CN103925568A - COB lamp protection support - Google Patents
COB lamp protection support Download PDFInfo
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- CN103925568A CN103925568A CN201410152523.8A CN201410152523A CN103925568A CN 103925568 A CN103925568 A CN 103925568A CN 201410152523 A CN201410152523 A CN 201410152523A CN 103925568 A CN103925568 A CN 103925568A
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- copper material
- thin copper
- material substrate
- colloid
- light fixture
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Abstract
The invention discloses a COB lamp protection support which comprises a thin-copper substrate and a rubber body. The thin-copper substrate is approximately square, the two sides of the center line of the upper edge and the lower edge are respectively provided with a notch for locating and fixing, the centers of the four edges are respectively provided with an opening groove where rubber clamping is conveniently carried out, the upper left corner and the lower right corner are respectively provided with a welding line area, the center of the rubber body is provided with a wafer containing area, the wafer containing area is provided with a connecting line opening penetrating through the rubber body and the thin-copper substrate, and the rubber body extends from the position of the connecting line opening to the side of the back face of the thin-copper substrate. Full-automatic production machining on the product production process can be achieved, the production and manufacturing cost can be greatly reduced, and the production efficiency is effectively improved. Bonding between the rubber body and copper is firmer, more stable and more reliable than bonding between conversional resin and a conventional substrate; the structure is reasonable, the heat conduction performance of the COB support is greatly improved, and heat generated by LEDs can be rapidly diffused to surrounding air.
Description
Technical field
The present invention relates to LED lighting technical field, particularly a kind of COB support.
Background technology
COB (Chip On Board) is that chip on board mounts, it is one of bare chip mounting technology, semiconductor chip is staggered to be mounted on printed substrate, the method realization that the electrical connection of chip and substrate adopts lead-in wire to sew up, and cover to guarantee reliability with resin.The LED module of COB encapsulation has been installed many pieces of LED chips on base plate, use the mode of many pieces of LED chips can expand to a great extent the area of dissipation of encapsulation, make heat more easily conduct to shell, on market, mass-produced COB light source is worked it out by this technology.The light fixture of working it out with COB light source, has life-span length, power saving, Gao Xian, efficient, safety anti-explosive, without ghost image, the feature such as attractive in appearance.Rely on many advantages, the features such as its high light efficiency, area source, personalized designs in LED industry, to rob and occupy a tiny space gradually.COB light source reaches 50% in the market share amount in shot-light, Down lamp, Ceiling light field.But from technical elements analysis, COB light source also exists many problems at present, be its most important thing but whether can solve preferably the problems such as substrate heat radiation is slow, heat conduction is difficult, production cost is high.
Common COB support is mainly made up of substrate and resin on the market, wherein substrate is most widely used is aluminium base and ceramic substrate, the heat that LED produces is transmitted to metal substrate by insulating barrier, be transmitted to radiator through thermal interfacial material again, most heats that so just LED can be produced are diffused in ambient air by the mode of convection current.But aluminium base and heat-conducting glue thermal resistance are large, and reliability is not high, easily cause the phenomenon such as light decay, dead lamp; Although and ceramic substrate is the ideal material of COB, cost is higher, especially power hour is difficult to be accepted by client.In addition, existing COB supporting structure is comparatively simple, reasonable not, has the space of optimization.
Summary of the invention
In order to overcome the deficiencies in the prior art, the invention provides a kind of COB support in crystal bonding area perfect heat-dissipating, rational in infrastructure, good stability, low cost of manufacture.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of COB light fixture protective stent, comprise thin copper material substrate, and be arranged on the colloid on this thin copper material substrate, thin copper material substrate is roughly square, the center line both sides on upper and lower both sides are respectively arranged with for locating, fixing recess, the center on four limits is respectively arranged with the open slot that facilitates stuck glue, the upper left corner and the lower right corner are respectively arranged with bonding wire region, the center of colloid is provided with a wafer rest area, wafer rest area is provided with the line mouth that penetrates colloid and thin copper material substrate, and the back side one side of colloid from this line mouth to thin copper material substrate extended.
Further, the upper right corner of described thin copper material substrate and the lower left corner are provided with the fixed part that facilitates screw fixed crystal.
Further, the described colloid upper left corner and the lower right corner are also provided with the extension that stops scolding tin.
Further, on described thin copper material substrate, be provided with ellipse hole.
Further, described thin copper material substrate is without the thin copper material substrate of splicing punch forming.
As the unseparated detailed description of the invention of thermoelectricity, described wafer rest area is circular, and described line mouth is the arc port that is arranged on edge, wafer rest area.
Further, the back side one side of described colloid from this line mouth to thin copper material substrate extended, and is fitted in a jiao of thin copper material substrate back.
The detailed description of the invention separating as thermoelectricity, described wafer rest area is the squares of four angles through fillet processing, and described line mouth is provided with two, and described line mouth is the strip mouth that is arranged on edge, relative both sides, wafer rest area.
Further, the described colloid respectively back side outer rim from line mouth to thin copper material substrate extends, and forms two colloid regions along center line symmetry.
Further, described colloid region is provided with for fixing bolt.
The invention has the beneficial effects as follows: COB support of the present invention has replaced conventional aluminium base or ceramic substrate with thin copper material substrate, simultaneously whole product use the thick end of copper material identical without splicing, thickness is thinner, in process of producing product, semi-finished product can be rolled, realize fully-automatic production processing, reduced greatly manufacturing cost, especially materials and cost of labor, effectively raise production efficiency; Adhesion between colloid and copper material is more firm, stable, reliable compared to the adhesion between conventional resin and substrate; Rational in infrastructure, the heat conductivility of COB support is improved greatly, the heat that LED can be produced is diffused rapidly in ambient air.
Brief description of the drawings
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is the front view of embodiment 1 in the present invention;
Fig. 2 is the rearview of embodiment 1 in the present invention;
Fig. 3 is the left view of embodiment 1 in the present invention;
Fig. 4 is the front view of embodiment 2 in the present invention;
Fig. 5 is the rearview of embodiment 2 in the present invention;
Fig. 6 is the left view of embodiment 2 in the present invention.
Detailed description of the invention
Referring to figs. 1 through Fig. 6, a kind of COB light fixture protective stent of the present invention, comprises thin copper material substrate 1, and is arranged on the colloid 2 on this thin copper material substrate 1.In the present invention, the direction of upper and lower, left and right is taking front view as benchmark.
Described thin copper material substrate 1 is that thin copper material substrate 1 is roughly square without the thin copper material substrate of splicing punch forming, and four edge lengths are identical, carry out fillet processing, and have certain thickness.The center line both sides on upper and lower both sides are respectively arranged with for locating, the center on fixing recess 12, four limits is respectively arranged with the open slot 11 that facilitates stuck glue, conveniently carry out stuck glue toward adding on thin copper material substrate 1 in the process of colloid 2.Thin copper material substrate 1 upper left corner and the lower right corner are respectively arranged with bonding wire region 13, and the upper left corner of described colloid 2 correspondences and the lower right corner are also provided with at the edge in bonding wire region 13 extends the extension 23 that stops scolding tin.The upper right corner of described thin copper material substrate 1 and the lower left corner are provided with the fixed part 14 that facilitates screw fixed crystal, and fixed part 14 is the region toward center position arc indent.
Embodiment 1: as the unseparated detailed description of the invention of thermoelectricity, the center of colloid 2 is provided with the wafer rest area 21 of a circle, a space that holds wafer concaves out in the middle of the colloid 2 of wafer rest area 21, the edge of wafer rest area 21 is provided with the line mouth 22 that penetrates colloid 2 and thin copper material substrate 1, described line mouth 22, for being arranged on the arc port at 21 edges, wafer rest area, is convenient to crystal and is connected with thin copper material substrate 1.The back side one side of colloid 2 from this line mouth 22 to thin copper material substrate 1 extended, and is fitted in a jiao of thin copper material substrate 1 back side, make colloid 2 tightr with the combination of thin copper material substrate 1, and heat conductivility is better.On described thin copper material substrate 1 back side, be provided with the ellipse hole 15 of three oblique settings.
Embodiment 2: the detailed description of the invention separating as thermoelectricity, described wafer rest area 21 is the squares of four angles through fillet processing, described line mouth 22 is provided with upper and lower two, and described line mouth 22 is for being arranged on the strip mouth at edge, both sides Shang Xia 21, wafer rest area.
The described colloid 2 respectively back side outer rim from line mouth 22 to thin copper material substrate 1 extends, and forms two colloid regions along center line symmetry.Described colloid region is provided with for fixing bolt 24.On described thin copper material substrate 1 back side, be symmetrically arranged with four longitudinal ellipse holes 15.
COB support has replaced conventional aluminium base and ceramic substrate with thin copper material substrate 1, simultaneously whole product use the thick end of copper material identical without splicing, and the thickness of product is thinner, in process of producing product, semi-finished product can be rolled, realize fully-automatic production processing, reduce greatly manufacturing cost, especially saved materials and cost of labor, effectively raised production efficiency.
COB support of the present invention, employing be injection molding type COB, mainly formed by copper material and colloid 2 two parts, the adhesion between colloid 2 and copper material compared to the adhesion between conventional resin and substrate more firmly, reliable, stable.
Certainly, the present invention, except above-mentioned embodiment, can also have other structural distortion, and these equivalent technical solutions also should be within its protection domain.
Claims (10)
1. a COB light fixture protective stent, it is characterized in that: comprise thin copper material substrate (1), and be arranged on the colloid (2) on this thin copper material substrate (1), thin copper material substrate (1) is roughly square, the center line both sides on upper and lower both sides are respectively arranged with for location, fixing recess (12), the center on four limits is respectively arranged with the open slot (11) that facilitates stuck glue, the upper left corner and the lower right corner are respectively arranged with bonding wire region (13), the center of colloid (2) is provided with a wafer rest area (21), wafer rest area (21) is provided with the line mouth (22) that penetrates colloid (2) and thin copper material substrate (1), the back side one side of colloid (2) from this line mouth (22) to thin copper material substrate (1) extended.
2. a kind of COB light fixture protective stent according to claim 1, is characterized in that: the upper right corner of described thin copper material substrate (1) and the lower left corner are provided with the fixed part (14) that facilitates screw fixed crystal.
3. a kind of COB light fixture protective stent according to claim 1, is characterized in that: described colloid (2) upper left corner and the lower right corner are also provided with the extension (23) that stops scolding tin.
4. a kind of COB light fixture protective stent according to claim 1, is characterized in that: on described thin copper material substrate (1), be provided with ellipse hole (15).
5. a kind of COB light fixture protective stent according to claim 1, is characterized in that: described thin copper material substrate (1) is the thin copper material substrate of nothing splicing punch forming.
6. according to a kind of COB light fixture protective stent described in any one in claim 1-5, it is characterized in that: described wafer rest area (21) is for circular, and described line mouth (22) is for being arranged on the arc port at edge, wafer rest area (21).
7. a kind of COB light fixture protective stent according to claim 6, is characterized in that: the back side one side of described colloid (2) from this line mouth (22) to thin copper material substrate (1) extended, and is fitted in a jiao of thin copper material substrate (1) back side.
8. according to a kind of COB light fixture protective stent described in any one in claim 1-5, it is characterized in that: described wafer rest area (21) is the squares of four angles through fillet processing, described line mouth (22) is provided with two, and described line mouth (22) is for being arranged on wafer rest area (21) the strip mouth at edge, both sides relatively.
9. a kind of COB light fixture protective stent according to claim 8, is characterized in that: described colloid (2) the respectively back side outer rim from line mouth (22) to thin copper material substrate (1) extends, and forms two colloid regions along center line symmetry.
10. a kind of COB light fixture protective stent according to claim 9, is characterized in that: described colloid region is provided with for fixing bolt (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410152523.8A CN103925568B (en) | 2014-04-16 | 2014-04-16 | A kind of COB light fixtures protective stent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410152523.8A CN103925568B (en) | 2014-04-16 | 2014-04-16 | A kind of COB light fixtures protective stent |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103925568A true CN103925568A (en) | 2014-07-16 |
| CN103925568B CN103925568B (en) | 2017-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410152523.8A Active CN103925568B (en) | 2014-04-16 | 2014-04-16 | A kind of COB light fixtures protective stent |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM337847U (en) * | 2008-02-01 | 2008-08-01 | Tato Prec Ind Co Ltd | LED lead base |
| CN202268391U (en) * | 2011-10-13 | 2012-06-06 | 杭州友旺科技有限公司 | Chip on board (COB) surface light source packaging structure |
| CN202772180U (en) * | 2012-07-28 | 2013-03-06 | 东莞市鑫亮光电科技有限公司 | Novel LED support |
| KR20130040477A (en) * | 2011-10-14 | 2013-04-24 | 엘지이노텍 주식회사 | Method for configuring illumination module using cob package and illumination module |
| CN103066196A (en) * | 2013-01-30 | 2013-04-24 | 江苏华英光宝科技股份有限公司 | High-brightness light-emitting diode (LED) chip carrier structure with powerful heat dissipation function |
| CN103426998A (en) * | 2013-07-24 | 2013-12-04 | 博罗承创精密工业有限公司 | Light emitting diode (LED) support and copper plate support |
| CN203848223U (en) * | 2014-04-16 | 2014-09-24 | 深圳市得润电子股份有限公司 | COB (chip on board) lamp protecting support |
-
2014
- 2014-04-16 CN CN201410152523.8A patent/CN103925568B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM337847U (en) * | 2008-02-01 | 2008-08-01 | Tato Prec Ind Co Ltd | LED lead base |
| CN202268391U (en) * | 2011-10-13 | 2012-06-06 | 杭州友旺科技有限公司 | Chip on board (COB) surface light source packaging structure |
| KR20130040477A (en) * | 2011-10-14 | 2013-04-24 | 엘지이노텍 주식회사 | Method for configuring illumination module using cob package and illumination module |
| CN202772180U (en) * | 2012-07-28 | 2013-03-06 | 东莞市鑫亮光电科技有限公司 | Novel LED support |
| CN103066196A (en) * | 2013-01-30 | 2013-04-24 | 江苏华英光宝科技股份有限公司 | High-brightness light-emitting diode (LED) chip carrier structure with powerful heat dissipation function |
| CN103426998A (en) * | 2013-07-24 | 2013-12-04 | 博罗承创精密工业有限公司 | Light emitting diode (LED) support and copper plate support |
| CN203848223U (en) * | 2014-04-16 | 2014-09-24 | 深圳市得润电子股份有限公司 | COB (chip on board) lamp protecting support |
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| Publication number | Publication date |
|---|---|
| CN103925568B (en) | 2017-10-03 |
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Address after: 518107 Derun Electronic Industrial Park, 269 Huitong Road, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN DEREN ELECTRONIC Co.,Ltd. Address before: 518107, Guangdong province Shenzhen Guangming New District Guangming Street, No. thirty-three Road, 9 Electronic Industrial Park run Patentee before: SHENZHEN DEREN ELECTRONIC Co.,Ltd. |