WO2020043127A1 - Photosensitive assembly, camera module, and mobile terminal - Google Patents

Abstract

A photosensitive assembly (10a) comprises: a circuit board (100), comprising an support surface (110) having a chip installation portion (112) and a border frame portion (114); a photosensitive chip (200) disposed at the chip installation portion (112), wherein a photosensitive surface (210) comprises a photosensitive portion (212); a support frame (500), comprising a support plate (510) located at a side of the photosensitive chip (200), an edge of the support plate (510) being spaced apart from the border frame portion so as to form a first gap (10c) in a circumferential direction; and a closure member (600) used to close the first gap (10c). The photosensitive assembly (10a) further comprises an anti-overflow member (10e). When a flowable and viscous material flows to space between the support plate (510) and the circuit board (100) via the first gap (10c) to be cured and form the closure member (600), the anti-overflow member (10e) is used to prevent the material forming the closure member (600) from flowing to the photosensitive portion (212) of the photosensitive chip (200).

Description

Photosensitive component, camera module and mobile terminal Technical field

The present invention relates to the field of camera technology, and in particular, to a photosensitive component, a camera module, and a mobile terminal.

Background technique

In recent years, electronic devices have increasingly shown a trend toward miniaturization. This has imposed stricter requirements on the size of the camera module, which is one of the standard configurations of electronic devices. At the same time, the pixel and quality of the camera module It's getting higher and higher.

The traditional camera module usually includes a circuit board, a photosensitive chip, electronic components, a bracket, and a lens. The photosensitive chip and the electronic components are located on the circuit board. The electronic components are located outside the photosensitive chip. The bracket is located on the circuit board. It is a hollow structure with two ends open to accommodate the photosensitive chip and electronic components in the bracket, and the lens is arranged on one end of the bracket away from the circuit board. When assembling the above camera module, the side wall of the bracket is connected to the circuit board by the glue marked on the circuit board. The side wall of the bracket needs to maintain a safe distance from the electronic components, resulting in a larger size of the camera module.

In order to reduce the size of the camera module, a bracket without a side wall or a bracket without a part of the side wall can be used to omit the side wall corresponding to the electronic component, so that the safety of the bracket and the electronic component can be omitted during assembly. Pitch to obtain a smaller camera module. A bracket without a side wall or a bracket with a missing side wall will form a gap in the circumferential direction. Subsequently, a flowable and viscous material can be filled in from the gap. After the material is cured, a closure can be formed to close the gap. In the process of forming the closure member, the material forming the closure member may flow to the photosensitive portion of the photosensitive chip, affect the photosensitive performance of the photosensitive chip, and cause a reduction in imaging quality.

Summary of the Invention

According to various embodiments of the present application, there is provided a photosensitive assembly capable of blocking a material forming a closure member from flowing to a photosensitive portion of a photosensitive chip.

A photosensitive component includes:

The circuit board includes a bearing surface, and the bearing surface includes a chip mounting portion and a frame portion located on an outer periphery of the chip mounting portion;

A photosensitive chip is provided on the chip mounting portion, and a surface of the photosensitive chip away from the circuit board is a photosensitive surface, and the photosensitive surface includes a photosensitive portion;

The bracket includes a support plate located on a side of the photosensitive chip away from the bearing surface, and an edge of the support plate is spaced from the frame portion to form a first gap in a circumferential direction;

A closure member provided at the first gap to close the first gap;

Wherein, the photosensitive component further includes an anti-overflow adhesive member provided between the circuit board and the support plate, and when the closure member flows from the flowable and adhesive material into the support through the first gap When post-curing is formed between the board and the circuit board, the anti-overflow adhesive member is used to block the material forming the closure member from flowing to the photosensitive portion of the photosensitive chip.

A camera module includes:

The above-mentioned photosensitive element; and

The lens assembly is disposed on a surface of the support board away from the circuit board.

A mobile terminal includes the camera module described above.

Details of one or more embodiments of the invention are set forth in the accompanying drawings and description below. Other features, objects, and advantages of the invention will be apparent from the description, the drawings, and the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to better describe and illustrate embodiments and / or examples of those inventions disclosed herein, reference may be made to one or more drawings. The additional details or examples used to describe the drawings should not be considered as limiting the scope of any of the disclosed inventions, the presently described embodiments and / or examples, and the best mode of these inventions as currently understood.

1 is a schematic cross-sectional view of a camera module according to an embodiment of the present invention;

2 is an exploded schematic diagram of a circuit board and a bracket provided by an embodiment of the present invention;

3 is a schematic plan view of the circuit board in FIG. 2;

4 is a schematic perspective view of the bracket in FIG. 2;

5 is a schematic plan view of a first surface of the bracket in FIG. 4;

6 is a schematic plan view of a second surface of the bracket in FIG. 4;

7 is a schematic diagram of comparison between the photosensitive component shown in FIG. 1 and a conventional photosensitive component;

8 is a schematic cross-sectional view of the camera module shown in FIG. 1 after removing a closure member;

9 is a schematic plan view of a bracket with a missing frame part according to an embodiment of the present invention;

10 is a schematic plan view of a bracket with a missing frame part according to another embodiment of the present invention;

11 is a schematic plan view of a bracket with all frames missing according to another embodiment of the present invention;

12 is a schematic cross-sectional view of a camera module according to another embodiment of the present invention;

13 is a schematic cross-sectional view of a camera module according to another embodiment of the present invention;

FIG. 14 is a schematic perspective view of a camera module according to another embodiment of the present invention after removing a sealing member; FIG.

15 is a schematic plan view of the camera module shown in FIG. 14;

16 is a sectional view taken along the line A-A in FIG. 14;

Fig. 17 is a sectional view taken along line B-B in Fig. 14;

18 is an exploded perspective view of the circuit board and the bracket shown in FIG. 14;

19 is a schematic perspective view of the bracket in FIG. 18;

FIG. 20 is a top-mounted zoom camera module according to an embodiment of the present invention; FIG.

21 is a bottom-mounted zoom camera module provided by an embodiment of the present invention;

22 is a schematic cross-sectional view of an upper-type fixed-focus camera module according to an embodiment of the present invention;

23 is a schematic cross-sectional view of a photosensitive component according to another embodiment of the present invention;

FIG. 24 is a partially enlarged view at C in FIG. 23.

detailed description

In order to make the foregoing objects, features, and advantages of the present invention more comprehensible, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. Numerous specific details are set forth in the following description in order to fully understand the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without departing from the content of the present invention, so the present invention is not limited by the specific implementations disclosed below.

It should be noted that when an element is referred to as being “fixed to” another element, it may be directly on the other element or there may be a centered element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the present invention is only for the purpose of describing specific embodiments, and is not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

As shown in FIG. 1, a camera module 10 according to an embodiment of the present invention includes a photosensitive component 10 a and a lens component 10 b provided on the photosensitive component 10 a. The lens unit 10b is provided on a light-receiving path of the light-receiving unit 10a. The light passes through the lens assembly 10b and reaches the photosensitive assembly 10a, thereby achieving imaging.

In this embodiment, the camera module 10 is applied to a mobile terminal. Specifically, in this embodiment, the mobile terminal includes a terminal body (not shown) and a camera module 10 provided on the terminal body. More specifically, in this embodiment, the mobile terminal is a portable mobile terminal such as a smart phone or a tablet computer.

As shown in FIG. 1, the photosensitive assembly 10 a includes a circuit board 100, a photosensitive chip 200, an electronic component 300, a conductive wire 400, a bracket 500, a closure member 600, and a filter 700.

The circuit board 100 is used to carry components such as the photosensitive chip 200. As shown in FIG. 2 and FIG. 3, the circuit board 100 includes a bearing surface 110. The bearing surface 110 includes a chip mounting portion 112 and a frame portion 114 on an outer periphery of the chip mounting portion 112. In some embodiments, the frame portion 114 is a closed loop structure. In this embodiment, the frame portion 114 is square. The frame portion 114 includes a component mounting area 1142 and a blank area 1144. The component mounting area 1142 is used for setting the first pad 120 and mounting electronic components 300 such as capacitors and resistors.

The photosensitive chip 200 is provided in the chip mounting portion 112. In some embodiments, an adhesive layer is provided between the photosensitive chip 200 and the chip mounting portion 112. The photosensitive chip 200 includes a photosensitive surface 210. The photosensitive surface 210 includes a photosensitive portion 212 and a non-photosensitive portion 214 surrounding the photosensitive portion 212. The non-photosensitive portion 214 includes a connection region 2142 and a non-connection region 2144 that are independent of each other. The connection area 2142 is used for electrical connection with the circuit board 100. In some embodiments, the connection region 2142 is provided with a second pad 220, and the second pad 220 and the first pad 120 are connected by a conductive line 400. In some embodiments, the conductive line 400 is a gold line.

The bracket 500 includes a support plate 510 and a first protrusion 520. The support plate 510 includes a first surface 512 and a second surface 514 opposite to each other, that is, the support plate 510 is a flat plate structure. The second surface 514 is used to connect the lens assembly 10b. The support plate 510 is provided with a light through hole 530 penetrating the first surface 512 and the second surface 514. The first protrusion 520 is disposed on the first surface 512. The number of the first protrusions 520 is multiple, and the plurality of first protrusions 520 are arranged at intervals to connect to the plurality of blank areas 1144 respectively.

When manufacturing the above-mentioned photosensitive element 10a, a circuit board 100 having a plurality of blank areas 1144 is provided first; then a bracket 500 having a plurality of first protrusions 520 is provided, and the number of the first protrusions 520 is less than or equal to the number of the blank areas 1144. And each first protrusion 520 corresponds to a blank area 1144; dispensing in the blank area 1144, and placing the first protrusion 520 in the blank area 1144 after dispensing; between the blank area 1144 and the first protrusion 520 After the glue is cured to form an adhesive layer, pre-fixing between the bracket 500 and the circuit board 100 is achieved.

As shown in FIG. 7, the conventional bracket 500 a is a hollow structure with two ends open. The side wall 502 of the bracket 500 a is connected to the circuit board 100 a by an adhesive glue drawn on the circuit board 100 a. The side wall 502 of the bracket 500 a is provided for the lens assembly. Support. The side wall 502 of the conventional bracket 500a is a complete closed-loop structure, which requires a large space of the circuit board 100a. When assembling the bracket 500a, it is necessary to reserve a safe distance between the bracket 500a and the electronic components 300a, which is not conducive to reducing the camera. The dimensions of the XY plane of the module.

In the camera module 10 described above, as shown in FIGS. 7 and 8, the first protrusion 520 provides a supporting force for the lens assembly 10 b, and the bracket 500 is connected to the circuit board 100 through a plurality of discrete first protrusions 520, so that At least a part of the edge of the support plate 510 lacks a sidewall between the edge of the support plate 510 and the circuit board 100, so that a first notch 10 c is formed in the circumferential direction. That is, the bracket 500 in the above camera module 10 omits at least part of the side wall compared to the conventional bracket 500a, which is beneficial to reducing the size of the XY plane of the camera module 10. Moreover, the multi-point contact is easier to control the assembly flatness of the bracket 500 than the surface contact.

In some embodiments, the formed first notch 10c can avoid the electronic component 300, so that when assembling the bracket 500 described above, the safety distance between the bracket 500 and the electronic component 300 may not be reserved, and the size of the XY plane of the bracket 500 may be reduced. Therefore, a smaller-sized camera module 10 can be obtained.

As shown in FIG. 8, when the above-mentioned photosensitive component 10 a is manufactured, after the bracket 500 and the circuit board 100 are pre-fixed, there is a first gap 10 c between the circuit board 100 and the support plate 510. The first gap 10 c may be filled with a filler to The first notch 10 c is formed to form a sealing member 600 (as shown in FIG. 1), so as to close the photosensitive chip 200 in the circumferential direction of the photosensitive chip 200, that is, the sealing member 600 is used to replace the missing frame (side wall) of the bracket 500. The closure member 600 can prevent the photosensitive chip 200 from contacting the outside air, and can better protect the photosensitive chip 200. The closure member 600 can increase the connection strength between the support plate 510 and the circuit board 100, so that the structure of the entire photosensitive module 10a more stable. In some other embodiments, the closure member 600 may be omitted. For example, when the camera module 10 including the photosensitive component 10a is applied to a mobile terminal, the housing of the mobile terminal may be used to isolate the photosensitive chip 200 from the outside atmosphere, or The limiting structure in the mobile terminal improves the stability of the entire photosensitive assembly 10a.

In some embodiments, the filler is a flowable and viscous material, and the closure member 600 may be formed by the flowable and viscous material flowing between the support plate 510 and the circuit board 100 through the first gap 10c, and then formed by a curing process. In this way, the closing member 600 can not only close the first gap 10c, but also increase the firmness of the connection between the support plate 510 and the circuit board 100. Specifically, in some embodiments, the filler is an adhesive. In some other embodiments, a semi-cured and viscous adhesive strip can also be made first, and then the adhesive strip is pressed into the first gap 10c by an interference fit, and the adhesive strip is finally cured to obtain a closure. 600.

In some other embodiments, when the first protrusion 520 is omitted, a supporting tool such as a manipulator may be used to suspend the support plate 510 above the circuit board 100, and then dispense the adhesive between the support plate 510 and the circuit board 100. After the glue is cured, a fixing point is formed. The fixing point has a similar function to the first protrusion 520, and mainly implements pre-fixing between the support plate 510 and the circuit board 100. Finally, a filler is used to fill the first gap 10c between the fixed points.

In some embodiments, please refer to FIG. 8, the circuit board 100 and the photosensitive chip 200 are arranged along the Z direction (that is, the height direction). The distance between the end surface of the electronic component 300 away from the circuit board 100 and the bearing surface 110 is H1, the opening width of the first notch 10c in the Z-axis direction is H2, and H2 is larger than H1. Therefore, when the first notch 10c is disposed adjacent to the electronic component 300, the first notch 10c can well avoid the electronic component 300, and further During assembly, the safety distance between the bracket 500 and the electronic component 300 may not be reserved, and the size of the XY plane of the photosensitive element 10a may be reduced, thereby obtaining a smaller-sized photosensitive element 10a. Moreover, H2 is larger than H1, which is very convenient for the filler to flow inwardly between the support plate 510 and the circuit board 100.

In some embodiments, the supporting plate 510 is a flat plate structure, and the thickness is equal everywhere, that is, the distance between the first surface 512 and the second surface 514 is equal. In other embodiments, the support plate 510 may also be a non-flat plate structure with a small middle thickness and a large edge thickness, which can ensure that H2 is greater than H1.

In general, the height H1 of the electronic component 300 is larger than the height of the photosensitive chip 200 and larger than the height of the conductive wire 400. In some embodiments, the number of electronic components 300 is usually multiple, and the specifications of each electronic component 300 are different. The height of some electronic components 300 is larger, and the height of some electronic components 300 is smaller. In some embodiments, controlling the opening width of the first notch 10c in the Z-axis direction to be H2 greater than the height H1 of the electronic component 300 having the highest height, that is, the support plate 510 can be suspended from the photosensitive chip 200, the conductive wire 400, and all Electronic components 300 above. In some embodiments, H2 is 200-500 microns.

The bracket 500 may be a bracket with all frames missing, that is, a bracket without a frame (a bracket without a side wall), and the bracket 500 may also be a bracket with a missing frame portion (a bracket with a missing side wall). FIG. 4 shows that the bracket 500 is a bracket with a missing frame portion. In the following, several specific embodiments will be described in detail about a bracket with all frames missing and a bracket with portions missing.

In some embodiments, as shown in FIGS. 9 and 10, the edge of the end surface of the at least one first protrusion 520 coincides with the edge of the first surface 512 of the support plate 510, that is, there is an outer side surface of the support plate 510. The first protrusions 510 flush on the outer side, that is, at least one first protrusion 520 is located at the edge of the support plate 510. The first protrusion 520 can be regarded as a part of the frame (part of the side wall) of the bracket 500. At this time, the bracket 500 is a bracket with a missing frame portion.

In some embodiments, as shown in FIG. 11, the edges of the end surfaces of all the first protrusions 520 are spaced from the edges of the first surface 512 of the support plate 510, that is, all the first protrusions 520 are located on the support. Inside the outer side of the plate 510, that is, all the first protrusions 520 are located in the middle of the support plate 510. At this time, the bracket 500 is a bracket with all the frames missing.

As shown in FIG. 9, FIG. 9 illustrates a bracket with a missing frame portion provided by an embodiment of the present invention. The bracket 500 includes four first protrusions 520 of the same size and shape. The four first protrusions 520 are respectively located at the four corners of the support plate 510 and are located at the edges of the support plate 510. The 520 can be regarded as a part of the frame of the bracket 500. After the bracket 500 and the circuit board 100 are pre-fixed, there are four first gaps 10c between the circuit board 100 and the support plate 510. In the process of forming the closure 600, the four sides of the bracket 500 can be glued to align the four first A gap 10c is closed.

After the glue is applied, the filler will flow inward (toward the photosensitive chip 200) to cover the electronic components 300, the first pad 120, and the end of the conductive wire 400 connected to the first pad 120, and the filler will also flow outward. . As shown in FIG. 12, the flexible circuit board 20 corresponds to a first gap 10 c. After the filler flows outward onto the flexible circuit board 20, it can be used as the reinforcing glue 22 of the flexible circuit board 20 to increase the strength of the flexible circuit board 20. That is, a part of the same closure 600 is located in the first gap 10 c, and another part is located at a connection between the circuit board 100 and the flexible circuit board 20. The other end of the flexible circuit board 20 is provided with a connector 30.

It should be noted that the condition of the filler coating element can be determined by controlling the amount of filler. Taking the viewing angle shown in FIG. 2 as an example, the photosensitive chip 200 has a square shape, and multiple electronic components 300 are arranged in two rows. The two rows of electronic components 300 are distributed on the opposite left and right sides of the photosensitive chip 200, and a plurality of conductive wires 400 are arranged. In three rows, three rows of conductive wires 400 are distributed on the upper side, the lower side, and the right side of the photosensitive chip 200. The right row of conductive wires 400 and the right row of electronic components 300 are spaced in parallel. When scoring (filler), if the amount of glue is particularly small, the filler may not wrap the electronic component 300, the first pad 120, and the end of the conductive wire 400 connected to the first pad 120 in the radial direction; It is relatively small. In the radial direction, the filler can only cover a part of the left electronic component 300, and cannot completely cover the left electronic component 300. The filler can only cover the upper and lower first pads 120 and conductive wires. One end of the 400 connected to the first pad 120 cannot completely cover the conductive wire 400 and the second pad 220, and the filler can only cover a part or all of the electronic component 300 on the right side, but not the conductive part on the right side. Line 400.

The larger the amount of filler, the easier it is to close the first gap 10c, and the stronger the connection between the support plate 510 and the circuit board 100, but the larger the amount of filler, the more the overflow of the filler to the photosensitive chip 200 will be correspondingly increased. The probability of the portion 212 affects the light-receiving performance of the light-sensitive chip 200, resulting in a decrease in image quality. In some embodiments, in combination with the above factors, by controlling the amount of filler, in a radial direction, the sealing member 600 covers at least part of the electronic components 300, so that the sealing member 600 covers at least the first pad 120 and the conductive wire 400 and One end to which the first pad 120 is connected.

As shown in FIG. 10, FIG. 10 illustrates a bracket with a missing frame part according to another embodiment of the present invention. The bracket 500 includes four first protrusions 520, and the four first protrusions 520 can be regarded as part of the frame of the bracket 500. In this embodiment, the first protrusion 520 at the top is elongated, that is, the first protrusion 520 at the top extends from one side of the support plate 510 to the opposite side, that is, one side of the bracket 500 has The shape and size of the complete side wall, the other three first protrusions 520 are the same, and they are square. That is, the bracket 500 has one continuous frame and three discrete frame portions. After the bracket 500 and the circuit board 100 are pre-fixed, there are three first gaps 10c between the circuit board 100 and the support plate 510. In the process of forming the closure member 600, the three sides of the bracket 500 can be glued to remove the three first A gap 10c is closed. As shown in FIG. 13, the first protrusion 520 in the shape of a strip is located on a side of the bracket 500 near the flexible circuit board 20 and is a bearing position of the bracket 500. In this way, in the predetermined step, the glue can be dispensed only in the blank area 1144 corresponding to the first protrusion 520 in a strip shape, and not in other blank areas 1144, thereby making the pre-curing step easier.

In the embodiment shown in FIG. 13, the flexible circuit board 20 is directly opposite the first protrusion 520 having a long shape, so that it is not necessary to draw glue on the side of the bracket 500 corresponding to the flexible circuit board 20 to fill the gap, which can be avoided. It appears that the electrical connection of the flexible circuit board 20 is affected by the glue covering the interface on the circuit board 100 for electrical connection with the flexible circuit board 20. In addition, the glue may be filled by filling the gap first, and then the flexible circuit board 20 is assembled on the circuit board 100. Alternatively, the glue may be filled after the flexible circuit board 20 is assembled on the circuit board 100.

As shown in FIG. 11, FIG. 11 illustrates a bracket with all the frames missing according to an embodiment of the present invention. The bracket 500 includes four first protrusions 520. The four first protrusions 520 are all located in the middle of the support plate 510, and none of them can form a frame of the bracket 500. After the bracket 500 and the circuit board 100 are pre-fixed, there are four first gaps 10c between the circuit board 100 and the support plate 510. In the process of forming the closure 600, the four sides of the bracket 500 can be glued to align the four first A gap 10c is closed. The frames of the bracket 500 are all formed by the closure member 600.

It should be noted that although the first protrusions 520 illustrated in FIGS. 9 to 11 are all square, the shape of the first protrusions 520 is not limited to a square, and may be any regular shape (for example, cylindrical, circular truncated, prism) Or an irregular shape, the support plate 510 can be supported.

In some embodiments, the closure 600 is connected to the first protrusion 520. Wherein, when the bracket 500 is a bracket with a missing frame part, the closure member 600 needs to be connected to the first protrusion 520 to form a closed structure to close the photosensitive chip 200. In some embodiments, when the bracket 500 is a bracket with all frames missing, the closure member 600 may not be connected to the first protrusion 520, and only the first gap 10 c between the circuit board 100 and the support plate 510 may be closed. Of course, in some embodiments, when the bracket 500 is a bracket with all frames missing, the closure member 600 may also be connected to the first protrusion 520.

In some embodiments, as shown in FIG. 1, the closure member 600 covers the electronic component 300, the first pad 120, and an end of the conductive wire 400 connected to the first pad 120. In this way, the sealing member 600 can well protect the electronic component 300, the first pad 120, and the end of the conductive wire 400 connected to the first pad 120.

As shown in FIG. 1, in some embodiments, the first protrusion 520 is located between the electronic component 300 and the photosensitive chip 200. In some embodiments, the electronic component 300 may also be located between the first protrusion 520 and the photosensitive chip 200.

In some embodiments, as shown in FIGS. 12 and 13, the bracket 500 further includes a second protrusion 540, which is disposed on the first surface 512 and corresponds to the frame portion 114 of the bearing surface 110. The height of the second protrusion 540 is smaller than the height of the first protrusion 520. A closure member 600 is provided between the second protrusion 540 and the frame portion 114. A second protrusion 540 is provided, and the height of the second protrusion 540 is smaller than the height of the first protrusion 520, so that when the closure member 600 is formed, the amount of the closure member 600 can be reduced to reduce the filling height of the closure member 600. The number of the second protrusions 540 may be one or more. When the number of the second protrusions 540 is multiple, the plurality of second protrusions 540 are arranged at intervals.

When the outer surface of the second protrusion 540 is flush with the outer surface of the support plate 510, the second protrusion 540 can be used as a frame of the bracket 500, and when the outer surface of the second protrusion 540 is located inside the outer surface of the support plate 510 The second protrusion 540 is not used as a frame of the bracket 500. As shown in FIGS. 12 and 13, the outer surface of the second protrusion 540 is flush with the outer surface of the support plate 510, and the second protrusion 540 serves as a frame of the bracket 500.

The second protrusion 540 may be connected to the first protrusion 520 or may be disposed at a distance from the second protrusion 540. As shown in FIG. 14, the second protrusion 540 is connected to the first protrusion 520.

In the embodiment shown in FIGS. 14 to 19, the first protrusion 520 and the second protrusion 540 both serve as a frame of the bracket 500, and the second protrusion 540 is connected to the first protrusion 520.

When the outer surface of the second protrusion 540 is flush with the outer surface of the support plate 510, and the height of the second protrusion 540 is smaller than the height of the first protrusion 520, after the bracket 500 and the circuit board 100 are pre-cured, the first The two protrusions 540 are spaced from the circuit board 100 and form a second notch 10f in the circumferential direction. As shown in FIGS. 17 to 19, the second notch 10 f is far away from the electronic component 300. When there are multiple first cutouts 10c, there are electronic components 300 near some of the first cutouts 10c, and there are no electronic components 300 near some of the first cutouts 10c. The second protrusion 540 can be provided to make the height larger. The first notch 10c becomes a second notch 10f having a smaller height, so that the amount of the closure member 600 can be reduced, and the filling height of the closure member 600 can be reduced.

In some embodiments, as shown in FIGS. 17-19, the second notch 10 f is disposed adjacent to the conductive line 400 to avoid the conductive line 400. Since the height of the conductive wire 400 is generally smaller than the height of the electronic component 300, the second notch 10f having a smaller height can avoid the conductive wire 400, so that the safe distance between the bracket 500 and the conductive wire 400 can be omitted during assembly, and A small-sized photosensitive member 10a can be obtained.

The opening width H3 of the second notch 10f in the first direction 12 is too small, and the resistance is large, which is not conducive to the filler flowing inwardly between the circuit board 100 and the support plate 510. In some embodiments, the opening width H3 of the second notch 10f in the first direction 12 is greater than 100 micrometers, so that a flowable and viscous filler flows through the second notch 10f to close the second notch 10f. Specifically, H3 is 100-200 microns.

In some embodiments, as shown in FIG. 18 and FIG. 19, the photosensitive chip 200 has a square shape, two rows of electronic components 300 correspond to opposite sides of the photosensitive chip 200, and each row of the electronic components 300 includes a plurality of spaced arrangements. In the electronic component 300, two rows of conductive wires 400 respectively correspond to the other two sides of the photosensitive chip 200, and each row of conductive wires 400 includes a plurality of spaced-apart conductive wires 400. There are two first notches 10c, two first notches 10c corresponding to two rows of electronic component 300, two second notches 10f, and two second notches 10f corresponding to two rows of conductive wires 400, respectively.

In some embodiments, as shown in FIGS. 15-19, the bracket 500 further includes a stopper 550. The stopper 550 is disposed on the first surface 512 and is adjacent to the edge of the light-passing hole 530 and the frame portion of the bearing surface 110. 114 correspondence. In this way, when the closure member 600 is formed, the filler can be prevented from flowing into the chip mounting portion 112 and the filler can be prevented from contaminating the photosensitive chip 200.

In some embodiments, the stopper 550 corresponds to the boundary between the frame portion 114 and the chip mounting portion 112.

In some embodiments, the height of the stopper 550 is the same as the height of the first protrusion 520. Wherein, when the height of the stopper 550 is the same as the height of the first protrusion 520, the stopper 550 has the function of the first protrusion 520, that is, the bracket 500 and the circuit board 100 are pre-fixed, and the filler prevents the photosensitive chip from being contaminated. 200 features. That is, when the first protrusion 520 is located between the electronic component 300 and the photosensitive chip 200, the first protrusion 520 can be used for both pre-fixing the bracket 500 and the circuit board 100, and preventing the filler from contaminating the photosensitive chip 200.

In some embodiments, the stopper 550 is connected to the first protrusion 520, and the stopper 550 and the second protrusion 540 are independent from each other, that is, the stopper 550 is not connected to the second protrusion 540.

In the embodiments shown in FIGS. 18 and 19, the number of the first protrusions 520 is three, and the three first protrusions 520 are distributed at three corners of the support plate 510. The number of the second protrusions 540 is two, and the two second protrusions 540 are opposite to each other. One of the second protrusions 540 is connected to two adjacent first protrusions 520, and the other second protrusion 540 is connected to one of the first protrusions. Protrusion 520. The number of the stoppers 550 is two. The two stoppers 550 are oppositely disposed and located between the two second protrusions 540. The height of the stopper 550 is the same as the height of the first protrusion 520, and the stopper 550 is connected to the first protrusion 520 and has an L shape. The entire L-shape formed by the stopper 550 and the first protrusion 520 can be regarded as It is an L-shaped first protrusion 520. The electronic component 300 is located between the stopper 550 and the edge of the support plate 510, that is, the electronic component 300 is disposed adjacent to the first gap 10c. The conductive line 400 is located between the second protrusion 540 and the light-passing hole 530, that is, the conductive line 400 is disposed adjacent to the second notch 10f.

In some embodiments, as shown in FIGS. 1 and 18, the second surface 514 is recessed to form a filter mounting groove 516 surrounding the light passing hole 530. The filter 700 is disposed in the mounting groove 516 and the filter 700 An adhesive layer 810 is provided between the bottom of the mounting groove 516 and the bottom of the mounting groove 516. At this time, the above-mentioned photosensitive element 10a is a top-mounted photosensitive element.

In some embodiments, the first surface 512 is recessed to form a filter mounting groove 516 surrounding the light passing hole 530, and the filter 700 is disposed in the mounting groove 516. At this time, the above-mentioned photosensitive element 10a is a bottom-mounted photosensitive element.

As shown in FIGS. 4, 5 and 6, the support plate 510 is provided with an escape hole groove 560. The escape hole groove 560 includes an escape hole 562 penetrating the first surface 512 and the second surface 514, and an opening 562 opened on the first surface 512. The escape slot 564, the escape hole 562 and the installation slot 516 are independent of each other. The two ends of the escape slot 564 communicate with the escape hole 562 and the through-hole 530, respectively, and the escape slot 564 is located between the escape hole 562 and the through-hole 530. . After the closure member 600 is formed, and the filter 700 is fixed on the mounting groove 516, the glue of the closure member 600 and the bonding filter 700 is cured while baking, and the heat-expanded gas can pass through the escape groove 564 and escape. Stomatal 562 discharge

In some embodiments, the filter 700 may not be disposed on the bracket 500. At this time, the filter 700 may be housed in a pattern surrounded by a plurality of first protrusions 520 and directly disposed on the photosensitive chip 200. On the photosensitive surface 210.

In some embodiments, the above-mentioned photosensitive component 10a may not include the filter 700. In this case, the filter 700 may be disposed in the lens component 10b. The lens assembly 10b may be a fixed focus lens assembly or a zoom lens assembly.

As shown in FIG. 1, the lens assembly 10 b is fixed on the second surface 514 of the support plate 510 through an adhesive layer 820. As shown in FIG. 1 and FIG. 17, the camera module 10 shown in FIG. 1 and FIG. 17 is a fixed focus camera module, and its lens assembly 10b is an integrated lens assembly. The integrated lens assembly includes a lens barrel and is disposed in the lens barrel. Of lenses. The camera module 10 shown in FIG. 1 and FIG. 17 is an upper fixed focus camera module.

As shown in FIG. 20, the camera module 10 shown in FIG. 20 is a zoom camera module, and its lens assembly 10b includes a voice coil motor 910, a lens barrel 920 provided in the voice coil motor 910, and a lens provided in the lens barrel 920. . The voice coil motor 910 is connected to the circuit board 100 through a pin 930. The voice coil motor 910 drives the lens barrel 920 to move the lens, thereby achieving autofocus. The camera module 10 shown in FIG. 25 is an overhead zoom camera module. The camera module 10 shown in FIG. 21 is a bottom-mounted zoom camera module.

In some embodiments, as shown in FIG. 20, the pin 930 is located on the outer periphery of the support plate 510, and the pin 930 is opposite to the first protrusion 520 having a long shape, wherein the first protrusion having a long shape is 520 extends from one side to the other side of the support plate 510. The pins 930 are directly opposite the first protrusions 520 in the shape of a strip, so that it is not necessary to draw glue on the side of the bracket 500 corresponding to the pins 930 to fill the gaps, and it is possible to prevent the glue from covering the circuit board 100 for contact with The pad of the pin 930 is electrically connected, and the electrical connection of the pin 930 is affected. In addition, the pin 930 does not interfere with the glue, and the glue can be filled to fill the gap first, and then the lens assembly 10b can be assembled on the support plate 510, or the glue can be filled after the lens assembly 10b is assembled on the support plate 510.

In some embodiments, as shown in FIG. 22, the camera module 10 further includes a protection member 10 d, and the protection member 10 d covers the conductive wire 400. In some embodiments, while the protective member 10d covers the conductive wire 400, both ends of the protective member 10d are respectively connected to the circuit board 100 and the non-photosensitive portion 214 of the photosensitive chip 200 to cover the second pad 220 and the first一 垫 120。 A pad 120. In some embodiments, the protective member 10d is a cured adhesive. The material of the protection member 10d and the closure member 600 may be the same or different. When the camera module 10 is manufactured, a protection member 10d is formed first, and then the bracket 500 is intended to be mounted on the circuit board 100, and then a closure member 600 is formed.

In the process of forming the closure member 600, the first pad 120 located on the circuit board 100 and connected to the conductive wire 400, one end of the conductive wire 400 near the circuit board 100, or even the photosensitive chip 200 and connected to the conductive wire 400 The second pads 220 may all be wrapped by the filler, that is, the first pads 120, the conductive wires 400, and the second pads 220 may all be wrapped by the filler. In the process of solidifying the flowable filler to form the closure member 600, due to the shrinkage of the filler, the conductive wire 400 may be injured, causing the conductive wire 400 to be detached from the first pad 120 and the second pad 220. It may cause the conductive wire 400 to be broken, resulting in a problem of poor electrical properties. In addition, once the closure member 600 is formed, when an electrical failure problem occurs, it is very difficult to disassemble, which makes it difficult to repair the electrical failure problem.

In some embodiments, before forming the closure member 600, a protection member 10d is first provided. The protection member 10d covers at least the end of the first pad 120 and the conductive wire 400 near the circuit board 100, so that it can be a flowable and adhesive material. When flowing into the support plate 510 and the circuit board 100 through the first notch 10c or the second notch 10f to solidify and form the closure member 600, the protection member 10d can prevent the material forming the closure member 600 from approaching the first pad 120 and the conductive wire 400. One end of the circuit board 100 is in direct contact. At this time, by controlling the amount of the material, the material can be prevented from directly contacting the end of the conductive wire 400 near the second pad 220 and the second pad 220. In some embodiments, the protection member 10d covers the first pad 120, the conductive line 400, and the second pad 220.

By providing the protection member 10d, the material forming the sealing member 600 can be prevented from directly covering the first pad 120, the conductive wire 400, and the second pad 220, so that the material forming the sealing member 600 can be prevented from shrinking due to the material when curing. The effect of the rate, and the problem of poor electrical properties. Moreover, since the step of forming the protection member 10d can be preceded by the step of pre-fixing the bracket 500 to the circuit board 100 and the step of forming the closure member 600, even if the electrical failure occurs due to other reasons, it is easy to disassemble, so that the repair of the electrical The problem of poor electrical properties can be achieved.

In some embodiments, the material of the protection member 10 d is the same as that of the closure member 600. At this time, since the amount of the material of the protective member 10d is much smaller than the amount of the material of the closing member 600, the effect of the material shrinkage of the protective member 10d is relatively small, and the problem of poor electrical properties can be avoided.

In some embodiments, the material of the protection member 10d is different from the material of the closure member 600, wherein the shrinkage rate of the material forming the protection member 10d is smaller than that of the material forming the closure member 600, and the fluidity of the material forming the protection member 10d is greater than For the fluidity of the material forming the closure member 600, the hardness of the protection member 10d is smaller than that of the closure member 600, and the elasticity of the protection member 10d is greater than the elasticity of the closure member 600.

In some embodiments, the second pad 220 is disposed on the non-photosensitive portion 214 of the photosensitive chip 200, and the protective member 10 d surrounds the photosensitive portion 212 for a period to block the material forming the closure member 600 from flowing to the photosensitive portion 212 of the photosensitive chip 200. At this time, the protective member 10d not only has a function of preventing poor electrical properties, but also has a function of preventing overflowing glue.

In some embodiments, a distance between the protection member 10d and the photosensitive portion 212 of the photosensitive chip 200 is 300 μm or more. In this way, even if the material forming the closure member 600 passes over the protection member 10d and flows toward the photosensitive portion 212, the material forming the closure member 600 is difficult to reach the photosensitive portion 212 due to the large distance between the protection member 10d and the photosensitive portion 212. Thereby, the material forming the sealing member 600 can be better prevented from flowing to the photosensitive portion 212 of the photosensitive chip 200.

In some embodiments, the protection member 10d is an asymmetric structure. The width of the protection member 10d on the connection region 2142 of the photosensitive chip 200 is greater than the width of the protection member 10d on the non-connection region 2144. Since the second pad 220 is provided on the connection area 2142, and the second pad 220 is connected to the conductive line 400, the second pad 220 is not provided on the non-connection area 2144, and the protective member 10d is located on the connection area 2142 of the photosensitive chip 200. The width of the protection member 10d is larger, which can better cover the second pad 220 and the conductive wire 400, and the width of the protection member 10d on the non-connection region 2144 is smaller, which can save the amount of the protection member 10d.

In some embodiments, as shown in FIG. 23 and FIG. 24, the camera module 10 further includes an anti-overflow adhesive member 10e, which is disposed on the first surface 512 of the support plate 510, and the anti-overflow adhesive member 10e Relative to the first protrusion 520 is closer to the photosensitive chip 200, and the filler for blocking the seal 600 is prevented from flowing to the photosensitive portion 212 of the photosensitive chip 200. The anti-overflow adhesive member 10e is disposed on the support plate 510, which can prevent the anti-overflow adhesive member 510 from occupying an area of the circuit board 100 for setting the electronic components 300.

In some embodiments, the anti-overflow adhesive member 10e is disposed adjacent to the light-through hole 530, and the anti-overflow adhesive member 10e is disposed near the light-through hole 530, which can prevent interference between the anti-overflow adhesive member 10e and the electronic component 300 on the circuit board 100.

In some embodiments, the anti-overflow adhesive member 10e is a closed ring structure that surrounds the light-passing 530 hole once. In this way, more comprehensive anti-spill adhesive can be obtained. In some embodiments, the anti-overflow rubber element 10e includes a plurality of anti-overflow rubber blocks, and the multiple anti-overflow rubber blocks are arranged at intervals around the light-through hole 530. In this way, not only a good anti-overflow adhesive, but also a space for avoiding the electronic component 300 can be formed between two adjacent anti-overflow rubber blocks according to the actual design needs. In some embodiments, as shown in FIG. 4, the support plate 510 is provided with an escape hole 562 penetrating through two opposite surfaces of the support plate 510, and a surface of the support plate 510 near the circuit board 100 is provided with an escape slot 564. The two ends of 564 communicate with the escape hole 562 and the light-passing hole 530 respectively. One end of the anti-overflow adhesive piece 10e is adjacent to one side of the escape hole 564, and the other end extends around the light-passing hole 530 to the other of the escape slot 564. Side and adjacent to the other side of the escape slot 564. In this way, not only can better anti-overflow glue, but also can help gas escape.

In some embodiments, as shown in FIG. 23 and FIG. 24, the anti-overflow adhesive member 10e1 is directly opposite the non-photosensitive portion 214 of the photosensitive chip 200, that is, the orthographic projection of the anti-overflow adhesive member 10e1 on the photosensitive surface 210 is on the photosensitive surface. 210 on. In some embodiments, as shown in FIGS. 31 and 32, a part of the anti-overflow adhesive 10e2 is directly opposite the non-photosensitive portion 214, and another portion is directly opposite the frame portion 114 of the circuit board 100. In some embodiments, the anti-overflow adhesive member 10e2 may not be directly opposed to the non-photosensitive portion 214. At this time, the anti-overflow adhesive member 10e2 is completely opposed to the frame portion 114 of the circuit board 100.

In some embodiments, as shown in FIGS. 23 and 24, the anti-overflow adhesive member 10 e is spaced from the non-photosensitive portion 214 to avoid the conductive wire 400. In other embodiments, the anti-overflow adhesive member 10e may also be in direct contact with the non-photosensitive portion 214.

In some embodiments, an end of the anti-overflow adhesive member 10e away from the support plate 510 is spaced from a plane where the surface of the photosensitive chip 200 away from the circuit board 100 is located. In this way, interference of the anti-overflow adhesive member 10e with the conductive wire 400 on the photosensitive chip 200 can be avoided. In some embodiments, the interval between the anti-overflow adhesive element 10e and the non-connection region 2144 is less than or equal to 150 microns, and the interval between the anti-overflow adhesive element 10e and the conductive line 400 is less than or equal to 150 microns. The pitch is less than or equal to 150 micrometers, that is, the glue passing channel is small, so that it has better anti-overflow glue effect.

In some embodiments, in the radial direction of the light-passing hole 530, at least part of the anti-overflow adhesive member 10e is disposed opposite to the connection region 2142, and at least part of the anti-overflow adhesive member 10e is disposed opposite to the non-connection region 2144. In this way, interference between the anti-overflow adhesive member 10e and the electronic component 300 on the circuit board 100 can be avoided.

As shown in FIG. 23 and FIG. 24, in some embodiments, the anti-overflow adhesive member 10e includes a first anti-overflow adhesive portion 10e1 and a second anti-overflow adhesive portion 10e2, and the first anti-overflow adhesive portion 10e1 and the second anti-overflow adhesive The portion 10e2 corresponds to the connection region 2142 and the non-connection region 2144, respectively. The height of the first spill-proof adhesive portion 10e1 is smaller than the height of the second spill-proof adhesive portion 10e2. The first anti-overflow adhesive portion 10e1 with a smaller height corresponds to the connection area 2142, and the first anti-overflow adhesive portion 10e1 and the conductive line 400 on the connection area 2142 can be prevented from interfering with each other, and the second high-overflow adhesive portion with a high height is used. 10e2 corresponds to the non-connection area 2144, which can make the glue passage smaller, thereby having better anti-overflow glue effect.

In some embodiments, the first anti-overflow adhesive portion 10e1 is directly opposite the connection area 2142, and the second anti-overflow adhesive portion 10e2 may be directly opposite the non-connection area 2144, or may be directly opposite the frame portion 114 of the circuit board 100. It may partially face the non-connection area 2144 and partially face the frame portion 114 of the circuit board 100. That is, in the radial direction of the light-passing hole 530, at least a part of the first anti-overflow adhesive portion 10e1 is disposed opposite to the connection region 2142, and at least a portion of the second anti-overflow adhesive portion 10e2 is disposed opposite to the non-connection region 2144.

In some embodiments, the anti-overflow adhesive member 10e may have a ring structure that surrounds the light-passing hole 530. At this time, the first anti-overflow adhesive portion 10e1 is connected to the second anti-overflow adhesive portion 10e2.

In some embodiments, as shown in FIG. 16 and FIG. 19, the anti-overflow rubber member 10e may also be a stopper 550. At this time, the anti-overflow rubber member 10e is directly opposite the frame portion 114 of the circuit board 100, that is, the anti-overflow member The orthographic projection of the adhesive member 10e on the circuit board 100 is on the circuit board 100.

In some embodiments, as shown in FIG. 16 and FIG. 19, the plastic overflowing member 10 e is located on the outer periphery of the photosensitive chip 200, and the plastic overflowing preventing member 10 e is in direct contact with the circuit board 100. In other embodiments, the glue overflowing member 10e is located on the outer periphery of the photosensitive chip 200, the overflow preventing glue 10e may be spaced from the circuit board 100, and the interval between the overflow preventing glue 10e and the circuit board 100 may be pre-cured. The adhesive glue from 520 may or may not be filled with the filler of the closure member 600.

In the process of forming the closure member 600, improper control of the amount of the material forming the closure member 600 will cause the material forming the closure member 600 to flow to the photosensitive portion 212 of the photosensitive chip 200, affect the photosensitive performance of the photosensitive chip 200, and cause a reduction in imaging quality. . By providing an anti-overflow adhesive member 10e between the circuit board 100 and the support plate 510, when the closure member 600 flows from the flowable and adhesive material through the first notch 10c or the second notch 10f into the support plate 510 and the circuit board 100 When the post-curing is formed, the anti-overflow adhesive member 10 e is used to block the material forming the closure member 600 from flowing to the photosensitive portion 212 of the photosensitive chip 200. The anti-overflow adhesive member 10e may be the baffle 550 shown in FIG. 19, the baffle 550 connects the circuit board 100 and the support plate 510, and the anti-overflow adhesive member 10e may also be a protective member 10d around the photosensitive portion 212 shown in FIG. 22 The anti-overflow rubber member 10e may also be the anti-overflow rubber member 10e shown in FIG. 23 and FIG. 24.

An embodiment of the present invention further provides a method for manufacturing a photosensitive component, including the following steps:

In step S1, a packaging substrate is provided. The packaging substrate includes a circuit board, a photosensitive chip, and electronic components. The circuit board includes a bearing surface. The bearing surface includes a chip mounting portion and a frame portion located on the periphery of the chip mounting portion. The photosensitive chip is disposed on the chip mounting portion. The electronic component is provided on the frame portion.

In step S2, the support plate is placed on the side of the photosensitive chip and the electronic component far away from the bearing surface. The light hole is directly opposite the photosensitive chip, and the edge of the support plate and the frame portion are spaced apart to form a peripheral direction adjacent to the electronic element. The first notch in the device.

In step S3, the first gap is closed, and a closure member between the support board and the circuit board is formed, and the closure member connects the support board and the circuit board.

In some embodiments, in step S2, a first protrusion provided on a surface of the support board near the circuit board is fixed to a blank area of the circuit board.

In some embodiments, in step S3, the flowable and viscous material flows into the support board and the circuit board from the first gap, and then solidifies to obtain a closure member.

In some embodiments, before step S2, the method further includes a step of providing a protection member.

The technical features of the embodiments described above can be arbitrarily combined. In order to simplify the description, all possible combinations of the technical features in the above embodiments have not been described. However, as long as there is no contradiction in the combination of these technical features, It should be considered as the scope described in this specification.

The above-mentioned embodiments only express several implementation manners of the present invention, and their descriptions are more specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be noted that, for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, which all belong to the protection scope of the present invention. Therefore, the protection scope of the invention patent shall be subject to the appended claims.

Claims (13)

1. A photosensitive component includes:

   The circuit board includes a bearing surface, and the bearing surface includes a chip mounting portion and a frame portion located on an outer periphery of the chip mounting portion;

   A photosensitive chip is provided on the chip mounting portion, and a surface of the photosensitive chip away from the circuit board is a photosensitive surface, and the photosensitive surface includes a photosensitive portion;

   The bracket includes a support plate located on a side of the photosensitive chip away from the bearing surface, and an edge of the support plate is spaced from the frame portion to form a first gap in a circumferential direction;

   A closure member provided at the first gap to close the first gap;

   Wherein, the photosensitive component further includes an anti-overflow adhesive member provided between the circuit board and the support plate, and when the closure member flows from the flowable and adhesive material into the support through the first gap When post-curing is formed between the board and the circuit board, the anti-overflow adhesive member is used to block the material forming the closure member from flowing to the photosensitive portion of the photosensitive chip.
2. The light-sensitive component according to claim 1, wherein the support plate is provided with a light-passing hole directly opposite to the light-sensitive portion, and the anti-overflow adhesive is provided on a surface of the support plate near the circuit board. .
3. The light-sensitive component according to claim 2, wherein the anti-overflow adhesive member is a closed ring structure that surrounds the light through hole once.
4. The light-sensitive component according to claim 2, wherein the anti-overflow rubber member comprises a plurality of anti-overflow rubber blocks, and the plurality of anti-overflow rubber blocks are arranged at intervals around the light passing hole.
5. The photosensitive assembly according to claim 2, wherein the support plate is provided with an escape hole penetrating through two opposite surfaces of the support plate, and the support plate is provided with an escape groove near a surface of the circuit board, Two ends of the escape slot are in communication with the escape slot and the light-passing hole, respectively. One end of the anti-overflow rubber piece is adjacent to one side of the escape slot, and the other end surrounds the light-pass hole. It extends to the other side of the escape slot and is adjacent to the other side of the escape slot.
6. The photosensitive component according to claim 1, wherein the photosensitive surface further comprises a non-photosensitive portion surrounding the photosensitive portion, and the non-photosensitive portion includes a separate connection area and a non-connection area, and the connection area passes through The conductive wire is electrically connected with the circuit board;

   The anti-overflow rubber component is disposed on a surface of the support plate near the circuit board. The anti-overflow rubber component includes a first anti-overflow rubber portion and a second anti-overflow rubber portion. The height is smaller than the height of the second anti-overflow rubber portion, the first anti-overflow rubber portion corresponds to the connection area and is spaced from the conductive line, and the second anti-overflow rubber portion and the non-connection area Correspond and set interval.
7. The light-sensitive component according to any one of claims 2-5, wherein the anti-overflow adhesive member is provided on a surface of the support plate close to the circuit board, and the anti-overflow adhesive member is located on the photosensitive chip On the outer periphery, an adhesive layer is provided between an end of the anti-overflow rubber piece far from the support plate and the circuit board.
8. The photosensitive component according to claim 1, wherein the photosensitive component further comprises an electronic component, the electronic component is provided on the frame portion, and the electronic component is provided adjacent to the first gap, so that An opening width of the first notch in an arrangement direction of the circuit board to the photosensitive chip is greater than a distance between an end surface of the electronic component far from the circuit board and the bearing surface, so as to avoid the electronic Components.
9. The photosensitive assembly according to claim 8, wherein the bracket further comprises a first protrusion provided on the support plate, an end of the first protrusion remote from the support plate and the frame portion The blank space is connected to pre-fix the support board to the circuit board.
10. The photosensitive assembly according to claim 9, wherein the bracket further comprises a second protrusion, and the second protrusion is provided on a surface of the support plate close to the circuit board, and is in contact with the frame The outer surface of the second protrusion is flush with the outer surface of the support plate to form a second gap in the circumferential direction. The second gap is far from the electronic component, and the closure is provided. The second gap to close the second gap.
11. The photosensitive component according to claim 10, wherein the photosensitive component further comprises a conductive wire, the frame portion is provided with a first pad, the photosensitive surface is provided with a second pad, and the conductive line is connected The first pad and the second pad, and the second gap is provided adjacent to the conductive line to avoid the conductive line.
12. A camera module includes:

    The photosensitive member according to any one of claims 1-11; and

    The lens assembly is disposed on a surface of the support board away from the circuit board.
13. A mobile terminal, comprising the camera module according to claim 12.

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