CN104124328A - Novel waterproof SMD (surface mounted device) LED and production technology thereof - Google Patents
Novel waterproof SMD (surface mounted device) LED and production technology thereof Download PDFInfo
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- CN104124328A CN104124328A CN201310150635.5A CN201310150635A CN104124328A CN 104124328 A CN104124328 A CN 104124328A CN 201310150635 A CN201310150635 A CN 201310150635A CN 104124328 A CN104124328 A CN 104124328A
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- 238000005516 engineering process Methods 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 235000012431 wafers Nutrition 0.000 claims abstract description 41
- 239000013078 crystal Substances 0.000 claims abstract description 31
- 238000001125 extrusion Methods 0.000 claims abstract description 12
- 239000003292 glue Substances 0.000 claims abstract description 7
- 238000005538 encapsulation Methods 0.000 claims description 57
- 239000004593 Epoxy Substances 0.000 claims description 38
- 239000000463 material Substances 0.000 claims description 32
- 239000000084 colloidal system Substances 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 241000567030 Ampulloclitocybe clavipes Species 0.000 claims description 6
- 206010043101 Talipes Diseases 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 6
- 201000011228 clubfoot Diseases 0.000 claims description 6
- 238000004513 sizing Methods 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 241000218202 Coptis Species 0.000 claims description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- 241000235388 Mucorales Species 0.000 claims description 3
- 230000008014 freezing Effects 0.000 claims description 3
- 238000007710 freezing Methods 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 12
- 229920000647 polyepoxide Polymers 0.000 abstract description 12
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000007787 solid Substances 0.000 abstract 2
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 230000008595 infiltration Effects 0.000 description 3
- 238000001764 infiltration Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- -1 benzene diamides Chemical class 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a novel waterproof SMD (surface mounted device) LED and a production technology thereof, and relates to the technical field of LED package. The novel waterproof SMD LED comprises an epoxy resin package main body and at least two brackets of which one ends are extended into the interior of the epoxy resin package main body, wherein a solid crystal region is arranged on one bracket, LED wafers are fixed in the a solid crystal region, the top surface of the epoxy resin package main body is composed of peripheral top planes and a light-emitting surface in the middle, and the light-emitting surface is a spherical shape, thereby forming the spherical lens. The novel waterproof SMD LED has the beneficial effects that: during the production of the novel waterproof SMD LED, the wire-welded bracket is subjected to extrusion molding package by using a high-pressure glue injector, the epoxy resin is tightly combined with the brackets by using the heavy pressure produced in extrusion molding, and one ends of the brackets and the LED wafers are integrally covered by the epoxy resin package main body, so that the integral package of the epoxy resin is realized, thereby achieving the waterproof and moisture-proof function.
Description
[technical field]
The present invention relates to LED encapsulation technology, in particular, the production technology that the present invention relates to a kind of new waterproof paster LED and make this new waterproof paster LED.
[background technology]
In recent years, adopting surface mounted LED becomes a Hot spots for development, has well solved the problems such as brightness, visual angle, evenness, consistency, is applicable to very much the application of high-resolution open air, outdoor full color display screen and outdoor building.But day by day universal along with LED, also more and more higher to its performance requirement, common paster LED water resistance is low, can not be placed in for a long time moist rugged environment and use.
Adopting surface mounted LED waterproof difficult point is mainly caused by two aspects: the one, and the infiltration of LED support.LED support infiltration is caused by the material of support and the contact-making surface of material and electrode pin.The support of current adopting surface mounted LED is by plastics and metal electrode is compressing obtains, and plastic cement material used is poly-clever benzene diamides (being called for short PPA), and metal electrode material has copper, aluminium etc.The weakness of the support of this material structure aspect waterproof is: 1, the easy moisture absorption of PPA material, and hydroscopicity is 6% left and right; 2, there is gap in the contact-making surface between PPA and metal electrode pin, and this gap can become after Reflow Soldering and in follow-up LED use procedure greatly, thereby make the impurity invasions such as aqueous vapor.
The infiltration of the 2nd, LED encapsulation glue-line.It is mainly epoxy resin and silicones (polyorganosiloxane resin) that LED uses packaging plastic.The thermal coefficient of expansion of epoxy resin and silicones is different from LED support, and in use, the phenomenon of expanding with heat and contract with cold can make the adhesiveness of packing colloid and LED support die down, and occurs gap, causes aqueous vapor intrusion.Therefore, need to study a kind of adopting surface mounted LED with waterproof, humidity resistance.
[summary of the invention]
The object of the invention is to effectively overcome the deficiency of above-mentioned technology, a kind of new waterproof paster LED with waterproof, humidity resistance is provided.
Technical scheme of the present invention is achieved in that it comprises that epoxy encapsulation main body and one end stretch at least two supports of epoxy encapsulation body interior, wherein a support is provided with crystal bonding area, in crystal bonding area, be fixed with LED wafer, its improvements are: the end face of described epoxy encapsulation main body is made up of the top plane of surrounding and middle exiting surface, described exiting surface is dome shape, thereby forms spherical lens;
Further, be sunken to the top plane of described epoxy encapsulation main body in described spherical lens, i.e. the peak of described sphere lens, in the plane at plane place, the top of described epoxy encapsulation main body;
Further, described support always has four, and described crystal bonding area is arranged on one bowl of cup, and a support with bowl cup is common port support, be provided with three LEDs wafers, and three LEDs wafers is connected respectively in described crystal bonding area with its excess-three support by gold thread;
Further, epoxy encapsulation body interior is all stretched in one end of described four supports, and the other end is support pin, and described support pin, after bending, turns back to the bottom of epoxy encapsulation main body;
Further, described crystal bonding area is round table-like, and described LED wafer is fixed on bottom, crystal bonding area by colloid.
The present invention also provides a kind of production technology that is applied to above-mentioned new waterproof paster LED, and this technique comprises the following steps:
The making of A, support: choose copper material, adopt bracket mould to carry out cold stamping to copper material, obtain support, wherein there is the crystal bonding area for fixed L ED wafer on a support;
B, LED wafer are fixed: the crystal bonding area that LED wafer is fixed on to support;
In step B, also comprise step B1-B3:
LED wafer fixing glue is put respectively at three places of the crystal bonding area of B1, the support that makes in steps A, in the time of glue, ensures that each some Jiao Chu connects without colloid;
B2, three LED wafers are placed on respectively to three some Jiao Chu of crystal bonding area;
After B3, LED wafer place, support and LED wafer are sent in heated-air circulation roaster and be cured, the baking temperature in heated-air circulation roaster is 150-160 DEG C, and baking time is 60 minutes.
C, bonding wire: the weld zone of the solder joint of LED wafer and remaining stents is welded;
D, extrusion molding encapsulation: utilize high-pressure injection moulding machine, to the two stands extrusion molding encapsulation of bonding wire;
Step D comprises step D1-D2:
D1, by the two stands of bonding wire, put into high-pressure injection plastic machine die cavity, use epoxy encapsulation sizing material to carry out moulding encapsulation, after encapsulation, form one end of coated stent and the epoxy encapsulation main body of LED chip, the end face of this epoxy encapsulation main body is made up of the top plane of surrounding and middle exiting surface, exiting surface is dome shape, thereby forms spherical lens; Described epoxy encapsulation sizing material is freezing solid-state shape in the time not using;
D2, the support after encapsulation is sent in heated-air circulation roaster and is cured, the temperature in heated-air circulation roaster is 155 DEG C, and baking time is 4 hours.
E, curing: utilize high temperature roaster to be cured in type material;
F, clubfoot: material is carried out to clubfoot processing, obtain the individuality of waterproof paster LED;
In step F, also comprise step F 1-F2:
F1, utilize bent pin mould, the pin of material is carried out to bending, the pin end of material is turned back to epoxy encapsulation bottom part body;
F2, utilize threshing mould that material is separated from support, thereby obtain the individuality of waterproof paster LED.
Beneficial effect of the present invention is: the production technology that the invention discloses a kind of waterproof paster LED and this LED, the support high-pressure injection plastic machine that welds line is carried out extrusion molding encapsulation by this production technology, the high pressure producing while utilizing extrusion molding, epoxy resin and support are combined closely, and epoxy encapsulation main body wraps one end of support and LED wafer entirety, realize the integrative packaging of epoxy resin, thereby realize the function of waterproof, protection against the tide, this waterproof paster LED is a kind of low cost, high novel semiconductor light-emitting element of trusting.
[brief description of the drawings]
Fig. 1 is the cutaway view of the first embodiment of new waterproof paster LED of the present invention;
Fig. 2 is the vertical view of the first embodiment of new waterproof paster LED of the present invention;
Fig. 3 is the vertical view of the second embodiment of new waterproof paster LED of the present invention;
Fig. 4 to Fig. 7 is the production technological process of new waterproof paster LED of the present invention.
[embodiment]
Below in conjunction with drawings and Examples, the invention will be further described.
With reference to Fig. 1, shown in Fig. 2, the present invention has disclosed a kind of new waterproof paster LED, this waterproof paster LED comprises epoxy encapsulation main body 10, and at least two supports 20 of epoxy encapsulation main body 10 inside are stretched in one end, and in the present embodiment, shown in Fig. 2, be provided with four supports 20, a wherein support 201 of four supports 20 is provided with crystal bonding area 202, general, this support 201 is provided with the bowl cup 203 that is truncated cone-shaped, this bowl of cup 203 bottoms are crystal bonding area 202, support 201 is common port support, in Fig. 1, the external part of four supports is after bending, turn back and be buckled on the bottom of epoxy encapsulation main body 10.Shown in Fig. 2, in crystal bonding area 202, be fixed with three LEDs wafers 30, this three LEDs wafer 30 is fixed on the bottom of crystal bonding area 202 stem for stem by colloid, and three LEDs wafers 30 are connected with the weld zone of other three supports 10 by gold thread 40 respectively, and ensure good electrical connection, passing into after electric current, can make LED wafer 30 luminous.In Fig. 1, the end face of above-mentioned epoxy encapsulation main body 10 is made up of the top plane 101 of surrounding and middle exiting surface 102, exiting surface 102 is dome shape, thereby form spherical lens 103, the top plane 101 of these spherical lens 103 interior heavy and described epoxy encapsulation main body 10, in the present embodiment, the peak of sphere lens 103, in the plane at plane 101 places, the top of described epoxy encapsulation main body 10, the surface of sphere lens 103 is refractive optical surface, the light that this kind of structure can make LED wafer send is more concentrated, improves light-source brightness.
With reference to Fig. 3, another specific embodiment of new waterproof paster LED of disclosing for the present invention, in the present embodiment, has reduced support 20 and has stretched into the part of epoxy encapsulation colloid 10, increase the volume of support 201 with crystal bonding area 202 simultaneously, and changed the shape that support 20,201 presents.
Shown in Fig. 4, the present invention has also disclosed the production technology that is applicable to above-mentioned new waterproof paster LED, and this technique comprises the following steps:
The making of A, support: choose copper material, adopt bracket mould to carry out cold stamping to copper material, obtain support, wherein there is the crystal bonding area for fixed L ED wafer on a support;
B, LED wafer are fixed: the crystal bonding area that LED wafer is fixed on to support;
In the present embodiment, shown in Fig. 5, in this step B, also comprise following detailed step B1-B3:
LED wafer fixing glue is put respectively at three places of the crystal bonding area of B1, the support that makes in steps A, in the time of glue, ensures that each some Jiao Chu connects without colloid;
B2, three LED wafers are placed on respectively to three some Jiao Chu of crystal bonding area;
After B3, LED wafer place, support and LED wafer are sent in heated-air circulation roaster and be cured, the baking temperature in heated-air circulation roaster is 150-160 DEG C, and baking time is 60 minutes.
C, bonding wire: the weld zone of the solder joint of LED wafer and remaining stents is welded;
D, extrusion molding encapsulation: utilize high-pressure injection moulding machine, to the two stands extrusion molding encapsulation of bonding wire;
In the present embodiment, with reference to Fig. 6, this step D comprises step D1-D2:
D1, by the two stands of bonding wire, put into high-pressure injection plastic machine die cavity, use epoxy encapsulation sizing material to carry out moulding encapsulation, after encapsulation, form one end of coated stent and the epoxy encapsulation main body of LED chip, the end face of this epoxy encapsulation main body is made up of the top plane of surrounding and middle exiting surface, exiting surface is dome shape, thereby forms spherical lens; Described epoxy encapsulation sizing material is freezing solid-state shape in the time not using;
D2, the support after encapsulation is sent in heated-air circulation roaster and is cured, the temperature in heated-air circulation roaster is 155 DEG C, and baking time is 4 hours.
E, curing: utilize high temperature roaster to be cured in type material;
F, clubfoot: material is carried out to clubfoot processing, obtain the individuality of waterproof paster LED;
In the present embodiment, with reference to Fig. 7, in this step F, also comprise step F 1-F2:
F1, utilize bent pin mould, the pin of material is carried out to bending, the pin end of material is turned back to epoxy encapsulation bottom part body;
F2, utilize threshing mould that material is separated from support, thereby obtain the individuality of waterproof paster LED.
By above-mentioned technique, the support high-pressure injection plastic machine that welds line is carried out to extrusion molding encapsulation, the high pressure producing while utilizing extrusion molding, epoxy resin and support are combined closely, and epoxy encapsulation main body wraps one end of support and LED wafer entirety, realized the integrative packaging of epoxy resin, thereby realized the function of waterproof, protection against the tide, this waterproof paster LED is a kind of low cost, high novel semiconductor light-emitting element of trusting.
Described above is only preferred embodiment of the present invention, and above-mentioned specific embodiment is not limitation of the present invention.In technological thought category of the present invention, can there is various distortion and amendment, retouching that all those of ordinary skill in the art make according to above description, revise or be equal to replacement, all belong to the scope that the present invention protects.
Claims (10)
1. a new waterproof paster LED, it comprises that epoxy encapsulation main body and one end stretch at least two supports of epoxy encapsulation body interior, wherein a support is provided with crystal bonding area, in crystal bonding area, be fixed with LED wafer, it is characterized in that: the end face of described epoxy encapsulation main body is made up of the top plane of surrounding and middle exiting surface, described exiting surface is dome shape, thereby forms spherical lens.
2. a kind of new waterproof paster LED according to claim 1, it is characterized in that: the top plane that is sunken to described epoxy encapsulation main body in described spherical lens, be the peak of described sphere lens, in the plane at plane place, the top of described epoxy encapsulation main body.
3. a kind of new waterproof paster LED according to claim 1, it is characterized in that: described support always has four, described crystal bonding area is arranged on one bowl of cup, and the support with bowl cup is common port support, in described crystal bonding area, be provided with three LEDs wafers, and three LEDs wafers are connected with its excess-three support respectively by gold thread.
4. a kind of new waterproof paster LED according to claim 3, it is characterized in that: epoxy encapsulation body interior is all stretched in one end of described four supports, the other end is support pin, and described support pin, after bending, turns back to the bottom of epoxy encapsulation main body.
5. a kind of new waterproof paster LED according to claim 1, is characterized in that: described crystal bonding area is round table-like, and described LED wafer is fixed on bottom, crystal bonding area by colloid.
6. a production technology for new waterproof paster LED, is characterized in that: this production technology comprises the following steps:
The making of A, support: choose copper material, adopt bracket mould to carry out cold stamping to copper material, obtain support, wherein there is the crystal bonding area for fixed L ED wafer on a support;
B, LED wafer are fixed: the crystal bonding area that LED wafer is fixed on to support;
C, bonding wire: the weld zone of the solder joint of LED wafer and remaining stents is welded;
D, extrusion molding encapsulation: utilize high-pressure injection moulding machine, to the two stands extrusion molding encapsulation of bonding wire;
E, curing: utilize high temperature roaster to be cured in type material;
F, clubfoot: material is carried out to clubfoot processing, obtain the individuality of waterproof paster LED.
7. the production technology of a kind of new waterproof paster LED according to claim 6, is characterized in that: further comprising the steps in described step B:
LED wafer fixing glue is put respectively at three places of the crystal bonding area of B1, the support that makes in steps A, in the time of glue, ensures that each some Jiao Chu connects without colloid;
B2, three LED wafers are placed on respectively to three some Jiao Chu of crystal bonding area;
After B3, LED wafer place, support and LED wafer are sent in heated-air circulation roaster and be cured, the baking temperature in heated-air circulation roaster is 150-160 DEG C, and baking time is 60 minutes.
8. the production technology of a kind of new waterproof paster LED according to claim 6, is characterized in that: further comprising the steps in described step D:
D1, by the two stands of bonding wire, put into high-pressure injection plastic machine die cavity, use epoxy encapsulation sizing material to carry out moulding encapsulation, after encapsulation, form one end of coated stent and the epoxy encapsulation main body of LED chip, the end face of this epoxy encapsulation main body is made up of the top plane of surrounding and middle exiting surface, exiting surface is dome shape, thereby forms spherical lens;
D2, the support after encapsulation is sent in heated-air circulation roaster and is cured, the temperature in heated-air circulation roaster is 150-160 DEG C, and baking time is 3.5-4.5 hour.
9. the production technology of a kind of new waterproof paster LED according to claim 8, is characterized in that: described epoxy encapsulation sizing material is freezing solid-state shape in the time not using; Temperature in described heated-air circulation roaster is 155 DEG C, and baking time is 4 hours.
10. the production technology of a kind of new waterproof paster LED according to claim 6, is characterized in that: further comprising the steps in described step F:
F1, utilize bent pin mould, the pin of material is carried out to bending, the pin end of material is turned back to epoxy encapsulation bottom part body;
F2, utilize threshing mould that material is separated from support, thereby obtain the individuality of waterproof paster LED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310150635.5A CN104124328A (en) | 2013-04-26 | 2013-04-26 | Novel waterproof SMD (surface mounted device) LED and production technology thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310150635.5A CN104124328A (en) | 2013-04-26 | 2013-04-26 | Novel waterproof SMD (surface mounted device) LED and production technology thereof |
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| CN104124328A true CN104124328A (en) | 2014-10-29 |
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| CN201310150635.5A Pending CN104124328A (en) | 2013-04-26 | 2013-04-26 | Novel waterproof SMD (surface mounted device) LED and production technology thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105047797A (en) * | 2015-09-17 | 2015-11-11 | 深圳成光兴光电技术股份有限公司 | SMD LED packaging structure |
| CN106252486A (en) * | 2016-08-03 | 2016-12-21 | 中山市雄纳五金照明科技有限公司 | A kind of manufacture method of Surface-mount LED lamp |
| CN108447961A (en) * | 2018-04-17 | 2018-08-24 | 深圳成光兴光电技术股份有限公司 | A kind of paster type light emitting type and electronic equipment |
| CN109119517A (en) * | 2018-09-12 | 2019-01-01 | 宁波升谱光电股份有限公司 | A kind of adopting surface mounted LED and preparation method thereof |
| CN113314653A (en) * | 2021-04-14 | 2021-08-27 | 浙江韩宇光电科技有限公司 | High-brightness multicolor LED (light-emitting diode) patch support and production process thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080099779A1 (en) * | 2006-10-25 | 2008-05-01 | Yi-Ming Huang | SMD diode holding structure and package thereof |
| CN102412362A (en) * | 2011-10-22 | 2012-04-11 | 浙江英特来光电科技有限公司 | Full outdoor light-emitting diode (LED) lamp with lens |
| CN202434510U (en) * | 2011-12-14 | 2012-09-12 | 四川柏狮光电技术有限公司 | Full color SMD (Surface Mount Device) LED (Light-Emitting Diode) |
| CN203218329U (en) * | 2013-04-26 | 2013-09-25 | 四川柏狮光电技术有限公司 | Novel waterproof SMD (surface mounted device) LED |
-
2013
- 2013-04-26 CN CN201310150635.5A patent/CN104124328A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080099779A1 (en) * | 2006-10-25 | 2008-05-01 | Yi-Ming Huang | SMD diode holding structure and package thereof |
| CN102412362A (en) * | 2011-10-22 | 2012-04-11 | 浙江英特来光电科技有限公司 | Full outdoor light-emitting diode (LED) lamp with lens |
| CN202434510U (en) * | 2011-12-14 | 2012-09-12 | 四川柏狮光电技术有限公司 | Full color SMD (Surface Mount Device) LED (Light-Emitting Diode) |
| CN203218329U (en) * | 2013-04-26 | 2013-09-25 | 四川柏狮光电技术有限公司 | Novel waterproof SMD (surface mounted device) LED |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105047797A (en) * | 2015-09-17 | 2015-11-11 | 深圳成光兴光电技术股份有限公司 | SMD LED packaging structure |
| CN106252486A (en) * | 2016-08-03 | 2016-12-21 | 中山市雄纳五金照明科技有限公司 | A kind of manufacture method of Surface-mount LED lamp |
| CN108447961A (en) * | 2018-04-17 | 2018-08-24 | 深圳成光兴光电技术股份有限公司 | A kind of paster type light emitting type and electronic equipment |
| CN109119517A (en) * | 2018-09-12 | 2019-01-01 | 宁波升谱光电股份有限公司 | A kind of adopting surface mounted LED and preparation method thereof |
| CN113314653A (en) * | 2021-04-14 | 2021-08-27 | 浙江韩宇光电科技有限公司 | High-brightness multicolor LED (light-emitting diode) patch support and production process thereof |
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Application publication date: 20141029 |
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