CN109174701A - A kind of IC chip test sorting unit and its working method - Google Patents
A kind of IC chip test sorting unit and its working method Download PDFInfo
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- CN109174701A CN109174701A CN201811186829.XA CN201811186829A CN109174701A CN 109174701 A CN109174701 A CN 109174701A CN 201811186829 A CN201811186829 A CN 201811186829A CN 109174701 A CN109174701 A CN 109174701A
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- 238000012360 testing method Methods 0.000 title claims abstract description 98
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000001514 detection method Methods 0.000 claims abstract description 68
- 230000007246 mechanism Effects 0.000 claims abstract description 42
- 238000012937 correction Methods 0.000 claims abstract description 23
- 238000010521 absorption reaction Methods 0.000 claims abstract description 7
- 238000007789 sealing Methods 0.000 claims description 23
- 230000002950 deficient Effects 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 9
- 230000033001 locomotion Effects 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 8
- 238000007664 blowing Methods 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 3
- 238000013459 approach Methods 0.000 claims description 2
- 230000007547 defect Effects 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 238000011056 performance test Methods 0.000 claims description 2
- 239000002699 waste material Substances 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/363—Sorting apparatus characterised by the means used for distribution by means of air
- B07C5/365—Sorting apparatus characterised by the means used for distribution by means of air using a single separation means
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a kind of IC chip test sorting unit and its working methods, device includes testing, sorting platform, the central part of test platform is equipped with turret system, several functional stations are equipped with around turret system, are sequentially installed with automatical feeding system, positioning system, Mark detection system, correction for direction system, test macro, 3D detection system, braid system and discharge system in each functional station；Turret system includes turntable and fixed station, and turntable is driven by directly-drive servo main motor and rotated, and turntable is equipped with several vacuum WANDs, directly-drive servo main motor one lattice of every rotation, and vacuum WAND reaches another functional station from a functional station；Fixed station is equipped with several independent press mechanisms, and independent press mechanism driving vacuum WAND pushes absorption chip.The present apparatus is simple and compact for structure, and measuring accuracy is high, and work efficiency is high.
Description
Technical field
The present invention relates to IC chip test technical fields, and in particular to a kind of IC chip test sorting dress
It sets and its working method.
Background technique
Testing, sorting technology is always the hot technology in the field IC, it is that IC test encapsulation field is indispensable together
Process.And the testing, sorting technology of invention packing forms integrated circuit even more wherein walks the key technology in Environment Science.Entirely certainly
The tower test macro of turn is mainly used for the testing, sorting of the inventions packing forms circuit such as QFN, CSP, SOIC, screening installation tool
There are automatic charging, transmission, the accurately functions such as rotation and positioning, the image detection of appearance, braid and automatic blanking.It is existing it is complete from
The tower test system structure of turn is complicated, and testing efficiency is low.
Summary of the invention
The present invention provides a kind of IC chip test sorting unit and its working method, can be completed by the present apparatus
Full-automatic carrying, power test, braid and the sorting of IC chip, the apparatus structure is simple, and manufacturing cost is low, test effect
Rate is high.
The technical solution adopted by the present invention is that:
A kind of IC chip test sorting unit, including testing, sorting platform, the center of the testing, sorting platform
Portion is equipped with turret system, is equipped with several functional stations around turret system, the functional station is arranged radially along platform, each function
Automatical feeding system, positioning system, Mark detection system, correction for direction system, test macro, 3D inspection are sequentially installed on station
Examining system, braid system and discharge system；The turret system includes turntable and fixed station, and fixed station is parallel with turntable and is located at
The top of turntable, turntable are rotated in the horizontal plane by the driving of directly-drive servo main motor, are equipped with several vacuum WANDs on turntable vertically,
Vacuum WAND is located at the top of each system and corresponds with each functional station；Fixed station is equipped with several independent press mechanisms,
Independent press mechanism is detected with feeding system, positioning system, Mark detection system, correction for direction system, test macro, 3D respectively
System, braid system correspond；Independent press mechanism driving vacuum WAND pushes absorption chip, every turn of directly-drive servo main motor
A dynamic lattice, vacuum WAND adsorb chip and reach another functional station from a functional station.
Further, the testing, sorting device further includes flash system, and flash system breaks down for discharge system
When, collect waste material.
Further, there are two the test macro is set.The power test time is longer, and two test macros are arranged and improve work
Make efficiency.
Further, the automatical feeding system includes piezoelectric ceramics ontology, vibrating disk, straight vibration track and first position inspection
Survey sensor；Piezoelectric ceramics ontology is equipped with cylindric inner cavity, and vibrating disk is arranged in cylindric inner cavity, and vibrating disk barrel is equipped with
From the spiral track of bottom to top, the straight track that shakes is set to the top of piezoelectric ceramics ontology, the outlet of one end and spiral track
Connection, the other end are connect with turret system, and the outlet of the straight guide rail that shakes is equipped with first position detection sensor.
Further, the independent press mechanism includes cam, down-pressed pole and pushing servo motor；It is perpendicular to push servo motor
It is directly mounted on fixed station, motor output shaft is extended downwardly across fixed station, and cam sleeve is mounted in the output for pushing servo motor
On axis, down-pressed pole is sequentially connected by the output shaft of cam and pushing servo motor, and the rotation that cam will push servo motor is transported
Turn is changed to the linear motion of down-pressed pole；Servo motor driving down-pressed pole movement is pushed, down-pressed pole drives vacuum WAND to push.
Further, the Mark detection system include overturning guided mode, vacuum warehouse, connecting rod, reset spring, servo motor,
Driving cam, vision camera and fixing seat；Fixing seat includes horizontally disposed pedestal and is arranged in the first, second of pedestal both ends
Vertically-mounted seat；Servo motor is fixedly mounted on the upper end of the first vertically-mounted seat, and output shaft extends vertically downwards and transmission
Cam is fixedly connected；Connecting rod is L-shaped, is made of a long side and a short side；Connecting rod long side is horizontally disposed, and one end passes through the
One shaft is connect with driving cam, and the other end is installed in rotation in the second vertically-mounted seat by the second shaft；Connecting rod
Upwards, end is equipped with overturning guided mode for short side overturning, and the bottom for overturning guided mode is equipped with vacuum warehouse；Servo motor drives driving cam
Rotation, driving cam drive connecting rod around the second shaft in vertical rotation in surface by first rotating shaft；Vision camera is fixedly mounted on
The top of first vertically-mounted seat, camera direction overturning guided mode.
Further, the braid system include mounting base and the carrying devices being mounted in mounting base, heat-sealing device and
Material collecting device；Carrying devices provide heat-sealing carrier band, and heat-sealing device is equipped with heat-sealing seat, and IC chip is sealed in heat-sealing seat pushing
It is carried into a lattice, material collecting device collects the chip after braid；Heat-sealing device is equipped with temperature controller, for detecting and controlling heat-sealing temperature
Degree.
Further, the discharge system includes discharge rewinding box, and discharge rewinding box is equipped with air blowing interface, air blowing interface
It is connect by pipeline and solenoid valve with the air compressor machine outside system.
The working method of any one of the above testing, sorting device, comprising: IC chip shakes through automatical feeding system
After dynamic discharging, the vacuum WAND above automatical feeding system takes out chip, and directly-drive servo main motor rotates a lattice, vacuum
Sucking pen absorption chip is moved to above positioning system, and positioning system is by chip positioning in the center of vacuum WAND；It has positioned
Cheng Hou, directly-drive servo main motor rotate a lattice, and chip enters the completion chip surface Mark detection of Mark detection system and direction is sentenced
It is disconnected；After the completion of Mark detection, directly-drive servo main motor rotates a lattice, and chip approach axis correction system rotates to chip specified
Angle；After the completion of correction for direction, directly-drive servo main motor rotates a lattice, and chip enters test macro and completes the survey of chip electrical property
Examination；After the completion of test, directly-drive servo main motor rotates a lattice, and chip enters the pin flaw inspection that 3D detection system completes device
It surveys；After the completion of 3D detection, directly-drive servo main motor rotates a lattice, complete into braid system when testing integrated circuit is non-defective unit
It is packed at integrated circuit, when testing integrated circuit is defective products, directly-drive servo main motor rotates a lattice, and bad chip enters row
Material system completes the collection in bulk of IC chip.
Beneficial effects of the present invention:
1, the present apparatus is tested items by setting central turret and each test macro being radially distributed in around turntable
For the chip braid of non-defective unit, the test and sorting of circuit chip are realized in the collection in bulk of defective products chip, and the apparatus structure is simply tight
It gathers, work efficiency is high.
2, cooperation pick-and-place chip of the present apparatus by independent press mechanism and vacuum WAND, accurate positioning, high reliablity, and
Damage will not be generated to chip in fetching process, influence chip quality.
3, the present apparatus is positioned by vibration feeding, positioning system, and correction for direction system compensation is tested behind direction, is tested
Precision is high.
Detailed description of the invention
Fig. 1 is the structural schematic diagram for showing the IC chip test sorting unit of first embodiment, and Fig. 1 (a) is
Three-dimensional installation diagram one, Fig. 1 (b) are three-dimensional installation diagrams two, and Fig. 1 (c) is the top view of Fig. 1 (a).
Fig. 2 is the structural representation for showing the turret system of IC chip test sorting unit of first embodiment
Figure.
Fig. 3 is to show the structure of the automatical feeding system of IC chip test sorting unit of first embodiment to show
It is intended to.
Fig. 4 is the structural representation for showing the positioning system of IC chip test sorting unit of first embodiment
Figure.
Fig. 5 is that the structure for the Mark detection system of IC chip test sorting unit for showing first embodiment is shown
It is intended to.
Fig. 6 is that the structure for the correction for direction system of IC chip test sorting unit for showing first embodiment is shown
It is intended to.
Fig. 7 is the structural representation for showing the test macro of IC chip test sorting unit of first embodiment
Figure.
Fig. 8 is the structural representation for showing the 3D detection system of IC chip test sorting unit of first embodiment
Figure.
Fig. 9 is the structural representation for showing the braid system of IC chip test sorting unit of first embodiment
Figure.
Figure 10 is the structural representation for showing the discharge system of IC chip test sorting unit of first embodiment
Figure.
Figure 11 is the structural representation for showing the flash system of IC chip test sorting unit of first embodiment
Figure.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing and a kind of preferred reality
Mode is applied technical solution of the present invention is clearly and completely described.
Embodiment 1
Refering to fig. 1, IC chip test sorting unit includes testing, sorting platform 11, and setting is flat in testing, sorting
Automatical feeding system 1, positioning system 2, Mark detection system 3, correction for direction system 4, test macro 5,3D detection on platform 11
System 6, braid system 7, discharge system 8, flash system 9 and turret system 10.Turret system 10 is set to testing, sorting platform 11
Central part.It is radial in the outer rim of the testing, sorting platform 11 of turret system 10 to be uniformly provided with first, second,
Three, the four, the five, the six, the seven, the eight, the nine, the tenth functional station.Feeding system 1, positioning system 2, Mark detection system
System 3, correction for direction system 4, the first test macro 5, the second test macro 5,3D detection system 6, braid system 7, discharge system 8
And flash system 9, one-to-one correspondence are mounted on first, second, third, fourth, the five, the six, the seven, the eight, the nine, the tenth function
On energy station.
Referring to Fig.2, turret system 10 includes directly-drive servo main motor 10.1, vacuum WAND 10.2, independent press mechanism
10.3, turntable, fixed station and vacuum warehouse 10.5.Fixed station is arranged in parallel with turntable, and fixed station is located at the top of turntable.Straight drive is watched
The central part that main motor 10.1 is fixedly mounted on testing, sorting platform by pedestal is taken, output end extends straight up.Turntable
It is fixedly mounted on the output end of directly-drive servo main motor 10.1, is equipped with several vacuum WANDs 10.2 vertically thereon, vacuum WAND
Absorption is upside down.In the present embodiment, it is equipped with 10 vacuum WANDs altogether, vacuum WAND is circumferentially uniformly distributed along turntable, and each
Each system in functional station corresponds.Directly-drive servo main motor 10.1 drives turntable to rotate in the horizontal plane, every rotation one
Lattice, i.e., 36 °, vacuum WAND reach another test station from a test station, and chip reaches another from a system and is
System.Fixed station is fixedly connected by bracket with directly-drive servo main motor 10.1, and fixed station is equipped with several independent press mechanisms
10.3.In the present embodiment, altogether be equipped with 8 independent press mechanisms, respectively with feeding system 1, positioning system 2, Mark detection system
System 3, correction for direction system 4, the first test macro 5, the second test macro 5,3D detection system 6, braid system 7 correspond.
Vacuum warehouse 10.5 is set between turntable and fixed station, and vacuum warehouse is connected to vacuum WAND, provides vacuum force for vacuum WAND.
Independent press mechanism 10.3 includes cam, down-pressed pole and pushes servo motor 10.4, pushes servo motor 10.4 and is vertically installed at
On fixed station, motor output shaft is extended downwardly across fixed station, and cam sleeve is mounted on the output shaft for pushing servo motor 10.4,
Down-pressed pole is sequentially connected by the output shaft of cam and pushing servo motor 10.4, and cam will push the rotation of servo motor 10.4
Movement is converted to the linear motion of down-pressed pole.It pushes servo motor 10.4 and drives down-pressed pole movement, down-pressed pole drives vacuum WAND
10.2 push.Reset spring is equipped on vacuum WAND 10.2 and down-pressed pole, reset spring is for vacuum WAND 10.2 and pushes
Bar automatically resets.Independent press mechanism 10.3 is equipped with reset detection sensor, multiple for detecting pushing servo motor 10.4
Position.
Refering to Fig. 3, automatical feeding system 1 includes piezoelectric ceramics ontology 1.1, vibrating disk 1.2, straight vibration track 1.3 and first
Position-detection sensor 1.4.Piezoelectric ceramics ontology 1.1 is fixedly mounted on the rear end of the first functional station, is equipped with cylindric inner cavity,
Vibrating disk 1.2 is arranged in cylindric inner cavity, and vibrating disk barrel is equipped with the spiral track from bottom to top, the straight track 1.3 that shakes
It is connected set on the top one end of piezoelectric ceramics ontology 1.1 and the outlet of spiral track, the other end extends to preceding and capstan head system
The outlet of system connection, the straight guide rail that shakes is equipped with first position detection sensor 1.4.Dissipate the IC chip in vibrating tray
Under the effect of vibration of vibrating disk, continuous, neat arrangement is formed along feeding track, and move with uniform velocity, eventually arrive at vibration
Moving plate outlet enters straight vibration track 1.3, and the track 1.3 that directly shaken enters turret system 10, and first position detection sensor 1.4 detects
Have chip in place after, independent press mechanism 10.3 pushes, and vacuum WAND will take out IC chip in place；Independent press mechanism
After reset detection sensor detects that independent press mechanism resets, controller is sent a signal to, controller controls directly-drive servo master
The rotation of motor 10.1 carries out the operation of next station.
Refering to Fig. 4, positioning system 2 includes that positioning guided mode 2.1 and the second position detection being arranged on positioning guided mode 2.1 pass
Sensor 2.2.Positioning system 2 is mounted in the second functional station by positioning guided mode 2.1, and positioning guided mode 2.1 is equipped with locating piece,
Locating piece is used for chip positioning in the center of vacuum WAND.After the completion of automatical feeding system, directly-drive servo main motor
10.1 turn of one lattice, IC chip reach the top of positioning system 2, and second position detection sensor 2.2 detects that chip is fixed
Behind position, servo motor 10.4 drives independent press mechanism 10.3 to act, and circuit chip indentation 2.1 is positioned guided mode by down-pressed pole, complete
At chip positioning；After the completion of positioning, after independent press mechanism reset detection sensor detects that independent press mechanism resets, send
For signal to controller, controller controls the operation that the rotation of directly-drive servo main motor carries out next station.
Refering to Fig. 5, Mark detection system 3 includes overturning guided mode 3.1, vacuum warehouse 3.2, connecting rod 3.3, reset spring 3.4, watches
Take motor 3.5, driving cam 3.6, vision camera 3.7 and fixing seat 3.8.Fixing seat 3.8 includes horizontally disposed pedestal and sets
The first, second vertically-mounted seat at pedestal both ends is set, the first vertically-mounted seat is equipped with cylindrical mounting portion, the second vertically-mounted seat
Equipped with groove.Mark detection system 3 is mounted in third functional station by fixing seat pedestal, and servo motor 3.5 is mounted on
On the cylindrical mounting portion of one vertically-mounted seat, output shaft is connect with driving cam 3.6.Connecting rod 3.3 is L-shaped, by a long side
And a short side is constituted.Connecting rod long side is horizontally disposed, and one end is connect by first rotating shaft with driving cam 3.6, and the other end is logical
It crosses the second shaft to be installed in rotation in the groove of the second vertically-mounted seat, is equipped with and resets in the groove of the second vertically-mounted seat
Spring 3.4, the upper end of reset spring 3.4 is against the downside of connecting rod long side, medial surface of the lower end against groove.Connecting rod 3.3
Upwards, end is equipped with overturning guided mode 3.1 for short side overturning, and the bottom of overturning guided mode 3.1 is equipped with vacuum warehouse 3.2.Servo motor 3.5
Driving cam 3.6 is driven to rotate, driving cam 3.6 drives connecting rod 3.3 to turn in vertical plane around the second shaft by first rotating shaft
It is dynamic.Vision camera 3.7 is fixedly mounted on the top of the cylindrical mounting portion of the first vertically-mounted seat, camera direction overturning guided mode
3.1。
After the completion of positioning system, 10.1 turn of one lattice of directly-drive servo main motor, IC chip reaches 3Mark detection system
Top, servo motor 10.4 drive independent press mechanism 10.3 to act, and chip is pressed into overturning guided mode 3.1, vacuum warehouse by down-pressed pole
IC chip is placed in overturning guided mode 3.1 by 10.5 vacuum breakers, and independent press mechanism resets, and 10.2 vacuum WANDs lift,
Servo motor 3.5 drives turnover transmission device that will overturn guided mode 3.1 and overturns 20 °, and chip is placed in the underface of vision camera 3.4
Completion is taken pictures, and image procossing is carried out.After the completion of image procossing, overturning guided mode is completed to reset under the movement of servo motor 3.5, independent
Press mechanism 10.3 does pressing action, IC chip is taken away from overturning guided mode, independent press mechanism resets, independent to push
After reset detection sensor detects that independent press mechanism resets, controller is sent a signal to, straight drive of controller control is watched
Take the operation that main motor rotation carries out next station.
Refering to Fig. 6, correction for direction system 4 includes rotation guided mode 4.1.Rotation guided mode 4.1 is fixedly mounted by guided mode bracket
In the 4th functional station, rotation guided mode 4.1 is rotatably set in guided mode bracket by shaft, rotates guided mode 4.1 by electric rotating
The driving of machine 4.2 rotates at an angle.After the completion of 3Mark detection system, 10.1 turn of one lattice of directly-drive servo main motor are integrated
Circuit chip arrival direction corrects 4 top of system, and chip is pressed into rotation guided mode 4.1, rotating electric machine by independent press mechanism 10.3
4.2 being rotated by a certain angle according to processing result image, chip is rotated to designated position by correction for direction system.Correction for direction is completed
Afterwards, independent press mechanism resets, and after independent press mechanism reset detection sensor detects that independent press mechanism resets, sends letter
Number controller is given, controller controls the operation that the rotation of directly-drive servo main motor carries out next station.The purpose of correction for direction is
In order to guarantee IC chip orientation consistency, guarantee the consistency of test with braid.
Refering to Fig. 7, test macro 5 includes test bench 5.1 and the tester connecting plate 5.2 being arranged on test bench.At this
In embodiment, there are two test macro 5 is set, the first test macro is mounted on five-function station by test bench, and second surveys
Test system is mounted in the 6th functional station by test bench.After the chip in the 4th functional station completes correction for direction, directly
10.1 turn of one lattice of servo main motor are driven, IC chip reaches the top of five-function station, the core in third functional station
Piece reaches the 4th functional station, after the 4th functional station completes correction for direction, the quick rotation again of directly-drive servo main motor 10.1
One lattice, the IC chip on five-function station reach the 6th functional station, the ic core in the 4th functional station
Piece reaches five-function station, and the 4th, the simultaneously operation of independent press mechanism 10.3 on five-function station is by two chips point
It is not pressed into the first, second test bench 5.1, it is electrical to complete circuit to two chips by the external test instrumentation of tester connecting plate
It can test.After the completion of test, independent press mechanism resets, and independent press mechanism reset detection sensor detects independent lower press
After structure resets, controller is sent a signal to, controller controls the operation that the rotation of directly-drive servo main motor carries out next station.
Refering to Fig. 8,3D detection system 6 includes that 3D detects camera 6.1.3D detection camera 6.1 is pacified by Camera fixing seat 6.2
In the 7th functional station.After the completion of power test system, 10.1 turn of one lattice of directly-drive servo main motor, the 6th functional station
On IC chip reach the top of the 3D detection system in the 7th functional station, independent press mechanism 10.3 is by chip pressure
The picture taking interval for entering 3D detection camera 6.1 completes the processing of 3D detection image；IC chip on five-function station reaches
6th functional station waits 3D detection.After the completion of chip 3D detection in 7th functional station, independent press mechanism resets, independent
After press mechanism reset detection sensor detects that independent press mechanism resets, controller is sent a signal to, controller control is straight
Drive the operation that the rotation of servo main motor carries out next station.
Refering to Fig. 9, braid system 7 include mounting base and be fixedly mounted in mounting base carrying devices, heat-sealing device and
Material collecting device.Braid system 7 is mounted in the 8th functional station by mounting base.Heat-sealing device is equipped with heat-sealing seat 7.2, seals seat
For sealing chip in carrier band.Carrying devices provide adhesive tape for heat-sealing.Material collecting device is for collecting heat-sealing rear bearing band.Heat-sealing
Device is equipped with temperature controller 7.3, for detecting and controlling heat-sealing temperature.
After circuit chip completes 3D detection, detection is that the chip of non-defective unit turns one by the driving of directly-drive servo main motor 10.1
Lattice reach the top of braid system 7, and chip is pressed into braid system population by independent press mechanism 10.3, and vacuum warehouse 10.5 is broken true
IC chip is placed in the lattice carrier band of carrying devices 7.1 by sky, and the carrier band dragging carrier band position-limit mechanism of driving motor 7.1 is real
Now carrier band walks a lattice, and heat-sealing seat 7.2, which pushes, completes braid；After the completion of braid, independent press mechanism resets, and independent press mechanism is multiple
After level detection sensor detects that independent press mechanism resets, controller is sent a signal to, controller controls the main electricity of directly-drive servo
Machine rotation carries out the operation of next station.When being detected as defective products, next station is taken to by vacuum WAND.
Refering to fig. 10, discharge system 8 includes discharge rewinding box 8.2, and discharge rewinding box 8.2 is equipped with air blowing interface 8.1, blows
Gas interface 8.1 is connect by pipeline and solenoid valve with the air compressor machine outside system.The chip of defective products is in directly-drive servo main motor
Lower turn of lattice of 10.1 drive reach the top of discharge system 8, and controller output signal connects the solenoid valve of air blowing interface 8.1,
The IC chip of defective products is blown into specified discharge rewinding box 8.2.
Refering to fig. 11, flash system 9 includes flash rewinding box 9.2 and the third position for being mounted on 9.2 top of flash rewinding box
Set detection sensor 9.1.Flash rewinding box 9.2 is mounted in the tenth functional station by screw, the upper end of flash rewinding box 9.2
Equipped with chip import.When discharge system failure, 10.1 turn of one lattice of directly-drive servo main motor, IC chip is from the 9th function
Station reaches the top of the flash system 9 in the tenth functional station, when the third place detection sensor 9.1 detects chip,
10.5 vacuum breaker of vacuum warehouse, chip, which is lost in flash rewinding box 9.2, to be collected.
Embodiment 2
Embodiment 2 and embodiment 1 are essentially identical, the difference is that only, test macro 5 is equipped with one, function work
Position is equipped with nine, feeding system 1, positioning system 2, Mark detection system 3, correction for direction system 4, the first test macro 5, second
Test macro 5,3D detection system 6, braid system 7, discharge system 8 and flash system 9, one-to-one correspondence is mounted on first, second,
In third, the four, the five, the six, the seven, the eight, the 9th functional stations.
The working method of embodiment 2 is: IC chip through automatical feeding system 1 enter turret system 10, first
Vacuum WAND in functional station takes out chip, and directly-drive servo main motor 10.1 rotates a lattice, that is, rotates 40 °, vacuum WAND
Absorption chip is moved to the positioning system 2 in the second functional station, and positioning system is by chip positioning in the centre bit of vacuum WAND
It sets；After the completion of positioning, directly-drive servo main motor 10.1 rotates a lattice, and chip enters the Mark detection system in third functional station
3, complete chip surface Mark detection and walking direction；After the completion of Mark detection, directly-drive servo main motor 10.1 rotates a lattice, core
Piece enters the correction for direction system 4 in the 4th functional station, and chip is rotated to specified angle by correction for direction system；Correction for direction
After the completion, directly-drive servo main motor 10.1 rotates a lattice, and chip enters the test macro 5 on five-function station, completes chip
Electric performance test；After the completion of test, directly-drive servo main motor 10.1 rotates a lattice, and chip enters the 3D inspection in the 6th functional station
The pin Defect Detection of the completion device of examining system 6；After the completion of 3D detection, directly-drive servo main motor 10.1 rotates a lattice, works as test
When integrated circuit is non-defective unit, integrated circuit packaging is completed into the braid system 7 in the 7th functional station, when test integrated circuit
When for defective products, directly-drive servo main motor 10.1 rotates a lattice, and chip enters the discharge system 8 in the 8th functional station, completes
The collection in bulk of IC chip；When discharge system 8 breaks down, directly-drive servo main motor 10.1 rotates a lattice, chip
Flash system 9 into the 9th functional station is collected in flash system 9.
Not doing the part illustrated in above instructions is the prior art, or has both been able to achieve by the prior art.
Claims (9)
1. a kind of IC chip test sorting unit, including testing, sorting platform, which is characterized in that the testing, sorting is flat
The central part of platform is equipped with turret system, is equipped with several functional stations around turret system, the functional station is radially set along platform
It sets, automatical feeding system, positioning system, Mark detection system, correction for direction system, test is sequentially installed in each functional station
System, 3D detection system, braid system and discharge system；The turret system includes turntable and fixed station, fixed station and turntable
Top that is parallel and being located at turntable, turntable is rotated in the horizontal plane by the driving of directly-drive servo main motor, if being equipped with vertically on turntable
Dry vacuum sucking pen, vacuum WAND are located at the top of each system and correspond with each functional station；Fixed station is equipped with several only
Make press mechanism, independent press mechanism respectively with feeding system, positioning system, Mark detection system, correction for direction system, test
System, 3D detection system, braid system correspond；Independent press mechanism driving vacuum WAND pushes absorption chip, and straight drive is watched
Main motor one lattice of every rotation are taken, vacuum WAND adsorbs chip and reaches another functional station from a functional station.
2. IC chip test sorting unit as described in claim 1, which is characterized in that further include flash system, overflow
When material system breaks down for discharge system, waste material is collected.
3. IC chip test sorting unit as claimed in claim 1 or 2, which is characterized in that the test macro is set
There are two.
4. IC chip test sorting unit as claimed in claim 1 or 2, which is characterized in that the automatic charging system
System includes piezoelectric ceramics ontology, vibrating disk, straight vibration track and first position detection sensor；Piezoelectric ceramics ontology is equipped with cylindrical shape
Inner cavity, vibrating disk are arranged in cylindric inner cavity, and vibrating disk barrel is equipped with the spiral track from bottom to top, and the straight track that shakes is set
In the top of piezoelectric ceramics ontology, the outlet of one end and spiral track, the other end is connect with turret system, and straight vibration is led
The outlet of rail is equipped with first position detection sensor.
5. IC chip test sorting unit as claimed in claim 1 or 2, which is characterized in that press under the independence
Structure includes cam, down-pressed pole and pushing servo motor；It pushes servo motor to be vertically installed on fixed station, motor output shaft is worn
It crosses fixed station to extend downwardly, for cam sleeve on the output shaft for pushing servo motor, down-pressed pole is by cam and pushes servo electricity
The output shaft of machine is sequentially connected, and the rotary motion for pushing servo motor is converted to the linear motion of down-pressed pole by cam；Pushing is watched
The movement of motor driven down-pressed pole is taken, down-pressed pole drives vacuum WAND to push.
6. IC chip test sorting unit as claimed in claim 1 or 2, which is characterized in that the Mark detection system
System includes overturning guided mode, vacuum warehouse, connecting rod, reset spring, servo motor, driving cam, vision camera and fixing seat；Fixing seat
Including horizontally disposed pedestal and the first, second vertically-mounted seat at pedestal both ends is set；Servo motor is fixedly mounted on
The upper end of one vertically-mounted seat, output shaft extends downwards vertically to be fixedly connected with driving cam；Connecting rod is L-shaped, long by one
Side and a short side are constituted；Connecting rod long side one end is connect by first rotating shaft with driving cam, and the other end can by the second shaft
It is rotatably mounted in the second vertically-mounted seat；Upwards, end is equipped with overturning guided mode for the short side overturning of connecting rod, overturns guided mode
Bottom is equipped with vacuum warehouse；Servo motor drives driving cam rotation, and driving cam drives connecting rod around second turn by first rotating shaft
Axis is in vertical rotation in surface；Vision camera is fixedly mounted on the top of the first vertically-mounted seat, camera direction overturning guided mode.
7. IC chip test sorting unit as claimed in claim 1 or 2, which is characterized in that the braid system packet
Carrying devices, heat-sealing device and the material collecting device for including mounting base and being mounted in mounting base；Carrying devices provide heat-sealing carrier band,
Heat-sealing device is equipped with heat-sealing seat, and heat-sealing seat is pushed to seal IC chip into a lattice and be carried, after material collecting device collects braid
Chip；Heat-sealing device is equipped with temperature controller, for detecting and controlling heat-sealing temperature.
8. IC chip test sorting unit as claimed in claim 1 or 2, which is characterized in that the discharge system packet
Discharge rewinding box is included, discharge rewinding box is equipped with air blowing interface, and air blowing interface passes through the pneumatics outside pipeline and solenoid valve and system
Machine connection.
9. such as the working method of claim 1~8 any one testing, sorting device, which is characterized in that IC chip warp
After automatical feeding system vibration discharging, the vacuum WAND above automatical feeding system takes out chip, the main electricity of directly-drive servo
Machine rotates a lattice, and vacuum WAND absorption chip is moved to above positioning system, and positioning system is by chip positioning in vacuum WAND
Center；After the completion of positioning, directly-drive servo main motor rotates a lattice, and chip enters Mark detection system and completes chip surface
Mark detection and walking direction；After the completion of Mark detection, directly-drive servo main motor rotates a lattice, and chip approach axis corrects system
Chip is rotated into specified angle；After the completion of correction for direction, directly-drive servo main motor rotates a lattice, and it is complete that chip enters test macro
At chip electric performance test；After the completion of test, directly-drive servo main motor rotates a lattice, and chip enters 3D detection system and completes device
Pin Defect Detection；After the completion of 3D detection, directly-drive servo main motor rotates a lattice, when testing integrated circuit is non-defective unit, into
Enter braid system and complete integrated circuit packaging, when testing integrated circuit is defective products, directly-drive servo main motor rotates a lattice, no
Good chip enters discharge system, completes the collection in bulk of IC chip.
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| CN201811186829.XA CN109174701A (en) | 2018-10-12 | 2018-10-12 | A kind of IC chip test sorting unit and its working method |
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| CN201811186829.XA CN109174701A (en) | 2018-10-12 | 2018-10-12 | A kind of IC chip test sorting unit and its working method |
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Application publication date: 20190111 |