CN105721754B - Camera module based on integrated packaging process - Google Patents
Camera module based on integrated packaging process Download PDFInfo
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- CN105721754B CN105721754B CN201610202500.2A CN201610202500A CN105721754B CN 105721754 B CN105721754 B CN 105721754B CN 201610202500 A CN201610202500 A CN 201610202500A CN 105721754 B CN105721754 B CN 105721754B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The camera module based on the integrated packaging technology comprises a packaging photosensitive assembly and a lens, wherein the packaging photosensitive assembly comprises a packaging part and a photosensitive assembly, the photosensitive assembly further comprises a photosensitive chip and a circuit board, the photosensitive chip is in conduction connection with the circuit board, the packaging part is packaged on the top surface of the circuit board and at least one side surface and/or the bottom surface of the circuit board, and therefore the strength and the heat dissipation of the camera module are enhanced, and the cutting procedure is reduced.
Description
Technical Field
The invention relates to a camera module, in particular to a camera module based on an integrated packaging process, which is molded on the side surface or the bottom of a circuit board.
Background
A capacitor and a plastic piece are usually attached to the traditional mobile phone camera module packaging circuit board, the capacitor resisting component and the plastic piece are independent and do not overlap in space, and the plastic piece plays a supporting role. The following problems mainly exist in the scheme:
1. the plastic support is adhered to the circuit board through glue after being independently molded, and the module is easy to incline due to the unevenness of the plastic support and the assembly inclination of the adhesion; 2. the resistance-capacitance device and the photosensitive chip exist in the same space, and dust on the resistance-capacitance device is not easy to clean, so that the final black spot and the stain of the module are influenced; 3. the structural strength of the circuit board part is not strong; 4. the size is difficult to accomplish very little, especially transverse dimension, and there is the waste of comparison in the size between two modules of making a video recording, has influenced holistic size.
Disclosure of Invention
The invention aims to provide a camera module based on an integrated packaging process, and the stress strength of the module can be enhanced by adopting a scheme of molding the side surface or the bottom surface of a circuit board.
Another objective of the present invention is to provide a camera module based on an integrated packaging process, which adopts a scheme of molding a side surface of a circuit board, so as to increase the cutting efficiency of the circuit board.
Another objective of the present invention is to provide a camera module based on an integrated packaging process, which employs a scheme of molding a side surface of a circuit board, so that the module design is more flexible.
The invention also aims to provide a camera module based on the integrated packaging technology, and the structural strength of the module can be enhanced by adopting a scheme of molding the bottom of the circuit board.
Another objective of the present invention is to provide a camera module based on an integrated packaging process, which employs a scheme of molding a side surface or a bottom surface of a circuit board, so as to improve the heat dissipation efficiency of the module.
Another objective of the present invention is to provide a camera module based on an integrated packaging process, which adopts a scheme of molding a side surface or a bottom surface of a circuit board, so as to improve the parallelism between the surface of a photosensitive chip of the module and the upper surface of a packaging portion, and the flatness of the upper surface of the packaging portion.
The invention also aims to provide a camera module based on the integrated packaging process, which adopts a scheme of molding the side surface or the bottom surface of the circuit board, can reduce the processing procedures and improve the production efficiency.
Another objective of the present invention is to provide a camera module based on an integrated packaging process, which employs a scheme of molding a side surface or a bottom surface of a circuit board, so as to make the overall size of the module smaller.
The invention also aims to provide a camera module based on the integrated packaging technology, which adopts a scheme of molding the side surface or the bottom surface of the circuit board to prevent dust from entering the module after molding to influence the performance.
In order to achieve the above object, the present invention provides a camera module based on an integrated package process,
the camera module based on the integrated packaging technology is characterized by comprising at least one packaging photosensitive assembly and at least one lens, wherein the packaging photosensitive assembly comprises at least one packaging part and at least one photosensitive assembly, the photosensitive assembly further comprises at least one photosensitive chip and at least one circuit board, the photosensitive chip is in conductive connection with the circuit board, the lens is located in a photosensitive path of the photosensitive chip, and the packaging part is integrally packaged on the top surface of the circuit board and at least one side surface of the circuit board.
In one embodiment, the packaging part further packages a bottom surface of the circuit board.
In one embodiment, a reinforcing plate is arranged on the bottom surface of the circuit board in a clinging mode.
In one embodiment, the encapsulation encapsulates at least one side of the stiffener.
In one embodiment, the encapsulation portion encapsulates a bottom portion of the stiffener.
In one embodiment, the encapsulating portion is further encapsulated in a non-photosensitive area of the photosensitive chip.
In one embodiment, the photosensitive chip and the circuit board are connected by a set of leads, wherein the encapsulation part covers the leads.
In one embodiment, the optical filter further comprises at least one optical filter, wherein the packaging part is used as a support for bearing the optical filter.
In one embodiment, the optical filter is laminated on the photosensitive chip, and the packaging part is further packaged on the optical filter.
In one embodiment, the top of the packaging part extends upwards to form at least one accommodating groove respectively for accommodating the lens.
In one embodiment, the camera module based on the integrated packaging process further includes a motor, and the motor is mounted in the packaging portion and is in conductive connection with the circuit board.
In one embodiment, the enclosure has electrical properties to conductively connect the motor and the circuit board.
In one embodiment, the circuit board is further provided with at least one through hole, and the packaging part extends and buries in the through hole.
In one embodiment, the encapsulation process is a molding process, such as an injection molding or compression molding process.
In one embodiment, the camera module is a fixed focus camera module.
In one embodiment, the camera module is an autofocus camera module.
Drawings
Fig. 1 is a side sectional view of a preferred embodiment of a camera module according to the present invention based on an integrated packaging process.
Fig. 2 is a side cross-sectional view of another embodiment of a camera module according to the present invention.
Fig. 3A is a schematic diagram of a comparative molded camera module.
Fig. 3B is a schematic diagram of a conventional camera module formed by molding in the prior art.
Fig. 3C is a schematic diagram of a conventional camera module formed by molding in the prior art.
Fig. 3D is a schematic diagram of a conventional camera module formed by molding in the prior art.
Fig. 3E is a schematic diagram of a conventional camera module formed by molding in the prior art.
Fig. 4A is a side cross-sectional view of another embodiment of a camera module according to the present invention.
Fig. 4B is a side cross-sectional view of another embodiment of a camera module according to the present invention.
Fig. 5 is a side cross-sectional view of another embodiment of a camera module according to the present invention.
Fig. 6 is a side cross-sectional view of another embodiment of a camera module according to the present invention.
Fig. 7A is a side cross-sectional view of another embodiment of a camera module according to the present invention.
Fig. 7B is a side cross-sectional view of another embodiment of a camera module according to the present invention.
Fig. 8A is a side cross-sectional view of another embodiment of a camera module according to the present invention.
Fig. 8B is a side cross-sectional view of another embodiment of a camera module according to the present invention.
Fig. 9A is a side cross-sectional view of another embodiment of a camera module according to the present invention.
Fig. 9B is a side cross-sectional view of another embodiment of a camera module according to the present invention.
Fig. 10 is a side sectional view of the motor and circuit board conduction mode of the above-mentioned embodiment of the camera module based on the integrated packaging process according to the present invention.
Fig. 11 is a side sectional view of another conduction mode of the motor and the circuit board of the camera module based on the integrated packaging process according to the present invention.
Fig. 12 is a side sectional view of another conduction mode of the motor and the circuit board of the camera module based on the integrated packaging process according to the present invention.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.
It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.
Since the module of the present invention is integrally formed by packaging based on a packaging process, in the embodiments of the present invention, a molding process in the packaging process is taken as an example for description. Therefore, in order to more clearly disclose the context of the present invention, a brief description of the molding process will be provided. There are two general implementations of the molding process, one is mob (molding On board), that is, the package is formed only On the circuit board of the module; the other is moc (molding On chip), that is, the package is formed On the circuit board and the photosensitive chip of the module. The present invention will be exemplified in the following disclosure in various molded-in implementations, respectively.
In addition, the molding process generally includes injection molding and compression molding in terms of equipment. The injection molding can be classified into injection molding and die casting. An injection molding machine (an injection machine or an injection molding machine for short) is a main molding device for making thermoplastic plastics or thermosetting materials into plastic products with various shapes by using a plastic molding die, and the injection molding is realized by the injection molding machine and the die. The compression molding is also called compression molding for short. A molding material such as a plastic or rubber compound is formed into an article by heating and pressing in a closed mold cavity. The present invention is described using molding in a molding process, but it will be understood by those skilled in the art that the present invention is not limited to molding processes only, but other packaging processes, and the present invention is not limited thereto.
Fig. 1 shows a preferred embodiment of a camera module based on an integrated package process according to the present invention, which employs a MOB process. The camera module based on the integrated packaging process includes a packaged photosensitive assembly 10, an optical filter 20, a lens 30 and a motor 40. It will be appreciated by those skilled in the art that the motor 40 may be absent in other embodiments, such as those involving a Fixed Focus (FF) module, and the invention is not so limited. That is, the preferred embodiment of the present invention is exemplified by an Auto Focus (AF) module. The encapsulated photosensitive assembly 10 includes an encapsulating portion 11 and a photosensitive assembly 12. The photosensitive assembly 12 further includes a photosensitive chip 121, and a circuit board 122 configured with a set of electronic components 123 (e.g., resistors, capacitors, drivers, etc., hereinafter referred to as ICs) and a set of leads 124. The lead 124 connects and connects the photosensitive chip 121 and the circuit board 122, but the photosensitive chip 121 and the circuit board 122 may have other conducting modes. In this preferred embodiment of the present invention, the leads 124 may be implemented as gold wires. The package portion 11 serves as a support for supporting the optical filter 20, and the package portion 11 may have electrical properties, such as being capable of being engraved with a circuit to electrically connect the motor 40 and the photosensitive assembly 12, and being capable of replacing a conventional motor bonding wire, thereby reducing a conventional process. Of course, the motor 40 and the circuit board 122 may also be electrically connected by conventional solder tail soldering. In the packaging process, the packaging part 11 packages the circuit board 122, and in the preferred embodiment of the present invention, the packaging part 11 packages the circuit board 122 except for the region contacting with the photosensitive chip 121 and the lead 124. The package portion 11 encapsulates not only the top surface 1221 of the circuit board 122, but also at least one side 1222 of the circuit board 122. It is to be understood that the encapsulating portion 11 may integrally encapsulate the electronic component 123 during the encapsulating process.
Fig. 3A to 3E show a mold set according to a comparative technique. The portion of the left side of the package portion 11P in fig. 3A is flush with the circuit board 122P, and such a design that the side surface of the circuit board 122P is flush with the side surface of the package portion 11P is also generally adopted by the related art. Therefore, in order to meet the above design requirements, as shown in fig. 3B, the structure shown in the figure needs to be achieved before the module is assembled, the circuit board 122P is processed as shown in fig. 3B during molding, that is, more than two pieces of the circuit boards 122P are connected together, molding is performed, and finally, the middle part of fig. 3B is cut by a machine, but a new cutting device is needed. If the method in fig. 3B is not used, considering that there is a certain deviation between the circuit board 122P and the mold, the edge of the circuit board 122P cannot be designed to be flush with the packaging part 11P, so it is usually designed only as shown in fig. 3C, in which the circuit board 122P needs to protrude a section for mold pressing, and the protruding length of the circuit board 122P on the branches is usually 0.3mm to 1 mm. As shown in fig. 3E, if cutting is not adopted, the protruding portion of the circuit board 122P at this section will affect the final size of the module, so that the size of the module is increased by 0.3mm to 1mm, which affects the quality of the product.
Therefore, compared with the prior art, the camera module based on the integrated packaging process of the present invention performs the inward-shrinkage design on the circuit board 122, so that the side surface of the packaging part 11 covers the side surface 1222 of the circuit board 122, and thus a certain dislocation space is still reserved between the side surface of the packaging part 11 and the circuit board 122, and after the molding, the side surface does not protrude from the circuit board 122, thereby reducing the cutting process and improving the product quality.
It should be noted that the package portion 11 can package and cover both sides of the circuit board 122. In this preferred embodiment of the invention, only the left side of the circuit board 122, i.e., the side 1222, is encapsulated because other components, such as a flexible circuit board, are connected to the right side. However, it will be understood by those skilled in the art that the packaging part 11 can not only package the side 1222 of the circuit board 122, but also can simultaneously package part or all of the area of the two sides of the circuit board 122 in other embodiments, and the invention is not limited thereto.
Referring to fig. 2, another embodiment of the camera module based on the integrated packaging process according to the present invention, in order to ensure that the module after the molding process can be easily mounted and positioned and improve the flatness, also in the form of MOB, includes a packaged photosensitive assembly 10 ', a filter 20', a lens 30 ', and a motor 40'. Similarly, the motor 40 'is disclosed as an AF module, but the motor 40' may not be required in other FF modules, and the invention is not limited thereto.
Specifically, the packaged photosensitive assembly 10 ' includes a packaging portion 11 ' and a photosensitive assembly 12 '. The photosensitive assembly 12 ' further includes a photosensitive chip 121 ', and a circuit board 122 ' configured with a set of electronic components 123 ' and a set of leads 124 '. The packaging part 11 ' is used as a support for bearing the optical filter 20 ', and the engraving line of the module part 11 ' is communicated with the motor 40 ' and the photosensitive assembly 12 '. Compared with the above preferred embodiment of the present invention, in the molding process, in addition to the encapsulating portion 11 ' encapsulating the circuit board 122 ' and the electronic component 123 ' and encapsulating the top surface 1221 ' and at least one side surface 1222 ' of the circuit board 122 ', the encapsulating portion 11 ' also molds and encapsulates a bottom portion 1223 ' of the circuit board 122 '. Therefore, after the molding is finished, the camera module based on the integrated packaging process has the advantages of smoothness of the integral side face and the integral bottom, and convenience for installation and positioning on other tools.
It should be noted that the encapsulating portion 11 ' may encapsulate the entire bottom 1223 ' of the circuit board 122 ', or encapsulate a part of the bottom 1223 ' of the circuit board 122 ' according to different requirements in other embodiments, and the invention is not limited thereto.
It should be noted that in this preferred embodiment of the present invention, since the right side of the image pickup module shown in the figure can be connected with other components or processed by other processes, the right side of the circuit board 122 ' is not encapsulated, but in other embodiments, the encapsulating portion 11 ' can encapsulate two or more sides of the circuit board 122 ' and encapsulate all or a part of the bottom 1223 ' of the circuit board 122 ', and the present invention is not limited thereto.
The two embodiments shown in fig. 1 and 2 are disclosed in the form of MOB, and the following modified embodiments are replaced by MOC, and various module structures are combined to disclose module packaging on the side or bottom of the circuit board.
Fig. 4A shows another embodiment of the camera module based on the integrated package process according to the invention. The camera module based on the integrated packaging process comprises a packaging part 11A, a photosensitive assembly 12A, an optical filter 20A and a lens 30. The photosensitive assembly 12A further includes a photosensitive chip 121A, and a circuit board 122A configured with a set of electronic components 123A and a set of leads 124A. The package portion 11A is used as a support for supporting the optical filter 20A, and is directly formed on the circuit board 122A except for the chip photosensitive area. That is, this embodiment of the present invention takes the form of a MOC. It should be noted that the photosensitive chip 121A includes a photosensitive region 1211A and a non-photosensitive region 1212A outside the photosensitive region 1211A, and the sealing portion 11A does not seal the photosensitive region 1211A during the sealing process. But encapsulates the non-photosensitive region 1212A of the photosensitive chip 121A. The non-photosensitive region 1212A is further provided with a pin connected to the lead 124A for turning on the photosensitive chip 121A.
Similarly, in the camera module based on the integrated packaging process shown in fig. 4A, the circuit board 122A is designed to be retracted so that the side surface of the packaging part 11A covers the side surface 1222A of the circuit board 122A, so that a certain misalignment space is still reserved between the side surface of the packaging part 11A and the circuit board 122A, and the side surface does not protrude from the circuit board 122A after the molding. In addition, in another modification of the present embodiment, the sealing portion 11A may seal and cover all of the side surfaces of the wiring board 122A.
Fig. 4B shows another embodiment of the camera module based on the integrated package process according to the invention. Unlike the embodiment of fig. 4A, the encapsulating portion 11A ' encapsulates a bottom 1223A ' of the circuit board 122A ', except that the encapsulating portion 11A ' encapsulates the circuit board 122A ' and the electronic component 123A ' and encapsulates the top surface 1221A ' and at least one side surface 1222A ' of the circuit board 122A '. Therefore, after the molding is finished, the camera module based on the integrated packaging process has the advantages of smoothness of the integral side face and the integral bottom, and convenience for installation and positioning on other tools.
Fig. 5 shows another embodiment of the camera module based on the integrated package process according to the invention. Unlike the embodiment of fig. 4A, the top of the packaging part 11B is designed differently, and in the embodiment of fig. 4A, the top of the packaging part 11A protrudes upwards and has a clearance groove 1121A between the side of the filter 20A and the top for mounting different lenses or motors. Whereas the embodiment of fig. 5 does not have said clearance pocket. In addition, a reinforcing plate 125B is closely attached to the bottom surface of the circuit board 122B. The reinforcing plate 125B may be implemented as a metal plate. The other structure is the same as that in fig. 4A. The top surface 1221B of the circuit board 122B, at least one side surface 1221B, the side portion of the reinforcing plate 125B, the non-photosensitive region 1212B of the photosensitive chip 121B, the electronic component 123B, and the lead 124B are all encapsulated and molded for the encapsulating portion 11B.
Fig. 6 shows another embodiment of the camera module based on the integrated package process according to the invention. Unlike the embodiment of fig. 5, with respect to the circuit board 122B 'and the reinforcing plate 125B', the encapsulating portion 11B 'also encapsulates the bottom of the reinforcing plate 125B' by molding, except for the encapsulating portion 11B 'encapsulating the top surface 1221B' and at least one side surface 1222B 'of the circuit board 122B'. Therefore, after the molding is finished, the camera module based on the integrated packaging process has the advantages of smoothness of the integral side face and the integral bottom and convenience in installation and positioning.
The module structure shown in fig. 7A is a modification of the module structure in the embodiment of fig. 5, and the other structures are the same, except that the optical filter 20C is placed on the photosensitive chip 121C and packaged together with the packaging part 11C. This can reduce the damage of the photosensitive chip 121C during packaging and use, and can reduce the back focus of the lens, thereby making the size smaller.
Similarly, the module structure shown in fig. 7B is a modification of the module structure in the embodiment of fig. 6, and the other structures are the same, except that the optical filter 20C ' is placed on the photosensitive chip 121C ' and packaged together with the packaging part 11C '. Therefore, the damage of the photosensitive chip 121C 'in the packaging and using processes can be reduced, the back focal length of the lens can be reduced, the size is smaller, the height can be reduced, heat emitted by the photosensitive chip 121C' can be released, and the high heat dissipation capacity is achieved. .
Fig. 8A is a variation of the modular structure based on the embodiment of fig. 7A. Mainly due to the deformation of the encapsulation 11D. The top of the package portion 11D extends upward to form a bearing wall 111D, and the bearing wall 111D forms a receiving groove 1111D for receiving a lens. That is, the package portion 11D can directly carry a lens, thereby implementing a high-precision Fixed Focus (FF) module.
Fig. 8B is a variation of the modular structure based on the embodiment of fig. 7B. Mainly due to the deformation of the encapsulation 11D'. The package portion 11D ' covers the bottom surface of the circuit board 121D ', and the top portions thereof respectively extend upward to form a carrying wall 111D ', and the carrying wall 111D ' forms a receiving groove 1111D ' for receiving a lens. That is, the package portion 11D' can directly carry a lens, thereby implementing a high-precision Fixed Focus (FF) module.
Fig. 9A and 9B are based on a modification of the modular structure in the embodiment of fig. 8A. Mainly due to the deformation of the encapsulation 11E. Therefore, the wiring board 121E is provided with one or more through holes 126E, and the molding material forming the sealing portion 11E enters the through holes 126E and is buried in the through holes 126E, thereby further reinforcing the reinforcing effect of the wiring board 121E. Similarly, the package portion 11E may be coated not only on the top surface of the wiring board 121E but also on the side and bottom surfaces of the wiring board 121E. It is understood that the way in which the circuit board 121E is provided with the through hole 126E can also be applied to other embodiments of the present invention.
It should be noted that, based on the embodiments shown in fig. 4A to 7B, in terms of the MOC technology of the above embodiments, when the motor needs to be connected, the motor pins and the circuit board are conducted in several connection manners shown in fig. 10 to 12.
Fig. 10 shows a modified structure of an embodiment, which employs an MOC process. The camera module based on the integrated packaging process comprises a packaging photosensitive assembly, an optical filter 20F, a lens 30F and a motor 40F. That is, the preferred embodiment of the present invention is exemplified by an Auto Focus (AF) module. The packaging photosensitive assembly comprises a packaging part 11F and a photosensitive assembly 12F. The photosensitive assembly 12F further includes a photosensitive chip 121F, a circuit board 122F, a set of electronic components 123F, and a set of leads 124F. The lead 124F connects and conducts the photosensitive chip 121F and the circuit board 122F. In this embodiment of the present invention, the leads 124F may be implemented as gold wires. The sealing part 11F serves as a support for supporting the optical filter 20F. In the packaging process, the packaging part 11F packages the circuit board 122F, and in this embodiment of the present invention, the packaging part 11F packages the circuit board 122F except for the photosensitive region of the photosensitive chip 121F. The encapsulating portion 11F encapsulates not only the top surface 1221F of the circuit board 122F but also at least one side 1222F that covers the circuit board 122F. It is to be understood that the electronic component 123F is also integrally packaged by the packaging portion 11F during the packaging process.
It should be noted that a package portion pin 1101F of the package portion 11F and the motor 40F are electrically connected, and at least one motor pin 41F of the motor 40F is electrically connected to the circuit board 122F through an internal conductive wire 1102F of the package portion 11F, which may not require a soldering process.
In the embodiment shown in fig. 11, a soldering process may be adopted, and the package portion 11G has a groove channel 1103G extending vertically therethrough for accommodating the motor pin 41G, so that the motor pin 41G is soldered to a circuit board pin 1231G of the circuit board 122G at a soldering point 60G through the groove channel 1103G.
Accordingly, the structure of fig. 12 is similar to the structure of fig. 10 and 11, but the motor pin of the structure of fig. 10 and 11 may not be designed to be long due to the high height of the package portion 11H, so that only the structure of fig. 12 can be used. That is, the groove channel 1103H on the outer wall of the package portion 11H is not directly connected to the bottom, but the motor pin 41H is soldered to the package portion pin 1101H of the package portion 11H in the groove channel 1103H, and a soldering point is 60H and is directly connected to the circuit board 122H through the internal wire 1102H of the package portion 11H, so as to achieve conduction between the motor and the circuit board.
In addition, according to another embodiment, the packaging part may also form a plating conductive circuit on the surface by using a laser direct structuring process, so as to connect the motor and the circuit board. Of course, the package portion may not have the electrical performance mentioned in the above embodiments, and the motor and the circuit board may be soldered by a conventional method.
It will be understood by those skilled in the art that the three embodiments illustrated in figures 10 to 12 are merely illustrative of the different ways in which the motor and the circuit board may be switched on in the presence of a motor. The encapsulating portion in the three embodiments encapsulates not only the top surface and the side surface of the wiring board but also the bottom surface of the wiring board as mentioned in the foregoing modified embodiments. In addition, other structures of the camera module can be correspondingly deformed, and the invention is not limited by the structure.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.
Claims (23)
1. The camera module based on the integrated packaging technology is characterized by comprising at least one packaging photosensitive assembly and at least one lens, wherein the packaging photosensitive assembly comprises at least one packaging part and at least one photosensitive assembly, the photosensitive assembly further comprises at least one photosensitive chip and at least one circuit board, the photosensitive chip is in conductive connection with the circuit board, the packaging part is integrally molded and mounted on a top surface of the circuit board, at least one side surface of the circuit board and a non-photosensitive area of the photosensitive chip in a molding process, and the lens is assembled on the upper surface of the packaging part so as to allow the lens to be located in a photosensitive path of the photosensitive chip.
2. The camera module based on one-piece packaging technology of claim 1, wherein the packaging part further packages a bottom surface of the circuit board.
3. The camera module based on one-piece packaging technology of claim 1, wherein a stiffener is disposed on a bottom surface of the circuit board.
4. The camera module based on the integrated packaging process of claim 3, wherein the packaging part packages at least one side part of the reinforcing plate.
5. The camera module based on one-piece packaging technology of claim 3, wherein the packaging part packages a bottom part of the reinforcing plate.
6. The camera module based on integrated packaging technology of any one of claims 1 to 5, wherein the packaging portion is further packaged in a non-photosensitive area of the photosensitive chip.
7. The camera module based on the integrated packaging process as claimed in claim 6, wherein the photosensitive chip and the circuit board are connected by a set of leads, and the packaging part covers the leads.
8. The camera module based on integrated packaging process of any one of claims 1 to 5, further comprising at least one optical filter, wherein the optical filter is attached to the packaging part, so that the packaging part serves as a support for bearing the optical filter.
9. The camera module based on integrated packaging technology of claim 8, wherein the packaging portion is further packaged in a non-photosensitive area of the photosensitive chip.
10. The camera module based on one-piece packaging process as claimed in any one of claims 1 to 5, wherein the optical filter is stacked on the photosensitive chip, and the packaging portion is further packaged in the optical filter.
11. The camera module based on one-piece packaging technology of any one of claims 1 to 5, wherein the circuit board is further provided with at least one through hole, and the packaging part extends and buries in the through hole.
12. The camera module based on one-piece packaging technology of claim 6, wherein the circuit board is further provided with at least one through hole, and the packaging part extends and buries in the through hole.
13. The camera module based on the integrated packaging process as claimed in any one of claims 1 to 5, wherein the photosensitive assembly further comprises a set of electronic components, and the electronic components are integrally packaged on the circuit board by the packaging part.
14. The camera module based on the integrated packaging process as claimed in claim 13, wherein the molding process is an injection molding or a die pressing process.
15. A camera module based on an integrated packaging process is characterized by comprising at least one packaging photosensitive assembly and at least one lens, wherein the packaging photosensitive assembly comprises at least one packaging part and at least one photosensitive assembly, the photosensitive assembly further comprises at least one photosensitive chip and at least one circuit board, the photosensitive chip is in conductive connection with the circuit board, the packaging part is integrally molded and packaged on the top surface of the circuit board, at least one side surface of the circuit board and a non-photosensitive area of the photosensitive chip in a molding process, the camera module further comprises a motor, the lens is arranged on the motor, and the motor is installed on the upper surface of the packaging part to allow the lens to be located in a photosensitive path of the photosensitive chip.
16. The camera module of claim 15, wherein the encapsulation portion is further encapsulated in a non-photosensitive region of the photosensitive chip.
17. The camera module of claim 15 or 16, further comprising at least one optical filter, wherein the optical filter is attached to the packaging portion, so that the packaging portion serves as a support for carrying the optical filter.
18. The camera module according to claim 15 or 16, wherein the photosensitive assembly further comprises a set of electronic components integrally packaged on the circuit board by the packaging portion.
19. The camera module of claim 15 or 16, wherein the camera module has electrical properties to conduct the motor and the wiring board.
20. The camera module based on the integrated packaging technology is characterized by comprising at least one packaging photosensitive assembly and at least one lens, wherein the packaging photosensitive assembly comprises at least one packaging part and at least one photosensitive assembly, the photosensitive assembly further comprises at least one photosensitive chip and at least one circuit board, the photosensitive chip is in conductive connection with the circuit board, the packaging part is integrally molded on a top surface of the circuit board, at least one side surface of the circuit board and a non-photosensitive area of the photosensitive chip in the molding process, and the top of the packaging part extends upwards to form a containing groove for containing the lens so as to allow the lens to be located in a photosensitive path of the photosensitive chip.
21. The camera module of claim 20, wherein the encapsulation portion is further encapsulated in a non-photosensitive region of the photosensitive chip.
22. The camera module of claim 20 or 21, further comprising at least one optical filter, wherein the optical filter is attached to the packaging portion, so that the packaging portion serves as a support for carrying the optical filter.
23. The camera module according to claim 20 or 21, wherein the photosensitive assembly further comprises a set of electronic components integrally packaged on the circuit board by the packaging portion.
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| CN201910932279.XA CN111010498B (en) | 2016-04-01 | 2016-04-01 | Camera module based on integrated packaging process |
| CN201610202500.2A CN105721754B (en) | 2016-04-01 | 2016-04-01 | Camera module based on integrated packaging process |
| EP16890320.1A EP3419275A4 (en) | 2016-02-18 | 2016-07-28 | Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor |
| JP2018543321A JP6829259B2 (en) | 2016-02-18 | 2016-07-28 | Integrated packaging process-based camera module, its integrated base parts, and how to manufacture them |
| KR1020187026982A KR102282687B1 (en) | 2016-02-18 | 2016-07-28 | Camera module based on integrated packaging process, integrated base part thereof, and manufacturing method thereof |
| CN201690000252.7U CN208353432U (en) | 2016-02-18 | 2016-07-28 | Camera module and its integral base component based on integral packaging technique |
| KR1020217023290A KR102465474B1 (en) | 2016-02-18 | 2016-07-28 | Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor |
| PCT/CN2016/092020 WO2017140092A1 (en) | 2016-02-18 | 2016-07-28 | Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor |
| US15/999,858 US11877044B2 (en) | 2016-02-18 | 2016-07-28 | Integral packaging process-based camera module, integral base component of same, and manufacturing method thereof |
| KR1020217005344A KR102294537B1 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| KR1020187029304A KR20180132684A (en) | 2016-03-12 | 2017-03-09 | Camera module, its photosensitive part and method of manufacturing the same |
| US16/082,533 US20190148429A1 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| KR1020217005352A KR102360319B1 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| PCT/CN2017/076041 WO2017157211A1 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| EP17765753.3A EP3429183A4 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| JP2018548099A JP7071926B2 (en) | 2016-03-12 | 2017-03-09 | Camera module and its photosensitive parts and their manufacturing method |
| TW108135672A TWI742441B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135670A TW202017356A (en) | 2016-03-12 | 2017-03-13 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| TW106108217A TWI754632B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW106203507U TWM559558U (en) | 2016-03-12 | 2017-03-13 | Camera module and light-sensing component |
| TW108135670D TWI758644B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135674D TWI758645B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135671A TWI769403B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135674A TW202019155A (en) | 2016-03-12 | 2017-03-13 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| TW106204229U TWM561225U (en) | 2016-04-01 | 2017-03-26 | Integral packaging process-based camera module and integral base component of same |
| TW106110049A TWI648587B (en) | 2016-04-01 | 2017-03-26 | Camera module based on integrated packaging process and integrated base assembly and manufacturing |
| TW108100078A TWI708987B (en) | 2016-04-01 | 2017-03-26 | Camera module based on integrated packaging process and integrated base assembly and manufacturing method thereof |
| TW108100066A TWI743429B (en) | 2016-04-01 | 2017-03-26 | Camera module based on integrated packaging process, integrated base assembly and manufacturing method thereof |
| JP2021007710A JP7508380B2 (en) | 2016-02-18 | 2021-01-21 | Integrated packaging process-based camera module, integrated base part thereof, and manufacturing method thereof |
| US17/847,569 US12021097B2 (en) | 2016-03-12 | 2022-06-23 | Camera module, and photosensitive component thereof and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610202500.2A CN105721754B (en) | 2016-04-01 | 2016-04-01 | Camera module based on integrated packaging process |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910932279.XA Division CN111010498B (en) | 2016-04-01 | 2016-04-01 | Camera module based on integrated packaging process |
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| CN105721754A CN105721754A (en) | 2016-06-29 |
| CN105721754B true CN105721754B (en) | 2020-04-28 |
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| CN201910932279.XA Active CN111010498B (en) | 2016-04-01 | 2016-04-01 | Camera module based on integrated packaging process |
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| CN201910932279.XA Active CN111010498B (en) | 2016-04-01 | 2016-04-01 | Camera module based on integrated packaging process |
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| CN105721754A (en) | 2016-06-29 |
| CN111010498B (en) | 2022-08-23 |
| CN111010498A (en) | 2020-04-14 |
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