CN102569281A - Integratedly-packaged LED bracket - Google Patents
Integratedly-packaged LED bracket Download PDFInfo
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- CN102569281A CN102569281A CN2012100133907A CN201210013390A CN102569281A CN 102569281 A CN102569281 A CN 102569281A CN 2012100133907 A CN2012100133907 A CN 2012100133907A CN 201210013390 A CN201210013390 A CN 201210013390A CN 102569281 A CN102569281 A CN 102569281A
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- rack body
- substrate
- led
- bracket
- electrode
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Abstract
The invention discloses an integratedly-packaged LED bracket, belonging to an LED bracket. The integrated-packaged LED bracket comprises a bracket body and a substrate arranged on the bracket body, wherein the substrate is a ceramic substrate, and a plurality of electrode interfaces which are used for installing LED chips and connected in parallel to one another are arranged above the ceramic substrate; each electrode interface can be extracted by a lead wire and extends out of the bracket body; and a fixing device is also arranged on the bracket body. Ceramic with better heat conduction property is matched with the alloy bracket body for package instead of a heat dissipation substrate material of an LED lamp, so that the whole heat dissipation property of the LED bracket can be remarkably improved, and therefore the light transparency of the packaged LED lamp is remarkably improved under the same volume by arranging the plurality of electrode interfaces which are used for fixedly welding a plurality of LED chips, on the heat dissipation substrate. In addition, the integrated-packaged LED bracket provided by the invention is simple in structure, smaller in size, applicable to industrial production and easy to popularize.
Description
Technical field
The present invention relates to a kind of led support, in particular, the present invention relates generally to a kind of integrated encapsulated LED support.
Background technology
Along with the continuous development of China LED industry, because the LED light fixture will be superior to incandescent lamp on power and brightness comprehensively, so the application of LED light fixture is more and more general; And in the production technology of LED, need to solve the heat dissipation problem of led chip in luminescence process through cooling base or substrate, prevent that Yin Wendu is too high and influence the operate as normal of luminescence chip; Or be damaged; And the material major part of the cooling stand of LED product and pedestal all is a copper material degree silver in the market, and its principle is to have utilized the high thermal conductivity of metal to dispel the heat, but for the luminous heat that produces of led chip; Its thermal conductivity of the thermal conductivity of metal is low; Radiating effect is bad, and this common support can only weld single led chip admittedly, makes that the luminous efficiency of the LED light fixture after the encapsulation is lower; Therefore poor reliability is necessary to do further improvement to the structure and the production technology of LED light fixture.
Summary of the invention
One of the object of the invention is to solve above-mentioned deficiency, provides a kind of luminous efficiency higher a kind of integrated encapsulated LED support.
For solving above-mentioned technical problem, the present invention adopts following technical scheme:
A kind of integrated encapsulated LED support provided by the present invention; Comprise rack body and be installed in the substrate on the rack body; Described substrate is a ceramic substrate; Its top is provided with a plurality of be used to install led chip, and electrode interfaces parallel with one another, and each electrode interface is all drawn through lead and extended to beyond the rack body, and also is provided with fixture on the rack body.
Further technical scheme is: the substrate that install described rack body and its top is rectangular.
Technical scheme further is: a plurality of on the described substrate be used to install led chip, and electrode interface parallel with one another be mutually netted arrangement, and keep the gap between each electrode interface.
Technical scheme further is: also be provided with through wires hole near the edge of described rack body, electrode interface is drawn and is extended to rack body lead in addition by passing in the through wires hole.
Technical scheme further is: described rack body adopts aluminium nitride or height to lead insulating resin aluminium and is processed into.
Technical scheme further is: the fixture that is provided with on the described rack body is a location hole, and location hole is positioned near the edge of rack body.
Technical scheme further is: the gap between described a plurality of electrode interfaces is 3 to 5 millimeters.
Compared with prior art, one of beneficial effect of the present invention is: replace with heat conductivility pottery preferably through the heat-radiating substrate material with the LED light fixture, matching with the alloy bracket body encapsulates; Make the integral heat sink performance of led support obviously improve; Therefore a plurality of electrode interfaces can be set on heat-radiating substrate, be used for solid weldering plurality of LEDs chip, make the LED light fixture after the encapsulation under equal volume, obviously improve logical light rate; A plurality of electrode interfaces are parallel with one another simultaneously; Make wherein one or more electrode interfaces Shi Buhui that breaks down influence the normal use of other electrode interfaces, and a kind of integrated encapsulated LED supporting structure provided by the present invention is simple, volume is less; Be suitable for suitability for industrialized production, be easy to promote.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Embodiment
Below in conjunction with accompanying drawing the present invention is done further elaboration.
Embodiment:
A kind of integrated encapsulated LED support provided by the present invention; Comprise rack body 1 and be installed in the substrate on the rack body 1; Described substrate is a ceramic substrate 2; Its top is provided with a plurality of be used to install led chip, and electrode interfaces 3 parallel with one another, and each electrode interface 3 is all drawn through lead and extended to beyond the rack body 1, and also is provided with fixture on the rack body 1.The conduct of aforementioned fixation device is used on the shell or battery lead plate that rack body are fixed on the LED light fixture; Inventor of the present invention is with reference to prior art; Think here as fixture location hole 5 preferably, can conveniently adopt bolt or screw to fix, in addition; Fixture also can adopt other form, for example clamp button of the spring etc.
Referring to shown in Figure 1; As of the present invention preferred; The rack body of being mentioned in the technique scheme 1 preferentially is set to rectangle, and for the rack body 1 with rectangle is complementary, the heat radiation ceramic substrate 2 that is installed on the rack body 1 also is set to rectangle; Further say; The purpose that ceramic substrate 2 is set to rectangle is can be the netted a plurality of electrode interfaces that are used to install led chip that distribute that are provided with on it in order to make, and avoids the space waste on the ceramic substrate 2, and the lead that also helps on the electrode interface 3 is drawn.
Content to above-mentioned also need to prove; Above-mentioned technical scheme only is of the present invention preferred, and the inventor finds in experiment, can aforementioned rack body of mentioning 1 and heat radiation ceramic substrate 2 be set to circle, ellipse even triangle; Even can also rack body 1 be set to circle; The ceramic substrate 2 that will dispel the heat is set to rectangle, and combination like that is even if compare with above-mentioned rectangle heat-radiating substrate; After the later stage is provided with a plurality of electrode interfaces 3, can cause too much space waste, but one of technical purpose of the present invention at least and effect remain and can realize.
Said according to as above, on the heat radiation ceramic substrate 2 of rectangle a plurality of electrode interfaces 3 can be set, but also need keep the gap between each electrode interface 3, prevent that led chip from influencing each other when luminous work.As preferably; Clearance distance between the electrode interface 3 can be selected in the middle of 3 to 5 millimeters, and the gap between the electrode interface 3 is remained on the width of aforementioned range, be appreciated that into the area of the ceramic substrate on the rack body 12 big more; The electrode interface 3 that can be provided with is just many more; Can the mounted LEDs chip also many more, and according to the different capacity of led chip, can adjustment arbitrarily in aforesaid scope; For example power is that the led chip clearance distance of 0.5W is set to 5 millimeters, and the led chip clearance distance of power 0.3W is set to 3 millimeters.
And the arrangement mode of electrode interface 3 comparative optimizations is for being netted arrangement; Specifically; For electrode interface 3 being set to cross one another formation shape; Intersection can also can be set to shown in Figure 1 a plurality of electrode interfaces 3 are lined up the row shape for intersecting at any angle, and orthogonal cross-distribution.
Simultaneously according to above-mentioned content; A plurality of netted arrangements and electrode interface parallel with one another 3 are set on heat-radiating substrate needs to adopt many leads to extend out; And get muddled after lead from extending to outside the rack body 1 for preventing; Cellular through wires hole 4 can also be set on rack body 1, electrode interface 3 extended leads are passed from through wires hole 4, the concrete form of through wires hole 4 is as shown in Figure 1; For the position of through wires hole 4, preferably it is arranged near the edge of rack body 1 corner near rectangle.
And according to the structure of above-mentioned said led support, in the middle of the heat dispersion of the rack body 1 mentioned need to echo mutually with heat radiation ceramic substrate 2, therefore in its material volume selection, preferentially adopt aluminium nitride or height to lead insulating resin aluminium and be processed into.
One of inventive point of the present invention is; On above-mentioned heat radiation ceramic substrate, weld a plurality of led chips admittedly; Make it to have obtained higher luminous flux in the relatively little volume, simultaneously on the basis of adopting a plurality of led chips to work simultaneously, avoided taking place because of wherein one or more led chips situation that the circuit that causes whole ceramic substrate can not connect that breaks down; Can need to use in the high light place at some, for example stage projector etc.
In addition; " embodiment ", " another embodiment ", " embodiment " that are in this manual to be spoken of that also need describe, etc., refer to the concrete characteristic, structure or the characteristics that combine this embodiment to describe and be included among at least one embodiment that the application's generality describes.A plurality of local appearance statement of the same race is not necessarily to refer to same embodiment in specification.Further, when describing a concrete characteristic, structure or characteristics in conjunction with arbitrary embodiment, what institute will advocate is that other embodiment of combination realize that this characteristic, structure or characteristics also fall within the scope of the invention.
Although invention has been described with reference to a plurality of explanatory embodiment of the present invention here; But; Should be appreciated that those skilled in the art can design a lot of other modification and execution modes, these are revised and execution mode will drop within disclosed principle scope of the application and the spirit.More particularly, in the scope of, accompanying drawing open and claim, can carry out multiple modification and improvement to the building block and/or the layout of subject combination layout in the application.Except modification that building block and/or layout are carried out with improve, to those skilled in the art, other purposes also will be tangible.
Claims (7)
1. integrated encapsulated LED support; Comprise rack body (1) and be installed in the substrate on the rack body (1); It is characterized in that: described substrate is ceramic substrate (2); Its top is provided with a plurality of be used to install led chip, and electrode interfaces (3) parallel with one another, and each electrode interface (3) is all drawn through lead and extended to rack body (1) in addition, and also is provided with fixture on the rack body (1).
2. integrated encapsulated LED support according to claim 1 is characterized in that: described rack body (1) is rectangular with the substrate that install its top.
3. integrated encapsulated LED support according to claim 1 and 2 is characterized in that: a plurality of on the described substrate be used to install led chip, and electrode interface (3) parallel with one another be mutually netted arrangement, and keep the gap between each electrode interface (3).
4. integrated encapsulated LED support according to claim 3 is characterized in that: also be provided with through wires hole (4) near the edge of described rack body (1), electrode interface (3) is drawn and is extended to rack body (1) lead in addition by passing in the through wires hole (4).
5. integrated encapsulated LED support according to claim 1 is characterized in that: described rack body (1) adopts aluminium nitride or height to lead insulating resin aluminium and is processed into.
6. integrated encapsulated LED support according to claim 1 is characterized in that: it is location hole (5) that described rack body (1) is gone up the fixture that is provided with, and location hole (5) is positioned near the edge of rack body (1).
7. according to claim 1 or 6 described integrated encapsulated LED supports, it is characterized in that: the gap between described a plurality of electrode interfaces (3) is 3 to 5 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100133907A CN102569281A (en) | 2012-01-16 | 2012-01-16 | Integratedly-packaged LED bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100133907A CN102569281A (en) | 2012-01-16 | 2012-01-16 | Integratedly-packaged LED bracket |
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| Publication Number | Publication Date |
|---|---|
| CN102569281A true CN102569281A (en) | 2012-07-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100133907A Pending CN102569281A (en) | 2012-01-16 | 2012-01-16 | Integratedly-packaged LED bracket |
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| Country | Link |
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| CN (1) | CN102569281A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103727451A (en) * | 2012-10-12 | 2014-04-16 | 宁波市镇海海鑫电子有限公司 | Led |
| CN104659186A (en) * | 2015-02-12 | 2015-05-27 | 矽照光电（厦门）有限公司 | LED integrated module |
| CN108224245A (en) * | 2018-02-08 | 2018-06-29 | 四川九洲光电科技股份有限公司 | Lightweight multifunctional modular Projecting Lamp |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201066099Y (en) * | 2007-06-14 | 2008-05-28 | 杭州艾欧易迪光能科技有限公司 | Integral large power LED bracket favorable to heat-conductive performance |
| CN102157507A (en) * | 2011-01-25 | 2011-08-17 | 北京工业大学 | White LED integration module with adjustable color temperature and color rendering indexes |
| CN202003993U (en) * | 2010-12-08 | 2011-10-05 | 彩虹集团公司 | Large power LED packaging structure |
| CN102214782A (en) * | 2011-06-08 | 2011-10-12 | 深圳市翠柏来特光电有限公司 | LED (light-emitting diode) metallic support and manufacturing method thereof as well as LED and LED lamp |
| US20110297976A1 (en) * | 2010-06-04 | 2011-12-08 | Everlight Electronics Co., Ltd. | Illumination Module |
| CN202473915U (en) * | 2012-01-16 | 2012-10-03 | 四川九洲光电科技股份有限公司 | Integrated packaged light-emitting diode (LED) supporting frame |
-
2012
- 2012-01-16 CN CN2012100133907A patent/CN102569281A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201066099Y (en) * | 2007-06-14 | 2008-05-28 | 杭州艾欧易迪光能科技有限公司 | Integral large power LED bracket favorable to heat-conductive performance |
| US20110297976A1 (en) * | 2010-06-04 | 2011-12-08 | Everlight Electronics Co., Ltd. | Illumination Module |
| CN202003993U (en) * | 2010-12-08 | 2011-10-05 | 彩虹集团公司 | Large power LED packaging structure |
| CN102157507A (en) * | 2011-01-25 | 2011-08-17 | 北京工业大学 | White LED integration module with adjustable color temperature and color rendering indexes |
| CN102214782A (en) * | 2011-06-08 | 2011-10-12 | 深圳市翠柏来特光电有限公司 | LED (light-emitting diode) metallic support and manufacturing method thereof as well as LED and LED lamp |
| CN202473915U (en) * | 2012-01-16 | 2012-10-03 | 四川九洲光电科技股份有限公司 | Integrated packaged light-emitting diode (LED) supporting frame |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103727451A (en) * | 2012-10-12 | 2014-04-16 | 宁波市镇海海鑫电子有限公司 | Led |
| CN104659186A (en) * | 2015-02-12 | 2015-05-27 | 矽照光电（厦门）有限公司 | LED integrated module |
| CN104659186B (en) * | 2015-02-12 | 2017-06-20 | 矽照光电（厦门）有限公司 | A kind of LED integration modules |
| CN108224245A (en) * | 2018-02-08 | 2018-06-29 | 四川九洲光电科技股份有限公司 | Lightweight multifunctional modular Projecting Lamp |
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Application publication date: 20120711 |