CN117410428B - LED chip packaging structure for COB light source - Google Patents
LED chip packaging structure for COB light source Download PDFInfo
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- CN117410428B CN117410428B CN202311704943.8A CN202311704943A CN117410428B CN 117410428 B CN117410428 B CN 117410428B CN 202311704943 A CN202311704943 A CN 202311704943A CN 117410428 B CN117410428 B CN 117410428B
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- groove
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- glue
- light source
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000003292 glue Substances 0.000 claims description 55
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 239000000565 sealant Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 abstract description 21
- 230000001070 adhesive effect Effects 0.000 abstract description 21
- 238000007789 sealing Methods 0.000 abstract description 11
- 230000000670 limiting effect Effects 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000004804 winding Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000007605 air drying Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Abstract
The invention provides an LED chip packaging structure for a COB light source, which relates to the technical field of optical elements and comprises a substrate and at least two LED chips, wherein a bottom plate is arranged on the upper surface of the substrate, each LED chip is arranged on the surface of the bottom plate, a first lead is connected between each two LED chips, a rectangular groove is formed in the upper end part of the bottom plate, an inner groove is formed in the rectangular groove, a conical groove is formed between the inner groove and the rectangular groove, when the substrate is packaged, the first adhesive groove or the second adhesive groove can be selected for sealing, and the positions of the first adhesive groove and the second adhesive groove are higher than those of the LED chips, so that the phenomenon of contact of the LED chips can be effectively avoided when the second adhesive groove and the first adhesive are sealed, meanwhile, an inner ring and an annular plate fixed below the lower plate can limit the position of the inner adhesive, the adhesive is placed to be contacted with a rectangular copper sheet below a radiating sheet, the whole packaging position has a limiting effect, and the packaging capacity is improved.
Description
Technical Field
The invention belongs to the technical field of optical elements, and particularly relates to an LED chip packaging structure for a COB light source.
Background
The COB light source is a high light efficiency integrated surface light source technology for directly attaching an LED chip to a mirror surface metal substrate with high reflectivity, the technology eliminates the bracket concept, and the processes of electroless plating, reflow soldering and surface mounting are omitted, so that the processes are reduced by nearly one third, the cost is also saved by one third, and the existing COB package has the following defects:
the existing LED chips are fixed on a substrate through epoxy resin, but along with heat generation of the chips, the epoxy resin is easy to fold and polymerize together, the chips are loose, heat dissipation is invalid, and the service life of the chips is reduced.
When the existing LED chips are electrically connected, the number of LEDs is large, so that the phenomenon of complex and staggered lines can occur when a plurality of LED lines are routed, and the packaging difficulty is greatly improved.
Accordingly, the present invention has been made in view of the above circumstances, and an object of the present invention is to provide an LED chip package structure for COB light sources, which has a more practical value.
Disclosure of Invention
In order to solve the above technical problems, the present invention provides an LED chip package structure for COB light source to solve the above problems.
The utility model provides a LED chip packaging structure that COB light source used, includes base plate and two at least LED chips, the upper surface mounting of base plate has the bottom plate, every LED chip all installs in the surface of bottom plate, every two all be connected with first wire between the LED chip, rectangular channel has been seted up to the upper end of bottom plate, the inside in rectangular channel has been seted up, be formed with the taper groove between inside channel and the rectangle groove, set up the guiding gutter between inside channel and the taper groove, the rectangle groove is used for filling glue, LED chip installs in the rectangle inslot;
the heat dissipation device comprises a substrate, wherein a radiating fin is arranged below the substrate, a bottom groove is formed in the lower surface of the radiating fin, and at least two rectangular copper sheets are fixedly arranged on the inner wall of the bottom groove.
Preferably, the upper surface of base plate outer wall has seted up first point and has glued the groove, is located first point and glues the inslot the upper surface of base plate outer wall has seted up the second and has glued the groove, the internally mounted in second point glues the groove has the second sealed glue, the top fixed mounting of second sealed glue has first sealed glue, every two the guiding gutter is located the left and right sides in rectangular channel respectively, and two the guiding gutter has all been seted up to the inner wall in rectangular channel, and every the guiding gutter all link up mutually with the guiding gutter, every the equal fixed mounting in left and right sides of LED chip has the side offset plate, every the lower surface of side offset plate has all seted up the interior gluey groove, and every the interior gluey groove is located the upper portion in guiding gutter.
Preferably, the surface fixed mounting of bottom plate has two at least unable adjustment base, and every unable adjustment base's upper end has all seted up the clamp groove, every first wire is all installed in the top of two unable adjustment bases, and every first wire all is located the clamp inslot portion, the upper end fixed mounting of bottom plate has two electrode slices, two the electrode slice is anodal and negative pole respectively, the anodal is connected with first LED chip through first wire, be connected with the second wire between negative pole and the last LED chip.
Preferably, the lower surface of base plate has seted up two at least first radiating grooves, two at least second radiating grooves have been seted up to the upper end of fin, every all install the copper sheet between first radiating groove and the second radiating groove, the lower tip fixed mounting of base plate has the hypoplastron, the inside inner wall fixed mounting of hypoplastron has the inner ring, the inner wall fixed mounting of inner ring has the annular plate.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the LED chips are placed in the rectangular grooves, the lower ends of the LED chips are in contact with the glue, the LED chips are electrically connected by the first lead, then the first lead and the second lead are electrically connected with the two electrode plates, at the moment, the LED chips are electrically connected, the copper sheet corresponds to the lower part of each rectangular groove, the copper sheet can play a role in heat dissipation, and meanwhile, the heat dissipation fin arranged below the substrate can play a good heat dissipation effect, so that the heat dissipation capability of the whole substrate during operation after encapsulation can be improved, and the problem of deformation and fold of the glue is solved.
According to the invention, the LED chips on the substrate are divided into two groups, one group is the outer ring, the other group is the inner ring, the LED chips form the inner ring and the outer ring, the LED chips are electrically connected in an end-to-end mode, and meanwhile, the distance between the two electrode plates is shorter, so that the problem of line winding caused by the electric connection of the LED chips is reduced, the sequence of the electric connection of the LED chips is greatly improved, and the efficiency of the LED chips in operation is effectively improved.
According to the LED packaging structure, when the fixed glue enters the rectangular groove, the glue flows into the inner groove along the conical groove, then enters the guide groove along the inner groove, after the LED chip is placed into the rectangular groove, the glue in the rectangular groove can be attached to the LED chip in a large area, after the LED chip is dried in the air, the LED chip can be firmly fixed, the rectangular groove and the inner groove adopt the design of narrow bottom and wide top, so that the phenomenon of glue leakage in the rectangular groove can be effectively reduced, and the waste of sealing glue is effectively avoided.
According to the LED chip fixing device, after the fixing glue enters the diversion trench, the fixing glue enters the inner glue groove formed in the side glue plate along the upper launder, so that the inner glue groove is fixed, the fixing of the two sides of the LED chip is further achieved, and when the LED chip fixing device is used later, the LED chip is loosened due to the fact that the fixing glue is softened at high temperature, and the side glue plates on the two sides of the LED chip are additionally fixed in a gelling mode, so that the LED chip is effectively prevented from loosening, the fixing is not needed by a mechanical structure, and the packaging difficulty is greatly reduced.
According to the LED chip temperature-reducing structure, the first radiating grooves are formed right below each rectangular groove, each copper sheet is located in each first radiating groove, and the second radiating grooves formed in the radiating fins are sleeved below the copper sheets, so that when the LED chip operates, the plurality of rectangular copper sheets below the radiating fins can achieve the effect of accelerating temperature reduction, and each copper sheet corresponds to the position of the LED chip, and the problem of temperature accumulation position is solved.
According to the invention, when the substrate is packaged, the first adhesive dispensing groove or the second adhesive dispensing groove can be selected for adhesive sealing, and the positions of the first adhesive dispensing groove and the second adhesive dispensing groove are higher than those of the LED chip, so that the phenomenon of contact of the LED chip can be effectively avoided when the second adhesive sealing groove and the first adhesive sealing groove are sealed, meanwhile, the inner ring and the annular plate fixed below the lower plate can limit the position of the inner adhesive sealing groove, the adhesive is placed to be in contact with the rectangular copper sheet below the radiating fin, the whole packaging position has a limiting effect, and the packaging capacity is improved.
Drawings
FIG. 1 is a schematic view of the overall structure of a substrate according to the present invention;
FIG. 2 is a schematic diagram of an LED chip structure according to the present invention;
FIG. 3 is a schematic view of the lower plate structure of the present invention;
FIG. 4 is a schematic view of the structure of a copper sheet according to the present invention;
FIG. 5 is a schematic view of a heat sink according to the present invention;
FIG. 6 is a schematic view of the electrode plate structure of the present invention;
FIG. 7 is a schematic view of a side glue plate structure according to the invention;
fig. 8 is an enlarged schematic view of the structure of fig. 6 according to the present invention.
In the figure, the correspondence between the component names and the drawing numbers is: 1. a substrate; 11. a first dispensing slot; 12. a second dispensing slot; 13. a bottom plate; 14. a second sealant; 15. a first sealant; 16. a lower plate; 17. an annular plate; 18. an inner ring; 19. a first heat sink; 2. copper sheets; 21. a heat sink; 22. a bottom groove; 23. rectangular copper sheets; 24. a second heat sink; 3. rectangular grooves; 31. a conical groove; 32. an inner tank; 33. a diversion trench; 34. a flow groove; 35. a first wire; 36. a fixed base; 37. a clamping groove; 38. an electrode sheet; 39. a second wire; 4. an LED chip; 41. a side glue plate; 42. and an inner glue groove.
Detailed Description
Embodiments of the present invention are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the invention but are not intended to limit the scope of the invention.
Embodiment one:
referring to fig. 1-8, the invention provides an LED chip package structure for a COB light source, which comprises a substrate 1 and at least two LED chips 4, wherein a bottom plate 13 is mounted on the upper surface of the substrate 1, each LED chip 4 is mounted on the surface of the bottom plate 13, a first lead 35 is connected between each two LED chips 4, a rectangular groove 3 is formed at the upper end of the bottom plate 13, an inner groove 32 is formed in the rectangular groove 3, a conical groove 31 is formed between the inner groove 32 and the rectangular groove 3, a diversion groove 33 is formed between the inner groove 32 and the conical groove 31, the rectangular groove 3 is used for filling glue, and the LED chips 4 are mounted in the rectangular groove 3; wherein, the fin 21 is installed to the below of base plate 1, the undercut 22 has been seted up to the lower surface of fin 21, adopt first wire 35 to carry out electric connection with a plurality of LED chips 4, then carry out electric connection with first wire 35 and second wire 39 and two electrode pieces 38, electric connection is accomplished to a plurality of LED chips 4 this moment, correspond copper sheet 2 under every rectangular channel 3, copper sheet 2 can play radiating mediation effect, the fin 21 of base plate 1 below installation can play better radiating effect simultaneously, the inner wall fixed mounting of undercut 22 has two at least rectangle copper sheets 23.
The upper surface of the outer wall of the substrate 1 is provided with a first adhesive dispensing groove 11, the upper surface of the outer wall of the substrate 1, which is positioned on the inner ring of the first adhesive dispensing groove 11, is provided with a second adhesive dispensing groove 12, the inside of the second adhesive dispensing groove 12 is provided with a second sealant 14, the top of the second sealant 14 is fixedly provided with a first sealant 15, each two diversion grooves 33 are respectively positioned on the left side and the right side of the rectangular groove 3, the inner walls of the two rectangular grooves 3 are respectively provided with an upper diversion groove 34, each upper diversion groove 34 is communicated with the corresponding diversion groove 33, a plurality of fixing bases 36 are used for fixedly supporting the first lead 35 in a head-to-tail mode, each first lead 35 is arranged in a clamping groove 37 formed by the fixing base 36, the plurality of fixing bases 36 can improve the cleanness of the first lead 35 in wiring, the stability of the LED chips 4 in packaging is improved, the fixing of the positions of the first lead 35 is improved, each side diversion groove 41 is fixedly arranged on the left side and right side of each LED chip 4, the lower surface of each side diversion groove 41 is provided with an inner glue groove 42, and each upper side glue groove 42 is positioned right above each inner groove 34.
The surface mounting of bottom plate 13 has two at least unable adjustment base 36, and the clamp groove 37 has all been seted up to the upper end of every unable adjustment base 36, every first wire 35 all installs in the top of two unable adjustment base 36, and every first wire 35 all is located clamp groove 37 inside, the upper end fixed mounting of bottom plate 13 has two electrode pieces 38, two electrode pieces 38 are anodal and negative pole respectively, the distance is shorter between two electrode pieces 38 simultaneously, thereby the circuit winding problem that a plurality of LED chips 4 brought when electric connection has been reduced, the sequency when a plurality of LED chips 4 electric connection has been greatly improved, effectively improve the efficiency of a plurality of LED chips 4 when the operation, the anodal is connected with first LED chip 4 through first wire 35, be connected with second wire 39 between negative pole and the last LED chip 4.
At least two first radiating grooves 19 are formed in the lower surface of the base plate 1, at least two second radiating grooves 24 are formed in the upper end portions of radiating fins 21, copper sheets 2 are installed between each first radiating groove 19 and each second radiating groove 24, glue in each rectangular groove 3 is attached to the corresponding LED chip 4 in a large area, after subsequent air drying, the LED chips 4 can be firmly fixed, the rectangular grooves 3 and the inner grooves 32 are designed to be narrow at the bottom and wide at the top, accordingly the phenomenon of glue leakage in the rectangular grooves 3 can be effectively reduced, a lower plate 16 is fixedly installed at the lower end portion of the base plate 1, an inner ring 18 is fixedly installed on the inner wall of the lower plate 16, and an annular plate 17 is fixedly installed on the inner wall of the inner ring 18.
Working principle:
firstly, drop into fixed glue in rectangular groove 3, the height of glue does not exceed the surface of rectangular groove 3, then the user puts a plurality of LED chips 4 into rectangular groove 3, the lower tip and the glue contact of LED chips 4, adopt first wire 35 to carry out electric connection with a plurality of LED chips 4, then carry out electric connection with first wire 35 and second wire 39 and two electrode plates 38, electric connection is accomplished to a plurality of LED chips 4 this moment, correspond copper sheet 2 under every rectangular groove 3, copper sheet 2 can play radiating mediation effect, the fin 21 of base plate 1 below installation can play better radiating effect simultaneously, thereby can improve the heat dissipation of base plate 1 whole when the operation after the encapsulation, reduce the problem of glue deformation fold.
Secondly, the LED chips 4 on the substrate 1 are divided into two groups, one group is an outer ring, the other group is an inner ring, the LED chips 4 form the inner ring and the outer ring, the LED chips 4 are electrically connected in an end-to-end mode, and meanwhile, the distance between the two electrode plates 38 is shorter, so that the problem of line winding caused by the electric connection of the LED chips 4 is reduced, the sequence of the electric connection of the LED chips 4 is greatly improved, and the efficiency of the LED chips 4 in operation is effectively improved;
when a plurality of first wires 35 carry out electric connection to LED chip 4, adopt a plurality of unable adjustment base 36 to carry out end-to-end fixed support to first wire 35, every first wire 35 is all installed in the double-layered inslot 37 that unable adjustment base 36 offered, and a plurality of unable adjustment base 36 can improve the neatly when first wire 35 walks the line, and improved the stability of LED chip 4 when the encapsulation, improves the fixity in first wire 35 position, reduces holistic encapsulation time.
Thirdly, when the fixed glue water enters the rectangular groove 3, the glue water firstly flows into the inner groove 32 along the conical groove 31, then enters the guide groove 33 along the inner groove 32, after the LED chip 4 is placed into the rectangular groove 3, the glue water in the rectangular groove 3 can be attached to the LED chip 4 in a large area, after the LED chip 4 is dried in the air, the LED chip 4 can be firmly fixed, and the rectangular groove 3 and the inner groove 32 are designed with narrow bottoms and wide tops, so that the phenomenon of glue water leakage in the rectangular groove 3 can be effectively reduced, and the waste of sealing glue is effectively avoided;
after the fixed glue enters the diversion trench 33, the fixed glue enters the inner glue groove 42 formed on the side glue plate 41 along the upper groove 34 to fix the inner glue groove 42, so that the fixation of the two sides of the LED chip 4 is further realized, and when the LED chip 4 is used later, the loosening phenomenon of the LED chip 4 can be caused due to the fact that the fixed glue is softened at high temperature, and the device can effectively avoid the loosening phenomenon of the LED chip 4 by additionally gelling and fixing the side glue plates 41 on the two sides of the LED chip 4 without adopting a mechanical structure for fixation, so that the packaging difficulty is greatly reduced;
because the first heat dissipation groove 19 is formed right below each rectangular groove 3, each copper sheet 2 is positioned in the first heat dissipation groove 19, and meanwhile, the second heat dissipation groove 24 formed by the heat dissipation fin 21 is sleeved below the copper sheet 2, when the LED chip 4 operates, the plurality of rectangular copper sheets 23 below the heat dissipation fin 21 can have the effect of accelerating the temperature reduction, and meanwhile, each copper sheet 2 corresponds to the position of the LED chip 4, so that the problem of temperature accumulation position is solved;
when the substrate 1 is packaged, the first dispensing groove 11 or the second dispensing groove 12 can be selected for sealing, and the positions of the first dispensing groove 11 and the second dispensing groove 12 are higher than the LED chip 4, so that the phenomenon of contacting the LED chip 4 can be effectively avoided when the second sealing glue 14 and the first sealing glue 15 are externally sealed, and meanwhile, the inner ring 18 and the annular plate 17 fixed below the lower plate 16 can limit the inner sealing glue position, the placing glue contacts with the rectangular copper sheet 23 below the radiating fin 21, and the whole packaging position has a limiting effect, so that the packaging capability is improved.
The embodiments of the invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (6)
1. The utility model provides a LED chip packaging structure that COB light source used, includes base plate (1) and two at least LED chips (4), its characterized in that: the LED chip comprises a substrate (1), wherein a bottom plate (13) is arranged on the upper surface of the substrate (1), each LED chip (4) is arranged on the surface of the bottom plate (13), a first lead (35) is connected between every two LED chips (4), a rectangular groove (3) is formed in the upper end part of the bottom plate (13), an inner groove (32) is formed in the rectangular groove (3), a conical groove (31) is formed between the inner groove (32) and the rectangular groove (3), a diversion groove (33) is formed between the inner groove (32) and the conical groove (31), the rectangular groove (3) is used for filling glue, and the LED chips (4) are arranged in the rectangular groove (3);
the heat dissipation device comprises a substrate (1), wherein a heat dissipation sheet (21) is arranged below the substrate (1), a bottom groove (22) is formed in the lower surface of the heat dissipation sheet (21), at least two rectangular copper sheets (23) are fixedly arranged on the inner wall of the bottom groove (22), each two guide grooves (33) are respectively arranged on the left side and the right side of the rectangular groove (3), an upper groove (34) is formed in the inner wall of the rectangular groove (3), each upper groove (34) is communicated with the guide grooves (33), side glue plates (41) are fixedly arranged on the left side and the right side of each LED chip (4), an inner glue groove (42) is formed in the lower surface of each side glue plate (41), each inner glue groove (42) is arranged right above each upper groove (34), at least two fixing bases (36) are fixedly arranged on the surface of the bottom plate (13), clamping grooves (37) are formed in the upper end portions of the fixing bases (36), and each first lead (35) is arranged on each first lead (35) and second lead (35) is arranged on the first lead (35).
2. The LED chip package structure for COB light source of claim 1 wherein: the upper surface of base plate (1) outer wall has seted up first point and has glued groove (11), is located the upper surface of base plate (1) outer wall of first point and glues groove (12), the internally mounted in second point glues groove (12) has second sealant (14), the top fixed mounting of second sealant (14) has first sealant (15).
3. The LED chip package structure for COB light source of claim 2 wherein: two electrode plates (38) are fixedly arranged at the upper end part of the bottom plate (13), and the two electrode plates (38) are respectively a positive electrode and a negative electrode.
4. The LED chip package structure for COB light source of claim 3 wherein: the positive electrode is connected with the first LED chip (4) through a first lead (35), and a second lead (39) is connected between the negative electrode and the last LED chip (4).
5. The LED chip package structure for COB light source of claim 1 wherein: at least two first radiating grooves (19) are formed in the lower surface of the base plate (1), at least two second radiating grooves (24) are formed in the upper end portions of the radiating fins (21), and copper sheets (2) are arranged between each first radiating groove (19) and each second radiating groove (24).
6. The LED chip package structure for COB light source of claim 1 wherein: the lower end part of the base plate (1) is fixedly provided with a lower plate (16), the inner wall of the lower plate (16) is fixedly provided with an inner ring (18), and the inner wall of the inner ring (18) is fixedly provided with an annular plate (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311704943.8A CN117410428B (en) | 2023-12-13 | 2023-12-13 | LED chip packaging structure for COB light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311704943.8A CN117410428B (en) | 2023-12-13 | 2023-12-13 | LED chip packaging structure for COB light source |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117410428A CN117410428A (en) | 2024-01-16 |
| CN117410428B true CN117410428B (en) | 2024-02-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311704943.8A Active CN117410428B (en) | 2023-12-13 | 2023-12-13 | LED chip packaging structure for COB light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117410428B (en) |
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|---|---|---|---|---|
| JP2012109328A (en) * | 2010-11-16 | 2012-06-07 | Panasonic Corp | Semiconductor device |
| CN103915392A (en) * | 2013-01-09 | 2014-07-09 | 联京光电股份有限公司 | Substrate, semiconductor structure and related manufacturing method thereof |
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