CN208460787U - A kind of New CSP light modulation color modulating light source - Google Patents

Abstract

The utility model discloses a kind of New CSP to dim color modulating light source, including aluminum nitride ceramic substrate, the aluminum nitride ceramic substrate upper end face is fixedly installed heat-conducting layer, the heat-conducting layer is fixedly installed line layer pad far from aluminum nitride ceramic substrate side, the line layer pad is fixedly installed thermoelectricity separating layer close to aluminum nitride ceramic substrate side, the line layer pad is fixedly installed line layer far from heat-conducting layer side, the line layer is fixedly installed fence glue-line far from line layer pad side, the fence glue-line is fixedly installed transparent filling glue layer close to thermoelectricity separating layer side, the transparent filling glue layer is fixedly installed PCB route close to line layer pad side.The utility model realizes the PCB layout circuit package mode of double pad independent controls, and photochromic effect can be promoted by meeting light modulation toning function using CSP packaging technology, improves the effect of steady illumination, has the advantages that structure is simple, easy to use, using effect is good.

Description

A kind of New CSP light modulation color modulating light source

Technical field

The utility model relates to technical field of LED illumination, specially a kind of New CSP dims color modulating light source.

Background technique

COB light source is that the high photosynthetic efficiency being placed directly against LED chip on the mirror metal substrate of high reflecting rate integrates area source Technology, this technology eliminate bracket concept, electroless plating, without Reflow Soldering, without patch process.COB light source can simply be interpreted as high Power integrates area source, and the lighting area and outer dimension of light source can be designed according to product shape structure, can carry out product Secondary optics it is mating, improve lighting quality, naked core chip technology is there are mainly two types of form: a kind of COB technology, another kind are upside-down mountings Chip technology, chip on board encapsulation, on a printed-wiring board, the electrical connection of chip and substrate is with drawing for semiconductor chip handover attachment Line sewing method is realized.COB chip on board technical process be first in substrate surface heat-conduction epoxy resin, it is general with mixing silver-colored The epoxy resin of grain covers silicon wafer nest point, silicon wafer is then rest directly upon substrate surface, and it is solid securely to be heat-treated to silicon wafer Until being scheduled on substrate, electrical connection is directly established between silicon wafer and substrate followed in turn by the method for wire bond.But traditional tune Light class COB uses gluing process, and since colour temperature difference causes the double-colored photochromic consistency of temperature area source product poor after light modulation, technique is difficult It is with high costs in control.

Utility model content

The purpose of this utility model is to provide a kind of New CSP to dim color modulating light source, to solve in above-mentioned background technique The problem of proposition.

To achieve the above object, the utility model provides the following technical solutions: a kind of New CSP light modulation color modulating light source, packet Aluminum nitride ceramic substrate is included, the aluminum nitride ceramic substrate upper end face is fixedly installed heat-conducting layer, and the heat-conducting layer is far from nitrogen Change aluminium ceramic substrate side and be fixedly installed line layer pad, the line layer pad is fixed close to aluminum nitride ceramic substrate side It is provided with thermoelectricity separating layer, the line layer pad is fixedly installed line layer far from heat-conducting layer side, and the line layer is separate Line layer pad side is fixedly installed fence glue-line, and the fence glue-line is fixedly installed transparent close to thermoelectricity separating layer side Glue layer is filled, the transparent filling glue layer is fixedly installed PCB route, the PCB route close to line layer pad side 12 positive white LEDs chips are fixedly installed far from line layer pad side, the PCB route is far from positive white LEDs chip two sides It is fixedly installed 13 warm white LED chips respectively, the positive white LEDs chip is fixedly installed CSP close to fence glue-line side Chip.

Preferably, the positive white LEDs chip is fixedly installed tin cream close to line layer two sides.

Preferably, the aluminum nitride ceramic substrate opens up that there are two threaded holes far from positive white LEDs chip two sides are fixed respectively.

Preferably, the CSP chip interior is fixedly installed series and parallel circuit.

Preferably, the fence glue-line is fixedly installed heat dissipation fence far from CSP chip-side.

Compared with prior art, the utility model has the beneficial effects that

1, the utility model is lost on DPC aluminum nitride ceramic substrate by setting DPC aluminum nitride ceramic substrate, CSP chip Special route is carved, while serial-parallel mirror, the PCB of double pad independent controls are realized using CSP flip chip on a light-emitting surface Wired circuit packaged type, can be with the problem of the photochromic consistency difference of the double-colored temperature area source product of effective solution routine formal dress；

2, the utility model also sets up heat-conducting layer and thermoelectricity separating layer simultaneously, it is ensured that in the heat of DPC aluminum nitride ceramic substrate Electrically separated structure is able to carry out steady operation, while realizing same light-emitting surface different-colour by the encapsulation to CSP flip chip The switching of light source and light mixing function, further improve light modulation illumination effect, have structure it is simple, it is easy to use, use effect The good advantage of fruit.

Detailed description of the invention

Fig. 1 is that a kind of New CSP of the utility model dims color modulating light source overall structure diagram；

Fig. 2 is that a kind of New CSP of the utility model dims color modulating light source cross-sectional view.

In figure: 1- warm white LED chip；2- aluminum nitride ceramic substrate；3- fence glue-line；4-PCB route；The weldering of 5- line layer Disk；The transparent filling glue layer of 6-；7- heat-conducting layer；8- thermoelectricity separating layer；9- line layer；The positive white LEDs chip of 10-；11- tin cream；12- CSP chip；13- heat dissipation fence；14- threaded hole.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

The utility model provides a kind of technical solution referring to FIG. 1-2: a kind of New CSP light modulation color modulating light source, including nitrogen Change aluminium ceramic substrate 2,2 upper end face of aluminum nitride ceramic substrate is fixedly installed heat-conducting layer 7, and the heat-conducting layer 7 is far from nitrogen Change 2 side of aluminium ceramic substrate and be fixedly installed line layer pad 5, the line layer pad 5 is close to 2 side of aluminum nitride ceramic substrate It is fixedly installed thermoelectricity separating layer 8, the line layer pad 5 is fixedly installed line layer 9, the line far from 7 side of heat-conducting layer Road floor 9 is fixedly installed fence glue-line 3 far from 5 side of line layer pad, and the fence glue-line 3 is close to 8 side of thermoelectricity separating layer It is fixedly installed transparent filling glue layer 6, the transparent filling glue layer 6 is fixedly installed PCB close to 5 side of line layer pad Route 4, the PCB route 4 are fixedly installed 12 positive white LEDs chips 10, the PCB line far from 5 side of line layer pad Road 4 is fixedly installed 13 warm white LED chips 1 far from positive 10 two sides of white LEDs chip respectively, and the positive white LEDs chip 10 leans on Nearly 3 side of fence glue-line is fixedly installed CSP chip 12.

The positive white LEDs chip 10 is fixedly installed tin cream 11 close to 9 two sides of line layer, can increase contact electric conductivity, Conductor resistance value is reduced simultaneously；The aluminum nitride ceramic substrate 2 far from positive 10 two sides of white LEDs chip respectively it is fixed open up there are two Threaded hole 14 is convenient for subsequent installation technique；It is fixedly installed series and parallel circuit inside the CSP chip 12, realizes double pads The encapsulation of the PCB route 4 of independent control, and realize and two kinds of light sources are uniformly controlled；The fence glue-line 3 is far from CSP chip 12 sides are fixedly installed heat dissipation fence 13, and further heat radiation guarantees that circuit works normally.

Working principle: the utility model passes through setting aluminum nitride ceramic substrate 2, CSP chip 12, transparent filling glue layer 6, Special construction CSP chip 12 is sticked on 2 surface of aluminum nitride ceramic substrate, by every LED chip tin cream 11 in fence glue-line 3 Connection conducting, wherein the right and left goes here and there 2 simultaneously for 13, and light emission color temperature is warm white, is controlled by a line layer pad 5,12 string 1 of centre And light emission color temperature is positive white, is controlled by another line layer pad 5, additional drive control circuit can individually light warm colour Light can also individually light positive white light, can also light two kinds of colour temperatures simultaneously and realize light mixing, and colour temperature is nature white light after light mixing Color can control simultaneously in the same light-emitting surface double-circuit layer pad 5, while meeting light modulation toning function, significantly be promoted Photochromic effect, high-reliability and bloom quality after light mixing, further improve the effect of steady illumination, simple with structure, Advantage easy to use, using effect is good.

It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment Intrinsic element.

While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims (5)

1. a kind of New CSP dims color modulating light source, including aluminum nitride ceramic substrate (2), it is characterised in that: the aluminium nitride ceramics Substrate (2) upper end face is fixedly installed heat-conducting layer (7), and the heat-conducting layer (7) is fixed far from aluminum nitride ceramic substrate (2) side It is provided with line layer pad (5), the line layer pad (5) is fixedly installed thermoelectricity close to aluminum nitride ceramic substrate (2) side Separating layer (8), the line layer pad (5) are fixedly installed line layer (9) far from heat-conducting layer (7) side, the line layer (9) It is fixedly installed fence glue-line (3) far from line layer pad (5) side, the fence glue-line (3) is close to thermoelectricity separating layer (8) one Side is fixedly installed transparent filling glue layer (6), and the transparent filling glue layer (6) is fixed close to line layer pad (5) side It is provided with PCB route (4), the PCB route (4) is fixedly installed 12 positive white LEDs cores far from line layer pad (5) side Piece (10), the PCB route (4) are fixedly installed 13 warm white LED chips far from positive white LEDs chip (10) two sides respectively (1), the positive white LEDs chip (10) is fixedly installed CSP chip (12) close to fence glue-line (3) side.

2. a kind of New CSP according to claim 1 dims color modulating light source, it is characterised in that: the positive white LEDs chip (10) tin cream (11) are fixedly installed close to line layer (9) two sides.

3. a kind of New CSP according to claim 1 dims color modulating light source, it is characterised in that: the aluminium nitride ceramics base Plate (2) opens up that there are two threaded hole (14) far from positive white LEDs chip (10) two sides are fixed respectively.

4. a kind of New CSP according to claim 1 dims color modulating light source, it is characterised in that: in the CSP chip (12) Portion is fixedly installed series and parallel circuit.

5. a kind of New CSP according to claim 4 dims color modulating light source, it is characterised in that: the fence glue-line (3) is remote Heat dissipation fence (13) is fixedly installed from CSP chip (12) side.