CN103426998B - Light emitting diode (LED) support - Google Patents
Light emitting diode (LED) support Download PDFInfo
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- CN103426998B CN103426998B CN201310312364.9A CN201310312364A CN103426998B CN 103426998 B CN103426998 B CN 103426998B CN 201310312364 A CN201310312364 A CN 201310312364A CN 103426998 B CN103426998 B CN 103426998B
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Abstract
The invention discloses a light emitting diode (LED) support. The LED support comprises a heat dissipation base plate, the center of the heat dissipation base plate is provided with a chip placing area, and opposite angle ends of the heat dissipation base plate are respectively concavely provided with open grooves for fixing screws. The LED support further comprises a main body plastic, an anode pin and a cathode pin, wherein the anode pin and the cathode pin are located on two sides of the heat dissipation base plate respectively. The heat dissipation base plate, the anode pin, the cathode pin and the main body plastic are in integral embedding forming connection. The main body plastic is provided with a reflection cup, the heat dissipation base plate is exposed out of the reflection cup to form the chip placing area, the anode pin and the cathode pin are exposed out of the reflection cup to form chip welding areas, and the free end of the anode pin and the free end of the cathode pin are further exposed out of the main body plastic for core wire connector butt joint so as to finish connection of electrical elements. Accordingly, a traditional COB (chip on board)-LED light source is modified into a PBA-LED support structure; on the premise that product heat dissipation is optimum, the LED support is simple to produce and process, and processing cost and raw material cost can be effectively reduced.
Description
Technical field
The present invention relates to LED field technology, a kind of LED support is referred in particular to.
Background technology
Because LED has the advantages that light efficiency high, radiationless, long lifespan, low-power consumption and environmental protection, present high-power down lamp, wall
Lamp etc. is used mostly LED as light source, and a kind of most common of which COB-LED light sources are widely used in illuminating industry.
China Patent No. is that 201220472094.1 utility model patent discloses a kind of COB-LED light sources, described
COB-LED light sources are by heat-radiating substrate（Aluminium base）Constituted with the LED wafer on aluminium base.The one pair of which angle end of aluminium base
Recessed open slot, fixes for confession screw respectively inwards.Set on the aluminium base edge of the aluminium base open slot side
Constituted with completing the socket of electrical equipment connection by for the docking of heart yearn interface.When using, it passes through electric interfaces support and screw
In lamp socket.
In addition, Fig. 1 discloses other several COB-LED（Model 1313）Light source, each COB-LED 1313 includes radiating base
Plate（Aluminium base）1, on the surface of heat-radiating substrate 1, chip rest area 3 and conductive welding region 4 are set.Fig. 1 a show a kind of profile
The COB-LED 1313 being square, its heat-radiating substrate 1 is provided with a pair of conductive weld zone 4 and is used to for a pair supply opening for screw locking
Mouth groove 2.Fig. 1 b show a kind of rounded COB-LED 1313 of profile, and its heat-radiating substrate 1 is provided with two pairs of conductive welding regions 4
With two pairs of open slots 2 being used for for screw locking.Fig. 1 c show a kind of polygonal COB-LED 1313 of profile, its radiating base
Plate 1 is provided with three pairs of conductive welding regions 4 and three pairs of open slots 2 being used for for screw locking.Fig. 2 d, Fig. 2 e, Fig. 2 f show respectively
Fig. 1 a, Fig. 1 b, the bottom diagram of the COB-LED 1313 of Fig. 1 c three types, its back side are directly exposed aluminium bases.
It is to cover dielectric isolation layer in the periphery of chip rest area 3 when current industry produces above-mentioned COB-LED, then at
The covering conductive layer of conductive welding region 4 specified, so that conductive welding region 4 is electrically isolated with heat-radiating substrate 1, during encapsulation, first in crystalline substance
Piece rest area 3 sets LED wafer, draws the positive and negative electrode of LED wafer with gold thread and is bonded to conductive welding region 4, then uses dispensing
Technology mode, fluorescent colloid is clicked and entered in this chip rest area 3 around LED wafer, to ensure reliability.
There are multiple deficiencies in above-mentioned COB-LED, be mainly reflected in production cost too high due to the limitation of structure：With aluminium base
Plate as light source main body, and for radiating, aluminium base is thick and heavy, and cost of material is high；Needed in aluminium base plate surface when producing in addition
The sandwich constructions such as circuit layer, separation layer, protective layer are set, and processed complex increases artificial cost, material cost and processing cost.
Another shortcoming of above-mentioned COB-LED is exactly to be easily damaged, due to conductive welding region be it is exposed outside, bonding wire causes hidden to LED
Shape is injured so that product fraction defective increases.Further, this COB-LED light sources itself can undoubtedly be deposited without any protection fixed structure
Easily scratching, structure is not firm, the shortcomings of being easily damaged in moving collision process, service life be short.
The content of the invention
In view of this, in view of the existing deficiencies of the prior art, its main purpose is to provide a kind of LED support to the present invention, will
Traditional COB-LED light sources are fabricated to PBA-LED supporting structures, on the premise of ensureing that product radiating is optimal, make production simple, plus
Work easily, can effectively reduce processing cost and cost of material, it is ensured that the reliability of finished product structure connection, protection finished product is difficult to scratch
Damage.
To achieve the above object, the present invention is using following technical scheme：
A kind of LED support, including heat-radiating substrate, the center of the heat-radiating substrate are provided with a chip rest area, heat-radiating substrate
One pair of which angle end respectively inwards it is recessed for for screw fix open slot, further include a main body plastic cement and be located at respectively
The positive pole pin and negative pin of heat-radiating substrate both sides, the heat-radiating substrate, positive pole pin, negative pin and main body plastic cement one are inlayed
Embedding shaping connection；
The main body plastic cement is provided with reflector, and the medial surface of the reflector has upper strata to incline reflective surface and lower floor's inclination instead
Smooth surface, horizontal reflective surface is equipped between upper strata inclines reflective surface and lower floor inclines reflective surface；
The heat-radiating substrate includes die bond portion, holding parts and the fixed part of one, and the holding parts are fixed on main body plastic cement, should
Fixed part extends outside insulating body；Placed with forming the chip at the cup bottom that the surface in the die bond portion covers reflector completely
Area, the back side of the die bond portion, holding parts and fixed part is exposed independent from the bottom surface formation radiating area of main body plastic cement；
The positive pole pin and negative pin the chip connecting portion including one, extension and weld part, the extension
Main body plastic cement is fixed on, the weld part exposes outside main body plastic cement for the docking of heart yearn interface to complete electrical equipment connection；The chip
The horizontal reflective surface that reflector is exposed on the surface of connecting portion forms chip weld zone, and there is height the chip weld zone with chip rest area
Low difference.
Preferably, plane where the positive and negative electrode pin is higher than plane where heat-radiating substrate, the table of the positive and negative electrode pin
Face flushes with horizontal reflective surface, and the surface of the heat-radiating substrate flushes with reflector bottom, the back side and the main body plastic cement of the heat-radiating substrate
Flush.
Preferably, the heat-radiating substrate holding parts include being connected to that the first holding parts of die bond portion both sides and second are consolidated
Portion is held, first holding parts and the second holding parts are provided with blanking circular hole, the outer in the blanking circular hole and die bond portion is provided with
The break difference structure of tight main body plastic cement can be stung.
Preferably, the fixed part of the heat-radiating substrate include the first fixed part and the second fixed part, first fixed part by
First holding parts extend to be formed, and the first fixed part stretches out the left front of main body plastic cement；Second fixed part is prolonged by the second holding parts
Stretch to be formed, the second fixed part stretches out the right back of main body plastic cement；First fixed part and the second fixed part are provided with for supplying spiral shell
Fixed open slot is followed closely, the main body plastic cement of correspondence is provided with the avoidance breach for avoiding screw, the avoidance breach is located in open slot
Side simultaneously maintains distance between open slot.
Preferably, the junction in first holding parts, the second holding parts and die bond portion is recessed narrow portion, described first
The junction evagination of holding parts and the first fixed part, the second holding parts and the second fixed part forms portion wide.
Preferably, the positive pole pin is installed on the left back of main body plastic cement, and negative pin is installed on the right side of main body plastic cement
Arc blanking hole is offered on the extension of front, the positive pole pin and negative pin, there is card the both sides of extension along indent
Recess is closed, the engaging recess and arc blanking hole bite main body plastic cement.
Preferably, the main body plastic cement left rear side and forward right side are provided with breach, the welding of positive pole pin and negative pin
The surface in portion forms pin weld zone in exposing breach.
Preferably, the top bump of the rim of a cup of the reflector have annular increase portion.
Preferably, the reflector is circular cup, and the horizontal reflective surface of correspondence is annular, is directed to this, the die bond
Portion is set to thin rounded flakes, and the size in die bond portion matches with the cup bottom of reflector, and the chip connecting portion is set to arc.
A kind of copper coin support, is spaced punching into multiple chip installation positions, often on a sheet copper sheet material in the way of array
The structure of individual installation position is identical, and the center of installation position is provided with a heat-radiating substrate, and there are positive pole pin and negative pole in the both sides of heat-radiating substrate
Pin；
The heat-radiating substrate includes the die bond portion of a circle, is connected to the first holding parts of die bond portion side, is connected to die bond
Second holding parts of portion's opposite side, the first fixed part for being connected to the first holding parts, the second fixation for being connected to the second holding parts
Portion, the junction in first holding parts, the second holding parts and die bond portion is recessed narrow portion, first holding parts and first
The junction evagination of fixed part, the second holding parts and the second fixed part forms portion wide, on the first holding parts and the second holding parts
Blanking circular hole is provided with, the open slot fixed for screw is provided with the free terminal of the first fixed part and the second fixed part；
The positive pole pin and negative pin include the chip connecting portion of arc, are integrally connected to the extension of chip connecting portion
Arc blanking hole is offered on the holding parts of portion and weld part, the positive pole pin and negative pin, the both sides of holding parts are along interior
It is recessed to have the engaging recess that sting tight plastic cement；
The die bond portion of the heat-radiating substrate, the first holding parts and the second holding parts are located at same level, and the positive pole draws
The chip connecting portion of pin and negative pin, extension and welding position in another horizontal plane, the positive pole pin and negative pin institute
It is higher than horizontal plane where plane heat-radiating substrate in horizontal plane.
The present invention has clear advantage and beneficial effect compared with prior art, specifically, by above-mentioned technical proposal
Understand, it is mainly and for traditional COB-LED light sources to be fabricated to PBA-LED supporting structures, and PBA-LED support production stages are few,
It is easy to make the copper coin support for having heat-radiating substrate, positive pole pin and negative pin and main body plastic cement one produced by insert molding, shaping is easy,
Make production simple, remove traditional COB-LED from needs to cross answering for the sandwich constructions such as circuit layer, separation layer, protective layer on aluminium base
General labourer's skill, simplifies production technology, reduces production cost；And it is of the invention directly to stamp out heat-radiating substrate, just from copper coin support
Pole pin and negative pin, substitute the thick and heavy and expensive aluminium base of tradition, to reduce cost of material；
In addition, the reflector of main body plastic cement is made two horizontal planes by the present invention, one be reflector bottom surface, separately
One horizontal reflective surface for being above reflector bottom surface, the bottom surface of the reflector is covered to form chip placement completely by heat-radiating substrate
Area, and the whole back side of heat-radiating substrate is exposed independent from the bottom surface of main body plastic cement, so that either in the front of heat-radiating substrate still
The back side has reached the maximization of area of dissipation, effectively lifting product heat dispersion；Be directed to this, the present invention by positive pole pin and
The chip connecting portion of negative pin expose on horizontal reflective surface formed chip weld zone, due to horizontal reflective surface not with instead
Tabula rasa cup bottom can't take the area of dissipation of reflector bottom with high, be more beneficial for chip radiating；It is relatively conventional to put chip
Area and chip weld zone are put for the structure at reflector cup bottom, the present invention can greatly promote the heat dispersion of product；
In a word, traditional COB-LED light sources are fabricated to PBA-LED supporting structures by the present invention, are ensureing that product radiating is optimal
On the premise of, make production simple, handling ease can effectively reduce processing cost and cost of material, it is ensured that finished product structure connection
Reliability, protection finished product is difficult to scratch damage.
Further, the present invention has a design structure of narrow portion and width portion on heat-radiating substrate, narrow portion can avoid positive pole pin with
The chip connecting portion of negative pin, enables chip connecting portion to be designed to sufficiently large to there is sufficiently large space as solder side, when
Carry out widening to form portion wide again after avoiding chip connecting portion, can further increase area of dissipation, improve heat dispersion.
Furthermore, main body plastic cement is bitten beneficial to copper coin in the arc blanking hole of heat-radiating substrate and being designed with for recess of engaging, prevent
Only product is influenceed and is loosened by the external force such as cutting off, and causes properties of product bad, and the design of arc blanking hole in addition also helps increasing
The circulation of glue is filled, makes product be easier to play full shaping.
Additionally, in the rim of a cup of reflector top bump have annular increase portion, thereby, main body plastic cement is made in entirety
When very thin, the portion of increasing can increase the depth of reflector, strengthen reflecting effect.
More clearly to illustrate architectural feature of the invention and effect, come to this hair with specific embodiment below in conjunction with the accompanying drawings
It is bright to be described in detail.
Brief description of the drawings
Fig. 1 a, Fig. 1 b, Fig. 1 c are respectively three kinds of top views of COB-LED light sources of prior art；
Fig. 2 d, Fig. 2 e, Fig. 2 f are respectively three kinds of upward views of COB-LED light sources of prior art；
Fig. 3 is the LED support finished product schematic perspective view of embodiments of the present invention, and LED support finished product is being shown in figure just
Face；
Fig. 4 is the rear view of Fig. 3；
Fig. 5 is the top view of the LED support finished product of embodiments of the present invention；
Fig. 6 is the sectional view at A-A in Fig. 5；
Fig. 7 is the exploded view of the LED support finished product of embodiments of the present invention；
Fig. 8 is the top view of the heat-radiating substrate of embodiments of the present invention, positive pole pin and negative pin；
Fig. 9 is the sectional view at B-B in Fig. 8；
Figure 10 is the sectional view at C-C in Fig. 8；
Figure 11 be embodiments of the present invention heat-radiating substrate in sectional view after blanking circular hole injecting glue；
Figure 12 is the schematic diagram when LED support finished product of the present invention is integrally connected to material strip；
Figure 13 be the present invention LED support injecting glue before copper coin support schematic diagram；
Figure 14 is the partial enlarged drawing of Figure 13.
Accompanying drawing identifier declaration.
1st, aluminium base 2, open slot
3rd, chip rest area 4, conductive welding region
10th, main body plastic cement 11, reflector
111st, upper strata inclines reflective surface 112, lower floor and inclines reflective surface
113rd, horizontal reflective surface 12, increase portion
13rd, 14, centre hole at copper coin stuck glue
15th, breach 16, breach is avoided
20th, heat-radiating substrate 21, die bond portion
22nd, the first holding parts 23, the second holding parts
24th, the first fixed part 25, the second fixed part
26th, blanking circular hole 27, break difference structure
28th, open slot 291, narrow portion
292nd, portion wide 30, positive pole pin
31st, chip connecting portion 32, extension
33rd, weld part 34, arc blanking hole
35th, recess 40, negative pin is engaged
41st, chip connecting portion 42, extension
43rd, weld part 44, arc blanking hole
45th, recess is engaged.
Specific embodiment
First, the front, rear, left and right direction mentioned by the present embodiment is defined by the arrow direction of Fig. 3, and upper and lower
It is defined to the arrow direction by 6.
Refer to shown in Fig. 3 to Figure 11, that show the concrete structure of the preferred embodiments of the invention, the present invention will be passed
System COB-LED light sources are fabricated to PBA-LED supporting structures, on the premise of ensureing that product radiating is optimal, make production simple, processing
Easily, processing cost and cost of material can effectively be reduced, it is ensured that the reliability of finished product structure connection, protection finished product is difficult to scratch damage
It is bad.
Specifically, the PBA-LED supports include main body plastic cement 10, heat-radiating substrate 20, positive pole pin 30 and negative pole and draw
Pin 40, the positive pole pin 30 is identical with the structure of negative pin 40, and positive and negative electrode pin 30,40 is respectively positioned at heat-radiating substrate 20
Both sides, the heat-radiating substrate 20, positive pole pin 30 and negative pin 40 are one time punching molded by a copper coin sheet material, the heat-radiating substrate
20th, after positive pole pin 30 and negative pin 40 are molded on copper coin directly with the one produced by insert molding of main body plastic cement 10, it is described positive and negative
Plane where pole pin 30,40 is higher than the place plane of heat-radiating substrate 20, this by positive and negative electrode pin 30,40 and radiating base
Plate 20 is designed with the structure of difference of height, makes the two each different height space for taking main body plastic cement 10, does not result in radiating
The limitation of face size.
Specifically, as shown in Fig. 1,3,4, the main body plastic cement 10 is provided with reflector 11, the medial surface of the reflector 11
There is upper strata to incline reflective surface 111 and lower floor's inclination reflective surface 112, incline reflective surface 111 in upper strata and lower floor inclines reflective surface 112
Between be equipped with horizontal reflective surface 113, the horizontal reflective surface 113 is parallel with the cup bottom of reflector 11, and horizontal reflective surface 113
Higher than the plane where cup bottom.In the present embodiment, substantially in the shape of square-outside and round-inside, reflector 11 is circle to the main body plastic cement 10
Shape cup, the horizontal reflective surface 113 of correspondence is annular, in the top bump of the rim of a cup of reflector 11 have it is annular increase portion 12,
Thereby, when main body plastic cement 10 is made very thin by entirety, this is increased portion 12 and can increase the depth of reflector 11, strengthens reflective effect
Really.
From the point of view of the bottom surface of main body plastic cement 10, as indicated with 2, have at the edge of the side of left, right, front and rear four of main body plastic cement 10
13 at 4 copper coin stuck glues, 13 increase gradients at the copper coin stuck glue, this is designed with during beneficial to product material stripping, benefit grain, because of copper coin branch
Frame stuck glue is too many or causes scratch plastic body or product easily to drop off the improvement of problem very little.
Additionally, increasing centre hole 14 on the back side of main body plastic cement 10, this is designed with beneficial to thimble when being molded to heat-radiating substrate
20 and 30,40 two controls of bottom surface size high of positive and negative electrode pin, after making product one produced by insert molding, finished product is difficult to be weighed wounded,
Will not flash long.
As shown in fig. 3 to 7, the heat-radiating substrate 20 is sheet metal, without concavo-convex bending structure.The heat-radiating substrate 20 is wrapped
Die bond portion 21, holding parts 22,23 and the fixed part 24,25 of one are included, during punch forming, the material strip of the heat-radiating substrate 20 and copper coin
With respect to the certain distance that sinks, the horizontal plane where making the entirety of heat-radiating substrate 20 is relatively lower than positive pole pin 30 and negative pole draws for junction
The place horizontal plane of pin 40.
The die bond portion 21 is set to thin rounded flakes, and the size in die bond portion 21 matches with the cup bottom of reflector 11, the die bond
The surface in portion 21 covers the cup bottom of reflector 11 to form chip rest area completely, so that the equal conduct in bottom surface of whole reflector 11
Chip rest area, on the one hand the area of increase chip rest area, on the other hand increases the radiating surface at the bottom of reflector 11, relative to biography
Unite for the multizone division that the bottom of reflector 11 had not only been done chip rest area but also done chip weld zone, the design is more simple, energy
The heat dispersion of product is effectively improved, area of dissipation maximization is reached.
The holding parts 22,23 are fixed on main body plastic cement 10, and holding parts 22,23 include being connected to the both sides of die bond portion 21
The first holding parts 22 and the second holding parts 23, the holding parts 23 of the first holding parts 22 and second are provided with blanking circular hole 26, should
The injection main body of blanking circular hole 26 plastic cement 10, in order to further make heat-radiating substrate 20 be connected to main body plastic cement 10, as illustrated in figs. 8-11,
In break difference structure 27 is equipped with the outer bottom side in die bond portion 21 and blanking circular hole 26, this is designed with solid beneficial to first, second
Hold portion 22,23 and bite main body plastic cement 10, prevent product from being influenceed and loosened by the external force such as cutting off, cause properties of product bad, and
The circulation of injecting glue can be increased, make product be easier to play full shaping, while increasing plastic cement and first, second holding parts 22,23
Conjugation, lifted product sealing.
As shown in Figure 1,5, the fixed part 24,25 extends outside insulating body, for fixing screws, by fixed part
Lock screw, so that whole finished product is fixed.The fixed part 24,25 includes the first fixed part 24 and the second fixed part 25, should
First fixed part 24 is extended by the first holding parts 22 and is formed, and the first fixed part 24 stretches out the left front of main body plastic cement 10；This second
Fixed part 25 is extended by the second holding parts 23 and is formed, and the second fixed part 25 stretches out the right back of main body plastic cement 10.By by first
The fixed part 25 of fixed part 24 and second is located at the diagonal position of main body plastic cement 10, relative to traditional directly from left and right sides or front and rear side
Stretch out for the design structure of first, second fixed part 24,25, energy increasing heat radiation area is designed during this hair, be truly realized radiating
Area is maximized.
As shown in Figure 1,5, the one pair of which angle end of heat-radiating substrate 20 respectively inwards it is recessed for for screw fix open slot
28, in the present embodiment, the open slot 28, the main body plastic cement 10 of correspondence are set on the fixed part 25 of the first fixed part 24 and second
Avoidance breach 15 is provided with, the avoidance breach 15 is located at the inner side of open slot 28 and maintains distance between open slot 28.Thereby,
When screw fixes the first fixed part 24 and the second fixed part 25, screw can be fixed copper coin through open slot 28, pass through
Copper coin is fixed to fix whole PBA-LED supports, it is often more important that, avoidance breach 15 is set in main body plastic cement 10, so that screw is not
Main body plastic cement 10 can be extruded, plastic cement ftractures when preventing screw-driving.
In the present invention, as shown in figure 4, by the die bond portion 21 of heat-radiating substrate 20, holding parts 22,23 and fixed part 24,25
The bottom surface that the back side is exposed independent from main body plastic cement 10 forms radiating area, this to stretch the full wafer of heat-radiating substrate 20, with main body plastic cement 10
The whole bottom surface of hot heat exchange sheet can be made to expose the bottom surface of main body plastic cement 10 after produced by insert molding, this is designed with beneficial to product radiating
Area is maximized, and the heat dispersion of product is improved, so as to lift the performance of product.
As shown in fig. 7, first holding parts 22, the second holding parts 23 are recessed narrow portion with the junction in die bond portion 21
291, the junction evagination of the fixed part 24 of first holding parts 22 and first, the second holding parts 23 and the second fixed part 25 is formed
Portion wide 292.The design of narrow portion 291 is to avoid the chip connecting portion 31,41 of positive pole pin 30 and negative pin 40, making chip
Connecting portion 31,41 can be designed to it is sufficiently large to there is sufficiently large space as solder side, after chip connecting portion 31,41 are avoided again
Carry out widening to form portion wide 292, area of dissipation can be increased, improve heat dispersion.
The positive pole pin 30 and negative pin 40 are made of metal material, respectively positioned at the both sides of heat-radiating substrate 20, should
Positive pole pin 30 is located at the forward right side of the left rear side of main body plastic cement 10, negative pin 40 located at main body plastic cement 10.
The positive pole pin 30 and negative pin 40 the chip connecting portion 31 including one, 41, extension 32,42 and welding
Portion 33,43.
There is difference of height the chip weld zone with chip rest area, and the chip connecting portion 31,41 is set to arc, and the chip connects
The horizontal reflective surface 113 that reflector 11 is exposed on the surface of socket part 31,41 forms chip weld zone, so that the chip connecting portion of arc
31st, 41 can be corresponding with the annular of horizontal reflective surface 113, it is made chip weld zone very wide, meet welding demand.Make
Used time, LED wafer is welded in chip weld zone by gold thread, is turned on positive and negative electrode pin.
The extension 32,42 is fixed on main body plastic cement 10, and arc blanking hole 34,44 is offered on extension 32,42, extends
There is engaging recess 35,45 both sides in portion 32,42 along indent, arc blanking hole 34,44 and engaging recess on this extension 32,42
35th, 45 it is designed with and bites main body plastic cement 10 beneficial to copper coin, prevent product from being influenceed and loosened by the external force such as cutting off, causes product
Can be bad, the design of arc blanking hole 34,44 in addition also helps the circulation for increasing injecting glue, makes product be easier dozen to satisfy into
Type.
The weld part 33,43 is extended outward outside main body plastic cement 10, and the left rear side of main body plastic cement 10 and forward right side set
Jagged 16, the surface of the weld part 33,43 of positive pole pin 30 and negative pin 40 forms pin weld zone in exposing breach 16.
Hold, as shown in figure 13, during production, punching into multiple chips is spaced in the way of array on a sheet copper sheet material
Installation position, the structure of each installation position is identical, and the center of installation position is provided with a heat-radiating substrate 20 by behind the right side to left front direction inclined,
The both sides of heat-radiating substrate 20（Right lateral side and forward right side）There are positive pole pin 30 and negative pin 40.
As shown in figure 14, the heat-radiating substrate 20 includes the die bond portion 21 of a circle, is connected to the first of the side of die bond portion 21
Holding parts 22, the second holding parts 23 for being connected to the opposite side of die bond portion 21, the first fixed part 24 for being connected to the first holding parts 22,
It is connected to the second fixed part 25 of the second holding parts 23.The company of first holding parts 22, the second holding parts 23 and die bond portion 21
The place of connecing is recessed narrow portion 291, the fixed part 24 of first holding parts 22 and first, the second holding parts 23 and the second fixed part 25
Junction evagination form portion wide 292, be provided with blanking circular hole 26 in the first holding parts 22 and the second holding parts 23, it is solid in first
The free terminal for determining the fixed part 25 of portion 24 and second is provided with the open slot 28 fixed for screw.
The positive pole pin 30 and negative pin including arc chip connecting portion 31,41, be integrally connected to chip connection
Opened on the extension 32,42 of the extension 32,42 and weld part 33,43 in portion 31,41, the positive pole pin 30 and negative pin 40
Arc blanking hole 34,44 is provided with, the both sides of extension 32,42 have along indent can sting the engaging recess 35,45 of tight plastic cement.
The die bond portion 21 of the heat-radiating substrate 20, the first holding parts 22 and the second holding parts 23 are located at same level, institute
State positive pole pin 30 and negative pin 40 chip connecting portion 31,41, extension 32,42 and weld part 33,43 be located at another water
Plane, the positive pole pin 30 and the place horizontal plane of negative pin 40 are higher than the place horizontal plane of plane heat-radiating substrate 20.Its realization side
Formula is as follows：During punch forming, the heat-radiating substrate 20 it is relative with the material strip junction of copper coin sink certain distance, make heat-radiating substrate 20
It is overall to form difference of height with positive and negative electrode pin 30,40.
During one produced by insert molding, full wafer copper coin support is placed in mould, one produced by insert molding goes out finished product（See Figure 12）,
After shaping, the surface of the positive and negative electrode pin 30,40 flushes with horizontal reflective surface 113, the surface of the heat-radiating substrate 20 and reflector
11 bottoms flush, and the back side of the heat-radiating substrate 20 flushes with main body plastic cement 10, obtains finished product.
In sum, design focal point of the invention is, it is mainly and for traditional COB-LED light sources to be fabricated to PBA-
LED support structure, PBA-LED support production stages are few, it is easy to make the copper coin branch for having heat-radiating substrate, positive pole pin and negative pin
Frame and main body plastic cement one produced by insert molding, shaping are easy, make production simple, and remove traditional COB-LED from needs to cross on aluminium base
The complicated technology of the sandwich constructions such as circuit layer, separation layer, protective layer, simplifies production technology, reduces production cost；And the present invention
Directly stamp out heat-radiating substrate, positive pole pin and negative pin from copper coin support, substitute the thick and heavy and expensive aluminium base of tradition,
To reduce cost of material；
In addition, the reflector 11 of main body plastic cement 10 is made two horizontal planes by the present invention, and one is reflector 11
Bottom surface, another is above the horizontal reflective surface 113 of the bottom surface of reflector 11, and the bottom surface of the reflector 11 is completely by heat-radiating substrate 20
Covering forms chip rest area, and the whole back side of heat-radiating substrate 20 is exposed independent from the bottom surface of main body plastic cement 10, so that either
The maximization of area of dissipation is reached in the front or the back side of heat-radiating substrate 20, effectively lifting product heat dispersion；For
In this, the chip connecting portion 31,41 of positive pole pin 30 and negative pin 40 is exposed the formation on horizontal reflective surface 113 by the present invention
Chip weld zone, because horizontal reflective surface 113 is not that, with high, can't take the bottom of reflector 11 with reflector cup bottom
Area of dissipation, is more beneficial for chip radiating；The present invention is relatively conventional to be located at reflector by chip rest area and chip weld zone
For 11 glasss of structures at bottom, the present invention can greatly promote the heat dispersion of product；
In a word, traditional COB-LED light sources are fabricated to PBA-LED supporting structures by the present invention, are ensureing that product radiating is optimal
On the premise of, make production simple, handling ease can effectively reduce processing cost and cost of material, it is ensured that finished product structure connection
Reliability, protection finished product is difficult to scratch damage.
The above, is only presently preferred embodiments of the present invention, and not technical scope of the invention is imposed any restrictions,
Therefore every any trickle amendment, equivalent variations and modification made to above example according to technical spirit of the invention, still
Belong in the range of technical solution of the present invention.
Claims (3)
1. a kind of LED support, including heat-radiating substrate, the center of the heat-radiating substrate is provided with a chip rest area, heat-radiating substrate its
Middle pair of horns end respectively inwards it is recessed for for screw fix open slot, it is characterised in that：Further include a main body plastic cement
Respectively positioned at the positive pole pin and negative pin of heat-radiating substrate both sides, the heat-radiating substrate, positive pole pin, negative pin and main body
Plastic cement one produced by insert molding is connected；
The main body plastic cement is provided with reflector, and the medial surface of the reflector has upper strata inclination reflective surface and lower floor's inclination reflective
Face, horizontal reflective surface is equipped between upper strata inclines reflective surface and lower floor inclines reflective surface；
The heat-radiating substrate includes die bond portion, holding parts and the fixed part of one, and the holding parts are fixed on main body plastic cement, and this is fixed
Extend outside insulating body in portion；The surface in the die bond portion covers the cup bottom of reflector to form the chip rest area, institute completely
The back side for stating die bond portion, holding parts and fixed part is exposed independent from the bottom surface formation radiating area of main body plastic cement；
The positive pole pin and negative pin the chip connecting portion including one, extension and weld part, the extension are fixed
In main body plastic cement, the weld part exposes outside main body plastic cement for the docking of heart yearn interface to complete electrical equipment connection；The chip is connected
The horizontal reflective surface that reflector is exposed on the surface in portion forms chip weld zone, and there is height the chip weld zone with chip rest area
Difference；
Plane where the positive and negative electrode pin is higher than plane where heat-radiating substrate, and the surface of the positive and negative electrode pin is reflective with level
Face flushes, and the surface of the heat-radiating substrate flushes with reflector bottom, and the back side of the heat-radiating substrate flushes with main body plastic cement；
The top bump of the rim of a cup of the reflector have annular increase portion；
The heat-radiating substrate holding parts include being connected to first holding parts and the second holding parts of die bond portion both sides, and this first
Holding parts and the second holding parts are provided with blanking circular hole, and the outer in the blanking circular hole and die bond portion is provided with can sting tight main body modeling
The break difference structure of glue；
The fixed part of the heat-radiating substrate includes the first fixed part and the second fixed part, and first fixed part is prolonged by the first holding parts
Stretch to be formed, the first fixed part stretches out the left front of main body plastic cement；Second fixed part is extended by the second holding parts and is formed, and second consolidates
Determine the right back that main body plastic cement is stretched out in portion；First fixed part and the second fixed part are provided with the opening for being fixed for screw
Groove, the main body plastic cement of correspondence is provided with the avoidance breach for avoiding screw, and the avoidance breach is located at open slot inner side and and open slot
Between maintain distance；
The junction in first holding parts, the second holding parts and die bond portion is recessed narrow portion, first holding parts and
The junction evagination of one fixed part, the second holding parts and the second fixed part forms portion wide；
The positive pole pin is installed on the left back of main body plastic cement, and negative pin is installed on the right front of main body plastic cement, the positive pole
Arc blanking hole is offered on the extension of pin and negative pin, there is engaging recess the both sides of extension along indent, the card
Close recess and arc blanking hole bites main body plastic cement.
2. LED support according to claim 1, it is characterised in that：The main body plastic cement left rear side and forward right side are provided with
The surface of the weld part of breach, positive pole pin and negative pin forms pin weld zone in exposing breach.
3. LED support according to claim 1, it is characterised in that：The reflector is circular cup, and the level of correspondence is reflective
Face is annular, is directed to this, and the die bond portion is set to thin rounded flakes, and the size in die bond portion matches with the cup bottom of reflector,
The chip connecting portion is set to arc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310312364.9A CN103426998B (en) | 2013-07-24 | 2013-07-24 | Light emitting diode (LED) support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310312364.9A CN103426998B (en) | 2013-07-24 | 2013-07-24 | Light emitting diode (LED) support |
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| CN103426998A CN103426998A (en) | 2013-12-04 |
| CN103426998B true CN103426998B (en) | 2017-05-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310312364.9A Active CN103426998B (en) | 2013-07-24 | 2013-07-24 | Light emitting diode (LED) support |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103672527B (en) * | 2013-12-30 | 2017-01-18 | 鸿利智汇集团股份有限公司 | COB integrated optical source lamp and clamping buckles |
| CN103855286B (en) * | 2014-02-20 | 2016-09-21 | 博罗承创精密工业有限公司 | LED support and preparation method thereof and double material strips LED support module |
| CN103883995B (en) * | 2014-03-28 | 2017-07-18 | 木林森股份有限公司 | The COB lamp beads, lamp bead support and the lamp bead preparation method that are easily assembled, assemble simple LED modules |
| CN103925568B (en) * | 2014-04-16 | 2017-10-03 | 深圳市得润电子股份有限公司 | A kind of COB light fixtures protective stent |
| CN109904297A (en) * | 2017-12-11 | 2019-06-18 | 深圳市科纳实业有限公司 | Adopting surface mounted LED and products thereof and preparation method thereof |
| CN109728140A (en) * | 2018-12-28 | 2019-05-07 | 映瑞光电科技(上海)有限公司 | A kind of high pressure flip LED chips and forming method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM337847U (en) * | 2008-02-01 | 2008-08-01 | Tato Prec Ind Co Ltd | LED lead base |
| CN202772180U (en) * | 2012-07-28 | 2013-03-06 | 东莞市鑫亮光电科技有限公司 | Novel LED support |
| CN203434194U (en) * | 2013-07-24 | 2014-02-12 | 博罗承创精密工业有限公司 | LED stent and copper plate stent |
-
2013
- 2013-07-24 CN CN201310312364.9A patent/CN103426998B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM337847U (en) * | 2008-02-01 | 2008-08-01 | Tato Prec Ind Co Ltd | LED lead base |
| CN202772180U (en) * | 2012-07-28 | 2013-03-06 | 东莞市鑫亮光电科技有限公司 | Novel LED support |
| CN203434194U (en) * | 2013-07-24 | 2014-02-12 | 博罗承创精密工业有限公司 | LED stent and copper plate stent |
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| CN103426998A (en) | 2013-12-04 |
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