CN204407358U - A kind of TOP LED support and TOP LED component thereof - Google Patents

A kind of TOP LED support and TOP LED component thereof Download PDF

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Publication number
CN204407358U
CN204407358U CN201520037477.7U CN201520037477U CN204407358U CN 204407358 U CN204407358 U CN 204407358U CN 201520037477 U CN201520037477 U CN 201520037477U CN 204407358 U CN204407358 U CN 204407358U
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Prior art keywords
inwall
reflector
topled
support
cup
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CN201520037477.7U
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Chinese (zh)
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刘传标
秦快
杨庭洪
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Foshan NationStar Optoelectronics Co Ltd
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Foshan NationStar Optoelectronics Co Ltd
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Abstract

The utility model relates to a kind of TOP LED support, comprise metallic support, wrap up the reflector of this metallic support, be arranged on the cavity in reflector, reflector comprises a glass inwall, cup end face and cup bottom surface, described cup inwall comprises the first inwall and the second inwall, described first inwall is arranged at the top of described second inwall and extends to the cup end face of described reflector, described second inwall extends to the cup bottom surface of described reflector, described first inwall is provided with threaded portion, second inwall of reflector is provided with ditch wall construction, the utility model also comprises the TOP LED component made of described TOP LED support, because the rim of a cup of reflector is provided with threaded portion, the binding ability of colloid and reflector can be improved, second inwall of reflector is provided with ditch wall construction, make packing colloid in cavity, form the band of a continued circling, the lamination that TOP LED component occurs in high temperature environments can be prevented.

Description

A kind of TOP LED support and TOP LED component thereof
Technical field
The utility model relates to LED encapsulation field, particularly relates to the encapsulation technology of a kind of TOPLED support and TOPLED device thereof.
Background technology
Outdoor display screen requires high to environmental suitability, needs waterproof, solar control direct projection, dust-proof, high temperature-proof, windproof and anti-lightning strike etc., especially requires to have good water proofing property.Reveal existing the TOP LED device or the module making outdoor display screen that have employed special pin chip package (Plastic Leaded Chip Carrier, PLCC) type support.At present, on market, normal support reflector inwall is smooth, after such encapsulation point glue packing colloid and wall of cup Percentage bound low, packing colloid easily comes off, and reliability is low.Silicones has good UV resistance but bad with the adhesion of the reflector support of PPA material, therefore at use silicon resin glue as adding the danger more easily producing delamination under machinery or heat load between reflector and packing colloid during packing colloid, this delamination starts on the top edge of groove, and propagates in groove.Because the additional reflection face in delamination district causes light loss, easily there is finedraw in the faying face on the inclined-plane of colloid and cavity, lamination occurs, the coated material of chip and housing base may be caused in the most severe case to depart from completely.This infiltrates just to oxygen, moisture element etc. and provides passage, causes LED to occur lacking the integrity problems such as bright, silver layer melanism.
Summary of the invention
The purpose of this utility model is the deficiency had for current traditional TOP LED support and TOPLED device thereof, a kind of TOPLED support with high-air-tightness is provided, reduce the danger of delamination between packing colloid and housing base, improve the adaptive capacity to environment of the TOPLED device utilizing this support to produce, improve the life-span of outdoor display screen.
The utility model adopts following technical scheme to realize above-mentioned purpose:
A kind of TOPLED support, comprise: metallic support, wrap up the reflector of this metallic support, be arranged on the cavity in described reflector, described reflector comprises a glass inwall, cup end face and cup bottom surface, and described cup inwall comprises the first inwall and the second inwall, described first inwall is arranged at the top of described second inwall and extends to the cup end face of described reflector, described second inwall extends to the cup bottom surface of described reflector, it is characterized in that, described first inwall is provided with concaveconvex structure.
Preferably, described concaveconvex structure is square groove, V shape groove, zigzag slot, dovetail groove or screw thread form.
Preferably, described concaveconvex structure is screw thread form.
Preferably, the height H of described first inwall 1for the 1/5-1/3 of described reflector height H.
Preferably, described second inwall is rough structure or smooth structure.
Preferably, described second inwall is provided with ditch wall construction.
Preferably, described second inwall is provided with gully, and the second inwall of the reflector simultaneously between described cavity and described gully is formed with peak wall, forms an annular cavity between described gully and described peak wall.
Preferably, described peak wall is smooth inclined-plane or rough inclined-plane near the surface of described cavity.
A kind of TOPLED device, is formed by described a kind of TOPLED support manufacture, comprises described TOPLED support, is arranged on the LED chip on described TOPLED support and covers the packing colloid of described LED chip.
[0014]the utility model has the following advantages:
1, a kind of TOPLED support of providing of the utility model and TOPLED device thereof, by the rim of a cup design concaveconvex structure at reflector, a kind of TOPLED device of high-air-tightness can be provided, improve the adaptive capacity to environment of the TOPLED device utilizing this support to produce, improve the life-span of outdoor display screen.
2, a kind of TOPLED support of providing of the utility model and TOPLED device thereof, second inwall of reflector is set to smooth bevel, when the part light that LED chip sends incides or reflexes to inclined-plane, can go out through this slant reflection, with the light-output effectively LED chip sent reflection cup, improve light extraction efficiency, and change rising angle.
3, a kind of TOPLED support of providing of the utility model and TOPLED device thereof, by the second inwall at reflector, ditch wall construction is set, in the bracket packing colloid is injected in cavity, make packing colloid in cavity, form the band of a continued circling, obviously can improve the adhesion of packing colloid and reflector, lamination caused between colloid and cavity under long hot environment when can avoid Reflow Soldering.
Accompanying drawing explanation
The schematic cross-section of the TOPLED support in figure l the utility model embodiment one;
The schematic top plan view of the TOPLED support in Fig. 2 the utility model embodiment one;
The schematic cross-section of the TOPLED support in Fig. 3 the utility model embodiment two;
The schematic top plan view of the TOPLED support in Fig. 4 the utility model embodiment two;
The schematic cross-section of the device that a kind of TOPLED support that Fig. 5 the utility model embodiment three provides according to embodiment one manufactures;
The schematic cross-section of the device that a kind of TOPLED support that Fig. 6 the utility model embodiment four provides according to embodiment two manufactures.
Embodiment
In order to make those skilled in the art understand the technical solution of the utility model better, below in conjunction with accompanying drawing and preferred embodiment, the utility model is described in further detail.
embodiment one
The utility model provides a kind of TOPLED support, its supporting structure is PLCC type, as shown in Fig. 1, described TOPLED support 10 structure, comprise: metallic support 1, wrap up the reflector 2 of this metallic support 1, wherein, metallic support 1 is made up of the metal pins embedded in reflector 2 and the metal pin be exposed at outward outside reflector 2, metal pins is for carrying LED chip, metal pin is used for as stent electrode, and the cavity 3 be arranged in described reflector 2, described reflector 2 comprises glass inwall 21, cup end face and cup bottom surface, described cup inwall 21 comprises the first inwall 211 and the second inwall 212, described first inwall 211 is arranged at the top of described second inwall 212 and extends to the cup end face of described reflector 2, described second inwall 212 extends to the cup bottom surface of described reflector 2, wherein, described first inwall 211 is provided with concaveconvex structure.
Described metallic support 1 can be made up of conductive metallic materials such as metallic copper, metallic aluminium, copper alloy, aluminium alloys.
The material of described reflector 2 is engineering resin, polyphtalamide resin (PPA), polymethyl methacrylate (PMMA), polyamide (PA), Merlon (PC) can be adopted, polyformaldehyde (POM), any one in polybutylene terephthalate (PBT) (PBT) and polyphenylene oxide (PPO), silica gel, epoxy resin, that select in the present embodiment is polyphtalamide resin (PPA).
Described first inwall 211 is provided with concaveconvex structure, and described concaveconvex structure is square groove, V shape groove, zigzag slot, dovetail groove, screw thread form or custom-shaped etc.Described in the present embodiment, the concaveconvex structure of the first inwall 211 is screw thread form, namely on described first inwall 211, is provided with threaded portion, the height H of described first inwall 211 1for the 1/5-1/3 of described reflector 2 height H, as shown in Figure 1 and Figure 2, described threaded portion to be arranged on described first inwall 211 and along described reflector cup inwall 21 around described cavity 3 spiral surrounding, described threaded portion extends to the cup end face of described reflector 2 from the top edges of described second inwall 212, by the rim of a cup design threaded portion at reflector, when being conducive to encapsulating, increase the air-tightness of support and packing colloid.Described second inwall 212 can be rough structure also can be smooth structure, described in the present embodiment, the second inwall 212 is smooth inclined-plane, can realize by carrying out the mode such as polishing or plated reflective layer to the second inwall 212, when the part light that LED chip sends incides or reflexes to inclined-plane, can go out through this slant reflection, with the light-output effectively LED chip sent reflection cup, improve light extraction efficiency, and change rising angle.
embodiment two
The present embodiment provides a kind of TOPLED support substantially identical with the TOPLED supporting structure that above-described embodiment one provides, difference is, the supporting structure 10 that above-described embodiment one provides, as shown in Figure 1, described second inwall 212 is through the smooth bevel of process, the supporting structure 20 that the present embodiment provides, as Fig. 3, shown in Fig. 4, described second inwall 212 is provided with ditch wall construction, in the present embodiment, described second inwall 212 is provided with gully 2121, on the second inwall 212 of the reflector 2 described in described cavity 3 and ditch between gully 2121, be formed with peak wall 2122 simultaneously, an annular cavity is formed between described gully 2121 and described peak wall 2122, described peak wall 2122 can be smooth inclined-plane near the surface of cavity 3, also can be rough inclined-plane, rough inclined-plane is preferably in the present embodiment.Look from the bottom of described cavity 3, the top of described peak wall 2122 is positioned at below the height bottom described first inwall 211.
embodiment three
The present embodiment as shown in Figure 5, utilize the TOPLED support 10 that embodiment one provides, corresponding LED device 30 can be manufactured, its structure comprises: TOPLED support 10, the LED chip 4 be arranged on described TOPLED support 10 metal pins, connects the wire 5 of chip electrode and TOPLED backbone metal pin and covers the packing colloid 6 of described LED chip 4 and wire 5.
Described LED chip 4 is arranged on the bottom of described cavity 3, and wherein, LED chip is one in UV chip, blue chip, green glow chip or red light chips or three kinds, is preferably the combination of red, green, blue three color chip in the present embodiment.Concrete implementation can be, bottom described cavity 3, arrange two separate metal areas, these two metal areas are electrically connected with the two pins of support respectively.LED chip 4 described in the present embodiment is fixed therein a metal area, and the mode that two of LED chip 4 electrodes are welded by metal wire is electrically connected with two metal areas.In other embodiments, LED chip 4 can be flip-chip, therefore can save wire 5.
Complete LED chip welding and fixing after, in described cavity 3, fill packing colloid 6, with sealing LED chip 4.Described packing colloid can, for the packing colloid containing fluorescent material, also can be the packing colloid not containing fluorescent material.Packing colloid described in the present embodiment is that described packing colloid 6 has close-burning colloid for epoxy resin, silica gel and silicones etc. not containing fluorescent material.Described packing colloid 6 can take the mode of a glue or injecting glue to be injected in described cavity 3, realizes the encapsulation to LED chip.Described first inwall is provided with threaded portion, the sealing effectiveness of the inwall of reflector and the good of packing colloid can be realized, thus when avoiding attachment LED, because the temperature of Reflow Soldering is higher, duration longer making occurs lamination between colloid and cavity, avoid oxygen, moisture etc. to infiltrate and enter into by the gap of packaging plastic and reflector the reliability that device inside improves LED.
embodiment four
The present embodiment as shown in Figure 6, it is substantially identical with the encapsulating structure of the TOPLED device 30 that above-described embodiment three provides that the TOPLED support 20 utilizing embodiment two to provide manufactures corresponding TOPLED device 40, difference is, the present embodiment is different from the supporting structure of above-described embodiment three, above-described embodiment three is that the TOPLED support 10 utilizing embodiment one to provide manufactures corresponding TOPLED device 30, described second inwall in support is treated smooth bevel, the TOPLED support 20 that the present embodiment utilizes embodiment two to provide manufactures corresponding TOPLED device 40, described in the support that the present embodiment provides, the second inwall 212 is provided with gully 2121, second inwall 212 of the reflector 2 simultaneously between cavity 3 and gully 2121 is formed with peak wall 2122, an annular cavity is formed between described gully 2121 and described peak wall 2122.
Because the adhesion of the reflector support of packing colloid and PPA material is bad, the easier danger producing delamination under machinery or heat load between reflector and packing colloid, therefore ditch wall construction is set at the second inwall of support reflector, in semiconductor components and devices, packing colloid is injected in cavity, makes it cross peak wall from chip circumference and be embedded into gully.The band of a continued circling is integrally formed with all the other packing colloids in gully.The TOPLED device provided in the present embodiment obviously can improve the adhesion of packing colloid and reflector, lamination caused between colloid and cavity under long hot environment when can avoid Reflow Soldering.
A kind of TOPLED support that the utility model provides and TOPLED device thereof, its beneficial effect is:
1, a kind of TOPLED support of providing of the utility model and TOPLED device thereof, by the rim of a cup design concaveconvex structure at reflector, a kind of TOPLED device of high-air-tightness can be provided, improve the adaptive capacity to environment of the TOPLED device utilizing this support to produce, improve the life-span of outdoor display screen.
2, a kind of TOPLED support of providing of the utility model and TOPLED device thereof, second inwall of reflector is set to smooth bevel, when the part light that LED chip sends incides or reflexes to inclined-plane, can go out through this slant reflection, with the light-output effectively LED chip sent reflection cup, improve light extraction efficiency, and change rising angle.
3, a kind of TOPLED support of providing of the utility model and TOPLED device thereof, by the second inwall at reflector, ditch wall construction is set, in the bracket packing colloid is injected in cavity, make packing colloid in cavity, form the band of a continued circling, obviously can improve the adhesion of packing colloid and reflector, lamination caused between colloid and cavity under long hot environment when can avoid Reflow Soldering.
Be described in detail the utility model above, apply specific case and set forth principle of the present utility model and execution mode in literary composition, the explanation of above embodiment just understands method of the present utility model and core concept thereof for helping.Should be understood that; for those skilled in the art; under the prerequisite not departing from the utility model principle, can also carry out some improvement and modification to the utility model, these improve and modify and also fall in the protection range of the utility model claim.

Claims (9)

1. a TOPLED support, comprise: metallic support, wrap up the reflector of this metallic support, be arranged on the cavity in described reflector, described reflector comprises a glass inwall, cup end face and cup bottom surface, and described cup inwall comprises the first inwall and the second inwall, described first inwall is arranged at the top of described second inwall and extends to the cup end face of described reflector, described second inwall extends to the cup bottom surface of described reflector, it is characterized in that, described first inwall is provided with concaveconvex structure.
2. a kind of TOP LED support according to claim 1, is characterized in that, described concaveconvex structure is square groove, V shape groove, zigzag slot, dovetail groove or screw thread form.
3. a kind of TOPLED support according to claim 2, is characterized in that, described concaveconvex structure is screw thread form.
4. a kind of TOPLED support according to claim 1, is characterized in that, the height H of described first inwall 1for the 1/5-1/3 of described reflector height H.
5. a kind of TOPLED support according to claim 1, is characterized in that, described second inwall is rough structure or smooth structure.
6. a kind of TOPLED support according to claim 5, is characterized in that, described second inwall is provided with ditch wall construction.
7. a kind of TOPLED support according to claim 6, it is characterized in that, described second inwall is provided with gully, and the second inwall of the reflector simultaneously between described cavity and described gully is formed with peak wall, forms an annular cavity between described gully and described peak wall.
8. a kind of TOPLED support according to claim 7, is characterized in that, described peak wall is smooth inclined-plane or rough inclined-plane near the surface of described cavity.
9. a TOPLED device, it is formed by the arbitrary described a kind of TOPLED support manufacture of claim 1 to 8, comprises described TOPLED support, is arranged on the LED chip on described TOPLED support and covers the packing colloid of described LED chip.
CN201520037477.7U 2015-01-20 2015-01-20 A kind of TOP LED support and TOP LED component thereof Active CN204407358U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106952996A (en) * 2017-04-26 2017-07-14 深圳国冶星光电科技股份有限公司 A kind of LED packagings and its method for packing
CN108258098A (en) * 2017-12-26 2018-07-06 佛山市南海区联合广东新光源产业创新中心 A kind of inorganic integrated deep ultraviolet LED encapsulation structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106952996A (en) * 2017-04-26 2017-07-14 深圳国冶星光电科技股份有限公司 A kind of LED packagings and its method for packing
CN108258098A (en) * 2017-12-26 2018-07-06 佛山市南海区联合广东新光源产业创新中心 A kind of inorganic integrated deep ultraviolet LED encapsulation structure

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