auto height alignment

Publications (1)

Publication Number Publication Date
MY186148A true MY186148A (en) 2021-06-28

Family

ID=66844943

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017704544A MY186148A (en) 2017-11-27 2017-11-27 Setup camera auto height alignment

Country Status (4)

Country Link
KR (1) KR102128662B1 (en)
MY (1) MY186148A (en)
PH (1) PH12018000382A1 (en)
TW (1) TWI699852B (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6171049B1 (en) * 1996-02-29 2001-01-09 Alphasem Ag Method and device for receiving, orientating and assembling of components
US6535291B1 (en) * 2000-06-07 2003-03-18 Cyberoptics Corporation Calibration methods for placement machines incorporating on-head linescan sensing
SG104292A1 (en) * 2002-01-07 2004-06-21 Advance Systems Automation Ltd Flip chip bonder and method therefor
JP4128540B2 (en) * 2003-06-05 2008-07-30 株式会社新川 Bonding equipment
US20050045914A1 (en) * 2003-07-09 2005-03-03 Newport Corporation Flip chip device assembly machine
KR20150029086A (en) * 2013-09-09 2015-03-18 한미반도체 주식회사 Z-axis height sensing method for semiconductor apparatus
KR102247600B1 (en) * 2015-03-16 2021-05-03 한화정밀기계 주식회사 Bonding apparatus and bonding method
KR102078185B1 (en) * 2019-10-01 2020-02-17 제너셈(주) Z axis movement amount calculating method and semiconductor package transfering apparatus

Also Published As

Publication number Publication date
PH12018000382A1 (en) 2019-06-10
TWI699852B (en) 2020-07-21
TW201926533A (en) 2019-07-01
KR102128662B1 (en) 2020-07-09
KR20190062236A (en) 2019-06-05

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