CN203848223U - COB (chip on board) lamp protecting support - Google Patents
COB (chip on board) lamp protecting support Download PDFInfo
- Publication number
- CN203848223U CN203848223U CN201420184861.5U CN201420184861U CN203848223U CN 203848223 U CN203848223 U CN 203848223U CN 201420184861 U CN201420184861 U CN 201420184861U CN 203848223 U CN203848223 U CN 203848223U
- Authority
- CN
- China
- Prior art keywords
- colloid
- thin copper
- copper material
- material substrate
- light fixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 52
- 229910052802 copper Inorganic materials 0.000 claims abstract description 52
- 239000010949 copper Substances 0.000 claims abstract description 52
- 239000000084 colloidal system Substances 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 54
- 239000000463 material Substances 0.000 claims description 51
- 230000001681 protective effect Effects 0.000 claims description 13
- 239000013078 crystal Substances 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 239000011347 resin Substances 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 5
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 239000000047 product Substances 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 230000005619 thermoelectricity Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000012080 ambient air Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a COB (chip on board) lamp protecting support which comprises a thin copper baseplate and a colloid. The thin copper baseplate is roughly square, notches used for positioning and fixing are arranged on two sides of central lines of the upper edge and the lower edge, an opening groove convenient for clamping of the colloid is arranged at the center of each of four edges, a welding line area is arranged at each of the upper left corner and the lower right corner, a chip placement area is arranged at the center of the colloid and provided with connecting line ports penetrating the colloid and the thin copper baseplate, and the colloid extends from the connecting line ports to one side of the back of the thin copper baseplate. Full-automatic production and processing can be realized in the process of product production, so that production and manufacturing cost is greatly lowered, and production efficiency is improved effectively; bonding force between the colloid and copper is firmer and more stable and reliable than that between conventional resin and the baseplate; the COB lamp protecting support is reasonable in structure, heat conducting performance of the COB support is improved greatly, and heat generated by an LED can be quickly diffused into surrounding air.
Description
Technical field
The utility model relates to LED lighting technical field, particularly a kind of COB support.
Background technology
COB (Chip On Board) is that chip on board mounts, it is one of bare chip mounting technology, semiconductor chip is staggered to be mounted on printed substrate, and the electrical connection of chip and substrate adopts the method that lead-in wire is sewed up to realize, and covers to guarantee reliability with resin.The LED module of COB encapsulation has been installed many pieces of LED chips on base plate, the mode of many pieces of LED chips of use can expand the area of dissipation of encapsulation to a great extent, make heat more easily conduct to shell, on market, mass-produced COB light source is worked it out by this technology.The light fixture of working it out with COB light source, has life-span length, power saving, high aobvious, efficient, safety anti-explosive, without ghost image, the feature such as attractive in appearance.Rely on many advantages, the features such as its high light efficiency, area source, personalized designs in LED industry, to rob and occupy a tiny space gradually.COB light source reaches 50% in the market share amount in shot-light, Down lamp, Ceiling light field.But from technical elements analysis, COB light source also exists many problems at present, but whether can solve preferably the problems such as substrate heat radiation is slow, heat conduction is difficult, production cost is high, be its most important thing.
Common COB support is mainly comprised of substrate and resin on the market, wherein substrate is most widely used is aluminium base and ceramic substrate, the heat that LED produces is transmitted to metal substrate by insulating barrier, through thermal interfacial material, be transmitted to radiator again, most heats that so just LED can be produced are diffused in ambient air by the mode of convection current.But aluminium base and heat-conducting glue thermal resistance are large, and reliability is not high, easily cause the phenomenons such as light decay, dead lamp; Although and ceramic substrate is the ideal material of COB, cost is higher, especially power hour is difficult to be accepted by client.In addition, existing COB supporting structure is comparatively simple, reasonable not, has the space of optimization.
Utility model content
In order to overcome the deficiencies in the prior art, the utility model provides a kind of COB support in crystal bonding area perfect heat-dissipating, rational in infrastructure, good stability, low cost of manufacture.
The utility model solves the technical scheme that its technical problem adopts:
A kind of COB light fixture protective stent, comprise thin copper material substrate, and be arranged on the colloid on this thin copper material substrate, thin copper material substrate is roughly square, the center line both sides on upper and lower both sides are respectively arranged with for locating, fixing recess, the center on four limits is respectively arranged with the open slot that facilitates stuck glue, the upper left corner and the lower right corner are respectively arranged with bonding wire region, the center of colloid is provided with a wafer rest area, wafer rest area is provided with the line mouth that penetrates colloid and thin copper material substrate, and the back side one side of colloid from this line mouth to thin copper material substrate extended.
Further, the upper right corner of described thin copper material substrate and the lower left corner are provided with the fixed part that facilitates screw fixed crystal.
Further, the described colloid upper left corner and the lower right corner are also provided with the extension that stops scolding tin.
Further, on described thin copper material substrate, be provided with ellipse hole.
Further, described thin copper material substrate is without the thin copper material substrate of splicing punch forming.
As the unseparated specific embodiment of thermoelectricity, described wafer rest area is circular, and described line mouth is the arc port that is arranged on edge, wafer rest area.
Further, the back side one side of described colloid from this line mouth to thin copper material substrate extended, and is fitted in a jiao of thin copper material substrate back.
As the specific embodiment of thermoelectricity separation, described wafer rest area is the square that process through fillet at four angles, and described line mouth is provided with two, and described line mouth is the strip mouth that is arranged on edge, relative both sides, wafer rest area.
Further, the described colloid respectively back side outer rim from line mouth to thin copper material substrate extends, and forms two colloid regions along center line symmetry.
Further, described colloid region is provided with for fixing bolt.
The beneficial effects of the utility model are: COB support of the present utility model has replaced conventional aluminium base or ceramic substrate with thin copper material substrate, simultaneously whole product use the thick end of copper material identical without splicing, thickness is thinner, in process of producing product, semi-finished product can be rolled, realize fully-automatic production processing, reduced greatly manufacturing cost, especially materials and cost of labor, effectively raise production efficiency; Adhesion between colloid and copper material is more firm, stable, reliable compared to the adhesion between conventional resin and substrate; Rational in infrastructure, the heat conductivility of COB support is improved greatly, the heat that LED can be produced is diffused rapidly in ambient air.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is the front view of embodiment 1 in the utility model;
Fig. 2 is the rearview of embodiment 1 in the utility model;
Fig. 3 is the left view of embodiment 1 in the utility model;
Fig. 4 is the front view of embodiment 2 in the utility model;
Fig. 5 is the rearview of embodiment 2 in the utility model;
Fig. 6 is the left view of embodiment 2 in the utility model.
The specific embodiment
Referring to figs. 1 through Fig. 6, a kind of COB light fixture protective stent of the present utility model, comprises thin copper material substrate 1, and is arranged on the colloid 2 on this thin copper material substrate 1.In the utility model, the direction of upper and lower, left and right be take front view as benchmark.
Described thin copper material substrate 1 is that thin copper material substrate 1 is roughly square without the thin copper material substrate of splicing punch forming, and four edge lengths are identical, carry out fillet processing, and have certain thickness.The center line both sides on upper and lower both sides are respectively arranged with for locating, the center on fixing recess 12, four limits is respectively arranged with the open slot 11 that facilitates stuck glue, conveniently toward adding on thin copper material substrate 1 in the process of colloid 2, carry out stuck glue.Thin copper material substrate 1 upper left corner and the lower right corner are respectively arranged with bonding wire region 13, and the upper left corner of described colloid 2 correspondences and the lower right corner are also provided with at the edge in bonding wire region 13 extends the extension 23 that stops scolding tin.The upper right corner of described thin copper material substrate 1 and the lower left corner are provided with the fixed part 14 that facilitates screw fixed crystal, and fixed part 14 is the region toward center position arc indent.
Embodiment 1: as the unseparated specific embodiment of thermoelectricity, the center of colloid 2 is provided with the wafer rest area 21 of a circle, a space that holds wafer concaves out in the middle of the colloid 2 of wafer rest area 21, the edge of wafer rest area 21 is provided with the line mouth 22 that penetrates colloid 2 and thin copper material substrate 1, described line mouth 22, for being arranged on the arc port at 21 edges, wafer rest area, is convenient to crystal and is connected with thin copper material substrate 1.The back side one side of colloid 2 from this line mouth 22 to thin copper material substrate 1 extended, and is fitted in a jiao of thin copper material substrate 1 back side, make colloid 2 tightr with the combination of thin copper material substrate 1, and heat conductivility is better.On described thin copper material substrate 1 back side, be provided with the ellipse hole 15 of three oblique settings.
Embodiment 2: as the specific embodiment of thermoelectricity separation, described wafer rest area 21 is the square that process through fillet at four angles, described line mouth 22 is provided with upper and lower two, and described line mouth 22 is for being arranged on the strip mouth at edge, both sides Shang Xia 21, wafer rest area.
The described colloid 2 respectively back side outer rim from line mouth 22 to thin copper material substrate 1 extends, and forms two colloid regions along center line symmetry.Described colloid region is provided with for fixing bolt 24.On described thin copper material substrate 1 back side, be symmetrically arranged with four ellipse holes 15 longitudinally.
COB support has replaced conventional aluminium base and ceramic substrate with thin copper material substrate 1, simultaneously whole product use the thick end of copper material identical without splicing, and the thickness of product is thinner, in process of producing product, semi-finished product can be rolled, realize fully-automatic production processing, reduce greatly manufacturing cost, especially saved materials and cost of labor, effectively raised production efficiency.
COB support of the present utility model, employing be injection molding type COB, mainly by copper material and colloid 2 two parts, formed, the adhesion between colloid 2 and copper material compared to the adhesion between conventional resin and substrate more firmly, reliable, stable.
Certainly, the utility model, except above-mentioned embodiment, can also have other structural distortion, and these equivalent technical solutions also should be within its protection domain.
Claims (10)
1. a COB light fixture protective stent, it is characterized in that: comprise thin copper material substrate (1), and be arranged on the colloid (2) on this thin copper material substrate (1), thin copper material substrate (1) is roughly square, the center line both sides on upper and lower both sides are respectively arranged with for location, fixing recess (12), the center on four limits is respectively arranged with the open slot (11) that facilitates stuck glue, the upper left corner and the lower right corner are respectively arranged with bonding wire region (13), the center of colloid (2) is provided with a wafer rest area (21), wafer rest area (21) is provided with the line mouth (22) that penetrates colloid (2) and thin copper material substrate (1), the back side one side of colloid (2) from this line mouth (22) to thin copper material substrate (1) extended.
2. a kind of COB light fixture protective stent according to claim 1, is characterized in that: the upper right corner of described thin copper material substrate (1) and the lower left corner are provided with the fixed part (14) that facilitates screw fixed crystal.
3. a kind of COB light fixture protective stent according to claim 1, is characterized in that: described colloid (2) upper left corner and the lower right corner are also provided with the extension (23) that stops scolding tin.
4. a kind of COB light fixture protective stent according to claim 1, is characterized in that: on described thin copper material substrate (1), be provided with ellipse hole (15).
5. a kind of COB light fixture protective stent according to claim 1, is characterized in that: described thin copper material substrate (1) is the thin copper material substrate of nothing splicing punch forming.
6. according to a kind of COB light fixture protective stent described in any one in claim 1-5, it is characterized in that: described wafer rest area (21) is for circular, and described line mouth (22) is for being arranged on the arc port at edge, wafer rest area (21).
7. a kind of COB light fixture protective stent according to claim 6, is characterized in that: the back side one side of described colloid (2) from this line mouth (22) to thin copper material substrate (1) extended, and is fitted in a jiao of thin copper material substrate (1) back side.
8. according to a kind of COB light fixture protective stent described in any one in claim 1-5, it is characterized in that: described wafer rest area (21) is the square that process through fillet at four angles, described line mouth (22) is provided with two, and described line mouth (22) is for being arranged on wafer rest area (21) the strip mouth at edge, both sides relatively.
9. a kind of COB light fixture protective stent according to claim 8, is characterized in that: described colloid (2) the respectively back side outer rim from line mouth (22) to thin copper material substrate (1) extends, and forms two colloid regions along center line symmetry.
10. a kind of COB light fixture protective stent according to claim 9, is characterized in that: described colloid region is provided with for fixing bolt (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420184861.5U CN203848223U (en) | 2014-04-16 | 2014-04-16 | COB (chip on board) lamp protecting support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420184861.5U CN203848223U (en) | 2014-04-16 | 2014-04-16 | COB (chip on board) lamp protecting support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203848223U true CN203848223U (en) | 2014-09-24 |
Family
ID=51561235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420184861.5U Withdrawn - After Issue CN203848223U (en) | 2014-04-16 | 2014-04-16 | COB (chip on board) lamp protecting support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203848223U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103925568A (en) * | 2014-04-16 | 2014-07-16 | 深圳市得润电子股份有限公司 | COB lamp protection support |
-
2014
- 2014-04-16 CN CN201420184861.5U patent/CN203848223U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103925568A (en) * | 2014-04-16 | 2014-07-16 | 深圳市得润电子股份有限公司 | COB lamp protection support |
| CN103925568B (en) * | 2014-04-16 | 2017-10-03 | 深圳市得润电子股份有限公司 | A kind of COB light fixtures protective stent |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140924 Effective date of abandoning: 20171003 |