CN109686685A - A kind of high temperature test sorting machine - Google Patents
A kind of high temperature test sorting machine Download PDFInfo
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- CN109686685A CN109686685A CN201910022145.4A CN201910022145A CN109686685A CN 109686685 A CN109686685 A CN 109686685A CN 201910022145 A CN201910022145 A CN 201910022145A CN 109686685 A CN109686685 A CN 109686685A
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- 238000012360 testing method Methods 0.000 title claims abstract description 107
- 238000001816 cooling Methods 0.000 claims abstract description 46
- 238000012546 transfer Methods 0.000 claims abstract description 44
- 238000001514 detection method Methods 0.000 claims abstract description 25
- 238000005538 encapsulation Methods 0.000 claims abstract description 10
- 238000012937 correction Methods 0.000 claims abstract description 8
- 238000010330 laser marking Methods 0.000 claims abstract description 7
- 230000007246 mechanism Effects 0.000 claims description 62
- 239000000203 mixture Substances 0.000 claims description 16
- 238000003860 storage Methods 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 15
- 238000009826 distribution Methods 0.000 claims description 7
- 238000013461 design Methods 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims description 5
- 239000012141 concentrate Substances 0.000 claims description 4
- 238000007689 inspection Methods 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 238000009781 safety test method Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 12
- 230000008569 process Effects 0.000 abstract description 11
- 239000004065 semiconductor Substances 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 14
- 238000012545 processing Methods 0.000 description 5
- 235000013547 stew Nutrition 0.000 description 4
- 230000032258 transport Effects 0.000 description 3
- 239000008186 active pharmaceutical agent Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000013480 data collection Methods 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a kind of high temperature test sorting machines, mould group is picked and placed including capstan head, transfer cools down mould group, high temperature picks and places mould group, mobile platform mould group, device feeding mold group, correction and test station, finished product exports mould group and equipment Electric Appliance Cabinet, machine is divided into device and launches region, room temperature test zone, transfer cooled region, platform moving area, high temperature test region, cooling test zone, mark bracket panel region, appearance detection zone, braid output area etc., make semiconductor electronic component on the same device, pass through mechanical fetching device, realize room temperature electrical testing, high temperature electrical testing, cooling electrical testing, laser marking, appearance detection, sorting classification, the processes such as braid encapsulation.By applying the present invention, a variety of test equipments will be needed to complete originally, function is integrated to be completed on one device, is improved production efficiency, has been saved cost.
Description
Technical field
The present invention relates to a kind of semiconductor field, specifically a kind of high temperature test sorting machine.
Background technique
Due to the needs of modern social development, what electronic device became becomes increasingly complex, and can adapt to a variety of environment, this will
It has asked electronic component that not only there is superperformance and reliability, but also has been required to be applicable under various temperature environment states normal
It uses.However, the processing method of conventional classes of semiconductors discrete semiconductor testing mark sorting, can only be under normal temperature state into
All kinds of performance detections of row are typically only capable to carry out semiconductor electronic component performance test in normal temperature environment indoors, because machinery is set
Semiconductor electronic component can not be carried out condition of high temperature test by the limitation such as meter, material structure, technology.
Summary of the invention
The purpose of the present invention is to provide a kind of high temperature test sorting machines, to solve mentioned above in the background art ask
Topic.
To achieve the above object, the invention provides the following technical scheme:
A kind of high temperature test sorting machine, disclose it is a kind of using use cover advanced DDR motor and real-time control group more
At device transmission and test macro, including capstan head pick and place mould group, the cooling mould group of transfer, high temperature pick and place mould group, mobile platform mould group,
Device feeding mold group, correction and test station, finished product output mould group and equipment Electric Appliance Cabinet, the capstan head pick and place the setting of mould group and are setting
At the center of the equipment work top of spare electrical device cabinet, it is composed of vacuum slot mechanism and independent servo press mechanism, vacuum
Suction nozzle body is by the pick-and-place DDR electric system that is fixedly connected on equipment work top and picks and places DDR electric system output shaft
The vacuum distributor gear and feeding suction nozzle body of upper fixation form, by pick and place DDR electric system drive vacuum distributor gear and
Feeding suction nozzle body rotates suction device, and device is driven to rotate, and is successively distributed in capstan head by round satellite shape and picks and places mould group
Around each station, carry out testing, sorting, the independent servo press mechanism passes through the master that is fixed on equipment work top
Capstan head support group is fixed on the surface of feeding suction nozzle body, will be right by electric conversion system drive independence servo press mechanism
It answers the feeding suction nozzle on station to push, is used for pick, capstan head picks and places mould group and transmits after device feeding mold group extraction device
To room temperature test station, high temperature is transported to by the cooling mould group of transfer after progress room temperature test and picks and places mould group progress high temperature test；
The cooling mould group of the transfer is located at that capstan head picks and places mould group and high temperature picks and places and is arranged between mould group, transfer cool down mould group by
Transfer DDR electric system, transfer load plate mechanism, air cooling mechanism composition, the transfer DDR electric system are fixed on equipment workbench
On face, output shaft is fixed with transfer load plate mechanism and air cooling mechanism upward, on output shaft vertically, and transfer load plate mechanism is disk knot
Structure, top edge are uniformly provided with eight stations, and each station design has the positioning guided mode of strip, symmetrical position in transfer load plate mechanism
It installs there are two station is picked and placed, corresponds respectively to capstan head and pick and place mould group and high temperature pick-and-place mould group, be equipped with and pick and place on the outside of pick-and-place station
Check device, is used for positioning devices position, and transfer load plate mechanism picks and places mould group from high temperature and turns to the side three that capstan head picks and places mould group
Connection is fixed by the bracket right above a station there are three cooling tuyere, cooling tuyere is connected with gas source by distributor gear and constitutes
By cooling tuyere to device cooling is blowed in air-cooling device, and the device for that will pass through room temperature test is transported to height
Temperature picks and places in mould group, and by the device cooling after high temperature test and transports in turret pick-and-place mould group, and pass through capstan head and pick and place
Test station carries out high temperature test after mould group is transported to cooling, tests after carrying out cooling；
The high temperature picks and places mould group by the column of secondary tower support group and crossbeam for high temperature independence press mechanism and high temperature DDR
Electric system is fixedly connected on equipment work top and hanging, and the output shaft of high temperature DDR electric system is downward, solid on output shaft
Surely be connected with high temperature feeding suction nozzle body, high temperature independence press mechanism compression bar be located at the suction nozzle of high temperature feeding suction nozzle body just on
Just, by controlling the pushing and pick-and-place of high temperature independence press mechanism and high temperature feeding suction nozzle body, original part is cooled down into mould from transfer
It takes out, and is put into the high-temperature storage device of mobile platform mould group in the transfer load plate mechanism of group, carry out device heating and stew temperature, together
When will take out heating and stew that device of warm time at most, be sent in high temperature test station, carry out electrical testing, system
The high temperature electrical property parameter information being collected into according to preceding process, carries out test parameter defective products device to abandon recovery processing, will close
Lattice device is sent into finished product output mould group and carries out mark encapsulation；
The mobile platform mould group by two sets of servo straight-line motion mechanisms of XY, supporting platform device, heating control apparatus and
High-temperature storage device composition, supporting platform device are fixed on two sets of servo straight-line motion mechanisms of XY, two sets of servo straight line fortune of XY
The Serve Motor Control supporting platform device of motivation structure is mobile, and the top surface of supporting platform device is fixedly connected with heating control apparatus
With high-temperature storage device, high-temperature storage device controls heating temperature by heating control apparatus, to the device in high temperature storage devices
Part heating；
The correction and test station are by positioning correcting device, steering correcting device, electric characteristic detecting apparatus, high temperature positioning dress
Set, high-temperature test device, video detection device and polarity test device composition, the positioning correcting device, steering correcting device,
Electric characteristic detecting apparatus, high temperature positioning device, high-temperature test device, video detection device and polarity test device are fixed on three-dimensional
Position adjusts the working position composition on pedestal, and the working position by the way that each station is arranged in detects and adjusting device position,
Device is tested and records data.
As a further solution of the present invention: the finished product output mould group is by mark bracket panel mould group, positioning correcting device, DS
Detection device concentrates feeding-distribution device and braid encapsulation module composition, and the mark bracket panel mould group turntable is divided into four stations, every station
Design has the positioning guided mode of strip, and laser marking machine and mark lettering vision inspection apparatus are disposed on the station of bracket panel.
It positions in guided mode when device is put into mark bracket panel by suction nozzle, then from next positioning guided mode, extracts through mark bracket panel laser marking
With the device of mark vision-based detection, the DS detection device is made of CCD high-speed industrial and adjustment mechanism, by adjusting mechanism tune
Lens location and secondary light source are saved, the appearance for making CCD high-speed industrial camera carry out five faces to the device of band on suction nozzle detects, record
Information data, the electrical parameter for concentrating feeding-distribution device to be collected by preceding process and visual appearance detection information, by suction nozzle
On device carry out concentrating stepping classification processing, device is encapsulated in carrier band and lid by packaging by hot pressing by the braid encapsulation module
It between band, and winds, completes finished product packing.
As a further solution of the present invention: the device feeding mold group is stored bowl by vibration feeder, device, is pneumatically sent
Expect track and high-speed separation mechanism composition, device stored by the device in bowl by vibration feeder and is sent to pneumatic feed track,
And device is sent to high speed separating mechanism by pneumatic feed track and is separated, mould group is picked and placed from high-speed separation mechanism by capstan head
Output end pickup.
As a further solution of the present invention: static elimination being installed at the top of the device storage bowl of the device feeding mold group
Fan reduces the influence that electrostatic detects semiconductor devices.
As further scheme of the invention: being equipped with the drive of device control module and equipment in the equipment Electric Appliance Cabinet
Dynamic power supply and gas source, by the output of control power supply and gas source, so that each mould group Collaboration, completes process.
Compared with prior art, the beneficial effects of the present invention are: machine, which is divided into device, launches region, room temperature test section
Domain, transfer cooled region, platform moving area, high temperature test region, cooling test zone, mark bracket panel region, appearance detection
Region, braid output area etc., make semiconductor electronic component on the same device, by mechanical fetching device, realize
Room temperature electrical testing, high temperature electrical testing, cooling electrical testing, laser marking, appearance detection, sorting classification, braid encapsulation
Etc. processes.By applying the present invention, a variety of test equipments will be needed to complete originally, function is integrated to be completed on one device, is improved
Production efficiency, has saved cost.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of high temperature test sorting machine.
Fig. 2 is the structural schematic diagram of station distribution in high temperature test sorting machine.
Fig. 3 is the structural schematic diagram that capstan head picks and places mould group in high temperature test sorting machine.
Fig. 4 is the structural schematic diagram of the cooling mould group of transfer in high temperature test sorting machine.
Fig. 5 is the structural schematic diagram that high temperature test sorting machine high temperature picks and places mould group.
Fig. 6 is the structural schematic diagram of mobile platform mould group in high temperature test sorting machine.
Fig. 7 is the structural schematic diagram of device feeding mold group in high temperature test sorting machine.
Fig. 8 is the structural schematic diagram of video detection device in high temperature test sorting machine.
Fig. 9 is the structural schematic diagram that correcting device is turned in high temperature test sorting machine.
Figure 10 is the structural schematic diagram of electric characteristic detecting apparatus in high temperature test sorting machine.
Figure 11 is the structural schematic diagram that correcting device is positioned in high temperature test sorting machine.
Figure 12 is the structural schematic diagram of high temperature test sorting machine high temperature positioning device.
Figure 13 is the structural schematic diagram of high temperature test sorting machine high temperature test device.
Figure 14 is circuit connection diagram in high temperature test sorting machine.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Please refer to Fig. 1~14, in the embodiment of the present invention, a kind of high temperature test sorting machine discloses a kind of use
Cover advanced DDR motor and real-time control composition device transmission and test macro, including capstan head picks and places mould group 1, transfer cooling more
Mould group 2, high temperature pick and place mould group 3, mobile platform mould group 4, device feeding mold group 5, correction and test station 6, finished product exports mould group 7
With equipment Electric Appliance Cabinet 8, the capstan head picks and places mould group 1 and is arranged at the center of equipment work top 81 of equipment Electric Appliance Cabinet 8, by true
Suction nozzle mechanism 11 is composed with independent servo press mechanism 12, and vacuum slot mechanism 11 is worked by being fixedly connected on equipment
Vacuum distributor gear 112 fixed on DDR electric system 111 and pick-and-place 111 output shaft of DDR electric system is picked and placed on table top 81
It is formed with feeding suction nozzle body 113, drives vacuum distributor gear 112 and feeding suction nozzle body by picking and placing DDR electric system 111
113 rotation suction devices, and device is driven to rotate, it is successively distributed in by round satellite shape each around capstan head pick-and-place mould group 1
A station, carries out testing, sorting, and the independent servo press mechanism 12 passes through the main capstan head that is fixed on equipment work top 81
Support group 121 is fixed on the surface of feeding suction nozzle body 113, drives press under independent servo by electric conversion system 122
Structure 12 pushes the feeding suction nozzle on corresponding station, is used for pick, and capstan head picks and places mould group 1 and extracts from device feeding mold group 5
It is sent to room temperature test station 61 after device, high temperature is transported to by the cooling mould group 2 of transfer after progress room temperature test and picks and places mould group 3
Carry out high temperature test；
The cooling mould group 2 of the transfer is located at capstan head pick-and-place mould group 1 and high temperature picks and places and is arranged between mould group 3, the cooling mould of transfer
Group 2 is made of transfer DDR electric system 21, transfer load plate mechanism 22, air cooling mechanism 23, and the transfer DDR electric system 21 is solid
It being scheduled on equipment work top 81, output shaft is fixed with transfer load plate mechanism 22 and air cooling mechanism 23 upward, on output shaft vertically,
Transfer load plate mechanism 22 is disc structure, and top edge is uniformly provided with eight stations, and each station design has the positioning of strip to lead
Mould, symmetric position is set there are two station is picked and placed in transfer load plate mechanism 22, corresponds respectively to that capstan head picks and places mould group 1 and high temperature picks and places
Mould group 3 picks and places and is equipped with pick-and-place check device 24 on the outside of station, is used for positioning devices position, and transfer load plate mechanism 22 takes from high temperature
It puts and is fixed by the bracket cooling tuyere there are three connections right above the station of side three of the steering capstan head pick-and-place mould group 1 of mould group 3, it is cold
But tuyere is connected with gas source by distributor gear and constitutes air-cooling device 23, device is blowed by cooling tuyere cold
But, mould group 3 is picked and placed for the device for passing through room temperature test to be transported to high temperature, and the device after high temperature test is cooling simultaneously
It transports turret to pick and place in mould group 1, and test station 63 after mould group 1 is transported to cooling is picked and placed by capstan head and carries out high temperature test,
It is tested after carrying out cooling；
The high temperature picks and places mould group 3 by the column of secondary tower support group 31 and crossbeam for high temperature independence press mechanism 32 and height
Warm DDR electric system 33 is fixedly connected on equipment work top 81 and hanging, the output shaft court of high temperature DDR electric system 33
Under, high temperature feeding suction nozzle body 34 is fixedly connected on output shaft, 32 compression bar of high temperature independence press mechanism is located at the suction of high temperature feeding
Right above the suction nozzle of nozzle mechanism 34, by controlling the pushing of high temperature independence press mechanism 32 and high temperature feeding suction nozzle body 34 and taking
It puts, original part is taken out from the transfer load plate mechanism 22 of the cooling mould group 2 of transfer, and be put into the high-temperature storage of mobile platform mould group 4
It in device 44, carries out device heating and stews temperature, while heating will be taken out and stew that device of warm time at most, be sent to high temperature
In test station 62, progress electrical testing, the high temperature electrical property parameter information that system is collected into according to preceding process, not by test parameter
Non-defective unit device carries out abandoning recovery processing, and good devices are sent into finished product output mould group 7 and carry out mark encapsulation；
The mobile platform mould group 4 is filled by two sets of servo straight-line motion mechanisms 42 of XY, supporting platform device 42, computer heating control
43 and the composition of high-temperature storage device 44 are set, supporting platform device 42 is fixed on two sets of servo straight-line motion mechanisms 42 of XY, XY two
The Serve Motor Control supporting platform device 42 for covering servo straight-line motion mechanism 42 is mobile, and the top surface of supporting platform device 42 is fixed
It is connected with heating control apparatus 43 and high-temperature storage device 44, high-temperature storage device 44 passes through the control heating of heating control apparatus 43
Temperature heats the device in high temperature storage devices 44；
The finished product output mould group 7 is by mark bracket panel mould group 71, positioning correcting device 61,3D5S detection device 72, concentration
Feeding-distribution device 73 and braid encapsulation module 74 form, and 71 turntable of mark bracket panel mould group is divided into four stations, and every station design has
The positioning guided mode of strip is disposed with laser marking machine and mark lettering vision inspection apparatus on the station of bracket panel.Work as suction nozzle
Device is put into mark bracket panel positioning guided mode, then from next positioning guided mode, is extracted through mark bracket panel laser marking and mark
The device of vision-based detection, the 3D5S detection device 72 are made of CCD high-speed industrial and adjustment mechanism, by adjusting mechanism adjusting
Lens location and secondary light source, the appearance for making CCD high-speed industrial camera carry out five faces to the device of band on suction nozzle detect, record letter
Data, the electrical parameter for concentrating feeding-distribution device 73 to be collected by preceding process and visual appearance detection information are ceased, by suction nozzle
On device carry out concentrate stepping classification processing, the braid encapsulation module 74 by packaging by hot pressing by device be encapsulated in carrier band with
It between lid band, and winds, completes finished product packing；
The correction and test station 6 are by positioning correcting device 61, steering correcting device 62, electric characteristic detecting apparatus 63, height
Warm positioning device 64, high-temperature test device 65, video detection device 66 and polarity test device 67 form, the positioning amendment dress
It sets 61, turn to correcting device 62, electric characteristic detecting apparatus 63, high temperature positioning device 64, high-temperature test device 65, video detection device
66 and polarity test device 67 by be fixed on three-dimensional position adjustment pedestal on working position form, by setting in each station
Working position detection and adjusting device position, device is tested and records data；
The device feeding mold group 5 is by vibration feeder 51, device storage bowl 52, pneumatic feed track 53 and high-speed separation
Mechanism 54 forms, and device is stored the device in bowl 52 by vibration feeder 51 and is sent to pneumatic feed track 53, and passes through gas
Dynamic feeding track 53, which send device to high speed separating mechanism 54, to be separated, and picks and places mould group 1 from high-speed separation mechanism 54 by capstan head
Output end pickup；
Air Ionizer is installed at the top of the device storage bowl 52 of the device feeding mold group 5, reduces electrostatic and half-and-half leads
The influence of body units test；
The driving power and gas source of device control module and equipment are installed in the equipment Electric Appliance Cabinet 8, pass through control electricity
The output of source and gas source, so that each mould group Collaboration, completes process.
The working principle of the invention is: capstan head pick and place mould group 1, the cooling mould group 2 of transfer and high temperature pick and place mould group 3 by device from
Device feeding mold group 5, data collection area, room temperature test zone, transfer cooling mould group 2, mobile platform mould group 4, high temperature test
Test zone, mark packaging area after region, the cooling mould group 2 of transfer, cooling, successively operate testing, sorting, data collection area
Altogether there are three station, three stations are corresponding in turn to video detection device 66, polarity test device 67 and turn to correcting device 62, lead to
It crosses video check device 66 and carries out video inspection, judge direction and position of the device on suction nozzle, collect number for the processing of rear process
According to being then sent to polarity test device 67 by capstan head suction nozzle band device, polarity test device carries out the materials and parts on suction nozzle
Polarity test judgement, determines its direction on suction nozzle, and recording information data is sent to finally by capstan head suction nozzle band device and turns
To correcting device 62, the information data that correcting device 62 is collected into according to preceding process is turned to, at the direction position correction of device
Reason makes each device direction position consistency on suction nozzle, and there are four stations for room temperature test zone, respectively correspond three electrical testings
Device 63 and a positioning correcting device 61, electric characteristic detecting apparatus 63 test electrical parameter according to the test request of device products
And recording information data is collected, according to the performance and capacity requirements of device products, it is able to carry out either simplex bit test and multistation is surveyed
Examination facilitates client's test configurations to expand, and carries out positioning amendment by positioning correcting device 61 after the completion of test, avoids capstan head suction nozzle
Deviate position of the device of band in transmit process, it is ensured that the uniqueness of position facilitates the cooling mould group 2 of transfer to transport, high temperature side
Examination region is made of three stations, is followed successively by a high temperature positioning device 64 and two high-temperature test devices 65 form, correct and turn
Device position offset after fortune, and the electrical parameter of device products is obtained after testing hot pot, and collect recording information data, after cooling
Test zone is successively made of a positioning correcting device 61 and two 63 devices of electric characteristic detecting apparatus, after correcting transhipment
Test device heats electrical parameter after cooling after device position offset, and collects recording information data, mark packaging area according to
It is secondary by mark bracket panel mould group 71, positioning correcting device 61,3D5S detection device 72, concentrate feeding-distribution device 73 and braid encapsulation module
74 6 station compositions.
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art,
It is still possible to modify the technical solutions described in the foregoing embodiments, or part of technical characteristic is carried out etc.
With replacement, all within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in this
Within the protection scope of invention.
Claims (5)
1. a kind of high temperature test sorting machine, including capstan head pick and place mould group, the cooling mould group of transfer, high temperature and pick and place mould group, mobile platform
Mould group, device feeding mold group, correction and test station, finished product output mould group and equipment Electric Appliance Cabinet, which is characterized in that the capstan head
It picks and places mould group to be arranged at the center of equipment work top of equipment Electric Appliance Cabinet, by press under vacuum slot mechanism and independent servo
Structure is composed, and vacuum slot mechanism is by the pick-and-place DDR electric system that is fixedly connected on equipment work top and picks and places DDR
Fixed vacuum distributor gear and feeding suction nozzle body composition, the independent servo press mechanism pass through on electric system output shaft
The main capstan head support group being fixed on equipment work top is fixed on the surface of feeding suction nozzle body；
The cooling mould group of the transfer is located at capstan head pick-and-place mould group and high temperature picks and places and is arranged between mould group, and the cooling mould group of transfer is by transfer
DDR electric system, transfer load plate mechanism, air cooling mechanism composition, the transfer DDR electric system are fixed on equipment work top
On, output shaft is fixed with transfer load plate mechanism and air cooling mechanism upward, on output shaft vertically, and transfer load plate mechanism is disk knot
Structure, top edge are uniformly provided with eight stations, and each station design has the positioning guided mode of strip, symmetrical position in transfer load plate mechanism
It installs there are two station is picked and placed, corresponds respectively to capstan head and pick and place mould group and high temperature pick-and-place mould group, be equipped with and pick and place on the outside of pick-and-place station
Check device, transfer load plate mechanism pass through branch right above the station of side three that high temperature pick-and-place mould group turns to capstan head pick-and-place mould group
Frame is fixedly connected there are three cooling tuyere, and cooling tuyere is connected with gas source by distributor gear and constitutes air-cooling device；
The high temperature picks and places mould group by the column of secondary tower support group and crossbeam for high temperature independence press mechanism and high temperature DDR motor
System is fixedly connected on equipment work top and hanging, and the output shaft of high temperature DDR electric system is downward, fixed on output shaft to connect
It is connected to high temperature feeding suction nozzle body, high temperature independence press mechanism compression bar is located at right above the suction nozzle of high temperature feeding suction nozzle body；
The mobile platform mould group is by two sets of servo straight-line motion mechanisms of XY, supporting platform device, heating control apparatus and high temperature
Storage device composition, supporting platform device are fixed on two sets of servo straight-line motion mechanisms of XY, two sets of servo straight line fitness machines of XY
The Serve Motor Control supporting platform device of structure is mobile, and the top surface of supporting platform device is fixedly connected with heating control apparatus and height
Warm storage device；
It is described correction and test station by positioning correcting device, turn to correcting device, electric characteristic detecting apparatus, high temperature positioning device,
High-temperature test device, video detection device and polarity test device composition, the positioning correcting device turn to correcting device, electricity
System safety testing device, high temperature positioning device, high-temperature test device, video detection device and polarity test device are fixed on three-dimensional position
Set the working position composition on adjustment pedestal.
2. high temperature test sorting machine according to claim 1, which is characterized in that the device feeding mold group is by vibration feeding
Device, device storage bowl, pneumatic feed track and high-speed separation mechanism composition.
3. high temperature test sorting machine according to claim 1, which is characterized in that the finished product output mould group is by mark bracket panel
Mould group, 3D5S detection device, concentrates feeding-distribution device and braid encapsulation module composition, the mark bracket panel mould at positioning correcting device
Group turntable is divided into four stations, and every station design has the positioning guided mode of strip, is disposed with laser marking machine on the station of bracket panel, with
And mark lettering vision inspection apparatus, the 3D5S detection device are made of CCD high-speed industrial and adjustment mechanism, the braid envelope
Die-filling group is encapsulated in device between carrier band and lid band by packaging by hot pressing.
4. high temperature test sorting machine according to claim 1, which is characterized in that the device of the device feeding mold group stores
Bowl top is equipped with Air Ionizer.
5. high temperature test sorting machine according to claim 1, which is characterized in that be equipped with equipment in the equipment Electric Appliance Cabinet
The driving power and gas source of control module and equipment.
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| CN201910022145.4A CN109686685A (en) | 2019-01-10 | 2019-01-10 | A kind of high temperature test sorting machine |
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| CN117682156A (en) * | 2023-12-22 | 2024-03-12 | 珠海芯试界半导体科技有限公司 | Intelligent pressure supplementing device for reel packaging and sealing and system thereof |
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Effective date of registration: 20211111 Address after: 518000 south side of block D, four floors, building 1, Wanfeng Huafeng Pioneer Park, Shajing street and community 1, Bao'an District, Shenzhen, Guangdong Province Applicant after: Shenzhen Nuotai Equipment Co.,Ltd. Address before: 518000 No. 1, floor 2, building 34, Ma'anshan second industrial zone, Shajing street, Bao'an District, Shenzhen, Guangdong Applicant before: SHENZHEN NORTECH AUTOMATION CO.,LTD. |
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Application publication date: 20190426 |