CN103682049B - A kind of waterproof paster LED and production technology thereof - Google Patents
A kind of waterproof paster LED and production technology thereof Download PDFInfo
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- CN103682049B CN103682049B CN201310730091.XA CN201310730091A CN103682049B CN 103682049 B CN103682049 B CN 103682049B CN 201310730091 A CN201310730091 A CN 201310730091A CN 103682049 B CN103682049 B CN 103682049B
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- 238000005516 engineering process Methods 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000004033 plastic Substances 0.000 claims abstract description 68
- 229920003023 plastic Polymers 0.000 claims abstract description 68
- 238000004806 packaging method and process Methods 0.000 claims abstract description 65
- 238000005538 encapsulation Methods 0.000 claims abstract description 24
- 239000013078 crystal Substances 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 18
- 239000004593 Epoxy Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 43
- 239000003822 epoxy resin Substances 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 12
- 229920000647 polyepoxide Polymers 0.000 claims description 12
- 238000007711 solidification Methods 0.000 claims description 12
- 230000008023 solidification Effects 0.000 claims description 12
- 241000567030 Ampulloclitocybe clavipes Species 0.000 claims description 9
- 206010043101 Talipes Diseases 0.000 claims description 9
- 201000011228 clubfoot Diseases 0.000 claims description 9
- 239000000084 colloidal system Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 241000235388 Mucorales Species 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 9
- 238000013461 design Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 3
- 238000001764 infiltration Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000004568 cement Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- -1 benzene diamides Chemical class 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of waterproof paster LED and production technology thereof, described paster LED includes: package main body, and described package main body is specially epoxy encapsulation main body；Plastic packaging shaped support, one end of described plastic packaging shaped support is stretched into inside described package main body, described plastic packaging shaped support is provided with crystal bonding area, it is fixed with LED wafer in described crystal bonding area, wherein, the pin of described plastic packaging shaped support is provided with waterproof groove and anti-water hole, it is achieved that paster LED has good waterproof, the technique effect of humidity resistance.
Description
Technical field
The present invention relates to field of photoelectric technology, particularly relate to a kind of waterproof paster LED and production technology thereof.
Background technology
In recent years, adopting surface mounted LED becomes a Hot spots for development, well solves the problems such as brightness, visual angle, flatness, concordance, is especially suitable for the application of high-resolution indoor full color display.But along with becoming increasingly popular of LED, more and more higher to its performance requirement, requiring to disclosure satisfy that high-resolution open air, outdoor full color display screen and the application of outdoor building, common paster LED water resistance is low, it is impossible to is placed in for a long time in moist rugged environment and uses.
The waterproof difficult point of adopting surface mounted LED is mainly caused by two aspects: one is the infiltration of LED support.LED support infiltration is caused by the contact surface of the material of support and material with electrode pin.The support of adopting surface mounted LED is to obtain compressing to plastics and metal electrode at present, and plastic cement material used is poly-spirit benzene diamides (being called for short PPA), and metal electrode material has copper, aluminum etc..The support of this material structure in the weakness of waterproof aspect is: 1, the easy moisture absorption of PPA material；2, there is gap in the contact surface between PPA and metal electrode pin, and this gap can after Reflow Soldering and follow-up LED use during become big, so that impurity invasions such as aqueous vapors.Two is the infiltration of LED encapsulation glue-line.LED uses packaging plastic to be mainly epoxy resin and silicones (polyorganosiloxane resin).The thermal coefficient of expansion of epoxy resin and silicones is different from LED support, and in use, phenomenon of expanding with heat and contract with cold can make packing colloid die down with the cohesive of LED support, gap occurs, causes aqueous vapor to invade.A kind of there is waterproof, the adopting surface mounted LED of humidity resistance accordingly, it would be desirable to study.
Present inventor in realizing the embodiment of the present application during inventive technique scheme, finds that above-mentioned technology at least exists following technical problem:
In the prior art, plastic cement material used by existing adopting surface mounted LED is the easy moisture absorption of PPA, there is interstitial water gas and be easily accessible in the contact surface between PPA and metal electrode pin, paster LED uses packaging plastic to be mainly the thermal coefficient of expansion of epoxy resin and silicones, epoxy resin and silicones and the different of LED support, in use, gap easily occurs, aqueous vapor is caused to invade, so, there is technical problem waterproof, that humidity resistance is poor in existing adopting surface mounted LED.
Summary of the invention
The embodiment of the present application, by providing a kind of waterproof paster LED and production technology thereof, solves existing adopting surface mounted LED in prior art and there is technical problem waterproof, that humidity resistance is poor, it is achieved that paster LED has good waterproof, the technique effect of humidity resistance.
For solving above-mentioned technical problem, on the one hand the embodiment of the present application provides waterproof a kind of paster LED, and described paster LED includes:
Package main body, described package main body is specially epoxy encapsulation main body；
Plastic packaging shaped support, one end of described plastic packaging shaped support is stretched into inside described package main body, and described plastic packaging shaped support is provided with crystal bonding area, is fixed with LED wafer in described crystal bonding area, wherein, the pin of described plastic packaging shaped support is provided with waterproof groove and anti-water hole.
Wherein, the pin of described plastic packaging shaped support has two ends, and wherein one end is positioned at described package main body, and the other end is bent to bottom described package main body through described package main body.
Wherein, described plastic packaging shaped bracket is electrically connected with described LED wafer, carries out full-enclosed encapsulation after connection.
On the other hand, present application example also provides for the production technology of a kind of waterproof paster LED, and described production technology comprises the following steps:
(1) making of plastic packaging shaped support, the making of described plastic packaging shaped support is particularly as follows: carry out cold stamping initially with bracket mould to copper material, then described plastic packaging shaped bracket is obtained by injection, wherein, cell cube in described plastic packaging shaped bracket is bowl shape, and capsulation material is opaque material, described plastic packaging shaped bracket having the crystal bonding area for fixing LED wafer and weld zone, the pin of described plastic packaging shaped bracket has waterproof groove and waterproof emptying aperture.
(2) LED wafer is fixed: described LED wafer is fixed on the described crystal bonding area of described plastic packaging shaped bracket；
(3) bonding wire: the solder joint of described LED wafer is welded with described weld zone；
(4) one-shot forming encapsulation: carry out a glue in the described plastic packaging shaped support bowl after bonding wire, click and enter optical grade epoxy resin；
(5) one-step solidification: utilize high temperature roaster that material the most for dispensing glue is solidified；
(6) post forming encapsulation: put in mould by the material of one-step solidification, in unsettled laying state, injects epoxy encapsulation, and described mould is cubic shaped, and the exiting surface making described plastic packaging shaped support is plane；
(7) secondary solidification: the material after utilizing high temperature roaster to encapsulate post forming solidifies；
(8) clubfoot: the material after solidifying secondary carries out clubfoot process, obtains the individuality of waterproof paster LED.
Further, described step (2) LED wafer is fixing specifically includes:
21, LED wafer fixing glue on the described crystal bonding area point of the described plastic packaging shaped support prepared in step (1), when glue, each some Jiao Chu connects without colloid；
22, described LED wafer is individually positioned in the some Jiao Chu of described crystal bonding area；
23, after described LED wafer is placed, described plastic packaging shaped support is sent in heated-air circulation roaster with described LED wafer and solidifies.
Further, the material after secondary is solidified by described step (8) carries out clubfoot process, obtains the individuality of waterproof paster LED, specifically includes:
81, utilizing bent pin mould, the pin of the material after being solidified by secondary carries out bending so that the pin end of the material after secondary solidification turns back to epoxy encapsulation bottom part body；
82, the material after utilizing threshing mould to be solidified by secondary separates from empty frame, thus obtains the individuality of waterproof paster LED.
The one or more technical schemes provided in the embodiment of the present application, at least have the following technical effect that or advantage:
It is epoxy resin owing to have employed the material design of package main body, and the support of LED is plastic packaging shaped bracket, carry out full-enclosed encapsulation, and the pin at plastic packaging shaped bracket is provided with the technological means of waterproof groove and anti-water hole, so, efficiently solve existing adopting surface mounted LED in prior art and there is technical problem waterproof, that humidity resistance is poor, and then achieve paster LED there is good waterproof, the technique effect of humidity resistance.
Accompanying drawing explanation
Fig. 1 is the structural representation of waterproof paster LED in the embodiment of the present application；
Fig. 2 is the structural representation of plastic packaging shaped support in the embodiment of the present application；
Fig. 3 is the structural representation of cell cube in plastic packaging shaped support in the embodiment of the present application；
Fig. 4 is the sectional view of waterproof paster LED in the embodiment of the present application；
Fig. 5 is the production technological process of waterproof paster LED in the embodiment of the present application；
Fig. 6 is structural representation after cell cube die bond bonding wire in plastic packaging shaped support in the embodiment of the present application；
Fig. 7 has been the waterproof paster LED structure schematic diagram after bent angle technique.
Detailed description of the invention
The embodiment of the present application, by providing a kind of waterproof paster LED and production technology thereof, solves existing adopting surface mounted LED in prior art and there is technical problem waterproof, that humidity resistance is poor, it is achieved that paster LED has good waterproof, the technique effect of humidity resistance.
Technical scheme during the application implements is the above-mentioned technical problem of solution.General thought is as follows:
Have employed the material design of package main body is epoxy resin, and the support of LED is plastic packaging shaped bracket, carry out full-enclosed encapsulation, and the pin at plastic packaging shaped bracket is provided with the technological means of waterproof groove and anti-water hole, so, efficiently solve existing adopting surface mounted LED in prior art and there is technical problem waterproof, that humidity resistance is poor, and then achieve paster LED there is good waterproof, the technique effect of humidity resistance.
In order to be better understood from technique scheme, below in conjunction with Figure of description and specific embodiment, technique scheme is described in detail.
Embodiment one
In embodiment one, it is provided that a kind of waterproof paster LED, refer to Fig. 1-Fig. 4, described paster LED includes:
Package main body 10, described package main body 10 is specially epoxy encapsulation main body；
Plastic packaging shaped support 20, it is internal that described package main body 10 is stretched in one end of described plastic packaging shaped support 20, and described plastic packaging shaped support 20 is provided with crystal bonding area, is fixed with LED wafer in described crystal bonding area, wherein, the pin of described plastic packaging shaped support is provided with waterproof groove 201 and anti-water hole 202.
Wherein, in the embodiment of the present application, the pin of described plastic packaging shaped support 20 has two ends, and wherein one end is positioned at described package main body 10, and the other end is bent to bottom described package main body 10 through described package main body 10.
Wherein, in the embodiment of the present application, described plastic packaging shaped bracket 20 is electrically connected with described LED wafer, carries out full-enclosed encapsulation after connection.
In actual applications, waterproof groove 201 is set and good waterproof moisture-proof effect can be played in anti-water hole 202.
In actual applications, it is that epoxy resin can avoid the moisture absorption by the material design of package main body, carries out full-enclosed encapsulation and be sealing effectiveness and preferably encapsulate, comprehensive seal, also for waterproof, moistureproof.
As shown in Figure 1, waterproof paster LED in the embodiment of the present application includes that epoxy resin surrounds package main body 10 entirely, and one end stretches into the plastic packaging shaped bracket 20 within epoxy encapsulation main body 10, the external part of plastic packaging shaped bracket 20, after bending, turns back and is buckled on the bottom of epoxy encapsulation main body 10.
In the diagram, the top plane of package main body 10 is made up of top plane 101 and the middle exiting surface 102 of surrounding, exiting surface is dome shape, thus form sphere lens 103, in the embodiment of the present application, the peak of described sphere lens 103 is in the plane at top plane 101 place of described package main body 10, sphere lens 103 is refractive optical surface, plastic packaging shaped bracket 20,30, plastic packaging shaped bracket 30 has bowl 50, is provided with crystal bonding area 40 in bowl.
Waterproof paster LED in corresponding embodiment one, embodiment one also provides for the production technology of a kind of waterproof paster LED, refer to Fig. 5-Fig. 7, and described production technology comprises the following steps:
(1) making of plastic packaging shaped support, the making of described plastic packaging shaped support is particularly as follows: carry out cold stamping initially with bracket mould to copper material, then described plastic packaging shaped bracket is obtained by injection, wherein, cell cube in described plastic packaging shaped bracket is bowl shape, and capsulation material is opaque material, described plastic packaging shaped bracket having the crystal bonding area for fixing LED wafer and weld zone, the pin of described plastic packaging shaped bracket has waterproof groove and waterproof emptying aperture.
(2) LED wafer is fixed: described LED wafer is fixed on the described crystal bonding area of described plastic packaging shaped bracket；
(3) bonding wire: the solder joint of described LED wafer is welded with described weld zone；
(4) one-shot forming encapsulation: carry out a glue in the described plastic packaging shaped support bowl after bonding wire, click and enter optical grade epoxy resin；
(5) one-step solidification: utilize high temperature roaster that material the most for dispensing glue is solidified；
(6) post forming encapsulation: put in mould by the material of one-step solidification, in unsettled laying state, injects epoxy encapsulation, and described mould is cubic shaped, and the exiting surface making described plastic packaging shaped support is plane；
(7) secondary solidification: the material after utilizing high temperature roaster to encapsulate post forming solidifies；
(8) clubfoot: the material after solidifying secondary carries out clubfoot process, obtains the individuality of waterproof paster LED.
Wherein, in the embodiment of the present application, described step (2) LED wafer is fixing specifically includes:
21, LED wafer fixing glue on the described crystal bonding area point of the described plastic packaging shaped support prepared in step (1), when glue, each some Jiao Chu connects without colloid；
22, described LED wafer is individually positioned in the some Jiao Chu of described crystal bonding area；
23, after described LED wafer is placed, described plastic packaging shaped support is sent in heated-air circulation roaster with described LED wafer and solidifies.
Wherein, in the embodiment of the present application, the material after secondary is solidified by described step (8) carries out clubfoot process, obtains the individuality of waterproof paster LED, specifically includes:
81, utilizing bent pin mould, the pin of the material after being solidified by secondary carries out bending so that the pin end of the material after secondary solidification turns back to epoxy encapsulation bottom part body；
82, the material after utilizing threshing mould to be solidified by secondary separates from empty frame, thus obtains the individuality of waterproof paster LED.
As shown in Figure 5, plastic packaging shaped support is provided with four support pins, lateral trench and emptying aperture is had on four support pins, a wherein support of four supports is provided with crystal bonding area, is fixed with LED wafer in crystal bonding area, and LED wafer is fixed on the bottom of crystal bonding area stem for stem by colloid, and LED wafer is connected with the weld zone of support by gold thread respectively, and ensure good electrical connection, after being passed through electric current, LED wafer can be made luminous.
Fig. 6 has been the paster LED structural representation after bent angle technique.
Technical scheme in above-mentioned the embodiment of the present application, at least has the following technical effect that or advantage:
It is epoxy resin owing to have employed the material design of package main body, and the support of LED is plastic packaging shaped bracket, carry out full-enclosed encapsulation, and the pin at plastic packaging shaped bracket is provided with the technological means of waterproof groove and anti-water hole, so, efficiently solve existing adopting surface mounted LED in prior art and there is technical problem waterproof, that humidity resistance is poor, and then achieve paster LED there is good waterproof, the technique effect of humidity resistance.
Although preferred embodiments of the present invention have been described, but those skilled in the art once know basic creative concept, then these embodiments can be made other change and amendment.So, claims are intended to be construed to include preferred embodiment and fall into all changes and the amendment of the scope of the invention.
Obviously, those skilled in the art can carry out various change and modification without departing from the spirit and scope of the present invention to the present invention.So, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (1)
1. the production technology of a waterproof paster LED, it is characterised in that described production technology comprises the following steps:
(1) making of plastic packaging shaped support, the making of described plastic packaging shaped support is particularly as follows: carry out cold stamping initially with bracket mould to copper material, then described plastic packaging shaped bracket is obtained by injection, wherein, cell cube in described plastic packaging shaped bracket is bowl shape, and capsulation material is opaque material, described plastic packaging shaped bracket having the crystal bonding area for fixing LED wafer and weld zone, the pin of described plastic packaging shaped bracket has waterproof groove and waterproof emptying aperture；
(2) LED wafer is fixed: described LED wafer is fixed on the described crystal bonding area of described plastic packaging shaped bracket；
(3) bonding wire: the solder joint of described LED wafer is welded with described weld zone；
(4) one-shot forming encapsulation: carry out a glue in the described plastic packaging shaped support bowl after bonding wire, click and enter optical grade epoxy resin；
(5) one-step solidification: utilize high temperature roaster that material the most for dispensing glue is solidified；
(6) post forming encapsulation: put in mould by the material of one-step solidification, in unsettled laying state, injects epoxy encapsulation, and described mould is cubic shaped, and the exiting surface making described plastic packaging shaped support is plane；
(7) secondary solidification: the material after utilizing high temperature roaster to encapsulate post forming solidifies；
(8) clubfoot: the material after solidifying secondary carries out clubfoot process, obtains the individuality of waterproof paster LED；
Described step (2) LED wafer is fixing to be specifically included:
21, LED wafer fixing glue on the described crystal bonding area point of the described plastic packaging shaped support prepared in step (1), when glue, each some Jiao Chu connects without colloid；
22, described LED wafer is individually positioned in the some Jiao Chu of described crystal bonding area；
23, after described LED wafer is placed, described plastic packaging shaped support is sent in heated-air circulation roaster with described LED wafer and solidifies；
Material after secondary is solidified by described step (8) carries out clubfoot process, obtains the individuality of waterproof paster LED, specifically includes:
81, utilizing bent pin mould, the pin of the material after being solidified by secondary carries out bending so that the pin end of the material after secondary solidification turns back to epoxy encapsulation bottom part body；
82, the material after utilizing threshing mould to be solidified by secondary separates from empty frame, thus obtains the individuality of waterproof paster LED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201310730091.XA CN103682049B (en) | 2013-12-26 | 2013-12-26 | A kind of waterproof paster LED and production technology thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310730091.XA CN103682049B (en) | 2013-12-26 | 2013-12-26 | A kind of waterproof paster LED and production technology thereof |
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| CN103682049A CN103682049A (en) | 2014-03-26 |
| CN103682049B true CN103682049B (en) | 2016-09-14 |
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| CN106784193A (en) * | 2017-01-03 | 2017-05-31 | 厦门天微电子有限公司 | A kind of small spacing LED photovoltaic module packaging method |
| CN108155106A (en) * | 2017-12-22 | 2018-06-12 | 珠海市大鹏电子科技有限公司 | A kind of length climbs the preparation process of electric light electric coupler |
| CN110164827B (en) * | 2019-05-22 | 2024-07-26 | 河源市富宇光电科技有限公司 | Integrated forming packaging structure and packaging process thereof |
| CN110277478B (en) * | 2019-06-28 | 2021-03-30 | 旭宇光电（深圳）股份有限公司 | Light emitting diode device and light emitting apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102832317A (en) * | 2012-08-16 | 2012-12-19 | 东莞市钜晶光电有限公司 | Red LED packaging method |
| CN103117350A (en) * | 2011-11-17 | 2013-05-22 | 佛山市国星光电股份有限公司 | Surface-mounting highly-waterproof light emitting diode (LED) support used for outdoor display screen and products thereof |
| CN203721759U (en) * | 2013-12-26 | 2014-07-16 | 四川柏狮光电技术有限公司 | A waterproof surface-mounted LED |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103117350A (en) * | 2011-11-17 | 2013-05-22 | 佛山市国星光电股份有限公司 | Surface-mounting highly-waterproof light emitting diode (LED) support used for outdoor display screen and products thereof |
| CN102832317A (en) * | 2012-08-16 | 2012-12-19 | 东莞市钜晶光电有限公司 | Red LED packaging method |
| CN203721759U (en) * | 2013-12-26 | 2014-07-16 | 四川柏狮光电技术有限公司 | A waterproof surface-mounted LED |
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