CN103682049A - Waterproof chip LED (Light-Emitting Diode) and production technology thereof - Google Patents
Waterproof chip LED (Light-Emitting Diode) and production technology thereof Download PDFInfo
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- CN103682049A CN103682049A CN201310730091.XA CN201310730091A CN103682049A CN 103682049 A CN103682049 A CN 103682049A CN 201310730091 A CN201310730091 A CN 201310730091A CN 103682049 A CN103682049 A CN 103682049A
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- 238000005516 engineering process Methods 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000003822 epoxy resin Substances 0.000 claims abstract description 13
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000004033 plastic Substances 0.000 claims description 70
- 229920003023 plastic Polymers 0.000 claims description 70
- 238000004806 packaging method and process Methods 0.000 claims description 67
- 239000000463 material Substances 0.000 claims description 43
- 238000005538 encapsulation Methods 0.000 claims description 28
- 239000013078 crystal Substances 0.000 claims description 22
- 239000003292 glue Substances 0.000 claims description 12
- 239000004593 Epoxy Substances 0.000 claims description 11
- 241000567030 Ampulloclitocybe clavipes Species 0.000 claims description 9
- 206010043101 Talipes Diseases 0.000 claims description 9
- 201000011228 clubfoot Diseases 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 6
- 230000008023 solidification Effects 0.000 claims description 6
- 239000000084 colloidal system Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 241000235388 Mucorales Species 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- 235000012431 wafers Nutrition 0.000 abstract 2
- 238000000034 method Methods 0.000 description 14
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 3
- 238000001764 infiltration Methods 0.000 description 3
- 239000004568 cement Substances 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 241000931705 Cicada Species 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- -1 benzene diamides Chemical class 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a waterproof chip LED (Light-Emitting Diode) and a production technology thereof. The chip LED comprises: a package main body, which is an epoxy resin package main body, and a plastic-package molded bracket, wherein one end of the plastic-package molded bracket stretches into the internal of the package main body, the plastic-package molded bracket is provided with a wafer fixing area in which LED wafers are fixed, and the pin of the plastic-package molded bracket is provided with a waterproof slot and a waterproof hole; and therefore, the technical effect that the chip LED has good water resistance and moisture resistance performances is achieved.
Description
Technical field
The present invention relates to field of photoelectric technology, relate in particular to a kind of waterproof paster LED and production technology thereof.
Background technology
In recent years, adopting surface mounted LED becomes a Hot spots for development, has well solved the problems such as brightness, visual angle, evenness, consistency, is applicable to very much the application of high-resolution indoor full color display.But day by day universal along with LED, also more and more higher to its performance requirement, requirement can meet the application of high-resolution open air, outdoor full color display screen and outdoor building, and common paster LED water resistance is low, can not be placed in for a long time moist rugged environment and use.
Adopting surface mounted LED waterproof difficult point is mainly caused by two aspects: the one, and the infiltration of LED support.LED support infiltration is caused by the material of support and the contact-making surface of material and electrode pin.The support of current adopting surface mounted LED is by plastics and metal electrode is compressing obtains, and plastic cement material used is poly-clever benzene diamides (being called for short PPA), and metal electrode material has copper, aluminium etc.The weakness of the support of this material structure aspect waterproof is: 1, the easy moisture absorption of PPA material; 2, there is gap in the contact-making surface between PPA and metal electrode pin, and this gap can become after Reflow Soldering and in follow-up LED use procedure greatly, thereby make the impurity invasions such as aqueous vapor.The infiltration of the 2nd, LED encapsulation glue-line.It is mainly epoxy resin and silicones (polyorganosiloxane resin) that LED is used packaging plastic.The thermal coefficient of expansion of epoxy resin and silicones is different from LED support, and in use, the phenomenon of expanding with heat and contract with cold can make the adhesiveness of packing colloid and LED support die down, and occurs gap, causes aqueous vapor intrusion.Therefore, need to study a kind of adopting surface mounted LED with waterproof, humidity resistance.
In the process of present inventor's invention technical scheme in realizing the embodiment of the present application, find that above-mentioned technology at least exists following technical problem:
In the prior art, because existing adopting surface mounted LED plastic cement material used is the easy moisture absorption of PPA, contact-making surface between PPA and metal electrode pin exists interstitial water air-capacitor easily to enter, it is mainly epoxy resin and silicones that paster LED is used packaging plastic, and the thermal coefficient of expansion of epoxy resin and silicones is different from LED support, in use, easily there is gap, cause aqueous vapor intrusion, so existing adopting surface mounted LED exists waterproof, the poor technical problem of humidity resistance.
Summary of the invention
The embodiment of the present application is by providing a kind of waterproof paster LED and production technology thereof, solved existing adopting surface mounted LED in prior art and had waterproof, the poor technical problem of humidity resistance, realized paster LED and there is good waterproof, the technique effect of humidity resistance.
For solving the problems of the technologies described above, the embodiment of the present application provides waterproof a kind of paster LED on the one hand, and described paster LED comprises:
Package main body, described package main body is specially epoxy encapsulation main body;
Plastic packaging shaped support, it is inner that described package main body is stretched in one end of described plastic packaging shaped support, and described plastic packaging shaped support is provided with crystal bonding area, is fixed with LED wafer in described crystal bonding area, wherein, the pin of described plastic packaging shaped support is provided with waterproof groove and anti-water hole.
Wherein, the pin of described plastic packaging shaped support has two ends, and wherein one end is positioned at described package main body, and the other end is bent to described package main body bottom through described package main body.
Wherein, described plastic packaging shaped bracket and described LED wafer are electrically connected, and carry out full-enclosed encapsulation after connection.
On the other hand, present application example also provides a kind of production technology of waterproof paster LED, and described production technology comprises the following steps:
(1) making of plastic packaging shaped support, the making of described plastic packaging shaped support is specially: first adopt bracket mould to carry out cold stamping to copper material, then by injection moulding, obtain described plastic packaging shaped bracket, wherein, cell cube in described plastic packaging shaped bracket is a bowl cup-shaped, and capsulation material is opaque material, on described plastic packaging shaped bracket, there is crystal bonding area and the weld zone for fixed L ED wafer, the pin of described plastic packaging shaped bracket has waterproof groove and waterproof emptying aperture.
(2) LED wafer is fixed: the described crystal bonding area that described LED wafer is fixed on to described plastic packaging shaped bracket;
(3) bonding wire: the solder joint of described LED wafer and described weld zone are welded;
(4) one-shot forming encapsulation: carry out a glue in the described plastic packaging shaped support bowl cup after bonding wire, click and enter optical grade epoxy resin;
(5) one-step solidification: utilize high temperature roaster to be cured putting the material of glue;
(6) post forming encapsulation: the material of one-step solidification is put into mould, be unsettled laying state, inject epoxy encapsulation, described mould is cube shaped, and the exiting surface that makes described plastic packaging shaped support is plane;
(7) regelate: the material after utilizing high temperature roaster to post forming encapsulation is cured;
(8) clubfoot: the material after regelate is carried out to clubfoot processing, obtain the individuality of waterproof paster LED.
Further, described step (2) LED wafer is fixing specifically comprises:
The upper LED wafer fixing glue of the described crystal bonding area point of the described plastic packaging shaped support 21, making in step (1), when glue, each some Jiao Chu connects without colloid;
22, described LED wafer is placed on respectively to the some Jiao Chu of described crystal bonding area;
23,, after described LED wafer is placed, described plastic packaging shaped support and described LED wafer are sent in heated-air circulation roaster and be cured.
Further, described step (8) is carried out clubfoot processing to the material after regelate, obtains the individuality of waterproof paster LED, specifically comprises:
81, utilize bent pin mould, the pin of the material after regelate is carried out to bending, the pin end of the material after regelate is turned back to epoxy encapsulation bottom part body;
82, utilize threshing mould that the material after regelate is separated from empty frame, thereby obtain the individuality of waterproof paster LED.
The one or more technical schemes that provide in the embodiment of the present application, at least have following technique effect or advantage:
Owing to having adopted the material design of package main body, be epoxy resin, and the support of LED is plastic packaging shaped bracket, carry out full-enclosed encapsulation, and at the pin of plastic packaging shaped bracket, be provided with the technological means in waterproof groove and anti-water hole, so, efficiently solve existing adopting surface mounted LED in prior art and have waterproof, the poor technical problem of humidity resistance, and then realized paster LED and there is good waterproof, the technique effect of humidity resistance.
Accompanying drawing explanation
Fig. 1 is the structural representation of waterproof paster LED in the embodiment of the present application;
Fig. 2 is the structural representation of plastic packaging shaped support in the embodiment of the present application;
Fig. 3 is the structural representation of cell cube in plastic packaging shaped support in the embodiment of the present application;
Fig. 4 is the cutaway view of waterproof paster LED in the embodiment of the present application;
Fig. 5 is the production technological process of waterproof paster LED in the embodiment of the present application;
Fig. 6 is the structural representation after cell cube die bond bonding wire in plastic packaging shaped support in the embodiment of the present application;
Fig. 7 has been the waterproof paster LED structural representation after bent angle technique.
Embodiment
The embodiment of the present application is by providing a kind of waterproof paster LED and production technology thereof, solved existing adopting surface mounted LED in prior art and had waterproof, the poor technical problem of humidity resistance, realized paster LED and there is good waterproof, the technique effect of humidity resistance.
Technical scheme during the application implements is for solving the problems of the technologies described above.General thought is as follows:
Having adopted the material design of package main body is epoxy resin, and the support of LED is plastic packaging shaped bracket, carry out full-enclosed encapsulation, and at the pin of plastic packaging shaped bracket, be provided with the technological means in waterproof groove and anti-water hole, so, efficiently solve existing adopting surface mounted LED in prior art and have waterproof, the poor technical problem of humidity resistance, and then realized paster LED and there is good waterproof, the technique effect of humidity resistance.
In order better to understand technique scheme, below in conjunction with Figure of description and concrete execution mode, technique scheme is described in detail.
Embodiment mono-
In embodiment mono-, a kind of waterproof paster LED is provided, please refer to Fig. 1-Fig. 4, described paster LED comprises:
Package main body 10, described package main body 10 is specially epoxy encapsulation main body;
Plastic packaging shaped support 20, described package main body 10 inside are stretched in one end of described plastic packaging shaped support 20, and described plastic packaging shaped support 20 is provided with crystal bonding area, are fixed with LED wafer in described crystal bonding area, wherein, the pin of described plastic packaging shaped support is provided with waterproof groove 201 and anti-water hole 202.
Wherein, in the embodiment of the present application, the pin of described plastic packaging shaped support 20 has two ends, and wherein one end is positioned at described package main body 10, and the other end is bent to described package main body 10 bottoms through described package main body 10.
Wherein, in the embodiment of the present application, described plastic packaging shaped bracket 20 is electrically connected with described LED wafer, carries out full-enclosed encapsulation after connection.
In actual applications, waterproof groove 201 is set and good waterproof moisture-proof effect can be played in anti-water hole 202.
In actual applications, by the material design of package main body, be that epoxy resin can be avoided the moisture absorption, to carry out full-enclosed encapsulation and be sealing effectiveness and encapsulate preferably, comprehensive sealing, is also for waterproof, protection against the tide.
As shown in Figure 1, waterproof paster LED in the embodiment of the present application comprises that epoxy resin surrounds package main body 10 entirely, and the plastic packaging shaped bracket 20 of epoxy encapsulation main body 10 inside is stretched in one end, the external part of plastic packaging shaped bracket 20, after bending, turns back and is buckled on the bottom of epoxy encapsulation main body 10.
In Fig. 4, the top plane of package main body 10 is comprised of the top plane 101 of surrounding and middle exiting surface 102, exiting surface is dome shape, thereby form sphere lens 103, in the embodiment of the present application, the peak of described sphere lens 103 is in the plane at plane 101 places, the top of described package main body 10, sphere lens 103 is refractive optical surface, plastic packaging shaped bracket 20,30, has bowl cup 50 on plastic packaging shaped bracket 30, in bowl cup, be provided with crystal bonding area 40.
Waterproof paster LED in corresponding embodiment mono-, embodiment mono-also provides a kind of production technology of waterproof paster LED, please refer to Fig. 5-Fig. 7, and described production technology comprises the following steps:
(1) making of plastic packaging shaped support, the making of described plastic packaging shaped support is specially: first adopt bracket mould to carry out cold stamping to copper material, then by injection moulding, obtain described plastic packaging shaped bracket, wherein, cell cube in described plastic packaging shaped bracket is a bowl cup-shaped, and capsulation material is opaque material, on described plastic packaging shaped bracket, there is crystal bonding area and the weld zone for fixed L ED wafer, the pin of described plastic packaging shaped bracket has waterproof groove and waterproof emptying aperture.
(2) LED wafer is fixed: the described crystal bonding area that described LED wafer is fixed on to described plastic packaging shaped bracket;
(3) bonding wire: the solder joint of described LED wafer and described weld zone are welded;
(4) one-shot forming encapsulation: carry out a glue in the described plastic packaging shaped support bowl cup after bonding wire, click and enter optical grade epoxy resin;
(5) one-step solidification: utilize high temperature roaster to be cured putting the material of glue;
(6) post forming encapsulation: the material of one-step solidification is put into mould, be unsettled laying state, inject epoxy encapsulation, described mould is cube shaped, and the exiting surface that makes described plastic packaging shaped support is plane;
(7) regelate: the material after utilizing high temperature roaster to post forming encapsulation is cured;
(8) clubfoot: the material after regelate is carried out to clubfoot processing, obtain the individuality of waterproof paster LED.
Wherein, in the embodiment of the present application, described step (2) LED wafer is fixing specifically to be comprised:
The upper LED wafer fixing glue of the described crystal bonding area point of the described plastic packaging shaped support 21, making in step (1), when glue, each some Jiao Chu connects without colloid;
22, described LED wafer is placed on respectively to the some Jiao Chu of described crystal bonding area;
23,, after described LED wafer is placed, described plastic packaging shaped support and described LED wafer are sent in heated-air circulation roaster and be cured.
Wherein, in the embodiment of the present application, described step (8) is carried out clubfoot processing to the material after regelate, obtains the individuality of waterproof paster LED, specifically comprises:
81, utilize bent pin mould, the pin of the material after regelate is carried out to bending, the pin end of the material after regelate is turned back to epoxy encapsulation bottom part body;
82, utilize threshing mould that the material after regelate is separated from empty frame, thereby obtain the individuality of waterproof paster LED.
As shown in Figure 5, plastic packaging shaped support is provided with four support pins, on four support pins, there are lateral trench and emptying aperture, a wherein support of four supports is provided with crystal bonding area, is fixed with LED wafer in crystal bonding area, and LED wafer is fixed on the bottom of crystal bonding area stem for stem by colloid, and LED wafer is connected with the weld zone of support by gold thread respectively, and guarantee good electrical connection, after passing into electric current, can make LED wafer luminous.
Fig. 6 has been the paster LED structural representation after bent angle technique.
Technical scheme in above-mentioned the embodiment of the present application, at least has following technique effect or advantage:
Owing to having adopted the material design of package main body, be epoxy resin, and the support of LED is plastic packaging shaped bracket, carry out full-enclosed encapsulation, and at the pin of plastic packaging shaped bracket, be provided with the technological means in waterproof groove and anti-water hole, so, efficiently solve existing adopting surface mounted LED in prior art and have waterproof, the poor technical problem of humidity resistance, and then realized paster LED and there is good waterproof, the technique effect of humidity resistance.
Although described the preferred embodiments of the present invention, once those skilled in the art obtain the basic creative concept of cicada, can make other change and modification to these embodiment.So claims are intended to all changes and the modification that are interpreted as comprising preferred embodiment and fall into the scope of the invention.
Obviously, those skilled in the art can carry out various changes and modification and not depart from the spirit and scope of the present invention the present invention.Like this, if within of the present invention these are revised and modification belongs to the scope of the claims in the present invention and equivalent technologies thereof, the present invention is also intended to comprise these changes and modification interior.
Claims (6)
1. a waterproof paster LED, is characterized in that, described paster LED comprises:
Package main body, described package main body is specially epoxy encapsulation main body;
Plastic packaging shaped support, it is inner that described package main body is stretched in one end of described plastic packaging shaped support, and described plastic packaging shaped support is provided with crystal bonding area, is fixed with LED wafer in described crystal bonding area, wherein, the pin of described plastic packaging shaped support is provided with waterproof groove and anti-water hole.
2. paster LED as claimed in claim 1, is characterized in that, the pin of described plastic packaging shaped support has two ends, and wherein one end is positioned at described package main body, and the other end is bent to described package main body bottom through described package main body.
3. paster LED as claimed in claim 1, is characterized in that, described plastic packaging shaped bracket and described LED wafer are electrically connected, and carry out full-enclosed encapsulation after connection.
4. a production technology for the waterproof paster LED as described in claim 1-3 any one, is characterized in that, described production technology comprises the following steps:
(1) making of plastic packaging shaped support, the making of described plastic packaging shaped support is specially: first adopt bracket mould to carry out cold stamping to copper material, then by injection moulding, obtain described plastic packaging shaped bracket, wherein, cell cube in described plastic packaging shaped bracket is a bowl cup-shaped, and capsulation material is opaque material, on described plastic packaging shaped bracket, there is crystal bonding area and the weld zone for fixed L ED wafer, the pin of described plastic packaging shaped bracket has waterproof groove and waterproof emptying aperture.
(2) LED wafer is fixed: the described crystal bonding area that described LED wafer is fixed on to described plastic packaging shaped bracket;
(3) bonding wire: the solder joint of described LED wafer and described weld zone are welded;
(4) one-shot forming encapsulation: carry out a glue in the described plastic packaging shaped support bowl cup after bonding wire, click and enter optical grade epoxy resin;
(5) one-step solidification: utilize high temperature roaster to be cured putting the material of glue;
(6) post forming encapsulation: the material of one-step solidification is put into mould, be unsettled laying state, inject epoxy encapsulation, described mould is cube shaped, and the exiting surface that makes described plastic packaging shaped support is plane;
(7) regelate: the material after utilizing high temperature roaster to post forming encapsulation is cured;
(8) clubfoot: the material after regelate is carried out to clubfoot processing, obtain the individuality of waterproof paster LED.
5. production technology as claimed in claim 4, is characterized in that, described step (2) LED wafer is fixing specifically to be comprised:
The upper LED wafer fixing glue of the described crystal bonding area point of the described plastic packaging shaped support 21, making in step (1), when glue, each some Jiao Chu connects without colloid;
22, described LED wafer is placed on respectively to the some Jiao Chu of described crystal bonding area;
23,, after described LED wafer is placed, described plastic packaging shaped support and described LED wafer are sent in heated-air circulation roaster and be cured.
6. production technology as claimed in claim 4, is characterized in that, described step (8) is carried out clubfoot processing to the material after regelate, obtains the individuality of waterproof paster LED, specifically comprises:
81, utilize bent pin mould, the pin of the material after regelate is carried out to bending, the pin end of the material after regelate is turned back to epoxy encapsulation bottom part body;
82, utilize threshing mould that the material after regelate is separated from empty frame, thereby obtain the individuality of waterproof paster LED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310730091.XA CN103682049B (en) | 2013-12-26 | 2013-12-26 | A kind of waterproof paster LED and production technology thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310730091.XA CN103682049B (en) | 2013-12-26 | 2013-12-26 | A kind of waterproof paster LED and production technology thereof |
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| CN103682049A true CN103682049A (en) | 2014-03-26 |
| CN103682049B CN103682049B (en) | 2016-09-14 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106784193A (en) * | 2017-01-03 | 2017-05-31 | 厦门天微电子有限公司 | A kind of small spacing LED photovoltaic module packaging method |
| CN108155106A (en) * | 2017-12-22 | 2018-06-12 | 珠海市大鹏电子科技有限公司 | A kind of length climbs the preparation process of electric light electric coupler |
| CN110164827A (en) * | 2019-05-22 | 2019-08-23 | 河源市富宇光电科技有限公司 | A kind of integral forming encapsulating structure and its packaging technology |
| CN110277478A (en) * | 2019-06-28 | 2019-09-24 | 旭宇光电（深圳）股份有限公司 | LED device and light emitting device |
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| CN102832317A (en) * | 2012-08-16 | 2012-12-19 | 东莞市钜晶光电有限公司 | Red LED packaging method |
| CN103117350A (en) * | 2011-11-17 | 2013-05-22 | 佛山市国星光电股份有限公司 | Surface-mounting highly-waterproof light emitting diode (LED) support used for outdoor display screen and products thereof |
| CN203721759U (en) * | 2013-12-26 | 2014-07-16 | 四川柏狮光电技术有限公司 | A waterproof surface-mounted LED |
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2013
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103117350A (en) * | 2011-11-17 | 2013-05-22 | 佛山市国星光电股份有限公司 | Surface-mounting highly-waterproof light emitting diode (LED) support used for outdoor display screen and products thereof |
| CN102832317A (en) * | 2012-08-16 | 2012-12-19 | 东莞市钜晶光电有限公司 | Red LED packaging method |
| CN203721759U (en) * | 2013-12-26 | 2014-07-16 | 四川柏狮光电技术有限公司 | A waterproof surface-mounted LED |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106784193A (en) * | 2017-01-03 | 2017-05-31 | 厦门天微电子有限公司 | A kind of small spacing LED photovoltaic module packaging method |
| CN108155106A (en) * | 2017-12-22 | 2018-06-12 | 珠海市大鹏电子科技有限公司 | A kind of length climbs the preparation process of electric light electric coupler |
| CN110164827A (en) * | 2019-05-22 | 2019-08-23 | 河源市富宇光电科技有限公司 | A kind of integral forming encapsulating structure and its packaging technology |
| CN110277478A (en) * | 2019-06-28 | 2019-09-24 | 旭宇光电（深圳）股份有限公司 | LED device and light emitting device |
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| CN103682049B (en) | 2016-09-14 |
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