CN110137117B - Semiconductor double-rail DD motor high-speed automatic test coding and taping separator - Google Patents
Semiconductor double-rail DD motor high-speed automatic test coding and taping separator Download PDFInfo
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- CN110137117B CN110137117B CN201910484132.9A CN201910484132A CN110137117B CN 110137117 B CN110137117 B CN 110137117B CN 201910484132 A CN201910484132 A CN 201910484132A CN 110137117 B CN110137117 B CN 110137117B
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- 238000012360 testing method Methods 0.000 title claims abstract description 40
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 230000007246 mechanism Effects 0.000 claims abstract description 215
- 238000004806 packaging method and process Methods 0.000 claims abstract description 33
- 238000007599 discharging Methods 0.000 claims abstract description 12
- 230000003287 optical effect Effects 0.000 claims abstract description 10
- 238000000926 separation method Methods 0.000 claims description 14
- 230000009977 dual effect Effects 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 7
- 238000007664 blowing Methods 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000007639 printing Methods 0.000 description 6
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000009954 braiding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/363—Sorting apparatus characterised by the means used for distribution by means of air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
Abstract
The invention discloses a semiconductor double-track DD motor high-speed automatic test coding and taping sorting machine, which comprises a taping module mechanism, a rack, a main turntable double-suction head mechanism, a double-motor independent pressing mechanism, a vibrating disc double-feeding module mechanism, a polarity direction identification module mechanism, a discharging module mechanism, a double-motor independent positioning and rotating mechanism, a first positioning module mechanism, a second positioning module mechanism, a Y disc module mechanism, a laser printer, an MSI module mechanism, a 3D5S optical module mechanism, a two-in-one packaging module mechanism, a flash box module mechanism, a packaging image module mechanism, a pair of eight-discharging module mechanisms and four test module mechanisms. The semiconductor double-rail DD motor high-speed automatic testing coding and taping sorting machine effectively improves production efficiency, and simultaneously saves manpower and space occupation rate.
Description
Technical Field
The invention relates to a semiconductor double-rail DD motor high-speed automatic test coding and taping sorting machine.
Background
At present, the test, printing and braiding of small chips (namely below 5 mm) in the semiconductor industry are generally produced by adopting traditional single-rail equipment, the speed is low, the yield is low, and a driving motor of a main rotary table is generally a common motor which can not drive the rotary table to horizontally and circumferentially rotate at high speed.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, and provides a semiconductor double-rail DD motor high-speed automatic test coding and taping sorting machine, which solves the problems of low speed and low yield of traditional single-rail equipment in the industry; meanwhile, labor and space occupation rate are saved.
The technical scheme for achieving the purpose is as follows: the utility model provides a semiconductor double track DD motor high-speed automatic test is beaten sign indicating number braid sorter, is in including going into take module mechanism, frame and setting main carousel double suction head mechanism, double motor independent push down mechanism, vibration dish double feed module mechanism, polarity direction discernment module mechanism, row material module mechanism, double motor independent positioning rotary mechanism, first positioning module mechanism, second positioning module mechanism, Y dish module mechanism, laser printer, MSI module mechanism, 3D5S optical module mechanism, two unification encapsulation module mechanisms, flash box module mechanism, encapsulation image module mechanism, a pair of eight row material module mechanisms and four test module mechanisms in the frame, wherein:
a DD motor is arranged on the frame and drives the main turntable double suction head mechanism to do horizontal circular motion;
the double-motor independent pressing mechanism is arranged in the middle of the top end of the rack through a bracket, and is positioned right above the main turntable double-suction head mechanism, and the double motors of the double-motor independent pressing mechanism and the double-suction heads of the main turntable double-suction head mechanism are coaxially arranged in one-to-one correspondence;
the vibration disc double-feeding module mechanism, the polarity direction identification module mechanism, the discharging module mechanism, the double-motor independent positioning rotating mechanism, the four testing module mechanisms, the first positioning module mechanism, the Y disc module mechanism, the second positioning module mechanism, the 3D5S optical module mechanism, the pair of eight-discharging module mechanisms, the two-in-one packaging module mechanism and the flash box module mechanism are sequentially arranged on the periphery of the main turntable double-suction head mechanism along the anticlockwise direction;
the laser printer and the MSI module mechanism are respectively arranged around the Y-disc module mechanism;
the tape feeding module mechanism is arranged on the outer side of the frame and is positioned right below the two-in-one packaging module mechanism;
the packaging image module mechanism is arranged on the frame through a bracket and is positioned at the left side of the two-in-one packaging module mechanism.
The semiconductor double-rail DD motor high-speed automatic testing coding and taping sorting machine is characterized in that the distance between the double motor of the double-motor independent pressing mechanism and the double suction heads of the main turntable double suction head mechanism is 0.5MM.
The high-speed automatic test coding and taping sorting machine for the semiconductor double-rail DD motor comprises two sets of vibrating disc feeding mechanisms, wherein each set of vibrating disc feeding mechanism comprises a vibrating disc, an air rail, a gate separation bearing seat and a feeding motor which are sequentially connected, the vibrating disc vibrates to convey products to the air rail, the air rail conveys the products to the gate separation bearing seat in an oblique blowing mode, the gate of the gate separation bearing seat is opened in vacuum to absorb the products, and the feeding motor drives the gate separation bearing seat to convey the products to a suction head in the main turntable double-suction head mechanism.
The high-speed automatic testing coding and taping sorting machine for the semiconductor double-rail DD motor is characterized in that the distance between the air rails of the two sets of vibration disc feeding mechanisms is 20mm.
The semiconductor double-rail DD motor high-speed automatic testing coding and taping sorting machine comprises a two-in-one packaging module mechanism, wherein the two-in-one packaging module mechanism comprises a track and two pressing heat sealing machines, detection holes are formed in the track, the two pressing heat sealing machines are respectively arranged on the track, and a camera lens of the packaging image module mechanism is located right above the detection holes of the track of the two-in-one packaging module mechanism.
The invention discloses a high-speed automatic testing, coding and taping sorter for a semiconductor double-rail DD motor, which is applied to high-speed precision equipment integrating testing, printing and taping of small chips (namely below 5 x 5 MM) in the semiconductor industry; the problems of low speed and low yield of the traditional monorail equipment in the industry are solved; meanwhile, labor and space occupation rate are saved.
Drawings
FIG. 1 is a top view of a semiconductor dual rail DD motor high speed automatic test code encoding tape separator of the present invention;
FIG. 2 is an exploded view (top view) of the semiconductor dual rail DD motor high speed automatic test coding tape separator of the present invention;
FIG. 3 is a left side view of the semiconductor dual rail DD motor high speed automatic test code encoding tape separator of the present invention;
FIG. 4 is a right side view of the semiconductor dual rail DD motor high speed automatic test code encoding tape separator of the present invention;
FIG. 5 is a front view of a semiconductor dual rail DD motor high speed automatic test code encoding tape separator of the present invention;
fig. 6 is a rear view of the semiconductor dual rail DD motor high speed automatic test code encoding tape handler of the present invention.
Detailed Description
In order to enable those skilled in the art to better understand the technical scheme of the present invention, the following detailed description is provided with reference to the accompanying drawings:
referring to fig. 1 to 6, a semiconductor dual-rail DD motor high-speed automatic test coding and taping sorter according to the preferred embodiment of the present invention includes a taping module mechanism 19, a frame 1, a main turntable dual suction head mechanism 2 disposed on the frame 1, a dual-motor independent pressing mechanism 3, a vibrating-disc dual-feeding module mechanism 4, a polarity direction recognition module mechanism 5, a discharging module mechanism 6, a dual-motor independent positioning and rotating mechanism 7, a first positioning module mechanism 9, a second positioning module mechanism 13, a Y-disc module mechanism 10, a laser printer 11, an MSI module mechanism 12, a 3D5S optical module mechanism 14, a two-in-one packaging module mechanism 16, a flash box module mechanism 17, a packaging image module mechanism 18, a pair of eight discharging module mechanisms 15, and four test module mechanisms 8.
A DD motor is arranged on the frame 1 and drives the main turntable double suction head mechanism 2 to do horizontal circular motion; the main rotary table double suction head mechanism 2 includes a main rotary table and double suction heads (two suction heads) provided thereon.
The double-motor independent pressing mechanism 3 is arranged in the middle of the top end of the frame 1 through a support, the double-motor independent pressing mechanism 3 is located right above the main turntable double-suction head mechanism 2, the double motors (two motors) of the double-motor independent pressing mechanism 3 and the double-suction heads of the main turntable double-suction head mechanism 2 are coaxially arranged in one-to-one correspondence, the double motors are respectively located right above the double suction heads, and the distance between the double motors of the double-motor independent pressing mechanism 3 and the double-suction heads of the main turntable double-suction head mechanism 2 is about 0.5MM.
The vibration dish double-feeding module mechanism 4, the polarity direction identification module mechanism 5, the discharging module mechanism 6, the double-motor independent positioning rotating mechanism 7, the four testing module mechanisms 8, the first positioning module mechanism 9, the Y-disc module mechanism 10, the second positioning module mechanism 13, the 3D5S optical module mechanism 14, the pair of eight discharging module mechanisms 15, the two-in-one packaging module mechanism 16 and the flash box module mechanism 17 are sequentially arranged on the periphery of the main turntable double-suction head mechanism 2 along the anticlockwise direction.
The laser printer 11 and the MSI die set mechanism 12 are disposed around the Y-disc die set mechanism 10, respectively. The tape-in module mechanism 19 is arranged on the outer side of the frame 1 and is positioned right below the two-in-one packaging module mechanism 16;
the packaging image module mechanism 18 is arranged on the frame 1 through a bracket and is positioned at the left side of the two-in-one packaging module mechanism 19.
The vibrating disc double-feeding module mechanism 4 comprises two sets of vibrating disc feeding mechanisms, each set of vibrating disc feeding mechanism comprises a vibrating disc, an air rail, a gate separation bearing seat and a feeding motor which are sequentially connected, the vibrating disc vibrates to convey products to the air rail, the air rail conveys the products to the gate separation bearing seat in an oblique blowing mode, the gate of the gate separation bearing seat is opened in vacuum to suck the products, and the feeding motor drives the gate separation bearing seat to convey the products to the suction head in the main turntable double-suction head mechanism 2. The two sets of vibrating disc feeding mechanisms can simultaneously send two products to the double suction heads of the main rotating disc double suction head mechanism 2 in a one-to-one correspondence manner. The distance between the air rails of the two sets of vibrating disk feeding mechanisms is 20mm.
The two-in-one packaging module mechanism 16 comprises a rail 161 and two pressing heat sealing machines 162, wherein detection holes are formed in the rail 161, the two pressing heat sealing machines 162 are respectively arranged on the rail 161, and a camera lens of the packaging image module mechanism 18 is positioned right above the detection holes of the rail 161 of the two-in-one packaging module mechanism 16.
The main turntable double-suction head mechanism 2 is driven by a daily high-precision DD motor, and the daily high-precision DD motor has high precision and high performance, is an absolute encoder type direct-drive motor which can freely and intermittently move and continuously rotate by 360 degrees, saves energy and space, and does not need lubrication to construct environmental-friendly production equipment.
The high-speed automatic test coding and taping sorting machine for the semiconductor double-rail DD motor has the following flow when in use:
(1) The vibrating disc of the vibrating disc double-feeding module mechanism 4 vibrates to convey the product to the air rail, the air rail conveys the material to the gate separation bearing seat in an inclined blowing mode, the gate is opened in vacuum to suck the product, and the feeding motor drives the gate separation bearing seat to convey the product to the position right below the suction head in the main turntable double-suction head mechanism 2;
(2) The suction head in the main turntable double suction head mechanism 2 is pressed down by the double-motor independent pressing mechanism 3, the suction head is pressed down to a position in quick contact with a product, the suction head sucks the product by utilizing vacuum, and the DD motor in the main turntable double suction head mechanism 2 drives the suction head to rotate anticlockwise and sequentially rotate towards the next station;
(3) The polarity direction identification module mechanism 5 judges the polarity direction of the product according to the appearance difference of the product or the positive and negative poles of the product, and can not judge the product in the direction, and the product is discharged into the discharging module mechanism 6 by utilizing a vacuum breaking mode that the blowing is larger than the vacuum to the next station; the product with the direction determined is continuously operated to the next station through the discharging module mechanism 6;
(4) The double-motor independent positioning and rotating mechanism 7 presses down the product to the guide die in the double-motor independent positioning and rotating mechanism 7 through the double-motor independent pressing mechanism 3, and the motor of the double-motor independent positioning and rotating mechanism 7 drives the guide die to rotate the product to a uniform direction; when the product passes through the four test module mechanisms 8, the dual-motor independent pressing mechanism 3 presses the product into the corresponding test module mechanism 8, the product is tightly contacted with the golden finger of the test module mechanism 8, and the performance of the product is tested by an external tester connected with the golden finger;
(5) After the product passes through the next station, namely the first positioning module mechanism 9, and is accurately positioned in the guide die of the first positioning module mechanism 9, the product enters the guide die on the small turntable of the next station, namely the Y-disc module mechanism 10, the small turntable of the Y-disc module mechanism 10 is driven by a motor to rotate, and the product is conveyed to enter the next station, namely the laser printer 11 for printing the required seal; and enter the next station, namely MSI module mechanism 12, MSI module mechanism 12 is used for detecting whether the upper surface of the product is abnormal or not and whether the printing is correct or not;
(6) The small turntable of the Y-disc module mechanism 10 rotates and then turns the product to the lower part of the suction head in the main turntable double suction head mechanism 2, the suction head presses down to take the product from the guide die of the small turntable of the Y-disc module mechanism 10, the product enters the 3D5S optical module mechanism 14 after being positioned accurately in the guide die of the next station, namely the second positioning module mechanism 13, the product sucked by the suction head is pressed down into the 3D5S optical module mechanism 14 by the double-motor independent pressing mechanism 3, and the 3D5S optical module mechanism 14 is used for carrying out detection judgment on the other five surfaces (five surfaces without printing seals) of the product and the foot of the product; the product enters the next station, namely a pair of eight-row material module mechanisms 15;
(7) The defective products tested by the four testing module mechanisms 8 and the MSI module mechanism 12 are blown into a pair of eight-row material module mechanisms 15 by using a side blowing mode; a pair of eight-row material module mechanisms 15 send defective products into a set material box by utilizing motor rotation; the good product (qualified product) enters the next station, namely the two-in-one packaging module mechanism 16, and is packaged and braided.
(8) The packaging carrier tape is placed on the tape-in module mechanism 19, the packaging carrier tape passes through the two-in-one packaging module mechanism 16, the placed carrier tape is driven to run to the packaging image module mechanism 18 for material print detection, if abnormal, the packaging carrier tape runs continuously according to alarm treatment, and is overlapped with a cover tape placed on the two-in-one packaging module mechanism 16 for heat sealing, and then the reel is wound.
In summary, the semiconductor double-rail DD motor high-speed automatic testing, coding and taping sorting machine is applied to high-speed precision equipment integrating testing, printing and taping of small chips (namely below 5 mm) in the semiconductor industry; the problems of low speed and low yield of the traditional monorail equipment in the industry are solved; meanwhile, labor and space occupation rate are saved.
It will be appreciated by persons skilled in the art that the above embodiments are provided for illustration only and not for limitation of the invention, and that variations and modifications of the above described embodiments are intended to fall within the scope of the claims of the invention as long as they fall within the true spirit of the invention.
Claims (5)
1. The utility model provides a semiconductor double track DD motor high-speed automatic test coding braid sorter, its characterized in that, is in including going into take module mechanism, frame and setting main carousel double suction head mechanism, the independent mechanism of pushing down of double motor, the two pan feeding module mechanisms of vibration dish, polarity direction discernment module mechanism, row material module mechanism, the independent positioning rotary mechanism of double motor, first positioning module mechanism, second positioning module mechanism, Y dish module mechanism, laser printer, MSI module mechanism, 3D5S optical module mechanism, two unification encapsulation module mechanisms, flash box module mechanism, encapsulation image module mechanism, a pair of eight row material module mechanisms and four test module mechanisms in the frame, wherein:
a DD motor is arranged on the frame and drives the main turntable double suction head mechanism to do horizontal circular motion;
the double-motor independent pressing mechanism is arranged in the middle of the top end of the rack through a bracket, and is positioned right above the main turntable double-suction head mechanism, and the double motors of the double-motor independent pressing mechanism and the double-suction heads of the main turntable double-suction head mechanism are coaxially arranged in one-to-one correspondence;
the vibration disc double-feeding module mechanism, the polarity direction identification module mechanism, the discharging module mechanism, the double-motor independent positioning rotating mechanism, the four testing module mechanisms, the first positioning module mechanism, the Y disc module mechanism, the second positioning module mechanism, the 3D5S optical module mechanism, the pair of eight-discharging module mechanisms, the two-in-one packaging module mechanism and the flash box module mechanism are sequentially arranged on the periphery of the main turntable double-suction head mechanism along the anticlockwise direction;
the laser printer and the MSI module mechanism are respectively arranged around the Y-disc module mechanism;
the tape feeding module mechanism is arranged on the outer side of the frame and is positioned right below the two-in-one packaging module mechanism;
the packaging image module mechanism is arranged on the frame through a bracket and is positioned at the left side of the two-in-one packaging module mechanism.
2. The semiconductor dual rail DD motor high speed auto test coded tape separator of claim 1 wherein the distance between the dual motor of the dual motor independent hold down mechanism and the dual suction heads of the main turntable dual suction head mechanism is 0.5MM.
3. The semiconductor double-rail DD motor high-speed automatic test coding and taping separator according to claim 1, wherein the vibrating disc double-feeding module mechanism comprises two sets of vibrating disc feeding mechanisms, each set of vibrating disc feeding mechanism comprises a vibrating disc, an air rail, a gate separation bearing seat and a feeding motor which are sequentially connected, the vibrating disc vibrates to convey products to the air rail, the air rail conveys the products to the gate separation bearing seat in an inclined blowing mode, gate vacuum of the gate separation bearing seat is opened to suck the products, and the feeding motor drives the gate separation bearing seat to convey the products to a suction head in the main turntable double-suction head mechanism.
4. A semiconductor dual-rail DD motor high-speed automatic test coding and taping sorter as claimed in claim 3, wherein the distance between the gas rails of the two sets of vibrating tray feeding mechanisms is 20mm.
5. The semiconductor double-rail DD motor high-speed automatic testing coding and taping separator according to claim 1, wherein the two-in-one packaging module mechanism comprises a rail and two pressing heat sealing machines, detection holes are formed in the rail, the two pressing heat sealing machines are respectively arranged on the rail, and a camera lens of the packaging image module mechanism is located right above the detection holes of the rail of the two-in-one packaging module mechanism.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910484132.9A CN110137117B (en) | 2019-06-05 | 2019-06-05 | Semiconductor double-rail DD motor high-speed automatic test coding and taping separator |
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| CN201910484132.9A CN110137117B (en) | 2019-06-05 | 2019-06-05 | Semiconductor double-rail DD motor high-speed automatic test coding and taping separator |
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| CN110137117A CN110137117A (en) | 2019-08-16 |
| CN110137117B true CN110137117B (en) | 2024-01-30 |
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| CN110676199B (en) * | 2019-10-16 | 2022-04-22 | 深圳市迈诺为智能科技有限公司 | High-speed mounting imprinter |
| CN111169976A (en) * | 2020-01-23 | 2020-05-19 | 江苏同臻智能科技有限公司 | Feeding adapter for semiconductor automatic detection coding braid sorting machine |
| CN111627836B (en) * | 2020-05-29 | 2021-07-13 | 太极半导体（苏州）有限公司 | Chip packaging device and packaging method thereof |
| CN115656759B (en) * | 2022-10-24 | 2023-06-16 | 深圳市三一联光智能设备股份有限公司 | Semiconductor test braid all-in-one |
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| CN109604188A (en) * | 2018-12-04 | 2019-04-12 | 深圳市阿尓法智慧科技有限公司 | Multiple Type bolt detects hybrid packed equipment simultaneously |
| CN209822605U (en) * | 2019-06-05 | 2019-12-20 | 上海赢朔电子科技股份有限公司 | Semiconductor double-rail DD motor high-speed automatic test coding and taping sorting machine |
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