CN111370556A - LED support light source packaging structure and process thereof - Google Patents

LED support light source packaging structure and process thereof Download PDF

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Publication number
CN111370556A
CN111370556A CN202010268812.XA CN202010268812A CN111370556A CN 111370556 A CN111370556 A CN 111370556A CN 202010268812 A CN202010268812 A CN 202010268812A CN 111370556 A CN111370556 A CN 111370556A
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Prior art keywords
led
support
light source
layer
package structure
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CN202010268812.XA
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CN111370556B (en
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廖建文
廖梓成
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Dongguan Liangyou Hardware Products Co ltd
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Dongguan Liangyou Hardware Products Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The invention relates to the technical field of semiconductor lighting, in particular to an LED bracket light source packaging structure and a process thereof. The LED packaging structure comprises a circuit module, wherein at least one group of LED packages are distributed on the circuit module, each LED package comprises a protective cover, a silica gel layer, a fluorescent layer, an upper layer support, heat-conducting glue, a connecting column, a lower layer support, a metal heat-radiating plate, a contact electrode, a conducting column, a ceramic support, a welding layer, an LED chip groove, a limiting column and a limiting hole, the metal heat-radiating plate is fixedly arranged inside the lower layer support, the upper end face of the metal heat-radiating plate is coated with the heat-conducting glue, the upper end face of the heat-conducting glue is provided with the contact electrode, and the contact electrode is connected with the welding layer through the conducting column.

Description

LED support light source packaging structure and process thereof
Technical Field
The invention relates to the technical field of semiconductor lighting, in particular to an LED bracket light source packaging structure and a process thereof.
Background
The LED support, LED lamp pearl are at the base before the encapsulation, on the basis of LED support, fix the chip into, weld positive and negative electrode, once only encapsulate the shaping with the encapsulation glue again.
The LED support is generally made of copper (also made of iron, aluminum, ceramic and the like), because the copper has good electrical conductivity, a lead is arranged inside the LED support to connect electrodes inside the LED lamp beads, the LED lamp beads can be taken down from the support after being packaged and formed, and copper feet at two ends of the lamp beads become positive and negative electrodes of the lamp beads and are used for being welded to an LED lamp or other LED finished products.
In present LED support, the heat-sinking capability is not enough often leads to LED module to damage, reduces the life of support, and current LED support adopts the gold thread to supply power for the chip more, uses the gold thread to connect and takes place the desolder because of the vibration easily in the transportation, leads to the LED module harm.
Disclosure of Invention
The invention aims to provide an LED bracket light source packaging structure and a process thereof, which aim to solve the problems in the background technology.
In order to achieve the above object, in one aspect, the present invention provides an LED support light source package structure, including a circuit module, at least one group of LED packages is distributed on the circuit module, the LED packages include a protective cover, a silica gel layer, a fluorescent layer, an upper support, a heat conducting adhesive, a connecting post, a lower support, a metal heat dissipating plate, a contact electrode, a conductive post, a ceramic support, a welding layer, an LED chip groove, a limiting post, and a limiting hole, the metal heat dissipating plate is fixedly mounted inside the lower support, the upper end surface of the metal heat dissipating plate is coated with the heat conducting adhesive, the upper end surface of the heat conducting adhesive is provided with the contact electrode, the contact electrode is connected with the welding layer through the conductive post, the contact electrode and the conductive post are wrapped by the ceramic support, the ceramic support is fixedly connected inside the upper support, the LED chip groove is formed on, the utility model discloses a ceramic support, including ceramic support, LED chip, fluorescent layer, protective cover, circuit module, protective cover, ceramic support's up end, the up end of ceramic support is equipped with the welding layer, the LED chip passes through the welding layer and fixes in the LED chip groove, the fluorescent layer sets up the up end at the LED chip, the up end in LED chip groove is installed to the protective cover, circuit module's four corners fixedly connected with fixed angle, circuit module's both ends fixedly connected with contact angle.
As a further improvement of the technical scheme, the limiting holes are formed in the upper end face of the lower layer of support and in the corresponding positions of the circuit module, and the limiting holes are matched with the limiting columns.
As a further improvement of the technical scheme, the four limiting columns are symmetrically distributed at four corners of the lower end surface of the upper-layer support.
As a further improvement of this technical scheme, the circuit module includes contact electrode, stationary blade, insulating connecting piece and negative plate, contact electrode comprises negative plate and positive plate, contact segment passes through insulating connecting piece between negative plate and the positive plate and links to each other, positive plate and negative plate are connected with a contact electrode respectively at least, the stationary blade alternates to be connected between positive plate and negative plate, and with the region partition one-tenth rectangle space between positive plate and the negative plate, is equipped with a pair of contact electrode in every group rectangle space.
As a further improvement of the technical scheme, the two groups of the contact angles are fixedly connected with the positive plate and the negative plate respectively.
As a further improvement of the technical scheme, the metal heat dissipation plates in each two adjacent groups of LED packages are connected through the connecting columns.
As a further improvement of the technical scheme, the bottom of the metal heat dissipation plate is connected with a plurality of groups of heat dissipation fins.
As a further improvement of the present technical solution, the circuit module is located in a gap in the upper layer bracket and the lower layer bracket.
As a further improvement of the technical scheme, the heat conducting glue is specifically an insulating heat conducting material.
As a further improvement of the technical scheme, the conductive posts are cast by using precious metal gold as a raw material.
As a further improvement of the technical scheme, the upper layer bracket and the lower layer bracket are made of heat-shrinkable materials.
In another aspect, the present invention provides a method for manufacturing an LED support light source package structure, including any one of the above LED support light source packages, including the following steps:
s1, fixedly connecting the connecting column with the metal heat dissipation plate through laser welding;
s2, sleeving the lower layer bracket outside the metal heat dissipation plate, and spraying heat-conducting glue on the upper surface of the metal heat dissipation plate;
s3, fixedly installing the conductive posts inside the ceramic support, and sleeving the upper layer support outside the ceramic support;
s4, assembling the upper layer bracket, the circuit module and the lower layer bracket through the limiting columns and the limiting holes, and heating and shrinking the upper layer bracket and the lower layer bracket after the assembly is finished;
s5, welding the LED chip on the upper end face of the ceramic support through a welding layer, wherein the fluorescent layer covers the upper end face of the LED chip;
and S6, adhering the protective cover to the upper part of the LED chip groove through hot melt adhesive, and injecting silica gel into the gap between the protective cover and the fluorescent layer to form a silica gel layer to complete the whole encapsulation.
Compared with the prior art, the invention has the beneficial effects that: use ceramic support, can effectually carry out effectual heat dissipation to the support when using, ceramic support's lower terminal surface is equipped with the heat conduction glue simultaneously, the heat conduction glue can be timely dispels the heat with the heat leading-in to metal heating panel, the side end face welding of metal heating panel has the spliced pole simultaneously, the spliced pole can be when single encapsulation heat is too high, disperse the heat to adjacent encapsulation through the spliced pole, avoid the LED chip to damage because of the high temperature, adopt simultaneously to lead electrical pillar and contact electrode to link to each other, and lead electrical pillar and fix inside ceramic support, the problem of leading to the chip to desolder because of the vibration has been avoided.
Drawings
FIG. 1 is a schematic view of the overall structure in embodiment 1;
fig. 2 is a schematic cross-sectional view of an LED package in embodiment 1;
FIG. 3 is a schematic circuit block diagram according to embodiment 1;
fig. 4 is a schematic perspective view of an LED package in embodiment 1;
FIG. 5 is a schematic view at A in FIG. 3 according to example 1;
the various reference numbers in the figures mean:
1. packaging the LED; 2. a contact angle; 3. a circuit module; 4. fixing the angle; 5. a protective cover; 6. a silica gel layer; 7. a fluorescent layer; 8. an upper layer bracket; 9. heat conducting glue; 10. connecting columns; 11. a lower layer bracket; 12. a metal heat dissipation plate; 13. a contact electrode; 14. a conductive post; 15. a ceramic support; 16. welding the layers; 17. an LED chip; 18. an LED chip slot; 19. a limiting column; 20. a limiting hole; 21. a positive plate; 22. a fixing sheet; 23. an insulating connector; 24. and a negative plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1-5, an object of the present invention is to provide an LED support light source package structure, which includes a circuit module 3, at least one group of LED packages 1 distributed on the circuit module 3, each LED package 1 including a protective cover 5, a silicone layer 6, a fluorescent layer 7, an upper support 8, a thermal conductive adhesive 9, a connection post 10, a lower support 11, a metal heat dissipation plate 12, a contact electrode 13, a conductive post 14, a ceramic support 15, a solder layer 16, an LED chip 17, an LED chip groove 18, a spacing post 19, and a spacing hole 20, the metal heat dissipation plate 12 being fixedly mounted inside the lower support 11, the upper end surface of the metal heat dissipation plate 12 being coated with the thermal conductive adhesive 9, the upper end surface of the thermal conductive adhesive 9 being provided with a contact electrode 13, the contact electrode 13 being connected to the solder layer 16 through a conductive post 14, the conductive post 14 being connected to the contact electrode 13, avoided leading to the chip to desolder because of the vibration, contact electrode 13 and lead electrical pillar 14 to be wrapped up by ceramic support 15, use ceramic support 15, can be effectual carry out effectual heat dissipation to the support when using, ceramic support 15 fixed connection is in upper support 8's inside, the up end at upper support 8 is seted up in LED chip groove 18, ceramic support 15's up end is equipped with welded layer 16, LED chip 17 passes through welded layer 16 and fixes in LED chip groove 18, fluorescent layer 7 sets up the up end at LED chip 17, the up end at LED chip groove 18 is installed to protection casing 5, circuit module 3's four corners fixedly connected with fixed angle 4, circuit module 3's both ends fixedly connected with contact angle 2.
The limiting holes 20 are arranged on the upper end face of the lower layer support 11 and corresponding positions of the circuit module 3, the limiting holes 20 are matched with the limiting columns 19, the limiting columns 19 are four groups in total, the limiting columns are symmetrically distributed on four corners of the lower end face of the upper layer support 8, the circuit module 3 comprises contact electrodes 13, fixing pieces 22, insulating connecting pieces 23 and negative plates 24, the contact electrodes 13 comprise negative plates 24 and positive plates 21, contact parts between the negative plates 24 and the positive plates 21 are connected through the insulating connecting pieces 23, the positive plates 21 and the negative plates 24 are respectively connected with at least one contact electrode 13, the fixing pieces 22 are connected between the positive plates 21 and the negative plates 24 in an inserting mode, areas between the positive plates 21 and the negative plates 24 are divided into rectangular spaces, a pair of contact electrodes 13 are arranged in each group of rectangular spaces, two groups of contact angles 2 are respectively fixedly connected with the positive plates 21 and the negative plates 24, and the, spliced pole 10 can be when single encapsulation heat is too high, through spliced pole 10 with heat dispersion to adjacent encapsulation, avoid the LED chip to damage because of the high temperature, the bottom of metal heating panel 12 is connected with the multiunit fin, the radiating effect is improved, circuit module 3 is arranged in the clearance in upper support 8 and lower floor's support 11, heat-conducting glue 9 specifically is an insulating heat-conducting material, heat-conducting glue 9 can be timely dispels the heat with the heat leading-in to metal heating panel 12, it adopts noble metal gold as the raw materials casting to lead electrical pillar 14, upper support 8 and lower floor's support 11 comprise pyrocondensation material.
Another object of the present invention is to provide a method for manufacturing an LED support light source package structure, including any one of the above LED support light source packages, including the following steps:
s1, fixedly connecting the connecting column 10 with the metal heat dissipation plate 12 through laser welding;
s2, sleeving the lower layer support 11 outside the metal heat dissipation plate 12, and spraying heat-conducting glue 9 on the upper surface of the metal heat dissipation plate 12;
s3, fixedly installing the conductive posts 14 inside the ceramic support 15, and sleeving the upper layer support 8 outside the ceramic support 15;
s4, assembling the upper bracket 8, the circuit module 3 and the lower bracket 11 through the limiting columns 19 and the limiting holes 20, and heating and shrinking the upper bracket 8 and the lower bracket 11 after the assembly is finished;
s5, welding the LED chip 17 on the upper end face of the ceramic support 15 through the welding layer 16, and covering the fluorescent layer 7 on the upper end face of the LED chip 17;
and S6, adhering the protective cover 5 to the upper part of the LED chip groove 18 through hot melt adhesive, and injecting silica gel into the gap between the protective cover 5 and the fluorescent layer 7 to form a silica gel layer 6, thereby completing the whole encapsulation.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (12)

1. The utility model provides a LED support light source packaging structure, includes circuit module (3), its characterized in that: the LED packaging structure is characterized in that at least one group of LED packages (1) are distributed on the circuit module (3), each LED package (1) comprises a protective cover (5), a silica gel layer (6), a fluorescent layer (7), an upper layer support (8), heat-conducting glue (9), a connecting column (10), a lower layer support (11), a metal heat-radiating plate (12), a contact electrode (13), a conductive column (14), a ceramic support (15), a welding layer (16), an LED chip (17), an LED chip groove (18), a limiting column (19) and a limiting hole (20), the metal heat-radiating plate (12) is fixedly arranged inside the lower layer support (11), the upper end face of the metal heat-radiating plate (12) is coated with the heat-conducting glue (9), the upper end face of the heat-conducting glue (9) is provided with the contact electrode (13), the contact electrode (13) is connected with the welding layer (16) through the conductive column (14), and the contact electrode (13) and the conductive column, ceramic support (15) fixed connection is in upper support (8), the up end at upper support (8) is seted up in LED chip groove (18), the up end of ceramic support (15) is equipped with welding layer (16), LED chip (17) pass through welding layer (16) and fix in LED chip groove (18), fluorescent layer (7) set up the up end at LED chip (17), the up end at LED chip groove (18) is installed in protection casing (5), the fixed angle of four corners fixedly connected with (4) of circuit module (3), the both ends fixedly connected with contact angle (2) of circuit module (3).
2. The LED bracket light source package structure of claim 1, wherein: the limiting hole (20) is formed in the upper end face of the lower layer support (11) and the corresponding position of the circuit module (3), and the limiting hole (20) is matched with the limiting column (19).
3. The LED bracket light source package structure of claim 1, wherein: the limiting columns (19) are four groups in total and are symmetrically distributed at four corners of the lower end face of the upper layer support (8).
4. The LED bracket light source package structure of claim 1, wherein: the circuit module (3) comprises a contact electrode (13), a fixing piece (22), an insulating connecting piece (23) and a negative plate (24), wherein the contact electrode (13) is composed of the negative plate (24) and the positive plate (21), the contact part between the negative plate (24) and the positive plate (21) is connected with the insulating connecting piece (23), the positive plate (21) and the negative plate (24) are respectively at least connected with one contact electrode (13), the fixing piece (22) is connected between the positive plate (21) and the negative plate (24) in a penetrating manner, the area between the positive plate (21) and the negative plate (24) is divided into rectangular spaces, and a pair of contact electrodes (13) is arranged in each rectangular space.
5. The LED bracket light source package structure of claim 1, wherein: the contact angles (2) are divided into two groups, and the two groups are fixedly connected with the positive plate (21) and the negative plate (24) respectively.
6. The LED bracket light source package structure of claim 1, wherein: the metal heat dissipation plates (12) in each two adjacent groups of LED packages (1) are connected through the connecting columns (10).
7. The LED bracket light source package structure of claim 1, wherein: the bottom of the metal heat dissipation plate (12) is connected with a plurality of groups of heat dissipation fins.
8. The LED bracket light source package structure of claim 1, wherein: the circuit module (3) is located in a gap between the upper layer support (8) and the lower layer support (11).
9. The LED bracket light source package structure of claim 1, wherein: the heat conducting glue (9) is specifically an insulating heat conducting material.
10. The LED bracket light source package structure of claim 1, wherein: the conductive posts (14) are cast by taking precious metal gold as a raw material.
11. The LED bracket light source package structure of claim 1, wherein: the upper layer support (8) and the lower layer support (11) are made of heat-shrinkable materials.
12. A manufacturing method of an LED support light source package structure, comprising the LED support light source package structure of any one of claims 1 to 11, wherein: the method comprises the following steps:
s1, fixedly connecting the connecting column (10) with the metal heat dissipation plate (12) through laser welding;
s2, sleeving the lower layer support (11) outside the metal heat dissipation plate (12), and spraying heat-conducting glue (9) on the upper surface of the metal heat dissipation plate (12);
s3, fixedly installing the conductive posts (14) in the ceramic support (15), and sleeving the upper layer support (8) outside the ceramic support (15);
s4, assembling the upper bracket (8), the circuit module (3) and the lower bracket (11) through the limiting columns (19) and the limiting holes (20), and heating and shrinking the upper bracket (8) and the lower bracket (11) after the assembly is finished;
s5, welding the LED chip (17) on the upper end face of the ceramic support (15) through a welding layer (16), wherein the fluorescent layer (7) covers the upper end face of the LED chip (17);
s6, adhering the protective cover (5) to the upper part of the LED chip groove (18) through hot melt adhesive, and injecting silica gel into the gap between the protective cover (5) and the fluorescent layer (7) to form a silica gel layer (6) to complete the whole encapsulation.
CN202010268812.XA 2020-04-08 2020-04-08 LED support light source packaging structure and process thereof Active CN111370556B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113097366A (en) * 2021-03-24 2021-07-09 广东良友科技有限公司 Inverted double-sided packaging full-circumference light-emitting LED bracket and preparation method thereof
CN113113525A (en) * 2021-04-08 2021-07-13 广东良友科技有限公司 Solderless LED patch bracket and welding method thereof

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7999450B2 (en) * 2006-12-18 2011-08-16 Delta Electronics, Inc. Electroluminescent module with thermal-conducting carrier substrate
WO2011108571A1 (en) * 2010-03-05 2011-09-09 日本電気株式会社 Cooling system for light emitting device, and light emitting device using same
US20120092833A1 (en) * 2010-10-13 2012-04-19 Ho Cheng Industrial Co., Ltd. Led heat-conducting substrate and its thermal module
US8183578B2 (en) * 2010-03-02 2012-05-22 Taiwan Semiconductor Manufacturing Company, Ltd. Double flip-chip LED package components
US20120236568A1 (en) * 2011-03-14 2012-09-20 Dong Yeoul Lee Light emitting device package and manufacturing method thereof
CN202662663U (en) * 2012-05-08 2013-01-09 东莞市凯昶德电子科技股份有限公司 Led ceramic bracket
CN205335296U (en) * 2016-01-14 2016-06-22 东莞市凯昶德电子科技股份有限公司 Ceramic packaging support that high -power LED used
CN206497901U (en) * 2017-03-02 2017-09-15 曹启航 A kind of LED package supports of good heat conductivity
CN107785473A (en) * 2017-09-22 2018-03-09 安徽中威光电材料有限公司 A kind of integrated LED light source package support
US20190181314A1 (en) * 2005-10-19 2019-06-13 Lg Innotek Co., Ltd. Light emitting diode package having frame with bottom surface having two surfaces different in height
CN110416384A (en) * 2019-07-30 2019-11-05 深圳市两岸光电科技有限公司 A kind of packaging method promoting LED lamp bead light efficiency
CN209785970U (en) * 2019-05-30 2019-12-13 东莞市伊伯光电科技有限公司 LED with stable structure
CN210224065U (en) * 2019-07-31 2020-03-31 东莞市良友五金制品有限公司 LED paster support with separate welding slot position

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190181314A1 (en) * 2005-10-19 2019-06-13 Lg Innotek Co., Ltd. Light emitting diode package having frame with bottom surface having two surfaces different in height
US7999450B2 (en) * 2006-12-18 2011-08-16 Delta Electronics, Inc. Electroluminescent module with thermal-conducting carrier substrate
US8183578B2 (en) * 2010-03-02 2012-05-22 Taiwan Semiconductor Manufacturing Company, Ltd. Double flip-chip LED package components
WO2011108571A1 (en) * 2010-03-05 2011-09-09 日本電気株式会社 Cooling system for light emitting device, and light emitting device using same
US20120092833A1 (en) * 2010-10-13 2012-04-19 Ho Cheng Industrial Co., Ltd. Led heat-conducting substrate and its thermal module
US20120236568A1 (en) * 2011-03-14 2012-09-20 Dong Yeoul Lee Light emitting device package and manufacturing method thereof
CN202662663U (en) * 2012-05-08 2013-01-09 东莞市凯昶德电子科技股份有限公司 Led ceramic bracket
CN205335296U (en) * 2016-01-14 2016-06-22 东莞市凯昶德电子科技股份有限公司 Ceramic packaging support that high -power LED used
CN206497901U (en) * 2017-03-02 2017-09-15 曹启航 A kind of LED package supports of good heat conductivity
CN107785473A (en) * 2017-09-22 2018-03-09 安徽中威光电材料有限公司 A kind of integrated LED light source package support
CN209785970U (en) * 2019-05-30 2019-12-13 东莞市伊伯光电科技有限公司 LED with stable structure
CN110416384A (en) * 2019-07-30 2019-11-05 深圳市两岸光电科技有限公司 A kind of packaging method promoting LED lamp bead light efficiency
CN210224065U (en) * 2019-07-31 2020-03-31 东莞市良友五金制品有限公司 LED paster support with separate welding slot position

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113097366A (en) * 2021-03-24 2021-07-09 广东良友科技有限公司 Inverted double-sided packaging full-circumference light-emitting LED bracket and preparation method thereof
CN113113525A (en) * 2021-04-08 2021-07-13 广东良友科技有限公司 Solderless LED patch bracket and welding method thereof

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