CN103872219A - LED packaging support and LED luminophor - Google Patents
LED packaging support and LED luminophor Download PDFInfo
- Publication number
- CN103872219A CN103872219A CN201410101543.2A CN201410101543A CN103872219A CN 103872219 A CN103872219 A CN 103872219A CN 201410101543 A CN201410101543 A CN 201410101543A CN 103872219 A CN103872219 A CN 103872219A
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- China
- Prior art keywords
- led
- plastic layer
- package support
- led package
- metal substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Abstract
The invention is applied to the field of lighting technologies, relates to an LED packaging support and an LED luminophor and provides an LED support. The LED support comprises a metal substrate provided with a sink bowl, a plastic layer is attached to the inner side face of the sink bowl, the plastic layer extends towards the periphery of the sink bowl to form the bowl edge, and the perpendicular distance from the upper surface of the bowl edge to the bottom of the bowl is one third to three times the thickness of a chip. The field angle of each set of opposite inner side faces of the plastic layer is smaller than 60 degrees. The LED support further comprises a plastic outer packaging piece, a reflector cup is formed on the metal substrate, and the reflector cup and the plastic layer are integrally molded. According to the LED support, the sink bowl is integrally molded on the metal substrate directly, so procedures are saved, and the production efficiency is improved; the depth of the plastic bowl is designed to be one third to three times the thickness of the chip, the field angle of the inner side faces is limited to be 60 degrees, so side face light absorption of the chip can be avoided, obverse side normal light emission can be guaranteed, and the luminous efficiency of an LED is improved; the plastic layer is arranged on the surface of the bowl, so depth and angle setting is facilitated; the reflector cup and the plastic layer are integrally molded, so the reliability of the LED is improved.
Description
Technical field
The present invention relates to LED lighting technical field, relate in particular to a kind of LED package support and LED luminous element.
Background technology
LED is one of current widely used light source, in the manufacturing process of LED, conventionally makes box dam in chip surrounding, so that apply fluorescent glue or packaging plastic, or stop the absorption of chip sidewall to light.Existing box dam manufacture method is before encapsulation, on substrate, to make box dam, then chip is arranged in the middle of box dam one by one to this mode complex procedures, efficiency is lower, has also increased cost, and because box dam is to be independent of on substrate, permanent use has distortion hidden danger, affects the reliability of LED.
Summary of the invention
The object of the present invention is to provide a kind of novel LED package support, be intended to simplify working process, enhance productivity, and improve its reliability.
The present invention realizes like this, a kind of LED package support, comprise metal substrate, described metal substrate has sinking bowl cup integrated with it, the medial surface of described sinking bowl cup is with plastic layer, described plastic layer from described medial surface to described sink the periphery of bowl cup extend to form a glass edge, the upper surface on described cup edge to described sink 1/3～3 times of the vertical range of bottom of the bowl cup thickness that is LED chip; Described plastic layer has two groups of relative medial surfaces, and the subtended angle of every group of relative medial surface is all less than 60 °; Described LED package support also comprises the outer sealing of plastic cement, and the part of the outer sealing of described plastic cement on described metal substrate forms reflector; Described reflector is formed at the periphery of described sinking bowl cup, and one-body molded with described plastic layer.
Another object of the present invention is to provide a kind of LED luminous element, comprise described LED package support, in the described sinking bowl cup of described LED package support, be provided with LED chip.
LED package support provided by the invention is one-body molded sinking bowl cup on metal substrate directly, does not need box dam is set in addition, has saved operation, has improved production efficiency; And, the degree of depth of plastic bowl cup is set to 1/3～3 times of thickness of LED chip, and the subtended angle of two groups of relative medial surfaces is defined as within 60 °, the cooperation of this degree of depth and angle can well be avoided chip sides extinction and ensure positive normal bright dipping, has improved the luminous efficiency of LED; In addition, on the bowl cup surface that sinks, plastic layer is set, has facilitated the setting of the above-mentioned degree of depth and angle, can effectively avoid chip sides extinction; On the other hand, reflector and plastic layer are one-body molded, have further strengthened the adhesion of reflector, plastic layer and metal substrate, have improved the reliability of LED.In addition, the geomery of lower heavy cup can not only be accurately controlled in this kind of design, and owing to being heavy cup project organization, can not destroy the optical texture of reflector, ensures good optical effect.
Brief description of the drawings
Fig. 1 is the front view of the LED package support that provides of the embodiment of the present invention;
Fig. 2 is that the A-A of the package support of LED shown in Fig. 1 is to cutaway view;
Fig. 3 is that the B-B of the package support of LED shown in Fig. 1 is to cutaway view.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Please together consult Fig. 1～3, Fig. 3 analyse and observe there is shown LED chip 4 so that describe, the LED package support that the embodiment of the present invention provides comprises metal substrate 1, it has sinking bowl cup 2 integrated with it, specifically can on a metal tablet, make bowl cup 2 to obtain this metal substrate 1 by methods such as chemical etching, punching press, forging and stamping, casting, machinings.This sinking bowl cup 2 has two groups of relative medial surfaces, on the medial surface of bowl cup 2 that sinks, has plastic layer 3, this plastic layer 3 extends to the periphery of bowl cup 2, form cup along 31, this cup is formed on metal substrate 1 along 31, plastic layer 3 encloses a plastic bowl cup, the degree of depth of this plastic bowl cup (i.e. vertical range between the bottom of the upper surface of cup along 31 and the bowl glasss 2 that sinks) is 1/3～3 times of thickness of LED chip 4, in addition, plastic layer 3 also has two groups of relative medial surfaces, i.e. the first medial surface 32 and the second medial surface 33, the subtended angle β of two the first medial surfaces 32 and two the second medial surfaces 33 is all less than 60 °.Further, this LED package support also comprises the outer sealing 5 of a plastic cement, to all parcel or part parcels of metal substrate 1, part on metal substrate 1 forms reflector 51, this reflector 51 is surrounded on the periphery of bowl cup 2, and the plastic layer 3 that bowl cup 2 surfaces that sink arrange is integrated with this reflector 51, the outer sealing 5 of whole plastic cement is one-body molded together with the plastic layer 3 on bowl cup 2 surfaces that sink.In addition, the coat of metal can be one or several the stepped construction in gold plate, silvering, copper coating, nickel coating and palladium coating.For realizing the electric connection of LED chip 4 and supply line.
This LED package support is one-body molded sinking bowl cup 2 on metal substrate 1 directly, does not need box dam is set in addition, has saved operation, has improved production efficiency; And, the degree of depth of plastic bowl cup is set to 1/3～3 times of thickness of LED chip 4, and the subtended angle of two groups of relative medial surfaces is defined as within 60 °, the cooperation of this degree of depth and angle can well be blocked the light of directive LED chip 4 sides and can not hindered chip front side bright dipping, avoid chip sides extinction and ensured positive normal bright dipping, improved the luminous efficiency of LED; In addition, because the sinking bowl cup 2 of directly making on metal substrate 1, the more difficult control in inclination angle of its side, general inclination angle is larger, and the top edge of bowl cup has larger radius of curvature, these are all unfavorable for blocking the light of directive chip sides, therefore on bowl cup 2 surfaces that sink, plastic layer 3 are set and have facilitated the setting of the above-mentioned degree of depth and angle, can effectively avoid chip sides extinction; On the other hand, reflector 51 is one-body molded with plastic layer 3, has further strengthened the adhesion of reflector 51, plastic layer 3 and metal substrate 1, has improved the reliability of LED.
With further reference to Fig. 1 and Fig. 3, metal substrate 1 can be rectangle, circle or square etc., and it is wrapped in the outer sealing of plastic cement 5 inside, and the shape of reflector 51 can be also rectangle, circle or square etc., preferably consistent with the shape of metal substrate 1.Fig. 1 is a kind of optional implementation, in the region enclosing at reflector 51, the first medial surface 32 of plastic layer 3 is comparatively approaching with the long limit of reflector 51, the cup that the first medial surface 32 connects connects as one with reflector 51 along 31, and the cup that the second medial surface 33 connects is isolated with reflector 51 along 31.
With further reference to Fig. 2, the subtended angle of every group of relative inner face of plastic layer 3 is all under 60 °, the subtended angle α of the medial surface of the sinking bowl cup 2 of metal substrate 1 can accomplish below 120 °, and therefore the thickness of plastic layer 3 is inconsistent at bowl cup depth direction, has lower thin thick feature.
In the present embodiment, the material of the outer sealing 5 of plastic cement and plastic layer 3 can be selected the thermosettings such as PPA, PCT, epoxy resin, silica gel or thermoplastic high reflection plastic material, plasticity and good stability, and be beneficial to reflection of light, reduce and absorb, improved light extraction efficiency.
In the present embodiment, the region enclosing at a plastic cement reflector 51 can be provided with the bowl cup 2 that sinks, as Fig. 1, multiple sinking bowl cups 2 also can be set, for example, in each reflector 51, be provided with three bowl cups 2 that sink, red, green, blue optical chip is set respectively, like this, each reflector 51 with and the internal structure that encloses form a white light unit.Moreover, can also adopt other modes, corresponding two or more sinking bowl cup 2 grades of such as each reflector 51 are all feasible.
Further, in the manufacture process of LED, after installing chip, need carry out a glue process, in fluorescent glue or transparent enclosure glue filling reflector 51, the bowl cup 2 that sinks can be filled up in the lump, also can only be covered in outside LED chip 4 and sinking bowl cup 2.That is: when the bowl cup size that encloses when plastic layer 3 is larger, fluorescent glue or transparent enclosure glue can fill bowl cup 2, the bowl cup size enclosing when plastic layer 3 hour, fluorescent glue or transparent enclosure glue be only covered on bowl cup or a small amount of bowl cup of filling inner, both of these case can not affect LED bright dipping, and the present embodiment repeats no more.
The present invention further provides a kind of LED luminous element, comprise above-mentioned LED support, and be arranged at the LED chip 4 in the sinking bowl cup 2 of LED support.This LED chip 4 can man-to-manly be arranged in bowl cup 2, also can be arranged in bowl cup 2 according to particular/special requirement is many-to-one.
Further, be filled with fluorescent glue or transparent enclosure glue in reflector 51, this fluorescent glue or transparent enclosure glue can be full of bowl cup 2 or be covered in outside bowl cup 2.
This LED luminous element has adopted LED package support provided by the invention, and its bowl cup that sinks is one-body molded with reflector, need on metal substrate, separately not establish box dam, save operation, improve production efficiency, and strengthened stability and the reliability of LED, improved product quality.In addition, because sealing outside plastic layer and plastic cement is one-body molded, strengthen the adhesion of plastic layer, reflector and metal substrate, improved the reliability of LED.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (9)
1. a LED package support, it is characterized in that, comprise metal substrate, described metal substrate has sinking bowl cup integrated with it, the medial surface of described sinking bowl cup is with plastic layer, described plastic layer from described medial surface to described sink the periphery of bowl cup extend to form a glass edge, the upper surface on described cup edge to described sink 1/3～3 times of the vertical range of bottom of the bowl cup thickness that is LED chip; Described plastic layer has two groups of relative medial surfaces, and the subtended angle of every group of relative medial surface is all less than 60 °; Described LED package support also comprises the outer sealing of plastic cement, and the part of the outer sealing of described plastic cement on described metal substrate forms reflector; Described reflector is formed at the periphery of described sinking bowl cup, and one-body molded with described plastic layer.
2. LED package support as claimed in claim 1, is characterized in that, one group of relative cup of described plastic layer is along connecting as one with reflector.
3. LED package support as claimed in claim 1, is characterized in that, described metal substrate is wrapped up by the outer sealing of described plastic cement.
4. LED package support as claimed in claim 1, is characterized in that, described metal substrate is rectangle, circular or square.
5. the LED package support as described in claim 1～4 any one, is characterized in that, the subtended angle of every group of relative medial surface of described sinking bowl cup is all less than 120 °.
6. LED package support as claimed in claim 1, is characterized in that, the material of the outer sealing of described plastic cement and plastic layer is thermosetting or the high reflection of thermoplasticity plastic material.
7. LED package support as claimed in claim 1, is characterized in that, the surface of described metal substrate is provided with the coat of metal, and the described coat of metal is one or several the stepped construction in gold plate, silvering, copper coating, nickel coating and palladium coating.
8. a LED luminous element, is characterized in that, comprises the LED package support described in claim 1 to 7 any one, in the described sinking bowl cup of described LED package support, is provided with LED chip.
9. LED luminous element as claimed in claim 8, is characterized in that, is filled with fluorescent glue or transparent enclosure glue in the reflector of described LED package support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410101543.2A CN103872219B (en) | 2014-03-18 | 2014-03-18 | A kind of LED package support and LED illuminator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410101543.2A CN103872219B (en) | 2014-03-18 | 2014-03-18 | A kind of LED package support and LED illuminator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103872219A true CN103872219A (en) | 2014-06-18 |
| CN103872219B CN103872219B (en) | 2016-09-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410101543.2A Active CN103872219B (en) | 2014-03-18 | 2014-03-18 | A kind of LED package support and LED illuminator |
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| Country | Link |
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| CN (1) | CN103872219B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015139191A1 (en) * | 2014-03-18 | 2015-09-24 | 深圳市瑞丰光电子股份有限公司 | Led packaging frame and led illuminant |
| WO2015139190A1 (en) * | 2014-03-18 | 2015-09-24 | 深圳市瑞丰光电子股份有限公司 | Led frame and led illuminant |
| CN105047797A (en) * | 2015-09-17 | 2015-11-11 | 深圳成光兴光电技术股份有限公司 | SMD LED packaging structure |
| CN110010741A (en) * | 2019-03-13 | 2019-07-12 | 惠州市长方照明节能科技有限公司 | A kind of novel high lumen LED support |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100308364A1 (en) * | 2006-03-17 | 2010-12-09 | Seoul Semiconductor Co., Ltd. | Side-view light emitting diode package having a reflector |
| CN101997075A (en) * | 2009-08-05 | 2011-03-30 | 夏普株式会社 | Light emitting device and method of manufacturing light emitting device |
| CN202094168U (en) * | 2011-05-03 | 2011-12-28 | 深圳市华星光电技术有限公司 | Led packaging structure |
| CN102683544A (en) * | 2011-03-17 | 2012-09-19 | 展晶科技(深圳)有限公司 | Paster type light-emitting diode |
| CN203787455U (en) * | 2014-03-18 | 2014-08-20 | 深圳市瑞丰光电子股份有限公司 | LED packaging bracket and LED luminous body |
-
2014
- 2014-03-18 CN CN201410101543.2A patent/CN103872219B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100308364A1 (en) * | 2006-03-17 | 2010-12-09 | Seoul Semiconductor Co., Ltd. | Side-view light emitting diode package having a reflector |
| CN101997075A (en) * | 2009-08-05 | 2011-03-30 | 夏普株式会社 | Light emitting device and method of manufacturing light emitting device |
| CN102683544A (en) * | 2011-03-17 | 2012-09-19 | 展晶科技(深圳)有限公司 | Paster type light-emitting diode |
| CN202094168U (en) * | 2011-05-03 | 2011-12-28 | 深圳市华星光电技术有限公司 | Led packaging structure |
| CN203787455U (en) * | 2014-03-18 | 2014-08-20 | 深圳市瑞丰光电子股份有限公司 | LED packaging bracket and LED luminous body |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015139191A1 (en) * | 2014-03-18 | 2015-09-24 | 深圳市瑞丰光电子股份有限公司 | Led packaging frame and led illuminant |
| WO2015139190A1 (en) * | 2014-03-18 | 2015-09-24 | 深圳市瑞丰光电子股份有限公司 | Led frame and led illuminant |
| CN105047797A (en) * | 2015-09-17 | 2015-11-11 | 深圳成光兴光电技术股份有限公司 | SMD LED packaging structure |
| CN110010741A (en) * | 2019-03-13 | 2019-07-12 | 惠州市长方照明节能科技有限公司 | A kind of novel high lumen LED support |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103872219B (en) | 2016-09-14 |
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