CN105047797A - SMD LED packaging structure - Google Patents

SMD LED packaging structure Download PDF

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Publication number
CN105047797A
CN105047797A CN201510593988.1A CN201510593988A CN105047797A CN 105047797 A CN105047797 A CN 105047797A CN 201510593988 A CN201510593988 A CN 201510593988A CN 105047797 A CN105047797 A CN 105047797A
Authority
CN
China
Prior art keywords
fin
depressed
wafer
plastic cement
led encapsulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510593988.1A
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Chinese (zh)
Inventor
王卫国
何细雄
胡自立
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Cgx Optoelectronic Technology Inc
Original Assignee
Shenzhen Cgx Optoelectronic Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Cgx Optoelectronic Technology Inc filed Critical Shenzhen Cgx Optoelectronic Technology Inc
Priority to CN201510593988.1A priority Critical patent/CN105047797A/en
Publication of CN105047797A publication Critical patent/CN105047797A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/642Heat extraction or cooling elements characterized by the shape

Abstract

The invention belongs to the technical field of LED packaging structures, and particularly relates to an SMD LED packaging structure. The SMD LED packaging structure comprises support cooling fins, a wafer, plastics and a sealant body. The support cooling fins comprises the first cooling fin and the second cooling fin, the plastics is provided with a first concave portion, the first cooling fin and the second fin are both embedded into the plastics, and part of the cooling fins are exposed into the first concave portion. A clearance is formed by the first cooling fin and the second cooling fin in the plastics, the wafer is located in the plastics and electrically connected to the first cooling fin and the second cooling fin, and the first concave portion is filled with the sealant body in a sealing and fixing mode. A second concave portion is formed at the position, at the bottom end in the first concave portion, of the second cooling fin, and the wafer is located in the second concave portion. The second concave portion is formed at the position, at the bottom end in the second cooling fin, and therefore the cup-in-cup SMD LED packaging structure is formed. The SMD LED packaging structure has the advantages of being good in light condensation effect and high in light emitting efficiency.

Description

A kind of paster LED encapsulating structure
Technical field
The invention belongs to LED (light-emitting diode) encapsulating structure technical field, particularly relate to a kind of paster LED encapsulating structure.
Background technology
Because LED has, the life-span is long, energy consumption is low, start the advantages such as fast, and be widely used in illuminating industry, the LED encapsulation structure on market is of all kinds.Current low-power LED packaged type has plug-in type LED (see Fig. 1) and adopting surface mounted LED (see Fig. 2) two kinds, because cost of labor increases, plug-in type LED is difficult to carry out paster operation (namely do mechanization operation difficulty is large), and the lighting angle of adopting surface mounted LED is more than 120 degree substantially at present, there is spotlight effect difference in it, the shortcoming that light extraction efficiency is lower.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of spotlight effect good and the paster LED encapsulating structure that light extraction efficiency is high.
The present invention realizes like this, a kind of paster LED encapsulating structure, comprise support fin, wafer, plastic cement and sealed colloid, described support fin comprises the first fin and the second fin, described plastic cement offers the first depressed part, described first fin and the second fin all embed in described plastic cement, and partial denudation is in described first depressed part, described first fin and the second fin form a gap in described plastic cement, described wafer is positioned at described plastic cement and is electrically connected at described first fin and the second fin respectively, described sealed colloid fills sealing in described first depressed part, the bottom of described second fin in described first depressed part forms the second depressed part, and described wafer is positioned at described second depressed part.
Further, one end of described wafer is electrically connected at described first fin by wire, the other end be fixed on bottom upper surface in described second depressed part and with its electric connection.
Further, the area of described second fin is greater than the area of the first fin.
Further, the bottom surface, bottom of described second depressed part exposes the bottom of described plastic cement.
Further, the lateral cross section of described first depressed part is square.
Further, the longitudinal cross-section of described second depressed part is inverted trapezoidal.
Further, the lateral cross section of described second depressed part is rounded.
Further, the upper end of described sealed colloid forms ball head structure.
The present invention compared with prior art, beneficial effect is: in the embodiment of the present invention, the second fin forms the second depressed part in the bottom of the first depressed part, thus form the paster LED encapsulating structure of " in cup cup ", the light that wafer is launched is after the reflecting condensation of the second depressed part, again reduce lighting angle further through the first depressed part and carry out reflecting condensation, to reach the good and effect that light extraction efficiency is high of optically focused.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the plug-in type LED encapsulation structure that prior art provides;
Fig. 2 is the schematic diagram of the adopting surface mounted LED encapsulating structure that prior art provides;
Fig. 3 is the cross-sectional schematic of the paster LED encapsulating structure of the embodiment of the present invention;
Fig. 4 is the schematic top plan view before paster LED encapsulating structure sealing embodiment illustrated in fig. 3;
Fig. 5 is the schematic top plan view after paster LED encapsulating structure sealing embodiment illustrated in fig. 3;
Fig. 6 is the elevational schematic view of paster LED encapsulating structure embodiment illustrated in fig. 3;
Fig. 7 is the bottom surface paster schematic diagram of paster LED encapsulating structure embodiment illustrated in fig. 3;
Fig. 8 is the side paster schematic diagram of paster LED encapsulating structure embodiment illustrated in fig. 4.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
As shown in Figure 3 and Figure 4, a kind of paster LED encapsulating structure of the embodiment of the present invention, comprises support fin, wafer 4, plastic cement 3 and sealed colloid 6.Support fin comprises the first fin 1 and the second fin 2, plastic cement 3 offers the first depressed part 8, first fin 1 and the second fin 2 all embed in plastic cement 3, and partial denudation is in the first depressed part 8, and the first fin 1 and the second fin 2 form a gap 10 in plastic cement 3.Wafer 5 is positioned at plastic cement 3, and is electrically connected at the first fin 1 and the second fin 2 respectively, and sealed colloid 6 fills sealing in the first depressed part 8.The bottom of the second fin 2 in the first depressed part 8 forms the second depressed part 4, and wafer 5 is positioned at the second depressed part 4.
Particularly, embed the first fin 1 in plastic cement 3 and the second fin 2 equal some be exposed to bottom in the first depressed part 8, it is as the part be electrically connected with wafer 5; Another part is positioned at outside plastic cement 3, and it is as the part be electrically connected with outside line.Extend to the first fin 1 outside plastic cement 3 and the second fin 2 bends from the sidepiece of plastic cement 3 bottom extending to plastic cement 3, can the effect (referring to aftermentioned) of paster to reach.
In above-described embodiment, one termination electrode of wafer 5 is electrically connected on the first fin 1 that part is placed in the first depressed part 8 by wire 9, the other end electrode of wafer 5 be fixed on bottom upper surface in the second depressed part 4 of the second fin 2 and with its electric connection, thus make the first fin 1, wafer 5 and the second fin 2 form conductive path.Wafer 5 is in the present embodiment set to one, also can arrange the number of wafer 5 in other embodiments as required.
In above-described embodiment, the lateral cross section of the first depressed part 8 is square, longitudinal cross-section is inverted trapezoidal, the lateral cross section of the second depressed part 4 is rounded, longitudinal cross-section is inverted trapezoidal, enlarging one end of second depressed part 4 communicates with the bottom of the first depressed part 8, makes the first depressed part 8 and the second depressed part 4 form the structure of " in cup cup ".Like this, the light that wafer 5 is launched is after the second depressed part 4 carries out reflecting condensation, again can reduce lighting angle further through the first depressed part 8 and carry out reflecting condensation, compared with traditional adopting surface mounted LED encapsulating structure (as shown in Figure 2), better spotlight effect can be reached, improve light extraction efficiency.
In above-described embodiment, the area of the second fin 2 is greater than the area of the first fin 1, and making, the second fin 2 has enough large area to form the second depressed part 4.
As shown in Fig. 3 and Fig. 5, form a ball head structure 7 in the embodiment of the present invention in the upper end of sealed colloid 6, its ball head structure 7 can improve the spotlight effect of this LED encapsulation structure further.
As shown in Figure 6, the bottom surface, bottom 41 of the second depressed part 4 of the embodiment of the present invention exposes the bottom of plastic cement 3, so as to make the second depressed part 4 of the second fin 2 bottom can with external contact, improve further the radiating effect of this LED encapsulation structure.
As illustrated in figs. 7 and 8, the part that first fin 1 of the embodiment of the present invention and the second fin 2 expose to plastic cement 3 bends the bottom extending to plastic cement 3 from the side, and the bottom surface of this paster LED encapsulating structure can not only be made can directly to fit in (as shown in Figure 7) on wiring board 12 by tin cream 11; Its side can also be made also directly to fit in (as shown in Figure 8) on wiring board 12 by tin cream 11, and to cause the paster mode of this paster LED encapsulating structure just to paste, also can paste side, it has good practicality.
In sum, the present invention has preferably spotlight effect and light extraction efficiency, has the advantage of good heat dissipation effect simultaneously, and its structure also simplify procedure for producing, reduces production cost; There are practical value and market prospects well.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.

Claims (8)

1. a paster LED encapsulating structure, comprise support fin, wafer, plastic cement and sealed colloid, described support fin comprises the first fin and the second fin, described plastic cement offers the first depressed part, described first fin and the second fin all embed in described plastic cement, and partial denudation is in described first depressed part, described first fin and the second fin form a gap in described plastic cement, described wafer is positioned at described plastic cement and is electrically connected at described first fin and the second fin respectively, described sealed colloid fills sealing in described first depressed part, it is characterized in that: the bottom of described second fin in described first depressed part forms the second depressed part, and described wafer is positioned at described second depressed part.
2. paster LED encapsulating structure as claimed in claim 1, is characterized in that: one end of described wafer is electrically connected at described first fin by wire, the other end be fixed on bottom upper surface in described second depressed part and with its electric connection.
3. paster LED encapsulating structure as claimed in claim 2, is characterized in that: the area of described second fin is greater than the area of described first fin.
4. the paster LED encapsulating structure according to any one of claim 1-3, is characterized in that: the bottom surface, bottom of described second depressed part exposes the bottom of described plastic cement.
5. the paster LED encapsulating structure according to any one of claim 1-3, is characterized in that: the lateral cross section of described first depressed part is square.
6. the paster LED encapsulating structure according to any one of claim 1-3, is characterized in that: the longitudinal cross-section of described second depressed part is inverted trapezoidal.
7. paster LED encapsulating structure as claimed in claim 6, is characterized in that: the lateral cross section of described second depressed part is rounded.
8. the paster LED encapsulating structure according to any one of claim 1-3, is characterized in that: the upper end of described sealed colloid forms ball head structure.
CN201510593988.1A 2015-09-17 2015-09-17 SMD LED packaging structure Pending CN105047797A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510593988.1A CN105047797A (en) 2015-09-17 2015-09-17 SMD LED packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510593988.1A CN105047797A (en) 2015-09-17 2015-09-17 SMD LED packaging structure

Publications (1)

Publication Number Publication Date
CN105047797A true CN105047797A (en) 2015-11-11

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106328642A (en) * 2016-10-18 2017-01-11 深圳成光兴光电技术股份有限公司 Chip LED for mixed light source

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100213496A1 (en) * 2009-02-25 2010-08-26 Everlight Electronics Co., Ltd. Light emitting diode package
CN102044599A (en) * 2009-10-10 2011-05-04 亿光电子工业股份有限公司 Light-emitting diode (LED)
CN103872219A (en) * 2014-03-18 2014-06-18 深圳市瑞丰光电子股份有限公司 LED packaging support and LED luminophor
CN104124328A (en) * 2013-04-26 2014-10-29 四川柏狮光电技术有限公司 Novel waterproof SMD (surface mounted device) LED and production technology thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100213496A1 (en) * 2009-02-25 2010-08-26 Everlight Electronics Co., Ltd. Light emitting diode package
CN102044599A (en) * 2009-10-10 2011-05-04 亿光电子工业股份有限公司 Light-emitting diode (LED)
CN104124328A (en) * 2013-04-26 2014-10-29 四川柏狮光电技术有限公司 Novel waterproof SMD (surface mounted device) LED and production technology thereof
CN103872219A (en) * 2014-03-18 2014-06-18 深圳市瑞丰光电子股份有限公司 LED packaging support and LED luminophor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106328642A (en) * 2016-10-18 2017-01-11 深圳成光兴光电技术股份有限公司 Chip LED for mixed light source

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Application publication date: 20151111

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