CN218939723U - High-brightness COB packaging structure and LED lamp - Google Patents

Abstract

The utility model provides a high-brightness COB packaging structure and an LED lamp, wherein the high-brightness COB packaging structure comprises: the LED lamp comprises a substrate, an insulating layer, a circuit layer and an LED chip, wherein the LED chip is fixed on the circuit layer, the insulating layer is arranged between the substrate and the circuit layer, the substrate is mirror aluminum, and through holes penetrating through the insulating layer and the circuit layer are formed between the substrate and the LED chip. When the COB packaging structure is formed, the mirror aluminum is used as the substrate, and the through holes are arranged between the LED chip and the mirror aluminum, so that the reflectivity of the substrate to light is greatly improved, the light of the LED chip can be fully reflected, the luminous flux and the luminous efficiency of the product are improved, and the energy-saving effect is improved.

Description

High-brightness COB packaging structure and LED lamp

Technical Field

The utility model relates to the technical field of LED lamps, in particular to a high-brightness COB packaging structure and an LED lamp.

Background

COB is a shorthand for Chip on Board english meaning Chip-on-Board packaging technology, which can be understood simply as: and the LED chips are integrated and packaged on the luminous body on the same substrate. COB integrated packaging is a relatively mature LED packaging mode, and with the wide application of LED products in the lighting field, COB light sources have become one of the mainstream products of the packaging industry.

However, the existing COB packaging structure is difficult to fully reflect light emitted by the LED chip, so that the luminous flux of the product is low, the light efficiency is low, and energy is not saved enough.

Disclosure of Invention

In order to overcome the defects of the prior art, the utility model provides the high-brightness COB packaging structure and the LED lamp, when the COB packaging structure is formed, mirror aluminum is used as a substrate, and through holes are arranged between the LED chip and the mirror aluminum, so that the reflectivity of the substrate to light is greatly improved, the light of the LED chip can be fully reflected, the luminous flux and the luminous efficiency of a product are improved, and the energy-saving effect is improved.

In order to solve the problems, the utility model adopts a technical scheme that: a high-luminance COB package, the high-luminance COB package comprising: the LED lamp comprises a substrate, an insulating layer, a circuit layer and an LED chip, wherein the LED chip is fixed on the circuit layer, the insulating layer is arranged between the substrate and the circuit layer, the substrate is mirror aluminum, and a through hole penetrating through the insulating layer and the circuit layer is formed between the substrate and the LED chip.

Further, the LED chip comprises at least one of a flip chip and a vertical chip.

Further, the high-brightness COB packaging structure further comprises an anode and a cathode, wherein the anode and the cathode are arranged around the LED chip and are electrically connected with the LED chip through the circuit layer.

Further, one ends of the positive electrode and the negative electrode, which are connected with the LED chips, are annular, a circular area is formed opposite to each other, and the LED chips are arranged in the circular area in series.

Further, the high-brightness COB package structure further includes a white oil layer covering a portion of the circuit layer where the LED chip is not disposed and extending along the circuit layer to the insulating layer.

Further, the high-brightness COB packaging structure further comprises a silica gel layer, and the silica gel layer covers the surrounding area of the anode and the cathode.

Further, the positive electrode and the negative electrode are exposed to the Bai Youceng.

Further, solder paste is arranged on one side, in contact with the circuit layer, of the LED chip, and the LED chip is fixed on the circuit layer through the solder paste.

Based on the same inventive concept, the utility model also provides an LED lamp, which comprises a driving circuit and at least one high-brightness COB packaging structure.

Compared with the prior art, the utility model has the beneficial effects that: when the COB packaging structure is formed, the mirror aluminum is used as the substrate, and through holes are formed between the LED chip and the mirror aluminum, so that the reflectivity of the substrate to light is greatly improved, the light of the LED chip can be fully reflected, the luminous flux and the light efficiency of the product are improved, and the energy-saving effect is improved.

Drawings

FIG. 1 is a block diagram of an embodiment of a high-brightness COB package structure according to the present utility model;

FIG. 2 is a top view of an embodiment of a high-brightness COB package structure according to the present utility model;

fig. 3 is a block diagram of an embodiment of an LED lamp according to the present utility model.

In the figure: 1. a mirror surface; 2. a positive electrode; 3. a negative electrode; 4. a substrate; 5. an insulating layer; 6. bai Youceng; 7. a circuit layer; 8. solder paste; 9. an LED chip.

Detailed Description

Other advantages and effects of the present application will become apparent to those skilled in the art from the present disclosure, when the following description of the embodiments is taken in conjunction with the accompanying drawings. The present application may be embodied or carried out in other specific embodiments, and the details of the present application may be modified or changed from various points of view and applications without departing from the spirit of the present application. It is noted that the various embodiments of the present disclosure, which are generally described and illustrated in the figures herein, may be combined with one another without conflict, wherein structural components or functional modules may be arranged and designed in a variety of different configurations. Thus, the following detailed description of the embodiments of the present disclosure provided in the accompanying drawings is not intended to limit the scope of the disclosure, as claimed, but is merely representative of selected embodiments of the disclosure. Based on the embodiments in this disclosure, all other embodiments that a person of ordinary skill in the art would obtain without making any inventive effort are within the scope of protection of this disclosure.

The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.

Referring to fig. 1 and 2, fig. 1 is a block diagram illustrating an embodiment of a high-brightness COB package structure of the utility model; fig. 2 is a top view of an embodiment of a high-brightness COB package of the utility model. The high-luminance COB package structure of the present utility model will be described with reference to fig. 1 and 2.

In this embodiment, the high-brightness COB package structure includes: the LED chip 9 is fixed on the circuit layer 7, the insulating layer 5 is arranged between the substrate 4 and the circuit layer 7, the substrate 4 is mirror aluminum, and through holes penetrating through the insulating layer 5 and the circuit layer 7 are formed between the substrate 4 and the LED chip 9. Among them, the mirror surface 1 of the mirror aluminum faces the LED chip 9, and the light emitted from the LED chip 9 is reflected by the mirror surface 1. And the heat conduction and heat dissipation of the COB packaging structure are also realized through mirror aluminum arranged at the bottom of the COB packaging structure. The insulating layer 5 provided between the circuit layer 7 and the substrate 4 realizes electrical insulation between the substrate 4 and the circuit layer 7.

In the present embodiment, the LED chip 9 includes at least one of flip chip and vertical chip. Wherein, the kind and the number of the LED chips 9 on the setting circuit layer 7 can be set according to the user's demands.

In this embodiment, the high-brightness COB package structure further includes a positive electrode 2 and a negative electrode 3, where the positive electrode 2 and the negative electrode 3 are disposed around the LED chip 9 and electrically connected to the LED chip 9 through the circuit layer 7. The positive electrode 2 is connected to the positive electrode 2 of the LED chip 9, and the negative electrode 3 is connected to the negative electrode 3 of the LED chip 9.

In other embodiments, the positive electrode 2 and the negative electrode 3 may be disposed in parallel on two sides of the LED chip 9, or may be disposed side by side on the same side of the LED chip 9, and specific positions of the positive electrode 2 and the negative electrode 3 may be set according to the user requirement, which is not limited herein.

In one embodiment, one end of the positive electrode 2 and the negative electrode 3, which is connected with the LED chip 9, is annular, and circular areas are formed opposite to each other, and the LED chips 9 are arranged in the circular areas in series. The other ends of the positive electrode 2 and the negative electrode 3 extend to a side away from the LED chip 9. The driving circuit is connected with the positive electrode 2 and the negative electrode 3 to connect to and drive the high-brightness COB package.

The LED chips 9 on the circuit layer 7 may be all connected in series, or may form a plurality of series structures, where the plurality of series structures are arranged in parallel, and may be connected in a partially serial manner and a partially parallel manner, and the specific connection manner is set according to the user requirement, and only the LED chips 9 need to work normally, which is not limited herein.

The high-brightness COB package further includes a white oil layer 6, and the white oil layer 6 covers a portion of the circuit layer 7 where the LED chip 9 is not disposed, and extends along the circuit layer 7 to the insulating layer 5. The reflectivity of the white oil layer 6 is about 70-80%, the reflectivity is low, the rest 30-20% of light is not reflected and is not utilized, 20-30% of light energy is wasted, the reflectivity of mirror aluminum reaches 98%, the traditional flip chip COB brightness can be improved by 18-28%, and the light emitted by the LED chip 9 can be further reasonably utilized.

Since the positive electrode 2 and the negative electrode 3 need to be connected to an external power source such as a driving circuit, the white oil layer 6 is exposed to the positive electrode 2 and the negative electrode 3. The positive electrode 2 and the negative electrode 3 may partially expose the white oil layer 6, or may completely expose the white oil layer 6.

The high-brightness COB packaging structure further comprises a silica gel layer, the silica gel layer fills the surrounding area of the anode and the cathode, the space between the LED chips 9 is included, and part of light emitted by the LED chips 9 is reflected to mirror aluminum by silica gel and is reflected out through the mirror aluminum.

In one embodiment, the side of the LED chip 9 contacting the circuit layer 7 is provided with a solder paste 8, and the LED chip 9 is fixed on the circuit layer 7 by the solder paste 8. The solder paste 8 can be used for welding the LED chip 9 and the circuit layer 7, and the solder paste 8 can also be used for conducting heat to the bottom of the mirror aluminum for heat dissipation.

The high-brightness COB package structure is further described below through the formation process of the high-brightness COB package structure.

The process flow steps for manufacturing the high-brightness COB packaging structure are as follows: the method comprises the steps of taking mirror aluminum as a substrate 4 of a COB packaging structure, paving one layer of insulating layer 5 on the smooth surface of the substrate 4 according to a circuit of a designed circuit layer 7, not paving the insulating layer 5 at a position corresponding to an LED chip 9, paving the circuit layer 7, designing the circuit layer 7 according to requirements, paving a white oil layer 6 again, repeatedly paving and covering the insulating layer 5 and the circuit layer 7 according to a path of the paved insulating layer 5, protecting the insulating layer 5 and the circuit layer 7 from external pollution, oxidation, leakage and the like, not performing covering and paving at a position which is required to reserve the electrode size of the LED chip 9 when the circuit layer 7 is covered, reserving the position which is required to be coated with the solder paste 8 at the electrode size of the LED chip 9, then aligning the electrode of the LED chip 9 with the position of the coated solder paste 8, then welding the LED chip 9 to be connected with the circuit layer 7 through the solder paste 8, and not covering the anode 2 and the cathode 3 when the white oil layer 6 is paved in a covering manner, and connecting the anode 2 and the cathode 3 with an external power supply when the circuit layer 7 is required to be covered.

When the external power supply (driving circuit) is connected to the positive electrode 2 and the negative electrode 3 and current is conducted, the current enters from the positive electrode 2 to the solder paste 8 through the circuit layer 7, the LED chip 9 receives the current to emit light, and the light emitted by six surfaces of the LED chip 9 is reflected out through the mirror surface 1. The silica gel is filled between the LED chips 9, and light of the other five surfaces is partially refracted by the silica gel and reflected on the mirror surface 1 of the substrate 4, so that the brightness of the whole COB package structure can be improved.

The beneficial effects are that: when the COB packaging structure is formed, the mirror aluminum is used as the substrate 4, and the through holes are arranged between the LED chip 9 and the mirror aluminum, so that the reflectivity of the substrate 4 to light is greatly improved, the light of the LED chip 9 can be fully reflected, the luminous flux and the light efficiency of a product are improved, and the energy-saving effect is improved.

Based on the same inventive concept, the utility model further provides an LED lamp, refer to fig. 3, fig. 3 is a structural diagram of an embodiment of the LED lamp of the utility model, and the LED lamp of the utility model is described with reference to fig. 3.

In this embodiment, the LED lamp includes a driving circuit and at least one high-brightness COB package structure as described in the above embodiment. The driving circuit is electrically connected with the LED chip in the high-brightness COB packaging structure, and the LED chip is driven to emit light through the driving circuit.

In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (9)

1. The utility model provides a hi-lite COB packaging structure which characterized in that, hi-lite COB packaging structure includes:

the LED lamp comprises a substrate, an insulating layer, a circuit layer and an LED chip, wherein the LED chip is fixed on the circuit layer, the insulating layer is arranged between the substrate and the circuit layer, the substrate is mirror aluminum, and a through hole penetrating through the insulating layer and the circuit layer is formed between the substrate and the LED chip.

2. The high brightness COB package of claim 1, wherein the LED chip comprises at least one of flip-chip, vertical chip.

3. The high-brightness COB package of claim 1 further comprising a positive electrode, a negative electrode disposed around the LED chip and electrically connected to the LED chip through the circuit layer.

4. The COB package as claimed in claim 3, wherein the ends of the positive and negative electrodes connected to the LED chips are ring-shaped, and are opposite to each other to form a circular area, and the LED chips are serially arranged in the circular area.

5. The high brightness COB package of claim 3 further comprising a white oil layer that covers the portion of the circuit layer where no LED die is disposed and extends along the circuit layer to an insulating layer.

6. The high brightness COB package of claim 5, further comprising a silicone layer covering the area surrounded by the positive and negative electrodes.

7. The high brightness COB package structure of claim 5 wherein said positive and negative electrodes are exposed to said Bai Youceng.

8. The high-brightness COB package of claim 1 wherein the LED chip is provided with solder paste on the side of the LED chip that contacts the circuit layer, and the LED chip is affixed to the circuit layer by the solder paste.

9. An LED lamp comprising a driving circuit, at least one high brightness COB package as claimed in any one of claims 1-8.

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