CN104660889A - Camera module - Google Patents
Camera module Download PDFInfo
- Publication number
- CN104660889A CN104660889A CN201410052556.5A CN201410052556A CN104660889A CN 104660889 A CN104660889 A CN 104660889A CN 201410052556 A CN201410052556 A CN 201410052556A CN 104660889 A CN104660889 A CN 104660889A
- Authority
- CN
- China
- Prior art keywords
- infrared filter
- adhesive
- spatial accommodation
- camera model
- accomodating unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 121
- 230000001070 adhesive effect Effects 0.000 claims abstract description 121
- 230000004308 accommodation Effects 0.000 claims description 45
- 230000001012 protector Effects 0.000 claims description 41
- 239000013589 supplement Substances 0.000 claims description 18
- 230000008878 coupling Effects 0.000 abstract description 3
- 238000010168 coupling process Methods 0.000 abstract description 3
- 238000005859 coupling reaction Methods 0.000 abstract description 3
- 230000001681 protective effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 238000000576 coating method Methods 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/208—Filters for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/006—Filter holders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B11/00—Filters or other obturators specially adapted for photographic purposes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Blocking Light For Cameras (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
Abstract
The application discloses a camera module, comprising a printed circuit board including an image sensor installed thereon; an infrared filter arranged on the image sensor; a lens unit arranged on the infrared filter; a housing coupled to the printed circuit board, and comprising an inner space used for accommodating the lens unit, and an accommodating unit used for accommodating the infrared filter therein; an adhesive located between the accommodating unit and the infrared filter, and configured to coupling the accommodating unit and the infrared filter; and an adhesive protective piece formed at an end portion of the accommodating unit so as to prevent the adhesive from flowing into the interior of the infrared filter.
Description
The cross reference of related application
This application claims and be forwarded to the priority of No. 10-201-0142336th, the korean patent application of Korean Intellectual Property Office on November 21st, 2013, by quoting as proof, its disclosure entirety being contained in this.
Technical field
The present invention relates to a kind of camera model.
Background technology
Camera model is for the optical imagery of the object received by lens being converted to the signal of telecommunication and the device exported by this signal of telecommunication by use imageing sensor.Camera model can be installed in a mobile device, such as mobile phone, notebook computer etc., and for providing polytype convenience for users.
Camera model can be made up of imageing sensor, infrared filter, lens unit, housing etc., and adhesive can be used to assemble these parts.That is, also by heat or ultraviolet, adhesive is hardened by the couplings office applying liquid adhesive at these parts, can by the assembling parts of camera model together.
Correlation technique of the present invention is disclosed in Korean Patent and discloses in No. 2006-0107257 (open on October 13rd, 2006).
Summary of the invention
Some embodiments of the present invention provide a kind of camera model, and this camera model can make the overflow of adhesive minimize when by using adhesive to be coupled in the housing by infrared filter.
One aspect of the present invention provides a kind of camera model, and it comprises: printed circuit board (PCB), and described printed circuit board (PCB) is provided with imageing sensor; Infrared filter, arranges on the image sensor; Lens unit, is arranged on infrared filter; Housing, is coupled to printed circuit board (PCB), and described housing has the inner space for holding lens unit and the accomodating unit for holding the infrared filter be arranged on wherein; Adhesive, between accomodating unit and infrared filter, and is arranged for accomodating unit and infrared filter to be coupled to each other; And adhesive protector, be formed in the end of accomodating unit, for stoping adhesive towards the internal flow of infrared filter.
Camera model also can comprise first of the end being formed in adhesive protector and supplement spatial accommodation, and this first supplementary spatial accommodation is for holding towards a part for the adhesive of the internal flow of infrared filter.
In the end of adhesive protector towards the inside of infrared filter, inclined-plane can be formed as follows, namely, make to increase towards the inside of infrared filter at the spacing distance of adhesive protector and infrared filter, and first supplements spatial accommodation and can be formed between inclined-plane and infrared filter.
Camera model can also comprise the adhesive spatial accommodation be formed in accomodating unit, and this adhesive spatial accommodation is for holding the adhesive flow stopped by adhesive protector in adhesive.
Camera model can also comprise second and supplement spatial accommodation, this second supplementary spatial accommodation is formed between the lateral surface of infrared filter and the inner surface of housing as follows, namely, make second to supplement spatial accommodation to be connected with adhesive spatial accommodation, to hold towards the part of the adhesive of the outside overflow of infrared filter.
Adhesive spatial accommodation can have loop configuration, and this loop configuration extends along the border of infrared filter.
Adhesive protector can be formed as from the end of accomodating unit towards infrared filter projection, and infrared filter can be received into and contacts with adhesive protector.
Adhesive protector can have loop configuration, and this loop configuration extends along the border of infrared filter.
Accomodating unit can be formed on an interior surface of the housing, with the inner space projection towards housing.
Accomodating unit can have loop configuration, and this loop configuration extends along the inner surface of housing.
Accompanying drawing explanation
Fig. 1 shows the viewgraph of cross-section of camera model according to the embodiment of the present invention.
Fig. 2 shows in Fig. 1 the zoomed-in view of the part using " A " to mark.
Fig. 3 is the bottom view of the housing of camera model according to the embodiment of the present invention.
Fig. 4 shows the cut-out perspective view of the housing of camera model according to the embodiment of the present invention.
Fig. 5 shows the partial enlarged view of the adhesive of camera model according to the embodiment of the present invention.
Embodiment
Hereinafter, some embodiments of the present invention will be described with reference to the drawings.When being described with reference to the drawings of the present invention, identical or corresponding figure will use same numbers numbers, and can not provide its description redundantly.
As shown in Fig. 1 to Fig. 5, an embodiment of the invention provide camera model 100, this camera model 100 can make the overflow of adhesive 140 in the assembling process of infrared filter 130 minimize, and this camera model comprises imageing sensor 110, printed circuit board (PCB) 120, infrared filter 130, adhesive 140, lens unit 150 and housing 160.
According to the present embodiment, by arranging adhesive protector 180 in housing 160, the supplementary spatial accommodation 192 and second of adhesive spatial accommodation 190, first supplements spatial accommodation 194, the adhesive 140 that the mobility due to adhesive 140 may be caused overflows to infrared filter 130 inner minimization, and this adhesive 140 is for assembling infrared filter 130.
Hereinafter, the element according to the camera model 100 of the present embodiment is described in detail with reference to Fig. 1 to Fig. 5.
Imageing sensor 110 is cameras, pixel a large amount of wherein integrated (integrate, integrated).Each in pixel is a kind of photo-detector (photodetector) that incident image can be converted to the signal of telecommunication and convert data subsequently to.In other words, imageing sensor 110 can convert the image of scioptics unit 150 incidence to the signal of telecommunication, and the data of conversion can by image processor process.
As shown in Figure 1, imageing sensor 110 can be arranged on printed circuit board (PCB) 120, and printed circuit board (PCB) can have the image processor be arranged on wherein.Image processor can store, edits, sends, recovers and delete the data being converted to the signal of telecommunication by imageing sensor 110.
As shown in Figure 1, infrared filter 130 can be arranged in the top of imageing sensor 110.As shown in Figure 1, infrared filter 130 can be accommodated in the inner space 162 of housing 160, and can be coupled to the accomodating unit 170 of housing 160 by adhesive 140.Infrared filter 130 can be introduced into the image of imageing sensor 110 from scioptics unit 150 and remove unnecessary noise (noise, interference).
As shown in Figure 1, lens unit 150 can be accommodated in the inner space 162 of housing 160 and to be arranged in the top of infrared filter 130.The lens unit 150 with hollow structure can be made up of lens drum and the multiple lens be contained in lens drum.
As shown in Figure 1, be provided with inner space 162 and accomodating unit 170 in housing together with housing 160 can be coupled in printed circuit board (PCB) 120, lens unit 150 is contained in this inner space, and infrared filter 130 is contained in this accomodating unit.Housing 160 and printed circuit board (PCB) 120 can be fixed by adhesive 140 etc.Housing 160 can have the inner space 162 for installing the lens unit 150 be formed in wherein, and lens unit 150 can be arranged in infrared filter 130 and be arranged on the imageing sensor 110 on printed circuit board (PCB) 120, and this lens unit can be arranged on housing 160 inside.In addition, for auto-focusing actuator and can be arranged on housing 160 for the actuator of image stabilization inner.
As shown in Figures 1 and 2, accomodating unit 170 can be arranged on the inner surface place of housing 160, for coupling between infrared filter 130 and housing 160.Particularly, accomodating unit 170 can be formed in the inner surface place of housing, towards inner space 162 projection of housing 160.In addition, as shown in Figure 3, accomodating unit 170 can have the loop configuration that the inner surface along housing 160 extends.
As previously discussed, together with infrared filter 130 can be coupled in accomodating unit 170 by adhesive 140.That is, as shown in Figures 1 and 2, adhesive 140 can between accomodating unit 170 and infrared filter 130, together with being coupled to each other with infrared filter 130 by accomodating unit 170.
Particularly, infrared filter 130 can be fixed to housing 160 by following steps: use the coatings such as distributor to have the fluid binder 140 of mobility and viscosity, the accomodating unit 170 making infrared filter 130 be coated with adhesive 140 holds, and is anyly hardened by adhesive 140 by curing process., depend on the type of adhesive 140 herein, curing process can be implemented by heat or ultraviolet.
Like this, because before the hardening there is mobility for the adhesive 140 assembling infrared filter 130, if so infrared filter 130 is placed on accomodating unit 170 place while application of adhesive 140, then can be present in adhesive 140 between accomodating unit 170 and infrared filter 130 due to mobility the inside of overflow to infrared filter or the situation of outside.
In the present embodiment, adhesive protector 180, adhesive spatial accommodation 190, first supplement spatial accommodation 192 and the second supplementary spatial accommodation 194 is formed in housing 160, minimize to make the overflow of adhesive 140.This will in following detailed description.
As shown in Figures 1 and 2, adhesive protector 180 can be formed in the end of accomodating unit 170, with the inside stoping adhesive 140 to flow to infrared filter 130.Particularly, adhesive protector 180, from the end of accomodating unit 170 towards infrared filter 130 projection, makes infrared filter 130 to be received into and contacts with adhesive protector 180.In addition, as shown in Figures 3 and 4, adhesive protector 180 can have the loop configuration that the border along infrared filter 130 extends.
Because adhesive protector 180 is formed from the end of accomodating unit 170 towards infrared filter 130 projection, and therefore form to obtain picture protection walls, so likely stop adhesive 140 overflow between accomodating unit 170 and infrared filter 130 to the inside of infrared filter 130, as shown in Figures 1 and 2.
In other words, owing to likely to contact with the projection loop configuration of adhesive protector 180 by infrared filter 130 is pressed into and makes infrared filter 130 be accommodated on accomodating unit 170, and form the protection walls of the flowing blocking adhesive 140, even if thus adhesive 140 does not harden completely, also adhesive 140 can be stoped towards the internal overflow of infrared filter 130 with maximum possible, and therefore likely stop scintillation (flare phenomenon), adhesive 140 overflow can cause this scintillation to the inside of infrared filter 130.
In addition, contact completely with the surface of adhesive protector 180 by allowing infrared filter 130, likely stop infrared filter 130 to tilt, and therefore no matter the thickness of adhesive 140 be how many, infrared filter 130 can without being positioned at obliquely in housing 160.
So, its flowing can be contained in the adhesive spatial accommodation 190 of accomodating unit 170 by the adhesive 140 that adhesive protector 180 stops, and as shown in Figures 1 and 2, and infrared filter 130 and housing 160 are fixed by this adhesive.
Due to the end making adhesive protector 180 towards the mode of infrared filter 130 projection, adhesive protector 180 to be formed in accomodating unit 170, can be formed on the outside of accomodating unit 170 for the adhesive spatial accommodation 190 holding adhesive 140.By being accommodated in adhesive spatial accommodation 190, infrared filter 130 can be bonded on accomodating unit 170 by adhesive 140.
As shown in Figures 3 and 4, similar to adhesive protector 180, adhesive spatial accommodation 190 also can have the loop configuration that the border along infrared filter 130 extends, and by using distributor etc. adhesive 140 can be coated in this loop configuration of adhesive spatial accommodation 190.
As mentioned above, by forming retaining wall structure by adhesive protector 180, and by forming the adhesive spatial accommodation 190 defined by surface and the adhesive protector 180 of accomodating unit 170, likely make adhesive 140 minimize towards the flowing of the inside of infrared filter 130.
Camera model 100 according to the present embodiment can have supplementary accomodating unit extraly, such as first supplements spatial accommodation 192 and second supplements spatial accommodation 194, in order to hold the possibility inside of overflow to infrared filter 130 or the adhesive portion 142,143 of outside, although there is adhesive protector 180 and adhesive spatial accommodation 190, but the adhesive 140 such as due to coating is excessive, still may there is the adhesive portion 142,143 of overflow.
As shown in Figure 5, first supplements the end that spatial accommodation 192 can be formed in adhesive protector 180, to hold the adhesive portion 142 of overflow to the inside of infrared filter 130.Particularly, as shown in Figures 4 and 5, in the end of adhesive protector 180 towards the inside of infrared filter 130, that is, in the corner of adhesive protector 180 towards the inner space 162 of housing 160, inclined-plane 182 can be formed as follows, namely, spacing distance between adhesive protector 180 and infrared filter 130 increases towards the inside of infrared filter 130, and by the corner making inclined-plane 182 be formed in adhesive protector 180, first supplements spatial accommodation 192 can be formed between the inclined-plane 182 of adhesive protector 180 and infrared filter 130.
Correspondingly, adhesive protector 180 can be accommodated in first towards the adhesive portion 142 of the internal flow of infrared filter 130 to supplement in spatial accommodation 192.In addition, because the spacing distance between the inclined-plane 182 of adhesive protector 180 and infrared filter 130 is due to the existence on inclined-plane 182, the inside towards infrared filter 130 increases, so the adhesive portion 142 flowed on adhesive protector 180 is no longer because surface tension, capillarity etc. are towards the internal flow of infrared filter 130, and can be maintained in the first supplementary spatial accommodation 192.
In addition, in order to hold towards the adhesive portion 144 of the outside overflow of infrared filter 130, second can be formed supplement spatial accommodation 194 between the lateral surface of infrared filter 130 and the inner surface of housing 160, so that be connected with adhesive spatial accommodation 190, as shown in FIG. 5.
As shown in Figure 5, the width accommodating the inner space 162 of the housing 160 of infrared filter 130 can be configured to the size being greater than infrared filter 130, and correspondingly, clearance space (such as second supplements spatial accommodation 194) can be formed between the lateral surface of infrared filter 130 and the inner surface of housing 160.
Therefore, by the lateral surface place making the second supplementary spatial accommodation 194 be connected with adhesive spatial accommodation 190 be formed in infrared filter 130, even if cause the amount of adhesive 140 to be greater than the capacity of adhesive spatial accommodation 190 due to the excessive of such as adhesive 140, excessive adhesive 140 also can be supplemented spatial accommodation 194 by second to be held, and therefore likely effectively stops the generation of any bad outward appearance, bad image etc. that can be caused by the overflow of adhesive 140.
Although describing particular implementation of the present invention above, should be understood that, under the prerequisite not deviating from technical concept of the present invention and scope, those of ordinary skill in the art can make a large amount of variants and modifications to the present invention, and scope of the present invention should be defined by the following claims.Should be understood that, other execution modes a large amount of in addition to the implementation described above, are all included in claim of the present invention.
Claims (10)
1. a camera model, comprising:
Printed circuit board (PCB), has imageing sensor mounted thereto;
Infrared filter, is arranged on described imageing sensor;
Lens unit, is arranged on described infrared filter;
Housing, is coupled to described printed circuit board (PCB), and described housing has inner space and accomodating unit, and described inner space is for holding described lens unit, and described accomodating unit is for holding the described infrared filter be arranged on wherein;
Adhesive, between described accomodating unit and described infrared filter, and described adhesive is arranged for described accomodating unit and described infrared filter to be coupled to each other; And
Adhesive protector, is formed in the end of described accomodating unit, to stop described adhesive towards the internal flow of described infrared filter.
2. camera model according to claim 1, comprise first further and supplement spatial accommodation, described first supplements the end that spatial accommodation is formed in described adhesive protector, to hold towards the part of the described adhesive of the described internal flow of described infrared filter.
3. camera model according to claim 2, wherein, in the described end of described adhesive protector towards the described inside of described infrared filter, define an inclined-plane by this way, described mode namely, spacing distance between described adhesive protector and described infrared filter increases towards the described inside of described infrared filter, and
Wherein, the described first supplementary spatial accommodation is formed between described inclined-plane and described infrared filter.
4. camera model as claimed in any of claims 1 to 3, comprises the adhesive spatial accommodation be formed in described accomodating unit further, for holding the described adhesive that its flowing is stopped by described adhesive protector.
5. camera model according to claim 4, comprise second further and supplement spatial accommodation, described second supplements spatial accommodation is formed between the lateral surface of described infrared filter and the inner surface of described housing by this way, described mode namely, described second supplements spatial accommodation is connected with described adhesive spatial accommodation, to hold towards the part of the described adhesive of the outside overflow of described infrared filter.
6. camera model according to claim 4, wherein, described adhesive spatial accommodation has the loop configuration that the border along described infrared filter extends.
7. camera model according to claim 1, wherein, described adhesive protector is formed from the described end of described accomodating unit towards described infrared filter projection, and
Wherein, described infrared filter is received to contact with described adhesive protector.
8. camera model according to claim 1, wherein, described adhesive protector has the loop configuration that the border along described infrared filter extends.
9. camera model according to claim 1, wherein, described accomodating unit is formed on the inner surface of described housing, with the described inner space projection towards described housing.
10. camera model according to claim 8, wherein, described accomodating unit has the loop configuration that the inner surface along described housing extends.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130142336A KR101588936B1 (en) | 2013-11-21 | 2013-11-21 | Camera module |
| KR10-2013-0142336 | 2013-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104660889A true CN104660889A (en) | 2015-05-27 |
Family
ID=53251550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410052556.5A Pending CN104660889A (en) | 2013-11-21 | 2014-02-14 | Camera module |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101588936B1 (en) |
| CN (1) | CN104660889A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104749857A (en) * | 2013-12-27 | 2015-07-01 | 三星电机株式会社 | Camera module |
| JP2020106726A (en) * | 2018-12-28 | 2020-07-09 | マクセル株式会社 | Lens unit and camera module |
| CN112015023A (en) * | 2019-05-30 | 2020-12-01 | 昆山康龙电子科技有限公司 | Light filtering component used in lens module |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10270950B2 (en) * | 2016-12-21 | 2019-04-23 | Robert Bosch Gmbh | IR blocking lens holder |
| KR101993898B1 (en) * | 2017-05-29 | 2019-06-27 | (주)파트론 | Camera module and method of manufacturing it |
| KR102558354B1 (en) | 2018-08-08 | 2023-07-21 | 삼성전자주식회사 | A camera module with an ir filter and electronic device having the same |
| TWI694300B (en) * | 2019-03-05 | 2020-05-21 | 英屬開曼群島商康而富控股股份有限公司 | Filter component used in lens module |
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| JP2002374439A (en) * | 2001-06-15 | 2002-12-26 | Seiko Precision Inc | Camera for portable equipment |
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| KR100658150B1 (en) | 2005-04-08 | 2006-12-15 | 삼성전기주식회사 | Camera module and method of manufacturing the same |
| KR100896645B1 (en) * | 2007-10-29 | 2009-05-08 | 삼성전기주식회사 | Camera Module Package |
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2013
- 2013-11-21 KR KR1020130142336A patent/KR101588936B1/en not_active IP Right Cessation
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- 2014-02-14 CN CN201410052556.5A patent/CN104660889A/en active Pending
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| JP2002374439A (en) * | 2001-06-15 | 2002-12-26 | Seiko Precision Inc | Camera for portable equipment |
| JP2004334048A (en) * | 2003-05-09 | 2004-11-25 | Sony Corp | Optical device, lens barrel and imaging apparatus |
| CN1782763A (en) * | 2004-11-29 | 2006-06-07 | 阿尔卑斯电气株式会社 | Camera module |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104749857A (en) * | 2013-12-27 | 2015-07-01 | 三星电机株式会社 | Camera module |
| JP2020106726A (en) * | 2018-12-28 | 2020-07-09 | マクセル株式会社 | Lens unit and camera module |
| JP7213685B2 (en) | 2018-12-28 | 2023-01-27 | マクセル株式会社 | Lens unit and camera module |
| JP2023033459A (en) * | 2018-12-28 | 2023-03-10 | マクセル株式会社 | Lens unit and camera module |
| JP7448696B2 (en) | 2018-12-28 | 2024-03-12 | マクセル株式会社 | Lens unit and camera module |
| CN112015023A (en) * | 2019-05-30 | 2020-12-01 | 昆山康龙电子科技有限公司 | Light filtering component used in lens module |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150058950A (en) | 2015-05-29 |
| KR101588936B1 (en) | 2016-01-26 |
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