CN206497881U - A kind of chip-packaging structure - Google Patents
A kind of chip-packaging structure Download PDFInfo
- Publication number
- CN206497881U CN206497881U CN201720107310.2U CN201720107310U CN206497881U CN 206497881 U CN206497881 U CN 206497881U CN 201720107310 U CN201720107310 U CN 201720107310U CN 206497881 U CN206497881 U CN 206497881U
- Authority
- CN
- China
- Prior art keywords
- glue
- chip
- support
- circuit board
- spill
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
The utility model provides a kind of chip-packaging structure, including circuit board, patch chip on circuit boards and the electronic component of chip periphery, is disposed with support on circuit board, chip and electronic component are placed on below by support.The support is located on the circuit board by the supporting ledge of frame bottom, the bottom surface that the supporting walls are fitted with circuit board is provided with some spill suction glue breach acted on pressure release, curable glue is set between supporting walls bottom surface and circuit board, is fixed on support is gluing by curable glue on circuit board.Supporting walls periphery opens up spill and inhales glue breach, with can effectively prevent product inclination, product excessive glue and increase product mechanical property after pressure release passage, and adhesive curing, improves push-pull effort reliability testing yield, product yield is improved with this.
Description
Technical field
The utility model is related to encapsulation field, refers in particular to a kind of chip-packaging structure.
Background technology
Conventional art be applied to mobile phone camera, the encapsulation of tablet personal computer camera, such as COB encapsulation (chip On
Board), PLCC encapsulates (Plastic Leaded Chip Carrier), includes PCB circuits inside traditional encapsulating structure
Plate, the chip being attached in PCB, the electronic component being attached in PCB, but chip and electronic component be vulnerable to
The pollution of dust and particle, cause image recognize stain problem, and encapsulating structure be easy in process of production produce inclination and
Excessive glue, product mechanical test is poor, and performance is lower after mechanical test.
Utility model content
The technical problems to be solved in the utility model is：A kind of chip-packaging structure is provided, chip-packaging structure is solved
The problems such as inclination, insecure structure, excessive glue being produced in encapsulation process, and encapsulating products poor mechanical property, reliability testing
Yield is relatively low, the problems such as anti-push-and-pull ability declines after mechanical test.
In order to solve the above technical problems, the technical scheme that the utility model is taken：
A kind of chip-packaging structure is provided, includes the electronics member of circuit board, patch chip on circuit boards and chip periphery
Support is disposed with device, the circuit board, chip and electronic component are placed on below by the support, and the support passes through
The supporting ledge of frame bottom is located on the circuit board, and the bottom surface that the supporting walls are fitted with the circuit board is provided with some
Glue breach is inhaled with the spill that pressure release is acted on, curable glue is set between the supporting walls bottom surface and circuit board, by curable
Glue is fixed on support is gluing on circuit board, the spill inhale solidification glue in glue breach and the spill inhale glue breach mutually it
Between formed location fit structure.
Further, surrounding sets the spill to inhale glue breach on the supporting walls, forms the non-close of the supporting walls
Structure.
Further, the spill inhales glue breach through the support wall thickness, and formation can be described in insertion in encapsulating structure
The through-hole structure of outer air pressure.
Further, provided with the annular brace boss for installing optical filter in the support formation center drilling, center drilling；
The glue limit channels for accommodating and spacing curable glue are formed on the inside of the support rim；Leaned on the outside of the support rim
The nearly center drilling formation is higher by the convex annular table top on the glue limit channels surface；The optical filter is by curable glue
It is adhesively fixed on the convex annular table top；The glue limit channels are surrounded on the convex annular mesa diameter periphery.
Further, the groove that the support rim is used to house finger or clamping tool provided with least one；It is each
The groove part area is covered by the optical filter.
Further, the support rim provided with least one through its thickness with outer gas in encapsulating structure described in insertion
The escape hole of pressure, the naughty hole is set away from the glue limit channels.
Further, the escape hole is up big and down small through-hole structure.
Further, it is further provided with that glue and pressure release can be inhaled in the boss face that the support rim is fitted with the optical filter
Spill hold glue breach.
Further, the spill set in the boss face holds glue breach and runs through the boss face width, with the glue
Limit channels insertion.
Further, the support includes the supporting walls and the horizontal annular frame at the top of it positioned at its bottom
Body；Annular framework is in step-like, the inside horizontal-extending formation support rim in its madial wall bottom；The support rim is water
Flat loop configuration, above the chip.
The utility model achieves following technique effect：
The utility model chip-packaging structure opens up spill by improving surrounding on the structure of support, supporting walls and inhales glue
Breach, in the processing procedure of the encapsulating structure, inhales in the setting of glue breach, heating process because of spill and can be employed to ensure that chip package
Structure can be uniformly dispersed and equilibrium air pressure, will not because air pressure is uneven and caused by product tilt or excessive glue；Again because spill is inhaled
Glue breach can increase glue uptake, after being heating and curing, and the bonding after further amounts of glue curing is more firm, solidification glue contact surface
Product increase, with reference to more firm.In addition, spill, which is inhaled, forms raised after the systemic glue curing of glue breach, it is mutual with texture grooves
Between form location fit structure, further the ability of increase stretching resistance, therefore can effectively prevent that support occurs in encapsulation process
Tilt, submit the mechanical property of product, be conducive to increasing the reliability testing of push-pull effort, will not be made because glue-contact face is too small
It is abnormal into push-pull effort reliability testing, so as to effectively improve product yield.
Brief description of the drawings
Stereograms of the Fig. 1 for the utility model chip-packaging structure after crosscutting.
Fig. 2 is the decomposing schematic representation of the utility model chip-packaging structure.
Fig. 3 is the stereogram of the utility model chip-packaging structure support.
Fig. 4 is the stereogram of another angle of the utility model chip-packaging structure support.
Embodiment
Fig. 1-4 are referred to, the utility model chip-packaging structure includes PCB 1, the core being attached in PCB 1
Support 4 and be installed at the top end opening of support 4 and be located on chip 3 that piece 3 and electronic component 5, the upper cover of PCB 1 are set
The optical filter 2 of side.Chip 3 and electronic component 5 are covered on the lower section of support 4.
The side that support 4 itself and circuit board 1 coordinate is bottom, and side that is relative with bottom and coordinating with optical filter 2 is pushes up
Portion.The support 4 is centrally formed perforate 42, and provided with the support rim 45 for installing optical filter, optical filter 2, which is just arranged on, supports convex
In the boss face 451 at the top of platform 45.When support 4 is covered on circuit board 1, perforate 42 houses chip 3 and for installing core
The optical filter 2 of the top of piece 3.The bottom of support 4 is provided with supporting walls 40, by glue bonding on circuit board 1.
Specifically, support 4 includes the supporting walls 40 and the horizontal annular framework 41 positioned at top positioned at bottom.
Annular framework 41 is in step-like, and its center is perforate 42, and its bottom of madial wall 46 is inwardly horizontal-extending to form the branch
Support boss 45.It is preferred that the support rim 45 is annular, the top of chip 3 is horizontally located at, its center is the perforate 42.Branch
Support boss 45 extends to form the boss face 451 and surround between madial wall 46 straight up close to the edge of center drilling 42
Annular glue limit channels 452.The glue limit channels 452 are used to hold curable glue and limit the position of glue,
Excessive glue can be prevented, the curable glue held is used to encapsulate cohesive optical filter 2.Optical filter 2 fits in the convex of support rim 45
On table top 451.Boss face 451 is higher by the surface of the glue limit channels 452, positioned at the outside of support rim 45.
Further, depression forms some spills that can inhale glue and pressure release and held downwards in the boss face 451 of support rim 45
Glue breach 453, in favor of accommodating more glue in encapsulation journey, increases bond area and forms location fit structure, make after solidification
Optical filter 2 bonds more stable and firm.Spill holds the quantity of glue breach 453 and position is not limited, can insertion support rim face 451 width
Degree and with the insertion of annular stop passage 452.As one kind citing, hold glue breach 453 symmetrically equal along the circular periphery of boss face 451
It is even to set.
At least one through-thickness insertion is with the escape hole of insertion encapsulating structure inner and outer air pressure on the support rim 45
455, and up big and down small escape hole 455 is may be designed as, the escape hole 455 is away from glue limit channels 452, to prevent in laminating
Glue blocks the escape hole 455 during optical filter 2.Escape hole 455, which is used to be vented in encapsulation process, to be used.
At least one groove 454 can be also provided with the support rim 45, for accommodating clamping tool or finger, to be convenient to
Install or optical filter 2 is placed or taken out when reprocessing.
Escape hole 455 is optimally located at the outside of optical filter 2 and not covered by optical filter 2.For accommodating clamping tool or hand
The groove 454 of finger is located at around optical filter 2, and each groove 454 has area to be covered positioned at the lower section of optical filter 2, another part
Area is located at the outside of optical filter 2 without being covered.
Supporting walls 40 are located at the bottom of support 4, are arranged at the annular lower section of framework 41 and support annular framework 41.Support 4 passes through
The frame of supporting walls 40 utilizes supporting walls 40 by the peripheral electron member of chip 3 and chip 3 in PCB 1 in PCB 1
Device 5 is separated to two spaces.Supporting walls 40 surround annular to enclose chip 3 located at it around the center drilling 42 of support 4
Center.Some spills are opened up on the basal surface 41 that supporting walls 40 are fitted with PCB 1 and inhale glue breach 410.Basal surface 41 and electricity
Set solidification glue that support 4 is adhesively fixed on circuit board 1 between road plate 1.Increasing spill suction glue breach 410 can have
What is imitated prevents the push-pull effort reliability testing of product inclination, product excessive glue and enhancing product, improves product yield.It is preferred that branch
Surrounding opens up spill suction glue breach 410 on support wall 40, so as to form the supporting walls 40 of non-close.
In the processing procedure of encapsulating structure, inhaled because of spill in the setting of glue breach 410, heating process and can be employed to ensure that chip
Encapsulating structure can be uniformly dispersed air pressure.Because spill, which inhales glue breach 410, can increase glue uptake, more after being heating and curing
Its bonding is more firm after the glue curing of amount, contact area increase, with reference to more firm.In addition, the systemic glue of concave indentation 410
Positioning convex is formed after water cure and inhales the formation location fit structure of glue breach 410 with spill, further the ability of increase stretching resistance,
Therefore it can effectively prevent that riding or excessive glue occur in encapsulation process, be conducive to increasing the reliability testing of push-pull effort, improve
Product yield.The spill of surrounding inhales dispersible in the encapsulation process and Balance Air of glue breach 410 on the supporting walls 40 of the support 4
Pressure, will not because air pressure is uneven and caused by product tilt and because glue-contact face is too small and caused by push-pull effort reliability testing it is different
Often.
In encapsulating structure of the present utility model, PCB 1 is provided with support 4, and chip 3 and electronic component 5 are covered
Under support 4, support 4 is erected in PCB 1 by supporting walls 40, and using support 4 supporting walls 40 by PCB circuits
On plate 1 chip 3 and and its peripheral electron component 5 separate in two spaces, and the side of supporting walls 40 4 all opens up the suction of spill
Glue breach 410, encapsulating structure run-off the straight, encapsulation process can effectively be prevented by increasing the quantity of spill suction glue breach 410
Excessive glue and the push-pull effort reliability testing for strengthening product, improve product yield.
Preferred embodiment of the present utility model is the foregoing is only, protection domain of the present utility model is not limited thereto,
Any equivalent transformation based in technical solutions of the utility model is belonged within the utility model protection domain.
Claims (10)
1. a kind of chip-packaging structure, including circuit board, patch chip on circuit boards and the electronic component of chip periphery, institute
State and support is disposed with circuit board, chip and electronic component are placed on below by the support, the support passes through support bottom
The supporting ledge in portion is located on the circuit board, it is characterised in that：Set on the bottom surface that the supporting walls are fitted with the circuit board
There are some spill suction glue breach acted on pressure release, curable glue is set between the supporting walls bottom surface and circuit board, passed through
Curable glue is fixed on support is gluing on circuit board, and the solidification glue that the spill is inhaled in glue breach inhales glue breach with the spill
Location fit structure is formed each other.
2. chip-packaging structure as claimed in claim 1, its feature is, surrounding sets the spill to inhale on the supporting walls
Glue breach, forms the non-close structure of supporting walls.
3. chip-packaging structure as claimed in claim 2, its feature is, the spill inhales glue breach and runs through the supporting walls
Thickness, formed can encapsulating structure inner and outer air pressure described in insertion through-hole structure.
4. chip-packaging structure as claimed in claim 1, its feature is, the support formation center drilling, center drilling
The interior annular brace boss provided with installation optical filter；Formed on the inside of the support rim for accommodating and spacing curable glue
Glue limit channels；The ring on the glue limit channels surface is higher by the outside of the support rim close to center drilling formation
Shape boss face；The optical filter is adhesively fixed on the convex annular table top by curable glue；The glue limit channels ring
It is around in the convex annular mesa diameter periphery.
5. chip-packaging structure as claimed in claim 4, its feature is, the support rim is used for provided with least one
The groove of accommodating finger or clamping tool；Each groove part area is covered by the optical filter.
6. chip-packaging structure as claimed in claim 4, its feature is, the support rim runs through provided with least one
Its thickness is set with the escape hole of encapsulating structure inner and outer air pressure described in insertion, the escape hole away from the glue limit channels.
7. chip-packaging structure as claimed in claim 6, its feature is, the escape hole is up big and down small through hole knot
Structure.
8. chip-packaging structure as claimed in claim 4, its feature is, the support rim is fitted with the optical filter
It is further provided with that glue can be inhaled in boss face and the spill of pressure release holds glue breach.
9. chip-packaging structure as claimed in claim 8, its feature is, the spill set in the boss face holds glue breach
Through the boss face width, with the glue limit channels insertion.
10. the chip-packaging structure as described in any one of claim 1 ~ 9, its feature is, the support includes being located at its bottom
The supporting walls in portion and the horizontal annular framework positioned at top；Annular framework is in step-like, its inside water in madial wall bottom
Flat extension forms the support rim；The support rim is horizontal annular structure, above the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720107310.2U CN206497881U (en) | 2017-01-25 | 2017-01-25 | A kind of chip-packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720107310.2U CN206497881U (en) | 2017-01-25 | 2017-01-25 | A kind of chip-packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206497881U true CN206497881U (en) | 2017-09-15 |
Family
ID=59804300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720107310.2U Active CN206497881U (en) | 2017-01-25 | 2017-01-25 | A kind of chip-packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206497881U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020042175A1 (en) * | 2018-08-31 | 2020-03-05 | 深圳市汇顶科技股份有限公司 | Chuck device |
| CN110868840A (en) * | 2019-11-13 | 2020-03-06 | Oppo（重庆）智能科技有限公司 | Electronic equipment and manufacturing method thereof |
| CN110911542A (en) * | 2018-09-14 | 2020-03-24 | 颀邦科技股份有限公司 | Chip package and chip thereof |
| TWI692671B (en) * | 2018-10-31 | 2020-05-01 | 大陸商三贏科技（深圳）有限公司 | Bracket and camera module |
| CN113766748A (en) * | 2021-09-14 | 2021-12-07 | 苏州新晶腾光电科技有限公司 | Infrared touch module processing technology |
-
2017
- 2017-01-25 CN CN201720107310.2U patent/CN206497881U/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020042175A1 (en) * | 2018-08-31 | 2020-03-05 | 深圳市汇顶科技股份有限公司 | Chuck device |
| CN110911542A (en) * | 2018-09-14 | 2020-03-24 | 颀邦科技股份有限公司 | Chip package and chip thereof |
| TWI692671B (en) * | 2018-10-31 | 2020-05-01 | 大陸商三贏科技（深圳）有限公司 | Bracket and camera module |
| CN111123457A (en) * | 2018-10-31 | 2020-05-08 | 三赢科技（深圳）有限公司 | Base and camera module |
| US10681255B2 (en) | 2018-10-31 | 2020-06-09 | Triple Win Technology (Shenzhen) Co. Ltd. | Holder for camera module and camera module with holder |
| CN111123457B (en) * | 2018-10-31 | 2022-06-24 | 三赢科技（深圳）有限公司 | Base and camera module |
| CN110868840A (en) * | 2019-11-13 | 2020-03-06 | Oppo（重庆）智能科技有限公司 | Electronic equipment and manufacturing method thereof |
| CN110868840B (en) * | 2019-11-13 | 2021-05-04 | Oppo（重庆）智能科技有限公司 | Electronic equipment and manufacturing method thereof |
| CN113766748A (en) * | 2021-09-14 | 2021-12-07 | 苏州新晶腾光电科技有限公司 | Infrared touch module processing technology |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206497881U (en) | A kind of chip-packaging structure | |
| CN101273673B (en) | Board structure and electronic device | |
| CN205621020U (en) | A fingerprint module for display screen | |
| TWI285423B (en) | System-in-package structure | |
| JP2010147153A5 (en) | ||
| TW201118964A (en) | Integrated circuit packaging system with encapsulated via and method of manufacture thereof | |
| TW200731503A (en) | Stacked semiconductor structure and fabrication method thereof | |
| CN106446853B (en) | A kind of fingerprint mould group assembling structure and mobile terminal | |
| EP1840941A3 (en) | Semiconductor device and manufacturing method thereof | |
| CN203238029U (en) | MEMS element provided with structure reducing packaging stress | |
| US9736560B2 (en) | Liquid impermeable sealed speaker design | |
| TW201622075A (en) | Package structure and method for manufacturing the same | |
| CN205620973U (en) | Touch -sensitive screen with lock screen function | |
| CN206022356U (en) | Integrated circuit package body and the base plate for packaging for being used | |
| CN106067457A (en) | Integrated circuit package body and manufacture method thereof and the base plate for packaging used | |
| CN206948450U (en) | Plastic packaging adds stent-type to minimize cam device | |
| CN206236120U (en) | A kind of fingerprint recognition module | |
| WO2021135880A1 (en) | Special-shaped tws sip module and manufacturing method therefor | |
| CN105848416B (en) | A kind of substrate and mobile terminal | |
| CN105428380B (en) | A kind of manufacture craft of sensor case chip | |
| CN203690294U (en) | Electronic component assembly | |
| CN105101716B (en) | Flashing member, waterproof construction and preparation method thereof | |
| CN205620974U (en) | Touch screen with recognition function | |
| JP2010097991A5 (en) | ||
| CN205385603U (en) | MEMS microphone |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210121 Address after: 518000 South 101, 1st floor, building B, Jinwanli company building, No.11 sightseeing Road, Guangming Street, Guangming New District, Shenzhen City, Guangdong Province Patentee after: Shenzhen crystal core semiconductor seal testing Co.,Ltd. Address before: 518000 south side of the first floor, building B, Jinwanli Industrial Park, No. 11, sightseeing Road, Guangming New District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN SENBOND SEMICONDUCTOR Co.,Ltd. |