CN201066099Y - Integral large power LED bracket favorable to heat-conductive performance - Google Patents
Integral large power LED bracket favorable to heat-conductive performance Download PDFInfo
- Publication number
- CN201066099Y CN201066099Y CNU2007201522485U CN200720152248U CN201066099Y CN 201066099 Y CN201066099 Y CN 201066099Y CN U2007201522485 U CNU2007201522485 U CN U2007201522485U CN 200720152248 U CN200720152248 U CN 200720152248U CN 201066099 Y CN201066099 Y CN 201066099Y
- Authority
- CN
- China
- Prior art keywords
- led
- led chip
- insulated conductor
- power
- power led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The utility model relates to an integrated high-power LED supporter which is beneficial to thermal conductivity which relates to the field of electron lighting. The existing high-power LED supporter has many parts and a complex combined body; while a simpler supporter is only suitable for the LED supporter with a smaller power, the thermal conduction and the viewing effect are all poorer, the reliability is low and the cost is high. The utility model proposed to overcome the defects is characterized in that an externally convex reflecting cavity in horn shape which is small in the bottom and big in the mouth is arranged on the surface of an aluminium and copper base; the inner surface of the cavity body is a slippy mirror face; the bottom surface of the reflecting cavity is fixed with a LED chip; an insulating lead passes in through a lead hole beside the LED chip; the LED chip is connected with the insulating lead through a wire solder and then connected with a power supply. The utility model has beneficial effects of simple and firm structure, good radiating and viewing effects, simple and convenient processing as well as low cost.
Description
Technical field
The utility model relates to the electrical lighting field, especially the support of great power LED.
Background technology
Existing common high-power LED bracket is in order to reach better radiating effect and to keep electric connection, generally two extraction electrodes, heat sink this three partially conductives heat-conducting metal spare are linked together in the mode of injection moulding processing, as the high-power LED bracket of present popular U.S. lumen company.Therefore, common high-power LED bracket generally is the complicated body that a plurality of parts are combined with metal and nonmetallic materials.
Cause under the heat conductivility to subtract, and the parts of support are more, influenced product reliability, increased product cost.Some simple relatively high-power LED brackets are arranged in recent years, but all be the LED that only is applicable to smaller power, heat conductivility and to get light effect relatively poor can't be applied in real great power LED field.
Summary of the invention:
The purpose of this utility model is in order to overcome the shortcoming of above-mentioned existence, provide a kind of have simple in structure firmly, radiating effect is good, it is good to get light effect, process characteristics such as easy, that cost is lower, be used for the integrated high-power LED bracket of the favourable lead performance in great power LED field.
The purpose of this utility model is finished by following technical solution, the integrated high-power LED bracket of favourable heat conductivility, has bracket base, led chip is housed on base, led chip is connected the light face that support aluminium backing or copper pedestal surface have an evagination by insulated conductor and power supply, reflective face cavity is big horn-like of end osculum, the inner surface of cavity is smooth reflective mirror, on the reflector cavity bottom surface, be fixed with one or more led chips, both sides, bottom surface on the chip next door respectively have wire guide, insulated conductor passes wire guide, insulated conductor, end face is equal with the reflector cavity bottom surface, is connected with two insulated conductor ends respectively after led chip is connected to each other by bonding wire.
Led chip sticks on the reflector cavity bottom surface with heat-conducting glue, or is fixed on the reflector cavity bottom surface with product mode altogether.
The bonding wire that connects led chip and insulated conductor end is the gold thread fly line.
The utility model can be crossed support, reflector cavity, heat sink, electric connection integrated, guaranteeing the electrically connected while, can reflect away most light, can be transmitted to external heat sink to heat rapidly again and distribute, heat cloudy little, to get light effect good, the industrialized mass production of firmly being convenient to simple in structure.
The utlity model has following beneficial effect:
(1) simple firmly, all parts of result are integrated.Heat sink part directly is connected good heat dissipation effect with aluminium with good heat conductive performance or steel base.
(2) have reflector cavity, the reflector cavity inner surface is smooth, be minute surface, and it is good to get light effect.
(3) processing is easy, and cost is lower.
Description of drawings:
Fig. 1 is the structural representation of the integrated high-power LED bracket of the favourable heat conductivility of the utility model
Fig. 2 is the A-A profile of Fig. 1.
The specific embodiment:
To be that example is further described the utility model to encapsulate four 1W chips by accompanying drawing Fig. 1 and Fig. 2 below: main body be a bracket base 1, there is the round platform 2 of a projection on bracket base 1 surface, the reflector cavity 3 that a depression is arranged in the round platform 2, be big horn-like of end osculum, the bottom of reflector cavity 3 is planes, position on this plane near the end, slope has two apertures to be used to pass the insulated conductor 4 of electric connection usefulness, the end face that insulated conductor 4 exposes in reflector cavity 3 inside becomes same plane substantially with the plane of reflector cavity 3 bottoms, with base 1 bonding, the Surface Machining of reflector cavity 3 became minute surface after insulated conductor 4 was in place.Four LEDs chips, 5 usefulness heat-conducting glues are fixed on the plane of reflector cavity 3 bottoms, connect the internal end surface of the electrode and the insulated conductor 4 of all led chips 5 on demand, finish and outside being electrically connected.Outside constant-current supply enters reflector cavity 3 from the wire guide 7 that insulated conductor 4 passes on the base 1, and the metal end face of insulated conductor 4 links by gold thread fly line 6 and led chip 5 and makes LED get electroluminescence.
Claims (3)
1. the integrated high-power LED bracket of favourable heat conductivility, has bracket base, led chip is housed on base, led chip is connected with power supply by insulated conductor, it is characterized by the reflector cavity that has an evagination on support aluminium backing or copper pedestal surface, reflective cavity is big horn-like of end osculum, the inner surface of cavity is smooth reflective mirror, on the reflector cavity bottom surface, be fixed with one or more led chips, both sides, bottom surface on the chip next door respectively have a wire guide, insulated conductor passes wire guide, and the insulated conductor end face is equal with the reflector cavity bottom surface, is connected with an insulated conductor end respectively after led chip is connected to each other by bonding wire.
2. the integrated high-power LED bracket of favourable heat conductivility according to claim 1 is characterized by led chip and sticks on the reflector cavity bottom surface with heat-conducting glue, or is fixed on the bottom surface with the eutectic mode.
3. the integrated high-power LED bracket of favourable heat conductivility according to claim 1 and 2, it is characterized by the bonding wire that connects led chip and insulated conductor end is the gold thread fly line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201522485U CN201066099Y (en) | 2007-06-14 | 2007-06-14 | Integral large power LED bracket favorable to heat-conductive performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201522485U CN201066099Y (en) | 2007-06-14 | 2007-06-14 | Integral large power LED bracket favorable to heat-conductive performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201066099Y true CN201066099Y (en) | 2008-05-28 |
Family
ID=39483278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201522485U Expired - Fee Related CN201066099Y (en) | 2007-06-14 | 2007-06-14 | Integral large power LED bracket favorable to heat-conductive performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201066099Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569281A (en) * | 2012-01-16 | 2012-07-11 | 四川九洲光电科技股份有限公司 | Integratedly-packaged LED bracket |
| WO2014134936A1 (en) * | 2013-03-08 | 2014-09-12 | Hsu Kang-Tse | Led lamp |
-
2007
- 2007-06-14 CN CNU2007201522485U patent/CN201066099Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569281A (en) * | 2012-01-16 | 2012-07-11 | 四川九洲光电科技股份有限公司 | Integratedly-packaged LED bracket |
| WO2014134936A1 (en) * | 2013-03-08 | 2014-09-12 | Hsu Kang-Tse | Led lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080528 Termination date: 20130614 |