CN103426998A - Light emitting diode (LED) support and copper plate support - Google Patents
Light emitting diode (LED) support and copper plate support Download PDFInfo
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- CN103426998A CN103426998A CN2013103123649A CN201310312364A CN103426998A CN 103426998 A CN103426998 A CN 103426998A CN 2013103123649 A CN2013103123649 A CN 2013103123649A CN 201310312364 A CN201310312364 A CN 201310312364A CN 103426998 A CN103426998 A CN 103426998A
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Abstract
The invention discloses a light emitting diode (LED) support and a copper plate support. The LED support comprises a heat dissipation base plate, the center of the heat dissipation base plate is provided with a chip placing area, and opposite angle ends of the heat dissipation base plate are respectively concavely provided with open grooves for fixing screws. The LED support further comprises a main body plastic, an anode pin and a cathode pin, wherein the anode pin and the cathode pin are located on two sides of the heat dissipation base plate respectively. The heat dissipation base plate, the anode pin, the cathode pin and the main body plastic are in integral embedding forming connection. The main body plastic is provided with a reflection cup, the heat dissipation base plate is exposed out of the reflection cup to form the chip placing area, the anode pin and the cathode pin are exposed out of the reflection cup to form chip welding areas, and the free end of the anode pin and the free end of the cathode pin are further exposed out of the main body plastic for core wire connector butt joint so as to finish connection of electrical elements. Accordingly, a traditional COB (chip on board)-LED light source is modified into a PBA-LED support structure; on the premise that product heat dissipation is optimum, the LED support is simple to produce and process, and processing cost and raw material cost can be effectively reduced.
Description
Technical field
The present invention relates to the LED art, refer in particular to a kind of LED support and copper coin support.
Background technology
Because LED has advantages of that light efficiency is high, radiationless, the life-span is long, low-power consumption and environmental protection, high-power down lamp, wall lamp etc. are used LED as light source mostly now, wherein modal a kind of COB-LED light source is widely used in illuminating industry.
The utility model patent that China Patent No. is 201220472094.1 discloses a kind of COB-LED light source, and described COB-LED light source is by heat-radiating substrate (aluminium base) and be located at the LED wafer formation on aluminium base.The open slot that the wherein pair of horns end of aluminium base sets to the concave respectively, for fixing for screw.The aluminium base edge that is positioned at described aluminium base open slot side is provided with for the heart yearn interface and has docked the socket composition that electric component connects.During use, it is by electric interfaces support and screw lamp socket.
In addition, Fig. 1 discloses other several COB-LED(model 1313) light source, each COB-LED 1313 comprises heat-radiating substrate (aluminium base) 1, and wafer rest area 3 and conductive welding region 4 are set on the surface of heat-radiating substrate 1.Fig. 1 a has shown the COB-LED 1313 that a kind of profile is square, and its heat-radiating substrate 1 is provided with pair of conductive weld zone 4 and a pair of for the open slot 2 for screw locking.Fig. 1 b has shown the rounded COB-LED of a kind of profile 1313, and its heat-radiating substrate 1 is provided with two pairs of conductive welding regions 4 and two pairs of open slots 2 for the confession screw locking.Fig. 1 c has shown the polygonal COB-LED 1313 of a kind of profile, and its heat-radiating substrate 1 is provided with three pairs of conductive welding regions 4 and three pairs of open slots 2 for the confession screw locking.Fig. 2 d, Fig. 2 e, Fig. 2 f have shown respectively the bottom diagram of the COB-LED 1313 of Fig. 1 a, Fig. 1 b, Fig. 1 c three types, and its back side is all direct exposed aluminium bases.
When industry is produced above-mentioned COB-LED at present, to cover dielectric isolation layer at wafer rest area 3 peripheries, conductive welding region 4 in appointment covers conductive layer again, so that conductive welding region 4 and heat-radiating substrate 1 electrical isolation, during encapsulation, first arrange the LED wafer at wafer rest area 3, with gold thread, the positive and negative electrode of LED wafer is drawn and is bonded to conductive welding region 4, then with the technology mode of a glue, fluorescent colloid is clicked and entered in this rest area of wafer around the LED wafer 3, to guarantee reliability.
, due to the restriction of structure, there are a plurality of deficiencies in above-mentioned COB-LED, is mainly reflected in production cost too high: using aluminium base as the main body of light source, and, for heat radiation, aluminium base is thick and heavy, cost of material is high; Need to the sandwich constructions such as circuit layer, separator, protective layer be set on the aluminium base surface while producing in addition, processed complex, increase artificial cost, material cost and processing cost.The another kind of shortcoming of above-mentioned COB-LED is exactly easily to damage, and because conductive welding region is outside exposed, bonding wire causes stealthy injury to LED, makes the product fraction defective increase.Also have, this COB-LED light source self is without any protection fixed structure, can exist easily undoubtedly and the shortcoming such as scratch, structure is not firm, easily damage in moving collision process, useful life are short.
Summary of the invention
In view of this; the present invention is directed to the disappearance of prior art existence; its main purpose is to provide a kind of LED support and copper coin support; traditional C OB-LED light source is made into to the PBA-LED supporting structure, guaranteeing that product dispels the heat under optimum prerequisite, makes to produce simple; handling ease; can effectively cut down finished cost and cost of material, guarantee the reliability that finished product structure connects, the protection finished product is difficult for scratching damage.
For achieving the above object, the present invention adopts following technical scheme:
A kind of LED support, comprise heat-radiating substrate, the center of this heat-radiating substrate is provided with a wafer rest area, the wherein pair of horns end of heat-radiating substrate sets to the concave respectively for supplying the fixing open slot of screw, further comprise a main body plastic cement and the anodal pin and the negative pole pin that lay respectively at the heat-radiating substrate both sides, this heat-radiating substrate, anodal pin, negative pole pin and main body plastic cement one produced by insert molding are connected;
Described main body plastic cement is provided with reflector, and the medial surface of this reflector has upper strata inclination reflective surface and lower floor's inclination reflective surface, between upper strata inclination reflective surface and lower floor's inclination reflective surface, is equipped with horizontal reflective surface;
Described heat-radiating substrate comprises die bond section, holding parts and the fixed part of one, and this holding parts is fixed in the main body plastic cement, and this fixed part extends outside insulating body; To form described wafer rest area, the bottom surface that the main body plastic cement is all exposed at the back side of described die bond section, holding parts and fixed part forms radiating area at the cup end of the complete capping reflector in the surface of this die bond section;
Described anodal pin and negative pole pin include wafer connecting portion, extension and the weld part of one, and this extension is fixed in the main body plastic cement, and this weld part exposes the main body plastic cement and docked the electric component connection for the heart yearn interface outward; The horizontal reflective surface that reflector is exposed on the surface of this wafer connecting portion forms the wafer weld zone, and this wafer weld zone and wafer rest area have difference of height.
Preferably, plane, described positive and negative electrode pin place is higher than plane, heat-radiating substrate place, and the surface of this positive and negative electrode pin flushes with horizontal reflective surface, and the surface of this heat-radiating substrate flushes with at the bottom of reflector, and the back side of this heat-radiating substrate flushes with the main body plastic cement.
Preferably, described heat-radiating substrate holding parts comprises the first holding parts and the second holding parts that is connected to die bond section both sides, this first holding parts and the second holding parts are provided with the blanking circular hole, and in this blanking circular hole and the outer of die bond section is provided with the break difference structure that can sting tight main body plastic cement.
Preferably, the fixed part of described heat-radiating substrate comprises the first fixed part and the second fixed part, and this first fixed part is extended to form by the first holding parts, and the first fixed part stretches out the left front of main body plastic cement; This second fixed part is extended to form by the second holding parts, and the second fixed part stretches out the right back of main body plastic cement; This first fixed part and the second fixed part are provided with for supplying the fixing open slot of screw, and the main body plastic cement of correspondence is provided with the breach of dodging of avoiding screw, and this is dodged breach and also and between open slot maintains distance in the open slot inboard.
Preferably, the junction indent of described the first holding parts, the second holding parts and die bond section forms narrow section, and the junction evagination of described the first holding parts and the first fixed part, the second holding parts and the second fixed part forms wide section.
Preferably, described anodal pin is installed on the left back of main body plastic cement, the negative pole pin is installed on the right front of main body plastic cement, all offer the arc blanking hole on the extension of this positive pole pin and negative pole pin, there is the engaging recess both sides of extension along indent, and this engaging recess and arc blanking hole are bitten the main body plastic cement.
Preferably, described main body plastic cement left rear side and forward right side are provided with breach, and formation pin weld zone in breach is exposed on the surface of the weld part of anodal pin and negative pole pin.
Preferably, the top bump of the rim of a cup of described reflector has the section of increasing of annular.
Preferably, described reflector is circular cup, and the horizontal reflective surface of correspondence is annular, is directed to this, and described die bond section is made as thin rounded flakes, and the cup end of the size of die bond section and reflector is complementary, and described wafer connecting portion is made as arc.
A kind of copper coin support, the mode interval punching by array on a sheet copper sheet material becomes a plurality of wafers installation position, and the structure of each installation position is identical, and the center of installation position is provided with a heat-radiating substrate, and there are anodal pin and negative pole pin in the both sides of heat-radiating substrate;
This heat-radiating substrate comprises the die bond section of a circle, be connected in the first holding parts of die bond section one side, be connected in the second holding parts of die bond section opposite side, be connected in the first fixed part of the first holding parts, be connected in the second fixed part of the second holding parts, described the first holding parts, the junction indent of the second holding parts and die bond section forms narrow section, described the first holding parts and the first fixed part, the junction evagination of the second holding parts and the second fixed part forms wide section, be provided with the blanking circular hole in the first holding parts and the second holding parts, be provided with the open slot fixing for screw in the free terminal of the first fixed part and the second fixed part,
Wafer connecting portion, the one that described anodal pin and negative pin include arc is connected in extension and the weld part of wafer connecting portion, all offer the arc blanking hole on the holding parts of this positive pole pin and negative pole pin, there is the engaging recess that can sting tight plastic cement the both sides of holding parts along indent;
The die bond section of described heat-radiating substrate, the first holding parts and the second holding parts are positioned at same level, wafer connecting portion, extension and the welding position of described anodal pin and negative pole pin are in another horizontal plane, and this positive pole pin and negative pole pin place horizontal plane are higher than heat-radiating substrate place, plane horizontal plane.
The present invention compared with prior art has obvious advantage and beneficial effect, particularly, as shown from the above technical solution, it is mainly that traditional COB-LED light source is made into to the PBA-LED supporting structure, PBA-LED support production stage is few, be easy to make copper coin support and the main body plastic cement one produced by insert molding of heat-radiating substrate, anodal pin and negative pole pin, moulding is easy, make to produce simple, remove traditional C OB-LED from needs to cross the complicated technology of the sandwich constructions such as circuit layer, separator, protective layer on aluminium base, simplify production technology, reduce production costs; And the present invention directly selects the copper coin support to stamp out heat-radiating substrate, anodal pin and negative pole pin, substitute the aluminium base that tradition is thick and heavy and expensive, to reduce cost of material;
In addition, the present invention makes two horizontal planes by the reflector of main body plastic cement, one is the bottom surface of reflector, another is the horizontal reflective surface higher than the reflector bottom surface, the bottom surface of this reflector is fully covered and forms the wafer rest area by heat-radiating substrate, and the bottom surface of main body plastic cement is all exposed at the whole back side of heat-radiating substrate, thereby no matter be the maximization that has all reached area of dissipation at front or the back side of heat-radiating substrate, effective improving product heat dispersion; Be directed to this, the present invention exposes the wafer connecting portion of anodal pin and negative pole pin the wafer weld zone formed on horizontal reflective surface, not with same high at the bottom of the reflector cup, can't take the area of dissipation of reflector bottom due to horizontal reflective surface, more be conducive to the wafer heat radiation; Tradition all is located at the structure at the bottom of the reflector cup by wafer rest area and wafer weld zone relatively, and the present invention is the heat dispersion of improving product greatly;
In a word, the present invention is made into the PBA-LED supporting structure by traditional C OB-LED light source, is guaranteeing that product dispels the heat under optimum prerequisite; make to produce simply, handling ease, can effectively cut down finished cost and cost of material; guarantee the reliability that finished product structure connects, the protection finished product is difficult for scratching damage.
Also have, the present invention has the project organization of narrow and wide section on heat-radiating substrate, narrow the wafer connecting portion that can dodge anodal pin and negative pole pin, the wafer connecting portion can be designed enough using greatly and enough large space arranged as solder side, widened again after avoiding the wafer connecting portion and formed wide section, can further increase area of dissipation, improve heat dispersion.
Moreover, be beneficial to copper coin in being designed with of the arc blanking hole of heat-radiating substrate and engaging recess and bite the main body plastic cement, external force affects and becomes flexible to prevent that product from being cut off etc., cause properties of product bad, the design of arc blanking hole also helps the circulation that increases injecting glue in addition, makes product more easily play full moulding.
In addition, the section of increasing of annular is arranged in the top bump of the rim of a cup of reflector, by this, when integral body is done very thinly by the main body plastic cement, this section of increasing can increase the degree of depth of reflector, strengthens reflecting effect.
For more clearly setting forth architectural feature of the present invention and effect, below in conjunction with accompanying drawing and specific embodiment, the present invention is described in detail.
The accompanying drawing explanation
Fig. 1 a, Fig. 1 b, Fig. 1 c are respectively the vertical views of three kinds of COB-LED light sources of prior art;
Fig. 2 d, Fig. 2 e, Fig. 2 f are respectively the upward views of three kinds of COB-LED light sources of prior art;
Fig. 3 is the LED support finished product schematic perspective view of the present invention's embodiment, has shown the front of LED support finished product in figure;
Fig. 4 is the rear view of Fig. 3;
Fig. 5 is the vertical view of LED support finished product of the present invention's embodiment;
Fig. 6 is the sectional view at A-A place in Fig. 5;
Fig. 7 is the exploded view of LED support finished product of the present invention's embodiment;
Fig. 8 is the vertical view of the heat-radiating substrate of the present invention's embodiment, anodal pin and negative pole pin;
Fig. 9 is the sectional view at B-B place in Fig. 8;
Figure 10 is the sectional view at C-C place in Fig. 8;
Figure 11 is the sectional view after blanking circular hole injecting glue in the present invention's the heat-radiating substrate of embodiment;
Figure 12 is the schematic diagram of the present invention's LED support finished product one while being connected in material strip;
Figure 13 is the schematic diagram of the present invention's the front copper coin support of LED support injecting glue;
Figure 14 is the partial enlarged drawing of Figure 13.
The accompanying drawing identifier declaration.
1, aluminium base 2, open slot
3, wafer rest area 4, conductive welding region
10, main body plastic cement 11, reflector
111, upper strata inclination reflective surface 112, lower floor's inclination reflective surface
113, horizontal reflective surface 12, increase section
13, copper coin stuck glue place 14, centre hole
15, dodge breach 16, breach
20, heat-radiating substrate 21, die bond section
22, the first holding parts 23, the second holding parts
24, the first fixed part 25, the second fixed part
26, blanking circular hole 27, break difference structure
28, open slot 291, narrow section
292, wide 30, anodal pin
31, wafer connecting portion 32, extension
33, weld part 34, arc blanking hole
35, engaging recess 40, negative pole pin
41, wafer connecting portion 42, extension
43, weld part 44, arc blanking hole
45, engaging recess.
Embodiment
At first, the mentioned front, rear, left and right direction of the present embodiment is as the criterion with the arrow direction of Fig. 3, and upper and lower is as the criterion to the arrow direction with 6.
Please refer to shown in Fig. 3 to Figure 11; it has demonstrated the concrete structure of the present invention's preferred embodiment; the present invention is made into the PBA-LED supporting structure by traditional C OB-LED light source; guaranteeing that product dispels the heat under optimum prerequisite; make to produce simply, handling ease, can effectively cut down finished cost and cost of material; guarantee the reliability that finished product structure connects, the protection finished product is difficult for scratching damage.
Particularly, this PBA-LED support includes main body plastic cement 10, heat-radiating substrate 20, anodal pin 30 and negative pole pin 40, this positive pole pin 30 is identical with the structure of negative pole pin 40, just, negative pole pin 30, 40 lay respectively at the both sides of heat-radiating substrate 20, this heat-radiating substrate 20, anodal pin 30 and negative pole pin 40 are one time punching molded by a copper coin sheet material, this heat-radiating substrate 20, anodal pin 30 and negative pole pin 40 on copper coin after moulding directly and main body plastic cement 10 one produced by insert molding, just described, negative pole pin 30, the plane at 40 places is higher than heat-radiating substrate 20 planes, place, this will be just, negative pole pin 30, 40 and heat-radiating substrate 20 be designed to have the structure of difference of height, make the two respectively take the differing heights space of main body plastic cement 10, can not cause the restriction of radiating surface size.
Particularly, as shown in Fig. 1,3,4, this main body plastic cement 10 is provided with reflector 11, the medial surface of this reflector 11 has upper strata inclination reflective surface 111 and lower floor's inclination reflective surface 112, be equipped with horizontal reflective surface 113 between upper strata inclination reflective surface 111 and lower floor's inclination reflective surface 112, this horizontal reflective surface 113 is parallel with the cup end of reflector 11, and horizontal reflective surface 113 is higher than the plane at place at the bottom of cup.In the present embodiment, described main body plastic cement 10 is the shape of square-outside and round-inside substantially, reflector 11 is circular cup, the horizontal reflective surface 113 of correspondence is annular, the section of increasing 12 that annular is arranged in the top bump of the rim of a cup of reflector 11, by this, when integral body is done very thinly by main body plastic cement 10, this increases the degree of depth that section 12 can increase reflector 11, strengthens reflecting effect.
Bottom surface from main body plastic cement 10, as shown in 2,4 copper coin stuck glue places 13 are arranged at Si Cede edge, the left, right, front and rear of main body plastic cement 10, this copper coin stuck glue place 13 increases gradient, this is designed with and is beneficial to the product material stripping, while mending grain, because copper coin support stuck glue causes scratch plastic body or product too much or very little, easily falls to expect the improvement of problem.
In addition, increase centre hole 14 on the back side of main body plastic cement 10, this is designed with the control of thimble to heat-radiating substrate 20 and 30,40 two high bottom surface sizes of positive and negative electrode pin while being beneficial to injection moulding, and after making product one produced by insert molding, finished product is difficult for being weighed wounded, not president's burr.
As shown in Fig. 3-7, described heat-radiating substrate 20 is sheet metals, does not have concavo-convex bending structure.This heat-radiating substrate 20 comprises die bond section 21, holding parts 22,23 and the fixed part 24,25 of one, during punch forming, this heat-radiating substrate 20 sink certain distance relative to the material strip junction of copper coin, make the horizontal plane at heat-radiating substrate 20 whole places relatively lower than anodal pin 30 and negative pole pin 40 place horizontal planes.
Described die bond section 21 is made as thin rounded flakes, the cup end of the size of die bond section 21 and reflector 11, be complementary, the cup end of the complete capping reflector 11 in the surface of this die bond section 21, is to form the wafer rest area, thereby the bottom surface of whole reflector 11 is all as the wafer rest area, increase on the one hand the area of wafer rest area, increase on the other hand the reflector radiating surface at 11 ends, for the multizone of not only having done the wafer rest area but also having done the wafer weld zone at 11 ends of reflector with respect to tradition is divided, the design is more simple, can effectively improve the heat dispersion of product, reaching area of dissipation maximizes.
Described holding parts 22, 23 are fixed in main body plastic cement 10, holding parts 22, 23 comprise the first holding parts 22 and the second holding parts 23 that is connected to die bond section 21 both sides, this first holding parts 22 and the second holding parts 23 are provided with blanking circular hole 26, this blanking circular hole 26 injects main body plastic cement 10, in order further to make heat-radiating substrate 20 be connected in main body plastic cement 10, as shown in Fig. 8-11, be equipped with break difference structure 27 in the bottom side, outer of die bond section 21 and blanking circular hole 26, this is designed with and is beneficial to first, the second holding parts 22, 23 bite main body plastic cement 10, external force affects and becomes flexible to prevent that product from being cut off etc., cause properties of product bad, and can increase the circulation of injecting glue, make product more easily play full moulding, increase plastic cement and first simultaneously, the second holding parts 22, 23 conjugation, the sealing of improving product.
As shown in Figure 1,5, described fixed part 24,25 extends outside insulating body, for hold-down screw, by the screw of locking at fixed part, so that whole finished product is fixed.This fixed part 24,25 comprises the first fixed part 24 and the second fixed part 25, and this first fixed part 24 is extended to form by the first holding parts 22, the left front that the first fixed part 24 stretches out main body plastic cement 10; This second fixed part 25 is extended to form by the second holding parts 23, the right back that the second fixed part 25 stretches out main body plastic cement 10.By the first fixed part 24 and the second fixed part 25 being located to the diagonal position of main body plastic cement 10, with respect to tradition, directly from left and right sides or front and back side, stretch out for the project organization of first, second fixed part 24,25, design energy increasing heat radiation area in the time of this, really accomplish that area of dissipation maximizes.
As shown in Figure 1,5, heat-radiating substrate 20 wherein pair of horns end sets to the concave respectively for supplying the fixing open slot 28 of screw, in the present embodiment, on this first fixed part 24 and the second fixed part 25, described open slot 28 is set, the main body plastic cement 10 of correspondence is provided with dodges breach 15, this dodge breach 15 at open slot 28 inboard and and open slot 28 between maintain distance.By this, when screw is fixed the first fixed part 24 and the second fixed part 25, screw can be fixed copper coin through open slot 28, fix whole PBA-LED support by fixing copper coin, the more important thing is, establish and dodge breach 15 at main body plastic cement 10, thereby screw can not push main body plastic cement 10, plastic cement cracking while preventing screw-driving.
In the present invention, as shown in Figure 4, the bottom surface of the back side of the die bond section 21 of heat-radiating substrate 20, holding parts 22,23 and fixed part 24,25 all being exposed to main body plastic cement 10 forms radiating area, this heat-radiating substrate 20 full wafers are done to stretching, the bottom surface of exposing main body plastic cement 10 with the whole bottom surface that can make hot heat exchange sheet after main body plastic cement 10 produced by insert molding, this is designed with and is beneficial to the maximization of product area of dissipation, improves the heat dispersion of product, thus the serviceability of improving product.
As shown in Figure 7, described the first holding parts 22, the second holding parts 23 form narrow 291 with the junction indent of die bond section 21, and the junction evagination of described the first holding parts 22 and the first fixed part 24, the second holding parts 23 and the second fixed part 25 forms wide 292.The design of narrow 291 is the wafer connecting portions 31,41 in order to dodge anodal pin 30 and negative pole pin 40, wafer connecting portion 31,41 can be designed enough using greatly and enough large space arranged as solder side, widened again after avoiding wafer connecting portion 31,41 and formed wide 292, can increase area of dissipation, improve heat dispersion.
Described anodal pin 30 and negative pole pin 40 are to make with metal material, lay respectively at heat-radiating substrate 20 both sides, and this positive pole pin 30 is located at the left rear side of main body plastic cement 10, the forward right side that negative pole pin 40 is located at main body plastic cement 10.
This positive pole pin 30 and negative pole pin 40 include wafer connecting portion 31,41, extension 32,42 and the weld part 33,43 of one.
This wafer weld zone and wafer rest area have difference of height, described wafer connecting portion 31,41 is made as arc, the horizontal reflective surface 113 that reflector 11 is exposed on the surface of this wafer connecting portion 31,41 forms the wafer weld zone, thereby the wafer connecting portion of arc 31,41 can be corresponding with the annular of horizontal reflective surface 113, make the wafer weld zone can do very widely, meet the welding demand.During use, the LED wafer is welded in the wafer weld zone by gold thread, with the conducting of positive and negative electrode pin.
This extension 32,42 is fixed in main body plastic cement 10, offer arc blanking hole 34,44 on extension 32,42, there is engaging recess 35,45 both sides of extension 32,42 along indent, arc blanking hole 34,44 on this extension 32,42 and being designed with of engaging recess 35,45 are beneficial to copper coin and bite main body plastic cement 10, external force affects and becomes flexible to prevent that product from being cut off etc., cause properties of product bad, the design of arc blanking hole 34,44 also helps the circulation that increases injecting glue in addition, makes product more easily play full moulding.
This weld part 33,43 extends outward outside main body plastic cement 10, and described main body plastic cement 10 left rear side and forward right side are provided with breach 16, and formation pin weld zone in breach 16 is exposed on the surface of the weld part 33,43 of anodal pin 30 and negative pole pin 40.
Hold, as shown in figure 13, during production, mode interval punching by array on a sheet copper sheet material becomes a plurality of wafers installation position, the structure of each installation position is identical, the center of installation position is provided with a heat-radiating substrate 20 to left front to inclined by right back, and the both sides of heat-radiating substrate 20 (right lateral side and forward right side) has anodal pin 30 and negative pole pin 40.
As shown in figure 14, this heat-radiating substrate 20 comprise a circle die bond section 21, be connected in die bond section 21 1 sides the first holding parts 22, be connected in die bond section 21 opposite sides the second holding parts 23, be connected in the first holding parts 22 the first fixed part 24, be connected in the second fixed part 25 of the second holding parts 23.Described the first holding parts 22, the second holding parts 23 form narrow 291 with the junction indent of die bond section 21, the junction evagination of described the first holding parts 22 and the first fixed part 24, the second holding parts 23 and the second fixed part 25 forms wide 292, be provided with blanking circular hole 26 in the first holding parts 22 and the second holding parts 23, in the free terminal of the first fixed part 24 and the second fixed part 25, be provided with the open slot 28 fixing for screw.
Die bond section 21, the first holding parts 22 and second holding parts 23 of described heat-radiating substrate 20 are positioned at same level, the wafer connecting portion 31,41 of described anodal pin 30 and negative pole pin 40, extension 32,42 and weld part 33,43 are positioned at another horizontal plane, and this positive pole pin 30 and negative pole pin 40 place horizontal planes are higher than plane heat-radiating substrate 20 place horizontal planes.Its implementation is as follows: during punch forming, this heat-radiating substrate 20 sink certain distance relative to the material strip junction of copper coin, make that heat-radiating substrate 20 is whole forms differences of height with positive and negative electrode pin 30,40.
During the one produced by insert molding, full wafer copper coin support is placed in mould, the one produced by insert molding goes out finished product (seeing Figure 12), after moulding, the surface of this positive and negative electrode pin 30,40 flushes with horizontal reflective surface 113, the surface of this heat-radiating substrate 20 flushed with 11 ends of reflector, and the back side of this heat-radiating substrate 20 flushes with main body plastic cement 10, obtains finished product.
In sum, design focal point of the present invention is, it is mainly that traditional COB-LED light source is made into to the PBA-LED supporting structure, PBA-LED support production stage is few, is easy to make copper coin support and the main body plastic cement one produced by insert molding of heat-radiating substrate, anodal pin and negative pole pin, and moulding is easy, make to produce simple, remove traditional C OB-LED from needs to cross the complicated technology of the sandwich constructions such as circuit layer, separator, protective layer on aluminium base, simplifies production technology, reduces production costs; And the present invention directly selects the copper coin support to stamp out heat-radiating substrate, anodal pin and negative pole pin, substitute the aluminium base that tradition is thick and heavy and expensive, to reduce cost of material;
In addition, the present invention makes two horizontal planes by the reflector of main body plastic cement 10 11, one is the bottom surface of reflector 11, another is the horizontal reflective surface 113 higher than reflector 11 bottom surfaces, the bottom surface of this reflector 11 is fully covered and forms the wafer rest area by heat-radiating substrate 20, and the bottom surface of main body plastic cement 10 is all exposed at the whole back side of heat-radiating substrate 20, thereby no matter be the maximization that has all reached area of dissipation at front or the back side of heat-radiating substrate 20, effective improving product heat dispersion; Be directed to this, the present invention exposes the wafer connecting portion of anodal pin 30 and negative pole pin 40 31,41 the wafer weld zone formed on horizontal reflective surface 113, because horizontal reflective surface 113 is not with same high at the bottom of the reflector cup, can't take the area of dissipation of reflector 11 bottoms, more be conducive to the wafer heat radiation; The present invention's tradition relatively all is located at the structure at the bottom of 11 glasss of reflectors by wafer rest area and wafer weld zone, and the present invention is the heat dispersion of improving product greatly;
In a word, the present invention is made into the PBA-LED supporting structure by traditional C OB-LED light source, is guaranteeing that product dispels the heat under optimum prerequisite; make to produce simply, handling ease, can effectively cut down finished cost and cost of material; guarantee the reliability that finished product structure connects, the protection finished product is difficult for scratching damage.
The above, it is only preferred embodiment of the present invention, not technical scope of the present invention is imposed any restrictions, therefore any trickle modification, equivalent variations and modification that every foundation technical spirit of the present invention is done above embodiment all still belong in the scope of technical solution of the present invention.
Claims (10)
1. a LED support, comprise heat-radiating substrate, the center of this heat-radiating substrate is provided with a wafer rest area, the wherein pair of horns end of heat-radiating substrate sets to the concave respectively for supplying the fixing open slot of screw, it is characterized in that: further comprise a main body plastic cement and the anodal pin and the negative pole pin that lay respectively at the heat-radiating substrate both sides, this heat-radiating substrate, anodal pin, negative pole pin and main body plastic cement one produced by insert molding are connected;
Described main body plastic cement is provided with reflector, and the medial surface of this reflector has upper strata inclination reflective surface and lower floor's inclination reflective surface, between upper strata inclination reflective surface and lower floor's inclination reflective surface, is equipped with horizontal reflective surface;
Described heat-radiating substrate comprises die bond section, holding parts and the fixed part of one, and this holding parts is fixed in the main body plastic cement, and this fixed part extends outside insulating body; To form described wafer rest area, the bottom surface that the main body plastic cement is all exposed at the back side of described die bond section, holding parts and fixed part forms radiating area at the cup end of the complete capping reflector in the surface of this die bond section;
Described anodal pin and negative pole pin include wafer connecting portion, extension and the weld part of one, and this extension is fixed in the main body plastic cement, and this weld part exposes the main body plastic cement and docked the electric component connection for the heart yearn interface outward; The horizontal reflective surface that reflector is exposed on the surface of this wafer connecting portion forms the wafer weld zone, and this wafer weld zone and wafer rest area have difference of height.
2. LED support according to claim 1, it is characterized in that: plane, described positive and negative electrode pin place is higher than plane, heat-radiating substrate place, the surface of this positive and negative electrode pin flushes with horizontal reflective surface, the surface of this heat-radiating substrate flushes with at the bottom of reflector, and the back side of this heat-radiating substrate flushes with the main body plastic cement.
3. LED support according to claim 1, it is characterized in that: described heat-radiating substrate holding parts comprises the first holding parts and the second holding parts that is connected to die bond section both sides, this first holding parts and the second holding parts are provided with the blanking circular hole, and in this blanking circular hole and the outer of die bond section is provided with the break difference structure that can sting tight main body plastic cement.
4. LED support according to claim 3, it is characterized in that: the fixed part of described heat-radiating substrate comprises the first fixed part and the second fixed part, and this first fixed part is extended to form by the first holding parts, and the first fixed part stretches out the left front of main body plastic cement; This second fixed part is extended to form by the second holding parts, and the second fixed part stretches out the right back of main body plastic cement; This first fixed part and the second fixed part are provided with for supplying the fixing open slot of screw, and the main body plastic cement of correspondence is provided with the breach of dodging of avoiding screw, and this is dodged breach and also and between open slot maintains distance in the open slot inboard.
5. LED support according to claim 4, it is characterized in that: the junction indent of described the first holding parts, the second holding parts and die bond section forms narrow section, and the junction evagination of described the first holding parts and the first fixed part, the second holding parts and the second fixed part forms wide section.
6. LED support according to claim 1, it is characterized in that: described anodal pin is installed on the left back of main body plastic cement, the negative pole pin is installed on the right front of main body plastic cement, all offer the arc blanking hole on the extension of this positive pole pin and negative pole pin, there is the engaging recess both sides of extension along indent, and this engaging recess and arc blanking hole are bitten the main body plastic cement.
7. LED support according to claim 1, it is characterized in that: described main body plastic cement left rear side and forward right side are provided with breach, and the surface of the weld part of anodal pin and negative pole pin is exposed in breach and is formed the pin weld zone.
8. LED support according to claim 1 is characterized in that: the top bump of the rim of a cup of described reflector has the section of increasing of annular.
9. LED support according to claim 1, it is characterized in that: described reflector is circular cup, the horizontal reflective surface of correspondence is annular, be directed to this, described die bond section is made as thin rounded flakes, and the cup end of the size of die bond section and reflector is complementary, and described wafer connecting portion is made as arc.
10. a copper coin support, it is characterized in that: the mode interval punching by array on a sheet copper sheet material becomes a plurality of wafers installation position, the structure of each installation position is identical, and the center of installation position is provided with a heat-radiating substrate, and there are anodal pin and negative pole pin in the both sides of heat-radiating substrate;
This heat-radiating substrate comprises the die bond section of a circle, be connected in the first holding parts of die bond section one side, be connected in the second holding parts of die bond section opposite side, be connected in the first fixed part of the first holding parts, be connected in the second fixed part of the second holding parts, described the first holding parts, the junction indent of the second holding parts and die bond section forms narrow section, described the first holding parts and the first fixed part, the junction evagination of the second holding parts and the second fixed part forms wide section, be provided with the blanking circular hole in the first holding parts and the second holding parts, be provided with the open slot fixing for screw in the free terminal of the first fixed part and the second fixed part,
Wafer connecting portion, the one that described anodal pin and negative pin include arc is connected in extension and the weld part of wafer connecting portion, all offer the arc blanking hole on the holding parts of this positive pole pin and negative pole pin, there is the engaging recess that can sting tight plastic cement the both sides of holding parts along indent;
The die bond section of described heat-radiating substrate, the first holding parts and the second holding parts are positioned at same level, wafer connecting portion, extension and the welding position of described anodal pin and negative pole pin are in another horizontal plane, and this positive pole pin and negative pole pin place horizontal plane are higher than heat-radiating substrate place, plane horizontal plane.
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| CN201310312364.9A CN103426998B (en) | 2013-07-24 | 2013-07-24 | Light emitting diode (LED) support |
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| CN201310312364.9A CN103426998B (en) | 2013-07-24 | 2013-07-24 | Light emitting diode (LED) support |
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| CN103672527A (en) * | 2013-12-30 | 2014-03-26 | 广州市鸿利光电股份有限公司 | COB integrated optical source lamp and clamping buckles |
| CN103855286A (en) * | 2014-02-20 | 2014-06-11 | 博罗承创精密工业有限公司 | LED supporting frame, manufacturing method of LED supporting frame and double-material belt LED supporting frame module |
| CN103883995A (en) * | 2014-03-28 | 2014-06-25 | 木林森股份有限公司 | COB lamp bead easy to assemble, support used for lamp bead, method for manufacturing lamp bead and easily-assembled LED module |
| CN103925568A (en) * | 2014-04-16 | 2014-07-16 | 深圳市得润电子股份有限公司 | COB lamp protection support |
| CN109728140A (en) * | 2018-12-28 | 2019-05-07 | 映瑞光电科技(上海)有限公司 | A kind of high pressure flip LED chips and forming method thereof |
| CN109904297A (en) * | 2017-12-11 | 2019-06-18 | 深圳市科纳实业有限公司 | Adopting surface mounted LED and products thereof and preparation method thereof |
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| CN203434194U (en) * | 2013-07-24 | 2014-02-12 | 博罗承创精密工业有限公司 | LED stent and copper plate stent |
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| CN103672527A (en) * | 2013-12-30 | 2014-03-26 | 广州市鸿利光电股份有限公司 | COB integrated optical source lamp and clamping buckles |
| CN103855286A (en) * | 2014-02-20 | 2014-06-11 | 博罗承创精密工业有限公司 | LED supporting frame, manufacturing method of LED supporting frame and double-material belt LED supporting frame module |
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| CN103883995A (en) * | 2014-03-28 | 2014-06-25 | 木林森股份有限公司 | COB lamp bead easy to assemble, support used for lamp bead, method for manufacturing lamp bead and easily-assembled LED module |
| CN103925568A (en) * | 2014-04-16 | 2014-07-16 | 深圳市得润电子股份有限公司 | COB lamp protection support |
| CN109904297A (en) * | 2017-12-11 | 2019-06-18 | 深圳市科纳实业有限公司 | Adopting surface mounted LED and products thereof and preparation method thereof |
| CN109728140A (en) * | 2018-12-28 | 2019-05-07 | 映瑞光电科技(上海)有限公司 | A kind of high pressure flip LED chips and forming method thereof |
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| CN103426998B (en) | 2017-05-24 |
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