CN103925568B - A kind of COB light fixtures protective stent - Google Patents
A kind of COB light fixtures protective stent Download PDFInfo
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- CN103925568B CN103925568B CN201410152523.8A CN201410152523A CN103925568B CN 103925568 B CN103925568 B CN 103925568B CN 201410152523 A CN201410152523 A CN 201410152523A CN 103925568 B CN103925568 B CN 103925568B
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- copper material
- thin copper
- material substrate
- colloid
- light fixtures
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Abstract
The invention discloses a kind of COB light fixtures protective stent, including thin copper material substrate and colloid, thin copper material substrate is substantially square, the center line both sides on both sides are separately provided for the recess for positioning, fixing up and down, the center on four sides is respectively arranged with the open slot for facilitating stuck glue, the upper left corner and the lower right corner are respectively arranged with bonding wire region, the center of colloid is provided with a chip rest area, chip rest area is provided with the line mouthful for penetrating colloid and thin copper material substrate, and colloid extends at the line mouthful to the reverse side of thin copper material substrate.Process of producing product can realize that fully-automatic production is processed, and manufacturing cost greatly reduces, production efficiency is effectively raised；Adhesion between colloid and copper material is compared to the adhesion between usual resins and substrate more firmly, stably, reliably；It is rational in infrastructure so that the heat conductivility of COB supports is greatly improved, the heat produced by LED can be diffused rapidly in the air of surrounding.
Description
Technical field
The present invention relates to technical field of LED illumination, particularly a kind of COB supports.
Background technology
COB (Chip On Board) is chip on board attachment, is one of bare chip mounting technology, semiconductor chip interlocks
On a printed-wiring board, the method that the electrical connection of chip and substrate is sutured using lead is realized for attachment, and with resin covering with
Ensure reliability.The LED module of COB encapsulation is mounted with many pieces of LED chips on bottom plate, uses the mode energy of many pieces of LED chips
Largely expand the area of dissipation of encapsulation, heat is easier conduction to shell, the COB light source that in the market is largely produced
Worked it out with this technology.The light fixture worked it out with COB light source, it is anti-with long lifespan, power saving, Gao Xian, efficient, safety
It is quick-fried, without ghost image, it is attractive in appearance the features such as.By many advantages such as its specular removal, area source, personalized designs, feature gradually in LED rows
Rob and occupy a tiny space in industry.Market share amount of the COB light source in shot-light, Down lamp, Ceiling light field reaches 50%.But from skill
Analyze in terms of art, the problem of current COB light source also has many, but whether can preferably solve that substrate radiating is slow, heat conduction
It is difficult, the problems such as production cost is high be then its most important thing.
Common COB supports are mainly made up of substrate and resin on the market, and it is aluminium base that wherein substrate is most widely used
Plate and ceramic substrate, the heat that LED is produced are transmitted to metal substrate by insulating barrier, then are transmitted to radiating by thermal interfacial material
Most heats produced by LED, can be thus diffused into the air of surrounding by device by way of convection current.But aluminium base
Plate is big with heat-conducting glue thermal resistance, and reliability is not high, is easily caused the phenomenons such as light decay, dead lamp；And although ceramic substrate is COB ideal
Material, but cost is higher, is difficult to be readily accepted by customers when especially power is smaller.In addition, existing COB supporting structures are more simple
It is single, not reasonable, the space with optimization.
The content of the invention
In order to overcome the deficiencies in the prior art, the present invention provide it is a kind of in crystal bonding area perfect heat-dissipating, it is rational in infrastructure, stably
The property low COB supports of good, manufacturing cost.
The technical solution adopted for the present invention to solve the technical problems is：
A kind of COB light fixtures protective stent, including thin copper material substrate, and the colloid being arranged on the thin copper material substrate are thin
Copper material substrate is substantially square, and the center line both sides on both sides are separately provided in the recess for positioning, fixing, four sides up and down
Heart position is respectively arranged with the open slot for facilitating stuck glue, and the upper left corner and the lower right corner are respectively arranged with bonding wire region, the center of colloid
Provided with a chip rest area, chip rest area is provided with the line mouthful for penetrating colloid and thin copper material substrate, and colloid is from the line mouthful
Place extends to the reverse side of thin copper material substrate.
Further, the upper right corner and the lower left corner of the thin copper material substrate are provided with the fixed part for facilitating screw to fix crystal.
Further, the colloid upper left corner and the lower right corner are additionally provided with the extension for stopping scolding tin.
Further, it is provided with ellipse hole on the thin copper material substrate.
Further, described thin copper material substrate is without the splicing thin copper material substrate of punch forming.
As the unseparated embodiment of thermoelectricity, described chip rest area is circle, and described line mouthful is to set
Put the arc port that area edge is placed in chip.
Further, the colloid extends at the line mouthful to the reverse side of thin copper material substrate, is fitted in thin copper material base
One jiao of back.
The pros that fillet is handled are passed through in the embodiment separated as thermoelectricity, described chip rest area for four angles
Shape, described line mouth is provided with two, and described line mouthful is to be arranged on strip mouthful of the chip rest area with respect to both sides edge.
Further, the colloid extends at line mouthful to the back side outer rim of thin copper material substrate respectively, forms two pieces in
The symmetrical colloid region of heart line.
Further, described colloid region is provided with for fixed bolt.
The beneficial effects of the invention are as follows：The COB supports of the present invention with thin copper material substrate instead of conventional aluminium base or
Ceramic substrate, while the thick bottom of copper material that whole product is used is identical without splicing, thickness is thinner, can be by process of producing product
Semi-finished product are rolled, and realize that fully-automatic production is processed, manufacturing cost, especially materials and cost of labor greatly reduces,
Effectively raise production efficiency；Adhesion between colloid and copper material is compared to the adhesion between usual resins and substrate more
Firmly, stably, reliably；It is rational in infrastructure so that the heat conductivility of COB supports is greatly improved, can be quick by the heat produced by LED
It is diffused into the air of surrounding.
Brief description of the drawings
The present invention is further described with reference to the accompanying drawings and examples.
Fig. 1 is the front view of embodiment 1 in the present invention；
Fig. 2 is the rearview of embodiment 1 in the present invention；
Fig. 3 is the left view of embodiment 1 in the present invention；
Fig. 4 is the front view of embodiment 2 in the present invention；
Fig. 5 is the rearview of embodiment 2 in the present invention；
Fig. 6 is the left view of embodiment 2 in the present invention.
Embodiment
Referring to figs. 1 to Fig. 6, a kind of COB light fixtures protective stent of the invention, including thin copper material substrate 1, and it is arranged on this
Colloid 2 on thin copper material substrate 1.In the present invention, the direction of upper and lower, left and right is on the basis of front view.
Described thin copper material substrate 1 is that, without the splicing thin copper material substrate of punch forming, thin copper material substrate 1 is substantially square,
I.e. four edge lengths are identical, carry out fillet processing, and with certain thickness.The center line both sides on both sides are respectively arranged with use up and down
In positioning, fixed recess 12, the center on four sides is respectively arranged with the open slot 11 for facilitating stuck glue, convenient toward thin copper material base
Stuck glue is carried out in the process that colloid 2 is added on plate 1.The thin upper left corner of copper material substrate 1 and the lower right corner are respectively arranged with wire welding area
The edge extension that domain 13, the corresponding upper left corner of the colloid 2 and the lower right corner are additionally provided with bonding wire region 13 stops prolonging for scolding tin
Extending portion 23.The upper right corner and the lower left corner of the thin copper material substrate 1 are provided with the fixed part 14 for facilitating screw to fix crystal, fixed part
14 be toward the region of center position arc concave shape.
Embodiment 1：As the unseparated embodiment of thermoelectricity, the center of colloid 2 is placed provided with a circular chip
Concaved out a space for accommodating chip in the middle of area 21, the colloid 2 of chip rest area 21, and the edge of chip rest area 21 is set
There is the line mouthful 22 for penetrating colloid 2 and thin copper material substrate 1, described line mouthful 22 is the arc for being arranged on the edge of chip rest area 21
Shape mouthful, is easy to crystal to be connected with thin copper material substrate 1.Colloid 2 prolongs at line mouthful 22 to the reverse side of thin copper material substrate 1
Stretch, be fitted in one jiao of the thin back side of copper material substrate 1 so that the combination of colloid 2 and thin copper material substrate 1 is even closer, and heat conduction
Performance is more preferable.Three angularly disposed ellipse holes 15 are provided with the thin back side of copper material substrate 1.
Embodiment 2：Fillet is passed through in the embodiment separated as thermoelectricity, described chip rest area 21 for four angles
The square of processing, described line mouthful 22 be provided with above and below two, described line mouthful 22 is is arranged on chip rest area 21
The strip mouthful at both sides edge up and down.
The colloid 2 extends at line mouthful 22 to the back side outer rim of thin copper material substrate 1 respectively, forms two pieces along center line
Symmetrical colloid region.Described colloid region is provided with for fixed bolt 24.It is symmetrical on the thin back side of copper material substrate 1
It is provided with the ellipse hole 15 of four longitudinal directions.
COB supports instead of conventional aluminium base and ceramic substrate with thin copper material substrate 1, while what whole product was used
Copper material thickness bottom is identical without splicing, and the thickness of product is thinner, can roll semi-finished product in process of producing product, realizes full-automatic
Production and processing, greatly reduces manufacturing cost, especially saves materials and cost of labor, effectively raise production
Efficiency.
The COB supports of the present invention, use injection molding type COB, are mainly made up of copper material and the two parts of colloid 2, the He of colloid 2
Adhesion between copper material is compared to the adhesion between usual resins and substrate more firmly, reliably, stably.
Certainly, the present invention can also have the deformation in other structures, these equivalent technologies in addition to above-mentioned embodiment
Scheme should also be as within its protection domain.
Claims (10)
1. a kind of COB light fixtures protective stent, it is characterised in that：Including thin copper material substrate (1), and it is arranged on the thin copper material substrate
(1) colloid (2) on, thin copper material substrate (1) is square, and the center line both sides on both sides are separately provided for positioning, consolidated up and down
Fixed recess (12), the center on four sides is respectively arranged with the open slot (11) for facilitating stuck glue, the upper left corner and lower right corner difference
Bonding wire region (13) is provided with, the center of colloid (2) is provided with a chip rest area (21), and chip rest area (21), which are provided with, to be penetrated
The line mouthful (22) of colloid (2) and thin copper material substrate (1), in order to which crystal is connected with thin copper material substrate (1), and colloid (2) from
The line mouthful (22) place extends to the reverse side of thin copper material substrate (1).
2. a kind of COB light fixtures protective stent according to claim 1, it is characterised in that：The right side of the thin copper material substrate (1)
Upper angle and the lower left corner are provided with the fixed part (14) for facilitating screw to fix crystal.
3. a kind of COB light fixtures protective stent according to claim 1, it is characterised in that：Colloid (2) upper left corner and the right side
Inferior horn is additionally provided with the extension (23) for stopping scolding tin.
4. a kind of COB light fixtures protective stent according to claim 1, it is characterised in that：Set on the thin copper material substrate (1)
It is equipped with ellipse hole (15).
5. a kind of COB light fixtures protective stent according to claim 1, it is characterised in that：Described thin copper material substrate (1) is
Without the splicing thin copper material substrate of punch forming.
6. a kind of COB light fixtures protective stent according to any one of claim 1-5, it is characterised in that：Described chip
Rest area (21) is circle, and described line mouthful (22) is the arc port for being arranged on chip rest area (21) edge.
7. a kind of COB light fixtures protective stent according to claim 6, it is characterised in that：The colloid (2) is from the line mouthful
(22) place extends to the reverse side of thin copper material substrate (1), is fitted in one jiao of thin copper material substrate (1) back side.
8. a kind of COB light fixtures protective stent according to any one of claim 1-5, it is characterised in that：Described chip
Rest area (21) is that the square that fillet is handled is passed through at four angles, and described line mouthful (22) is provided with two, described line
Mouth (22) is to be arranged on strip mouthful of the chip rest area (21) with respect to both sides edge.
9. a kind of COB light fixtures protective stent according to claim 8, it is characterised in that：The colloid (2) is respectively from line
Mouth (22) place extends to the back side outer rim of thin copper material substrate (1), forms two pieces along the symmetrical colloid region of center line.
10. a kind of COB light fixtures protective stent according to claim 9, it is characterised in that：Described colloid region is provided with
For fixed bolt (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410152523.8A CN103925568B (en) | 2014-04-16 | 2014-04-16 | A kind of COB light fixtures protective stent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410152523.8A CN103925568B (en) | 2014-04-16 | 2014-04-16 | A kind of COB light fixtures protective stent |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103925568A CN103925568A (en) | 2014-07-16 |
| CN103925568B true CN103925568B (en) | 2017-10-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410152523.8A Active CN103925568B (en) | 2014-04-16 | 2014-04-16 | A kind of COB light fixtures protective stent |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203848223U (en) * | 2014-04-16 | 2014-09-24 | 深圳市得润电子股份有限公司 | COB (chip on board) lamp protecting support |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM337847U (en) * | 2008-02-01 | 2008-08-01 | Tato Prec Ind Co Ltd | LED lead base |
| CN202268391U (en) * | 2011-10-13 | 2012-06-06 | 杭州友旺科技有限公司 | Chip on board (COB) surface light source packaging structure |
| KR101895359B1 (en) * | 2011-10-14 | 2018-09-07 | 엘지이노텍 주식회사 | Method for Configuring Illumination Module using COB Package and Illumination Module |
| CN202772180U (en) * | 2012-07-28 | 2013-03-06 | 东莞市鑫亮光电科技有限公司 | Novel LED support |
| CN103066196B (en) * | 2013-01-30 | 2015-10-28 | 江苏华英光宝科技股份有限公司 | There is the high brightness LED chip carrier structure of strong heat sinking function |
| CN103426998B (en) * | 2013-07-24 | 2017-05-24 | 博罗承创精密工业有限公司 | Light emitting diode (LED) support |
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2014
- 2014-04-16 CN CN201410152523.8A patent/CN103925568B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203848223U (en) * | 2014-04-16 | 2014-09-24 | 深圳市得润电子股份有限公司 | COB (chip on board) lamp protecting support |
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| CN103925568A (en) | 2014-07-16 |
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Address after: 518107 Derun Electronic Industrial Park, 269 Huitong Road, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN DEREN ELECTRONIC Co.,Ltd. Address before: 518107, Guangdong province Shenzhen Guangming New District Guangming Street, No. thirty-three Road, 9 Electronic Industrial Park run Patentee before: SHENZHEN DEREN ELECTRONIC Co.,Ltd. |