CN205845950U

CN205845950U - A kind of COB light source modular structure substrate of flip LED chips

Info

Publication number: CN205845950U
Application number: CN201620208244.3U
Authority: CN
Inventors: 冯挺; 王忆; 杨华; 王振兴; 杨涛
Original assignee: GUANGDONG HUAHUIHUANG PHOTOELECTRIC TECHNOLOGY Co Ltd
Current assignee: GUANGDONG HUAHUIHUANG PHOTOELECTRIC TECHNOLOGY Co Ltd
Priority date: 2016-03-16
Filing date: 2016-03-16
Publication date: 2016-12-28
Anticipated expiration: 2026-03-16

Abstract

The utility model discloses the COB light source modular structure substrate of a kind of flip LED chips, several COB light source modules it are provided with on described substrate, being packaged with many flip LED chips on described COB light source module, the spacing between adjacent LED chip is more than the thickness of LED chip.This utility model is owing to the spacing between adjacent LED chip is more than the thickness of LED chip, thus avoid COB light source and excessively concentrate the defect of arrangement, be conducive to dissipating of heat, optimize LED chip collaborative work effect each other the most to a certain extent simultaneously, make each LED chip side send whole light as far as possible, and then improve the efficiency of COB light source.

Description

A kind of COB light source modular structure substrate of flip LED chips

Technical field

This utility model relates to a kind of COB light source structure, is specifically related to the COB light source module knot of a kind of flip LED chips Structure substrate.

Background technology

COB light source can simply be interpreted as the integrated area source of high power, it is simply that LED chip is placed directly against the mirror of high reflecting rate Specular removal integrated area source technology on the metal basal board of face, the products characteristics of COB light source is: electrically stable, circuit design, optics Design, heat dissipation design scientific and reasonable；Use heat sink Technology, it is ensured that LED has leading hot lumen depreciation (95% Above)；The secondary optics being easy to product is supporting, improves lighting quality；Height develops the color, luminescence is uniform, without hot spot, health environment-friendly；Peace Dress is simple, easy to use, reduces Design of Luminaires difficulty, saves light fixture processing and follow-up maintenance cost.

First COB chip on board (Chip On Board, COB) technical process is at substrate surface heat-conduction epoxy resin (general with the epoxy resin mixing Argent grain) covers silicon chip nest point, and then silicon chip is rest directly upon substrate surface, heat treatment Being securely fixed in substrate to silicon chip, the method direct foundation between silicon chip and substrate followed in turn by wire bond electrically connects Connect.Bare chip technology mainly has two kinds of forms: a kind of cob technology, another kind is flip chip technology (Flip Chip).Core on plate Sheet encapsulation (COB), semiconductor chip handing-over mounts on a printed-wiring board, the electrical connection of chip and substrate lead-in wire stitching side Method realizes, and chip realizes with lead-in wire sewing method with the electrical connection of substrate, and covers with resin to guarantee reliability.

The universal high power light source between 50W～250W for power, such as high-power LED street lamp, LED tunnel lamp, Multiple small-power COB light source are often combined thus are reached to specify by LED projector lamp, LED anti-explosion lamp, LED bay light etc. The requirement of power, but the COB light source of prior art is the most too concentrated, and not only can produce substantial amounts of heat and assemble, and COB Block mutually between light source so that COB light source inefficient, i.e. utilization rate is the highest.

Utility model content

For the deficiencies in the prior art, this utility model provides the COB light source modular structure of a kind of flip-chip, to avoid COB light source excessively concentrates the defect of arrangement, optimizes COB chip collaborative work effect each other, makes each COB as far as possible Sides of chip sends whole light, and then improves the efficiency of COB light source.

This utility model solves its technical problem and be the technical scheme is that the COB light source mould of a kind of flip LED chips Group structural substrate, described substrate is provided with several COB light source modules, described COB light source module is packaged with many upside-down mountings LED chip, the spacing between adjacent LED chip is more than the thickness of LED chip.

Preferably, the spacing between adjacent LED chip is more than 1.5 times of LED chip thickness.

Preferably, the spacing between adjacent LED chip is more than 3 times of LED chip thickness.

Preferably, described COB light source module is provided with columned chip die bond groove, described chip die bond trench bottom Being provided with the electrode structure corresponding to flip LED chips, described many flip LED chips are encapsulated in described chip die bond groove, The degree of depth of described chip die bond groove is more than the thickness of LED chip.

Preferably, the degree of depth of described chip die bond groove is more than 2 times of thickness of LED chip.

Preferably, the degree of depth of described chip die bond groove is more than 4 times of thickness of LED chip.

Preferably, described COB light source module is provided with reflective burr.

Preferably, described reflective burr is arranged between adjacent LED chip, and its height is spacing between adjacent LED chip 1/6～2/3.

Preferably, described reflective burr is provided with high reflective membrane, and for upward in the arcuate structure arched upward.

Preferably, described reflective burr is provided with high reflective membrane, and is the trapezoidal ridge structure of cross section.

The beneficial effects of the utility model are: owing to the spacing between adjacent LED chip is more than the thickness of LED chip, from And avoid COB light source and excessively concentrate the defect of arrangement, beneficially the dissipating of heat, optimize the most to a certain extent simultaneously LED chip collaborative work effect each other, makes each LED chip side send whole light as far as possible, and then improves The efficiency of COB light source.

Accompanying drawing explanation

With embodiment, this utility model is further illustrated below in conjunction with the accompanying drawings.

Fig. 1 is the structural representation of this utility model specific embodiment；

Fig. 2 is the side view of Fig. 1.

Detailed description of the invention

Fig. 1 is the structural representation of this utility model specific embodiment；Fig. 2 is the side view of Fig. 1.See figures.1.and.2, This utility model provides the COB light source modular structure substrate of a kind of flip LED chips, and described substrate is provided with several COB light source module 1, described COB light source module 1 is packaged with many flip LED chips 2, the spacing between adjacent LED chip 2 Thickness more than LED chip 2.

In above-described embodiment, owing to the spacing between adjacent LED chip 2 is more than the thickness of LED chip 2, thus avoid COB light source excessively concentrates dissipating of the defect of arrangement, beneficially heat, optimize the most to a certain extent simultaneously LED chip 2 that Collaborative work effect between this, makes each LED chip 2 side send whole light as far as possible, and then improves COB light source Efficiency.

Specifically, the spacing between described adjacent LED chip 2 is more than 1.5 times of thickness of LED chip 2.Specifically Ground, the spacing between described adjacent LED chip 2 is more than 3 times of the thickness of LED chip 2.It should be noted that through repeatedly Test and checking, under the conditions of this ratio, LED chip 2 collaborative work effect each other is preferable, i.e. the efficiency of COB light source Higher.

As the further preferred scheme of above-described embodiment, described COB light source module 1 is provided with columned chip Die bond groove 3, is provided with the electrode structure corresponding to flip LED chips 2, described many flip LEDs bottom described chip die bond groove 3 Chip 2 is encapsulated in described chip die bond groove 3, and the degree of depth of described chip die bond groove 3 is more than the thickness of LED chip 2.This embodiment In, the design of chip die bond groove 3, the light that LED chip 2 sends can be put together, and upwards distribute, to improve LED The luminous efficiency of chip 2.

As the preferred version of the degree of depth of chip die bond groove 3, the degree of depth of described chip die bond groove 3 is more than the thickness of LED chip 2 2 times of degree.Being more highly preferred to, the degree of depth of described chip die bond groove 3 is more than 4 times of the thickness of LED chip 2.Through examination repeatedly Testing and verify, under the conditions of this ratio, the optically focused effect of chip die bond groove 3 is more preferable, and the light that can LED chip 2 be sent is abundant Put together, and upwards distribute, significantly improve the luminous efficiency of LED chip 2.

Optionally, described substrate 1 is provided with 5 and LED chip 2 in cross arrangement.At this under the conditions of arrangement, relatively Avoid well COB light source and excessively concentrate dissipating of the defect of arrangement, beneficially heat, optimize the most to a certain extent simultaneously LED chip 2 collaborative work effect each other, makes each LED chip 2 side send whole light, Jin Erti as far as possible The high efficiency of COB light source.

Additionally, be provided with reflective burr (i.e. a kind of optical texture), this reflective burr punching press on described COB light source module 1 Molding (not shown), reflective burr the collaborative work effect that can optimize LED chip 2 each other is set, as far as possible The side making each LED chips has the optical design of abundant light extraction, is designed with optical texture around every chips, and Composition array structure, and then improve the efficiency of COB light source；Preferably, described reflective burr is arranged between adjacent LED chip 2, Its height is 1/6～2/3 of the spacing between adjacent LED chip 2.In this embodiment, by reflective burr by LED chip 2 every Opening, reduce heat and assemble, the most reflective burr increases area of dissipation, beneficially quick heat radiating, such that it is able to reach to improve The purpose of light efficiency；Reflective burr adds the reflection of light so that the light that LED chip 2 sends can more reflect, with Sample improves light efficiency, improves the uniformity of light, decreases light dark space；Use one-body molded, easy to process, volume will not be increased Outer cost；LED chip 2 simple installation, facilitates large-scale production to process.

Preferably, described reflective burr height is 1/3 of the spacing between LED chip 2.I.e. between adjacent LED chip 2 Spacing is assumed to be L, and the height of reflective burr is H, as H=1/3L, under the conditions of this ratio, can reach preferably to reflect effect Really.

The described light source module that COB light source module 1 is the integrated molding with reflection action, the most ganoid Metallic plate, adds disposable punch forming in man-hour, process, produce simpler.Or described COB light source module 1 is the most reflective Effect, but it is provided with high reflective membrane on its reflective burr.These effects arranged are some light LED chip 2 sent Line reflection out, reaches to improve light efficiency, reduces the purpose of dark space, can be according to actual production status, production cost, difficult processing Degree selects process program.

Preferably, described reflective burr is upward in the arcuate structure arched upward, and now reflective surface is its arcwall face；Described Reflective burr be the trapezoidal ridge structure of cross section, the up-narrow and down-wide structure of trapezoidal one-tenth, its inclined-plane facing LED chip 2 can To play reflective effect, the slope of this trapezoidal inclined plane can select according to the difference of LED chip 2 light illumination angle.

It addition, LED chip 2 may be circular or other irregular structures in some cases, cause adjacent LED chip Some is local wide for the spacing of 2, and some place is narrow, now, it is preferred that reflective burr is set to width with adjacent LED chip 2 The structure of spacing change, and it the most both can be fixed as a certain occurrence meeting condition, too can be with phase The spacing of adjacent LED chip 2 changes and height changes, but processing is got up, possible technology difficulty is higher, can be according to concrete feelings Condition takes the circumstances into consideration to select.

As it is shown in figure 1, use the COB light source module 1 described in 8 any of the above-described embodiments, they are grouped together and make With, each COB light source module 1 has anelectrode and negative electrode.Specifically, substrate is provided with 8 convenient separation or cutting COB light source module 1, each COB light source module 1 is an independent light source module, has the welding of independent both positive and negative polarity Point.

Finally illustrating, it is only limited by above example in order to the technical solution of the utility model to be described System, although being described in detail this utility model with reference to preferred embodiment, but those of ordinary skill in the art should manage Solve, the technical solution of the utility model can be modified or equivalent, without deviating from the technical program objective and Scope, it all should be contained in right of the present utility model.

Claims

1. a COB light source modular structure substrate for flip LED chips, described substrate is provided with several COB light source modules, Many flip LED chips it are packaged with on described COB light source module, it is characterised in that: the spacing between adjacent LED chip is more than The thickness of LED chip.

The COB light source modular structure substrate of a kind of flip LED chips the most according to claim 1, it is characterised in that: adjacent Spacing between LED chip is more than 1.5 times of LED chip thickness.

The COB light source modular structure substrate of a kind of flip LED chips the most according to claim 2, it is characterised in that: adjacent Spacing between LED chip is more than 3 times of LED chip thickness.

The COB light source modular structure substrate of a kind of flip LED chips the most according to claim 1, it is characterised in that: described Being provided with columned chip die bond groove on COB light source module, described chip die bond trench bottom is provided with flip LED chips institute Corresponding electrode structure, described many flip LED chips are encapsulated in described chip die bond groove, the degree of depth of described chip die bond groove Thickness more than LED chip.

The COB light source modular structure substrate of a kind of flip LED chips the most according to claim 4, it is characterised in that: described The degree of depth of chip die bond groove is more than 2 times of the thickness of LED chip.

The COB light source modular structure substrate of a kind of flip LED chips the most according to claim 5, it is characterised in that: described The degree of depth of chip die bond groove is more than 4 times of the thickness of LED chip.

7. according to the COB light source modular structure substrate of a kind of flip LED chips described in claim 1-6 any claim, It is characterized in that: on described COB light source module, be provided with reflective burr.

The COB light source modular structure substrate of a kind of flip LED chips the most according to claim 7, it is characterised in that: institute Stating reflective burr to be arranged between adjacent LED chip, its height is 1/6～2/3 of spacing between adjacent LED chip.

The COB light source modular structure substrate of a kind of flip LED chips the most according to claim 7, it is characterised in that: described High reflective membrane it is provided with on reflective burr, and for upward in the arcuate structure arched upward.

The COB light source modular structure substrate of a kind of flip LED chips the most according to claim 7, it is characterised in that: institute State and on reflective burr, be provided with high reflective membrane, and be the trapezoidal ridge structure of cross section.