CN109192840A - A kind of die pressing type LED structure and its packaging method - Google Patents
A kind of die pressing type LED structure and its packaging method Download PDFInfo
- Publication number
- CN109192840A CN109192840A CN201811136890.3A CN201811136890A CN109192840A CN 109192840 A CN109192840 A CN 109192840A CN 201811136890 A CN201811136890 A CN 201811136890A CN 109192840 A CN109192840 A CN 109192840A
- Authority
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- China
- Prior art keywords
- bracket
- type led
- pressing type
- die pressing
- led structure
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007723 die pressing method Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 16
- 239000003292 glue Substances 0.000 claims abstract description 41
- 239000003822 epoxy resin Substances 0.000 claims abstract description 21
- 239000004033 plastic Substances 0.000 claims abstract description 21
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 21
- 241000218202 Coptis Species 0.000 claims abstract description 20
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 20
- 238000000465 moulding Methods 0.000 claims abstract description 8
- 229910000679 solder Inorganic materials 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 238000000748 compression moulding Methods 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 abstract description 5
- 239000004568 cement Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of die pressing type LED structures, include: bracket, taper accommodating space, plastic parts, plastic parts is an integral molding structure with taper accommodating space, chip is equipped on the top of plastic parts, and the baseline and gold thread connecting with chip, chip, gold thread, baseline are encapsulated in taper accommodating space by glue.A kind of die pressing type LED structure packaging method is also disclosed, can be applied to above-mentioned die pressing type LED structure.A kind of reliable die pressing type LED structure is formed by setting bracket, taper accommodating space, plastic parts, chip, gold thread, baseline.Further through the region solder bonds silk in fixed wafer；Point elargol carries out die bond；First time baking is carried out later；Liquid-state epoxy resin glue is put in bottom of a cup；Second of baking is carried out again；Lens are bonded in the top of bottom of a cup later；Third time baking is finally carried out, to ensure the reliability of die pressing type LED structure encapsulation.
Description
Technical field
The present invention relates to LED encapsulation technology field, specially a kind of die pressing type LED structure and its packaging method.
Background technique
LED encapsulation includes mainly three kinds of modes, the first is made of using the flat cup bracket dispensing of common patch；It is for second
It is made using the flat cup bracket moulded lens of common patch；The third is utilized in the mode of pcb board molding LENS to reduce angle.
The first generally carries out dispensing using highly viscous silica gel, glue consumption number control height and the angle R of lens,
Major defect: the faint difference of glue amount is that will cause the height and the angle R exception of lens, thus processing procedure is uncontrollable.
Second of packaged type, which has, is divided into two ways: 1. use liquid-state silicon gel direct die press, the moulding press pole of liquid glue
It is expensive, and every machine used device is at million yuans or more, and silica gel cost is also high.2. using epoxide-resin glue cake mould
Pressure is to be developed according to the characteristic of the plastic cement of patch support there are no a epoxide-resin glue cake currently on the market, therefore glue
The associativity of cake and plastic cement hardly results in guarantee, and it is de- that product is easy to appear lens after crossing the Reflow Soldering that peak temperature is 265 DEG C
It falls, the problem of chip or elargol are unplugged.
The periphery light leakage that the mode of the third pcb board pressing mold pressure LENS goes out light light type is serious, and axial intensity, which is not able to satisfy, to be made
With requiring, and PCB is at high cost, leads to packaging cost height.
Summary of the invention
The technical problem to be solved by the present invention is providing, a kind of cost performance is high, reliable and stable die pressing type LED structure and its
Packaging method, to solve the problems, such as that such LED was unreliable, at high cost when high temperature Reflow Soldering.
The present invention is to solve a kind of technical solution that its technical problem provides to be: a kind of die pressing type LED structure includes: branch
Frame, the accommodating space for being provided centrally with taper in the bracket, the bottom setting in the centre in taper accommodating space
Have plastic parts, the plastic parts is an integral molding structure with the bracket, on plastic parts be equipped with chip, and with the chip
The baseline and gold thread of connection, the chip, gold thread, baseline are encapsulated in the taper accommodating space by glue.
As an improvement of the above scheme, the bottom of the bracket is additionally provided with the metal pins being arranged symmetrically, the metal
Pin is connect with the chip respectively.
As a further improvement of the foregoing solution, lens are equipped at the bracket rim of a cup, the lens and the bracket connect
It connects.
A kind of packaging method of LED structure the present invention also provides die pressing type with lens mainly includes the following steps: solid
Determine the region solder bonds silk of chip；Point elargol carries out die bond；First time baking is carried out later；Next it is carried out using bonding wire
Bonding wire connects chip and metal pins；Then liquid-state epoxy resin glue is put in bracket；Next second of baking is carried out again
It is roasting；Lens are connected in bracket rim of a cup later；Finally carry out third time baking.
As an improvement of the above scheme, when elargol carries out die bond, so that part bonding wire is embedded in elargol.
As a further improvement of the foregoing solution, welded bonding wire is the alloy wire of 5% gold content before fixed wafer, is fixed
Welded bonding wire is the gold thread of 99.99% gold content after chip.
As an improvement of the above scheme, when putting epoxy resin glue in cup, ensure that the epoxy resin glue covers institute
Chip and bonding wire are stated, and glue surface is no more than the rim of a cup of bracket.
As a further improvement of the foregoing solution, the lens are that epoxide-resin glue cake is molded to be formed.
As an improvement of the above scheme, the bonding wire includes gold thread and baseline, and the gold thread and the baseline are and institute
State chip connection.
As a further improvement of the foregoing solution, the lens are molded directly within rim of a cup, the branch of the bracket by molding
Epoxy resin glue bonding in frame.
The method have the benefit that: by the way that bracket is arranged, the accommodating space of taper is set at the center of bracket,
Plastic parts is arranged in the bottom in the centre in taper accommodating space, and plastic parts is an integral molding structure with bracket, in plastic parts
It is equipped with chip, the baseline connecting with chip, elargol and gold thread, chip, gold thread, baseline, elargol are encapsulated in taper by glue
In accommodating space, then in the rim of a cup of bracket lens are made, form a kind of reliable die pressing type LED structure.
Further through the region solder bonds silk in fixed wafer；Point elargol carries out die bond；First time baking is carried out later；?
Liquid-state epoxy resin glue is put in bottom of a cup；Next second of baking is carried out again；Lens are bonded in the top of bracket later；Most
Third time baking is carried out afterwards.To ensure the reliability of die pressing type LED structure encapsulation.
Detailed description of the invention
For the clearer technical solution illustrated in the embodiment of the present invention, will make below to required in embodiment description
Attached drawing briefly describes.
Fig. 1 is the top view of one embodiment of the present invention；
Fig. 2 is the perspective view of one embodiment of the present invention；
Fig. 3 is the flow chart of die pressing type LED structure packaging method of the present invention.
Specific embodiment
Carried out with reference to embodiments with technical effect of the attached drawing to design of the invention, specific structure and generation it is clear,
It is fully described by, to fully understand the purpose of the present invention, scheme and effect.It should be noted that in the absence of conflict originally
The feature in embodiment and embodiment in application can be combined with each other.Furthermore the upper and lower, left and right etc. used in the present invention
It describes in only opposite figure for each component part mutual alignment relation of the present invention.
Fig. 1 is the top view of one embodiment of the present invention, and Fig. 2 is the perspective view of one embodiment of the present invention, reference
Fig. 1 and Fig. 2, die pressing type LED structure include bracket 10, and the center of bracket 10 is equipped with the accommodating space 11 of taper, are accommodated in taper
The bottom in the centre in space 11 is equipped with plastic parts 12, and plastic parts 12 and bracket 10 are to be integrally formed structure, in plastic cement
Chip 13 is arranged in the top of part 12, and chip 13 is connect with baseline 14, elargol (not shown) and gold thread 15, chip 13, baseline 14,
Elargol gold thread 15 is encapsulated in taper accommodating space 11 by glue.
Metal pins 16 are additionally provided in the bottom of bracket 10, metal pins 16 are electrically connected with chip 13, are used for die pressing type LED
The connection of structure and external device (ED) or component, is powered on convenient for LED structure.
Lens 20 are equipped in the rim of a cup of bracket 10, lens 20 are to be pressed and molded structure by epoxide-resin glue cake, are molded into
The lens 20 of type epoxide-resin glue cake fusing glue in mold process is covered on bracket rim of a cup border and is in half curdled appearance, with
The plastic parts and glue of taper accommodating space surrounding combine, then the rim of a cup of bracket 10 is bonded in by third time baking solidification.Shape
At closed LED structure.
The invention also discloses a kind of LED structure packaging method, mainly include the following steps: to weld in the region of fixed wafer
Connect bonding wire, bonding wire includes gold thread and baseline, carries out an elargol later and carries out a die bond, in elargol die bond, so that part
Bonding wire is embedded in elargol, is carried out first time baking later, is an integral structure so that bonding wire is fully connected with elargol.In this way
After operation, even if elargol and bracket are detached from, moreover it is possible to ensure that bottom of wafer is electrically connected by elargol and bonding wire with bracket formation, protect
Hinder the reliability being electrically connected.
After the completion of toasting first time, bonding wire is welded at the top of chip, preferred bonding wire is the gold of 99.9% gold content
Line, so that the positive and negative anodes of chip are connected with two external pins respectively.
Liquid-state epoxy resin glue is put in bracket later, so that chip and gold thread is completely covered in glue in carrier cup, glue
Face is no more than rim of a cup, toasts followed by second；Lens are connected at bracket rim of a cup later；Finally carry out third time baking
It is roasting.
It should be noted that being significantly better than epoxy with the plastic cement adhesive property of bracket after the toasted solidification of epoxy resin glue
Resin glue cake, so that epoxide-resin glue will not be separated with bracket plastic cement, is ensured in LED encapsulation structure when crossing high temperature Reflow Soldering
Chip and the fixed reliability of gold thread installation, effectively avoid lens fall off, dead lamp the problem of.
As an improvement of the above scheme, above-mentioned lens are the compression molding of epoxide-resin glue cake, and in compression molding process
In in the taper accommodating space on bracket rim of a cup, bracket glue bond, baking solidification is finally also carried out, compared to traditional
Lens, it is lower by molding glue cake production glue cake cost, and the glue put in bracket is all epoxide-resin glue, lens and branch
Frame, bracket taper accommodating space in glue be bonded so that between lens and bracket have better switching performance, it is ensured that
Lens will not be fallen off.
Although specifically showing and describing the present invention in conjunction with preferred embodiment, those skilled in the art should be bright
It is white, it is not departing from the spirit and scope of the present invention defined by described claims, it in the form and details can be right
The present invention makes a variety of changes, and is protection scope of the present invention.
Claims (10)
1. a kind of die pressing type LED structure is, characterized by comprising: bracket, the accommodating for being provided centrally with taper in the bracket
Space, the bottom in the centre in taper accommodating space are provided with plastic parts, and the plastic parts is integrated with the bracket
Molding structure is equipped with chip, and the baseline and gold thread that connect with the chip, the chip, gold thread, baseline on plastic parts
It is encapsulated in the taper accommodating space by glue.
2. die pressing type LED structure according to claim 1, it is characterised in that: the bottom of the bracket is additionally provided in symmetrical
The metal pins of arrangement, the metal pins are connect with the chip.
3. die pressing type LED structure according to claim 2, it is characterised in that: be equipped with lens, institute at the rim of a cup of the bracket
Lens are stated to connect with bracket.
4. a kind of die pressing type LED structure packaging method mainly includes the following steps: for implementing above-mentioned die pressing type LED structure
The region solder bonds silk of fixed wafer；Point elargol carries out die bond；First time baking is carried out later；Next using bonding wire into
Row bonding wire connects chip and metal pins；Then liquid-state epoxy resin glue is put in bracket；Next second of baking is carried out again
It is roasting；Lens are connected in bracket rim of a cup later；Finally carry out third time baking.
5. die pressing type LED structure packaging method according to claim 4, it is characterised in that: when elargol carries out die bond,
So that part bonding wire is embedded in elargol.
6. die pressing type LED structure packaging method according to claim 5, it is characterised in that: weld bonding before fixed wafer
Silk is the alloy wire of 5% gold content, and welded bonding wire is the gold thread of 99.99% gold content after fixed wafer.
7. die pressing type LED structure packaging method according to claim 4, it is characterised in that: put epoxide-resin glue in cup
When water, ensure that the epoxy resin glue covers the chip and bonding wire, and glue surface is no more than the rim of a cup of bracket.
8. die pressing type LED structure packaging method according to claim 4, it is characterised in that: the lens are epoxy resin
The compression molding of glue cake.
9. die pressing type LED structure packaging method according to claim 4, it is characterised in that: the bonding wire includes gold thread
And baseline, the gold thread and the baseline are connect with the chip.
10. according to die pressing type LED structure packaging method described in claim 4-9 any one, it is characterised in that: the lens
The rim of a cup of the bracket is molded directly within by being molded, with the epoxy resin glue in the rim of a cup of the bracket, the rim of a cup of bracket
Bonding.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821510211 | 2018-09-14 | ||
| CN201821510211X | 2018-09-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109192840A true CN109192840A (en) | 2019-01-11 |
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ID=64906755
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821596281.1U Active CN209150142U (en) | 2018-09-14 | 2018-09-28 | A kind of die pressing type LED structure |
| CN201811136890.3A Pending CN109192840A (en) | 2018-09-14 | 2018-09-28 | A kind of die pressing type LED structure and its packaging method |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821596281.1U Active CN209150142U (en) | 2018-09-14 | 2018-09-28 | A kind of die pressing type LED structure |
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| Country | Link |
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| CN (2) | CN209150142U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109719381A (en) * | 2019-02-21 | 2019-05-07 | 巴中市特兴智能科技有限公司 | A kind of process of automatic welding bonding gold thread |
| CN114937647A (en) * | 2022-05-30 | 2022-08-23 | 广东省旭晟半导体股份有限公司 | Semiconductor packaging structure and packaging method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111276591B (en) * | 2020-02-18 | 2020-12-11 | 旭宇光电（深圳）股份有限公司 | LED packaging structure and LED die bonding method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004025741A1 (en) * | 2002-09-16 | 2004-03-25 | Tco Co., Ltd | A high brightness light emitting diode and its method of making |
| CN201204212Y (en) * | 2008-05-30 | 2009-03-04 | 深圳市瑞丰光电子有限公司 | LED encapsulation structure |
| CN206742275U (en) * | 2016-12-26 | 2017-12-12 | 芜湖聚飞光电科技有限公司 | A kind of patch-type infrared LED lamp bead |
-
2018
- 2018-09-28 CN CN201821596281.1U patent/CN209150142U/en active Active
- 2018-09-28 CN CN201811136890.3A patent/CN109192840A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004025741A1 (en) * | 2002-09-16 | 2004-03-25 | Tco Co., Ltd | A high brightness light emitting diode and its method of making |
| CN201204212Y (en) * | 2008-05-30 | 2009-03-04 | 深圳市瑞丰光电子有限公司 | LED encapsulation structure |
| CN206742275U (en) * | 2016-12-26 | 2017-12-12 | 芜湖聚飞光电科技有限公司 | A kind of patch-type infrared LED lamp bead |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109719381A (en) * | 2019-02-21 | 2019-05-07 | 巴中市特兴智能科技有限公司 | A kind of process of automatic welding bonding gold thread |
| CN114937647A (en) * | 2022-05-30 | 2022-08-23 | 广东省旭晟半导体股份有限公司 | Semiconductor packaging structure and packaging method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN209150142U (en) | 2019-07-23 |
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