CN217334077U - Large-step-distance semiconductor lead frame convenient for heat dissipation - Google Patents
Large-step-distance semiconductor lead frame convenient for heat dissipation Download PDFInfo
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- CN217334077U CN217334077U CN202220094414.5U CN202220094414U CN217334077U CN 217334077 U CN217334077 U CN 217334077U CN 202220094414 U CN202220094414 U CN 202220094414U CN 217334077 U CN217334077 U CN 217334077U
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- pin
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- lead frame
- heat dissipation
- carrying area
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Abstract
The utility model discloses a large-step-distance semiconductor lead frame convenient for heat dissipation, which comprises a main body, wherein a chip carrying area is arranged in the main body, the peripheral side wall of the chip carrying area is provided with an inclined plane, the lower left corner of the chip carrying area is fixedly provided with a circular positioning column, the upper right corner of the chip carrying area is provided with an elliptical positioning column, a pin is fixedly arranged below the main body, a connecting hole is arranged in the pin, the outer side of the tail end of the pin is provided with an outer inclined plane, the outer end of the connecting hole is provided with a V-shaped groove, the middle part of the pin is connected with a lantern ring, a fixing rod is connected between the lantern rings, a base layer is arranged below the chip carrying area, a heat conducting layer is arranged below the base layer, the bottom of the heat conducting layer is provided with heat dissipation holes, the tail ends of the pins are fixedly provided with connecting frames, and gaps are uniformly arranged between the connecting frames, the device has solved the current inconvenient problem of lead frame chip installation.
Description
Technical Field
The utility model belongs to the technical direction of semiconductor processing, concretely relates to convenient radiating big step distance semiconductor lead frame.
Background
The lead frame is a carrier for bearing the chip, plays a role in transmitting an internal circuit of the chip and an external electric signal after being bonded by a wire, and plays a role in positioning and mechanical supporting in the packaging process and the mounting process; and heat conduction during operation. Therefore, the lead frame is an important component in the field of power device packaging.
The existing lead frame is troublesome in chip installation, the chip is easy to deflect in the frame, and the installation efficiency is low. This phenomenon becomes an urgent problem to be solved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to current device a convenient radiating big step distance semiconductor lead frame to solve the problem that proposes in the above-mentioned background art.
In order to solve the technical problem, the utility model provides a following technical scheme: the utility model provides a convenient radiating big step-pitch semiconductor lead frame, includes the main part, the inside of main part is provided with the slide holder district, the lateral wall all around of slide holder district is provided with the inclined plane, the lower left corner fixed mounting in slide holder district has circular reference column, the upper right corner in slide holder district is provided with oval reference column.
The utility model discloses further explain, the below fixed mounting of main part has the pin, the inside of pin is provided with the connecting hole, the terminal outside of pin is provided with outer inclined plane, the outer end of connecting hole is provided with V type groove, the middle part of pin is connected with the lantern ring, be connected with the dead lever between the lantern ring.
The utility model discloses explain further, the below in slide glass district is provided with the basic unit, the below of basic unit is provided with the heat-conducting layer, the bottom of heat-conducting layer is provided with the louvre.
The utility model discloses further explain, the terminal fixed mounting of pin has the link, evenly be provided with the breach between the link.
Compared with the prior art, the utility model discloses the beneficial effect who reaches is: the utility model is a novel water-saving water dispenser,
(1) the chip is arranged in the chip carrying area and the inclined plane, the semiconductor chip is placed in the chip carrying area in the main body before the lead frame is packaged, the inclined plane arranged on the periphery of the chip carrying area enables the semiconductor chip to be placed in the chip carrying area more easily, the semiconductor chip is prevented from being clamped, and the chip penetrates through the round positioning column and the oval positioning column in the chip carrying area during installation, so that the chip is conveniently positioned, the chip is prevented from being deviated in the chip carrying area, and the chip is conveniently and quickly installed through the steps;
(2) through the arrangement of the pins and the fixing rods, after the chip is installed, the connecting wires are inserted into the connecting holes in the pins, the V-shaped grooves formed in the outer ends of the connecting holes can facilitate the insertion of the connecting wires, the wiring efficiency is improved, after the connecting wires are contacted with the chip, the connecting wires are welded with the chip together and fixed, finally, glue is dripped onto the surface of the chip in the chip carrying area through a glue dispenser, the chip and the lead frame are packaged and fixed together, the chip can be conveniently inserted in use due to the outer inclined surfaces formed at the tail ends of the pins, the strength of the pins is effectively improved due to the fixing rods connected between lantern rings installed outside the pins, and the pins are prevented from being deformed in use;
(3) through being provided with heat-conducting layer and louvre, through being provided with the basic unit, can increase the intensity of lead frame, the heat-conducting layer that the below of basic unit set up can be discharged the heat that the chip produced when moving through the louvre of below, improves the radiating efficiency of device, avoids the chip to damage because of the high temperature.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic top view of the lead frame of the present invention;
fig. 3 is a schematic cross-sectional structure diagram of the lead frame of the present invention;
in the figure: 1. a main body; 2. a pin; 3. a connecting frame; 4. a notch; 5. a collar; 6. a fixing rod; 7. a bevel; 8. a slide area; 9. an elliptical positioning post; 10. a circular positioning column; 11. connecting holes; 12. an outer bevel; 13. a V-shaped groove; 14. a base layer; 15. a heat conductive layer; 16. and (4) heat dissipation holes.
Detailed Description
The following non-limiting detailed description of the present invention is provided in connection with the preferred embodiments and accompanying drawings. It is to be understood that the disclosed embodiments are merely exemplary of the invention, and are not intended to limit the invention to the precise embodiments disclosed. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a large-step-distance semiconductor lead frame convenient for heat dissipation comprises a main body 1, wherein a chip carrying area 8 is arranged in the main body 1, an inclined surface 7 is arranged on the peripheral side wall of the chip carrying area 8, a circular positioning column 10 is fixedly arranged at the lower left corner of the chip carrying area 8, an oval positioning column 9 is arranged at the upper right corner of the chip carrying area 8, a semiconductor chip is placed in the chip carrying area 8 in the main body 1 before the lead frame is packaged, the semiconductor chip can be more easily placed in the chip carrying area 8 due to the inclined surface 7 arranged at the periphery of the chip carrying area 8, the semiconductor chip is prevented from being clamped, and the chip penetrates through the circular positioning column 10 and the oval positioning column 9 in the chip carrying area 8 during installation, so that the chip is conveniently positioned, the chip is prevented from being rapidly deviated in the chip carrying area 8, and the chip is conveniently installed through the steps;
the pin 2 is fixedly arranged below the main body 1, the connecting hole 11 is arranged inside the pin 2, the outer inclined surface 12 is arranged outside the tail end of the pin 2, the V-shaped groove 13 is arranged at the outer end of the connecting hole 11, the lantern ring 5 is connected to the middle part of the pin 2, the fixing rod 6 is connected between the lantern rings 5, after the chip is installed, the connecting wire is inserted into the connecting hole 11 in the pin 2, the V-shaped groove 13 arranged at the outer end of the connecting hole 11 can facilitate the insertion of the connecting wire, the wiring efficiency is improved, after the connecting wire is contacted with the chip, the connecting wire is welded with the chip together, the connecting wire is fixed, finally, the glue is dripped into the surface of the chip in the chip carrying area 8 through a glue dispenser, the chip and the lead frame are packaged and fixed together, the outer inclined surface 12 arranged at the tail end of the pin 2 enables the chip to be more conveniently inserted in use, the fixing rod 6 connected between the lantern rings 5 arranged outside the pin 2 effectively increases the strength of the pin 2, the deformation of the pin 2 is avoided when the pin is used;
a base layer 14 is arranged below the chip carrying area 8, a heat conduction layer 15 is arranged below the base layer 14, heat dissipation holes 16 are formed in the bottom of the heat conduction layer 15, the base layer 14 can increase the strength of the lead frame, the heat conduction layer 15 arranged below the base layer 14 can discharge heat generated during operation of a chip through the heat dissipation holes 16 below the heat conduction layer, the heat dissipation efficiency of the device is improved, and the chip is prevented from being damaged due to overhigh temperature;
the terminal fixed mounting of pin 2 has link 3, evenly is provided with breach 4 between the link 3, can link together a plurality of lead frames through link 3, carries out simultaneous processing to it, has effectively improved machining efficiency, and breach 4 can be separated it after finishing by convenient processing, has effectively improved production efficiency.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description of the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Finally, it should be pointed out that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: it is to be understood that modifications may be made to the technical solutions described in the foregoing embodiments, or some technical features may be equivalently replaced without departing from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (4)
1. The utility model provides a make things convenient for radiating big step pitch semiconductor lead frame, includes main part (1), its characterized in that: the inside of main part (1) is provided with slide carrying district (8), the lateral wall all around of slide carrying district (8) is provided with inclined plane (7), the lower left corner fixed mounting in slide carrying district (8) has circular reference column (10), the upper right corner in slide carrying district (8) is provided with oval reference column (9).
2. The large step pitch semiconductor lead frame facilitating heat dissipation of claim 1, wherein: the utility model discloses a pin (2) with the fixed mounting of main part (1), the below fixed mounting of main part (1) has pin (2), the inside of pin (2) is provided with connecting hole (11), the terminal outside of pin (2) is provided with outer inclined plane (12), the outer end of connecting hole (11) is provided with V type groove (13), the middle part of pin (2) is connected with the lantern ring (5), be connected with dead lever (6) between the lantern ring (5).
3. The large step pitch semiconductor lead frame facilitating heat dissipation of claim 2, wherein: the chip carrying area is characterized in that a base layer (14) is arranged below the chip carrying area (8), a heat conduction layer (15) is arranged below the base layer (14), and heat dissipation holes (16) are formed in the bottom of the heat conduction layer (15).
4. The large step pitch semiconductor lead frame facilitating heat dissipation of claim 3, wherein: the terminal fixed mounting of pin (2) has link (3), evenly be provided with breach (4) between link (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220094414.5U CN217334077U (en) | 2022-01-14 | 2022-01-14 | Large-step-distance semiconductor lead frame convenient for heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220094414.5U CN217334077U (en) | 2022-01-14 | 2022-01-14 | Large-step-distance semiconductor lead frame convenient for heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217334077U true CN217334077U (en) | 2022-08-30 |
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ID=82992650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220094414.5U Active CN217334077U (en) | 2022-01-14 | 2022-01-14 | Large-step-distance semiconductor lead frame convenient for heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217334077U (en) |
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2022
- 2022-01-14 CN CN202220094414.5U patent/CN217334077U/en active Active
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