CN114937730A - High-reliability integrated packaging support - Google Patents
High-reliability integrated packaging support Download PDFInfo
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- CN114937730A CN114937730A CN202210463447.7A CN202210463447A CN114937730A CN 114937730 A CN114937730 A CN 114937730A CN 202210463447 A CN202210463447 A CN 202210463447A CN 114937730 A CN114937730 A CN 114937730A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 30
- 239000013078 crystal Substances 0.000 claims abstract description 13
- 239000007787 solid Substances 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims description 27
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims 1
- 238000007711 solidification Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 12
- 238000005538 encapsulation Methods 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 9
- 239000011324 bead Substances 0.000 abstract description 8
- 239000000463 material Substances 0.000 description 19
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000005987 sulfurization reaction Methods 0.000 description 4
- 238000004073 vulcanization Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000026030 halogenation Effects 0.000 description 1
- 238000005658 halogenation reaction Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a high-reliability integrated packaging bracket, wherein the positive and negative electrodes of a chip are respectively connected to a positive electrode functional area bulge and a negative electrode functional area bulge through bonding wires, the front surface of a plastic bracket is provided with a circular light-reflecting surface, one corner of the front surface of the plastic bracket is provided with an identification corner, the back surface of the plastic bracket is provided with a positive electrode bonding pad, a negative electrode bonding pad and a positive electrode bonding pad, be provided with the white way between the negative pole pad, be provided with the protruding inner groovy of positive pole functional area in the positive pole functional area arch, be provided with the positive pole pad inner groovy in the positive pole pad, be provided with the protruding inner groovy of negative pole functional area in the negative pole functional area arch, be provided with negative pole pad inner groovy in the negative pole pad, be formed with the recess that bellied functional area and white way formed on the white way between positive pole functional area arch and the negative pole functional area arch, the encapsulation is glued and will be glued along the solid crystal of recess, a chip, bonding wire and the sealed integrative structure that forms of recess that corresponds. The LED lamp bead adopts an integrated packaging structure, is simple in process, and greatly improves the reliability of the LED lamp bead.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to a high-reliability integrated packaging support.
Background
Since the advent of the world, LEDs have been rapidly developed with a great deal of attention, and are not distinguished from their own advantages. These advantages are summarized as follows: high brightness, low working voltage, low power consumption, small size, long service life, impact resistance and stable performance. The development prospect of the LED is very broad, and the LED is currently developing towards higher brightness, higher weatherability, higher light-emitting density and higher light-emitting uniformity.
However, in the process of producing and using the LED product, the problems of product vulcanization (including pollution phenomena such as vulcanization, halogenation and oxidation), product failure caused by severe environments such as high temperature and high humidity, large temperature difference change and the like are frequently encountered, the problems bring certain loss to customers and manufacturers, after the vulcanization reaction occurs, a functional area of the product can be blackened, the luminous flux can be gradually reduced, and the color temperature can obviously drift. The principle is as follows: because the support of the surface mount LED is formed by silver plating on a copper base material (a silver layer can play a role in lightening and reflecting light), when the TOP LED is welded at high temperature and meets sulfur or sulfur vapor, the silver layer on the support and the sulfur can generate a chemical reaction Ag + S ═ AgS ↓toform AgS, and the color of the AgS is different from yellow or black according to the reaction amount. The most serious silver layer is reacted, and the gold wire is broken to cause open circuit of the LED. High temperature and high humidity, under adverse circumstances such as the difference in temperature change is big, can cause the encapsulation to glue and the support plastic between the gap appears, steam, sour gas etc. can pass through the gap, oozes into the support functional area, causes the product functional area to blacken, and solid crystal glue peels off, can appear the whole phenomenon that drops of encapsulation glue even to cause the lamp of dying of lamp pearl.
The current LED bracket has the following defects:
1: the bracket functional areas (the positive electrode functional area a and the negative electrode functional area b) and the cup wall c are in a smooth plane structure (as shown in figures 1-1 and 1-2), and the following influences are caused on the product performance:
1.1: peeling the packaging adhesive from the wall of the bracket cup:
the encapsulation is glued and is smooth plane with the support wall of cup, and the expansion coefficient that the encapsulation was glued and support plastic is also different, and in the long-term use of product, both because cold and hot impact, influences such as high temperature and high humidity, encapsulation glue adhesion can constantly reduce, finally cause encapsulation glue and support interfacial layering to peel off, and steam or sulfuration gas can be along with the layering gap, invade inside the support.
1.2: peeling off the interface between the packaging adhesive and the functional area of the bracket:
the encapsulation is glued and support functional area also is smooth plane, along with the reduction of glue viscidity, peels off the aggravation of degree, and the further extension of steam invasion also can lead to appearing peeling off the phenomenon in encapsulation glue and support functional area interfacial, peels off degree and regional along with the use aggravation and extension, further causes solid crystal glue and support to peel off, and bonding wire and chip are corroded, finally leads to the sample to appear dying the lamp.
2: the bracket is white, and the following influences are caused on the product performance:
be level and smooth combination between support plastic and the metal pad, very easily cause the gap to appear between support plastic and the metal pad: the expansion coefficient of support plastic and metal pad differs great, and at the in-process of lamp pearl paster, both are through high temperature expansion and shrinkage back, and the gap of different degrees can appear in its interface.
For the two sealing defects, the following two methods are generally adopted in the industry:
1: packaging adhesive surface coating process: and coating the sealing waterproof material on the upper surface of the packaging adhesive again so as to achieve the surface isolation effect.
This process has two major disadvantages: because the LED lamp beads can generate a large amount of heat in the using process, the waterproof material can also have the aging and stripping phenomena after a certain using time; the waterproof material can affect the luminous flux, light color, color index, color coordinate and the like of the lamp bead to a certain degree.
2: and (3) electroplating the silver coating on the functional area again: because the silver coating is easy to be vulcanized, the silver coating is sputtered with materials such as alumina, titanium oxide and the like again to slow down the vulcanization and oxidation speed of the functional area.
This process has two major disadvantages:
1): after a single-layer or multi-layer plating layer is made again, the die bonding and wire bonding is easy to be abnormal, for example: the push-pull force is insufficient; difficult wire bonding, poor contact between a bonding wire and a bracket functional area and the like;
2): bonding wire and functional area welding part, support white road, solid brilliant glue etc. do not protected including, the cladding material function also can weaken gradually in the lamp pearl use, after the lamp pearl uses certain time, can appear that the bonding wire blackens, bonding wire bad contact, solid brilliant glue phenomenon such as drops.
Therefore, in the actual production process, a red ink experiment is usually adopted, and 3 reflow soldering experiments are taken as a product sealing property verification experiment.
Aiming at the defects, the invention designs the high-reliability integrated packaging support.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide the high-reliability integrated packaging support which is reasonable in structural design, adopts an integrated packaging structure, is simple in process and greatly improves the reliability of LED lamp beads.
In order to achieve the purpose, the invention is realized by the following technical scheme: a high-reliability integrated packaging support comprises a plastic support, solid crystal glue, a wafer placing area, a bonding wire, a chip, a reflecting surface, a marking angle, a white channel, an anode bonding pad, a cathode bonding pad, an anode functional area bulge inner groove, an anode bonding pad inner groove, a cathode functional area bulge inner groove, a cathode bonding pad inner groove, a packaging glue, a bulge functional area and a groove formed in the white channel, wherein the chip at the center of the front surface of the plastic support is fixed in the wafer placing area (on a support line) through the solid crystal glue, the anode and the cathode of the chip are respectively connected to the anode functional area bulge and the cathode functional area bulge through the bonding wire, the front surface of the plastic support is provided with a circular reflecting surface, one corner of the front surface of the plastic support is provided with the marking angle, the back surface of the plastic support is provided with the anode bonding pad and the cathode bonding pad, the white channel is arranged between the anode bonding pad and the cathode bonding pad, be provided with the protruding inner groovy of anodal functional area in the positive pole functional area arch, be provided with anodal pad inner groovy in the anodal pad, be provided with the protruding inner groovy of negative pole functional area in the negative pole functional area arch, be provided with negative pole pad inner groovy in the negative pole pad, be formed with the recess that bellied functional area and white way formed on the white way between anodal functional area arch and the negative pole functional area arch, the encapsulation is glued along recess (the protruding inner groovy of anodal functional area, anodal pad inner groovy, the protruding inner groovy of negative pole functional area, negative pole pad inner groovy, the crystal fixing glue, a chip, bonding wire and the sealed integrative structure that forms of recess that corresponds.
Preferably, the positive electrode bonding pad and the negative electrode bonding pad are welded on the PCB through solder paste for electrical connection.
Preferably, the plastic support is used for fixing the circuit board and creating a corresponding safe space for the design of the electric circuit.
Preferably, the cup mouth of the plastic support can be round, square, oval and the like.
Preferably, the number of the pins of the plastic support is not less than 2.
Preferably, the white channel edge is provided with a white channel edge groove.
The invention has the following beneficial effects:
1: promotion of LED lamp pearl reliability:
1.1: the hidden danger that the packaging adhesive and the wall of the bracket cup are peeled is overcome, the packaging adhesive is integrally packaged, the functional area, the die bond adhesive, the chip and the bonding wire are completely sealed inside to form a whole, and even if gaps, water vapor and sulfuration gas occur, the sealing adhesive is isolated on the outer surface of the packaging adhesive. The outer surface of the packaging adhesive and the edge of the white channel form a flow channel, and even if gaps occur, water vapor and sulfuration gas can be guided out of the lamp bead along the flow channel;
1.2: the hidden trouble that the packaging adhesive and the bracket functional area are stripped is overcome;
1.3: the hidden trouble that the coefficient of expansion of overcoming material is inconsistent leads to: because integrative packaging structure, support plastic material, packaging glue, the nature tolerance hidden danger that expansion coefficient nonconformity such as metal pad leads to is showing and is being reduced.
1.4: overcoming the potential sex tolerance hazard caused by the bracket white passage: because it is sealed including also by the encapsulation glue to middle or middle part, also can avoid the support by the risk that the fracture of white road plastic arouses, make the hidden danger of white road obviously reduced.
And 1.5, enabling all parts of the lamp beads to be combined more tightly, namely enabling the packaging glue to flow into the corresponding grooves, enabling the positive and negative bonding pads to be combined towards the middle after curing, and enabling the positive and negative metal bonding pads and the support plastic material to be combined together tightly.
And 1.6, the welding functional area is made into a convex design, and has a certain height with the bottom surface of the bracket, so that the crystal fixing glue, the chip, the bonding wire and the like can be prevented from being polluted by water vapor and sulfurated gas.
2: compared with the two sealing processes at present, the method has the following advantages:
2.1: integrally packaging: the functional area, the die bond, the chip and the bonding wire are completely sealed, and are not contacted with outside moisture, sulfuration gas and the like, so that the product is prevented from being used in a safe environment for a long time.
2.2: the cost is saved: the invention does not need to encapsulate the surface or sputter other metals, saves the cost while improving the sexual endurance, and has the advantages of simple implementation process, strong operability and the like;
2.3: the product solid welding and optical parameter are not influenced: the invention does not need to encapsulate or sputter other metals, thereby avoiding the process abnormity caused by the metal, and the influence on the luminous flux, the light color, the color index, the color coordinate and the like of the lamp bead.
Drawings
The invention is described in detail below with reference to the drawings and the detailed description;
FIG. 1-1 is a schematic diagram of the background of the invention;
FIG. 1-2 is an isometric view of FIG. 1-1;
FIG. 2-1 is a top view of the present invention;
2-2 are bottom views of the present invention;
FIGS. 2-3 are front views of the present invention;
FIGS. 2-4 are perspective views of the present invention;
FIG. 3-1 is a front cross-sectional view of the present invention;
FIG. 3-2 is an axial cross-sectional view of the present invention;
FIGS. 3-3 are schematic views of the package of the present invention;
FIG. 4 is a top view of another structure of the present invention;
FIG. 5-1 is a cross-sectional view of another construction of the present invention;
fig. 5-2 is a package diagram of another configuration of the present invention.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Referring to fig. 2-1 to 5-2, the present embodiment adopts the following technical solutions: a high-reliability integrated packaging support comprises a plastic support 1, solid crystal glue 2, a wafer placing area 3, a bonding wire 4, a chip 5, a reflecting surface 6, a mark angle 7, a white channel 8, an anode pad 9, a cathode pad 10, an anode functional area bulge 11, an anode functional area bulge inner groove 12, an anode pad inner groove 13, a cathode functional area bulge 14, a cathode functional area bulge inner groove 15, a cathode pad inner groove 16, packaging glue 17, and grooves 18 formed in the bulge functional area and the white channel, wherein the chip 5 at the center of the front surface of the plastic support 1 is fixed in the wafer placing area 3 (on a support line) through the solid crystal glue 2, the anode and the cathode of the chip 5 are respectively connected to the anode functional area bulge 11 and the cathode functional area bulge 14 through the bonding wire 4, the front surface of the plastic support 1 is provided with the circular reflecting surface 6, one corner of the front surface of the plastic support 1 is provided with the mark angle 7, the back of the plastic support 1 is provided with an anode pad 9, a cathode pad 10, the anode pad 9, a white channel 8 is arranged between the cathode pads 10, a raised inner groove 12 of an anode functional area is arranged in a raised 11 of the anode functional area, an anode pad inner groove 13 is arranged in the anode pad 9, a raised inner groove 15 of a cathode functional area is arranged in a raised 14 of the cathode functional area, an inner groove 16 of a cathode pad is arranged in the cathode pad 10, a raised functional area and a groove 18 formed in the white channel are formed on the white channel 8 between the raised 11 of the anode functional area and the raised 14 of the cathode functional area, packaging glue 17 is formed along the groove (the raised inner groove 12 of the anode functional area, the inner groove 13 of the anode pad, the raised inner groove 15 of the cathode functional area, the inner groove 16 of the cathode pad), solid crystal glue is formed, a chip, and a bonding line and a corresponding groove are sealed to form an integrated structure.
The wafer placing area 3 is a wafer placing functional area with a bulge formed on the functional area; the identification angle 7 distinguishes the anode and the cathode of the bracket, and the white passage 8 separates the functional regions of the bracket; the positive electrode functional region projection 11 is a wafer placing functional region where a projection is formed on an original functional region; the negative electrode functional region projection 14 is a wafer placement functional region where a projection is formed on an original functional region.
In the specific embodiment, a raised die bonding functional area is formed on the functional area of the original bracket, and grooves are also formed in the raised functional area and the bonding pad; during packaging, the packaging adhesive seals the die attach adhesive, the chip, the bonding wire and the corresponding groove along the groove to form an integrated structure.
The plastic bracket of this embodiment is made of plastic material: the plastic material is used for fixing the circuit board and creating a corresponding safe space for the design of the electric circuit. Thus:
1): the color and material of the plastic material can be designed in various ways according to the purpose: such as white PCT, white PPA, black PPA, transparent PC, white EMC, white ceramic, etc.;
2): the shape and size of the plastic material can be designed in various ways according to the purpose.
The shape and size of the stent of the embodiment are as follows: the overall shape and size of the bracket can be designed into different shapes and sizes according to the use of a designer, so that:
1): the cup mouth of the bracket can be designed into a round shape, a square shape, an oval shape and the like;
2): the functional area of the bracket can be designed into different shapes;
3): the bracket may be sized 3528,5050,2835,5730, etc.
The relevant substitutions of the bracket pin, the insulating layer and the bottom bonding pad of the embodiment are as follows:
1): the three can be designed into functional areas with different structures and different shapes according to different purposes so as to meet the corresponding welding arrangement. Thus:
2): the material of the base material is not limited: the material of the substrate can be aluminum, copper, ceramic and the like;
3): the surface treatment mode of the base material, the material of the plating layer and the like are not limited;
4: the shape and the size are not limited;
5): the shape and number of the pins are not limited: the embodiment is illustrated by using only a two-pin support, and a plurality of pins can be provided to form a plurality of concave cups and functional area protrusions, as shown in the three-cup support in fig. 4-1;
6): the shape and number of the grooves are not limited: for example, the following design can be adopted in the present embodiment: (no recess is provided in the pad of FIG. 5-1; white-tracking edge recess 19 of FIG. 5-2); the negative electrode functional region protrusion and the positive electrode functional region protrusion can also be designed into unequal-height shapes according to actual requirements.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, and such changes and modifications are within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A high-reliability integrated packaging support is characterized by comprising a plastic support (1), solid crystal glue (2), a wafer placing area (3), a bonding wire (4), a chip (5), a light reflecting surface (6), a mark corner (7), a white channel (8), an anode pad (9), a cathode pad (10), an anode functional area bulge (11), an anode functional area bulge inner groove (12), an anode pad inner groove (13), a cathode functional area bulge (14), a cathode functional area bulge inner groove (15), a cathode pad inner groove (16), packaging glue (17), and grooves (18) formed in the raised functional area and the white channel, wherein the chip (5) at the front center of the plastic support (1) is fixed in the wafer placing area (3) through the solid crystal glue (2), and the positive and negative poles of the chip (5) are respectively connected to the anode functional area bulge (11) and the cathode functional area bulge (14) through the bonding wire (4), the front surface of the plastic support (1) is provided with a circular reflective surface (6), one corner of the front surface of the plastic support (1) is provided with an identification angle (7), the back surface of the plastic support (1) is provided with an anode pad (9) and a cathode pad (10), a white channel (8) is arranged between the anode pad (9) and the cathode pad (10), an anode functional region convex inner groove (12) is arranged in the anode functional region bulge (11), an anode pad inner groove (13) is arranged in the anode pad (9), a cathode functional region convex inner groove (15) is arranged in the cathode functional region bulge (14), a cathode pad inner groove (16) is arranged in the cathode pad (10), a convex functional region and a groove (18) formed in the white channel are formed on the white channel (8) between the anode functional region bulge (11) and the cathode functional region bulge (14), and crystal solidification glue (17) is arranged along the groove, the chip, the bonding wire and the corresponding groove are sealed to form an integral structure.
2. A high reliability integrated package support according to claim 1, wherein the positive electrode pad (9) and the negative electrode pad (10) are soldered on the PCB board by solder paste for electrical connection.
3. The package support of claim 1, wherein the plastic support is used for fixing a circuit board and creating a safe space for designing an electrical circuit.
4. The high reliability integrated package support of claim 1, wherein the cup mouth of the plastic support (1) is circular, square or oval.
5. A high reliability integrated package support according to claim 1, wherein the number of pins of the plastic support (1) is not less than 2.
6. A high reliability one-piece package support according to claim 1, wherein said white channel (8) edge is provided with a white channel edge groove (19).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210463447.7A CN114937730A (en) | 2022-04-28 | 2022-04-28 | High-reliability integrated packaging support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210463447.7A CN114937730A (en) | 2022-04-28 | 2022-04-28 | High-reliability integrated packaging support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114937730A true CN114937730A (en) | 2022-08-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210463447.7A Pending CN114937730A (en) | 2022-04-28 | 2022-04-28 | High-reliability integrated packaging support |
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| Country | Link |
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| CN (1) | CN114937730A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117410428A (en) * | 2023-12-13 | 2024-01-16 | 深圳市绿源极光科技有限公司 | LED chip packaging structure for COB light source |
-
2022
- 2022-04-28 CN CN202210463447.7A patent/CN114937730A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117410428A (en) * | 2023-12-13 | 2024-01-16 | 深圳市绿源极光科技有限公司 | LED chip packaging structure for COB light source |
| CN117410428B (en) * | 2023-12-13 | 2024-02-23 | 深圳市绿源极光科技有限公司 | LED chip packaging structure for COB light source |
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