CN212485323U - LED lamp device and LED lamp bead thereof - Google Patents
LED lamp device and LED lamp bead thereof Download PDFInfo
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- CN212485323U CN212485323U CN202021591227.5U CN202021591227U CN212485323U CN 212485323 U CN212485323 U CN 212485323U CN 202021591227 U CN202021591227 U CN 202021591227U CN 212485323 U CN212485323 U CN 212485323U
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Abstract
The utility model discloses a LED lamp device and LED lamp bead thereof, the LED lamp bead comprises an anode conducting strip, a cathode conducting strip, a wafer and a bracket, the bracket is in a bowl shape, the inner wall surface is provided with a first inclined surface part to form a reflecting surface, the wafer is arranged at the upper side of the bottom of the bracket, and the anode conducting strip and the cathode conducting strip are mutually insulated; the two poles of the wafer are respectively and electrically connected with the contacts on the positive conducting strip and the negative conducting strip; the positive conducting plate and the negative conducting plate are respectively electrically connected with the positive bonding pad and the negative bonding pad of the circuit board after being bent at the position close to the bowl edge of the bracket. The utility model provides a LED lamp pearl utilizes the bowl dress structural design of support, and the internal face is equipped with first inclined plane part in order to form the reflection of light face, improves luminous effect, and on the other hand still utilizes the setting of buckling of anodal conducting strip and negative pole conducting strip, when convenient and circuit board are connected, has increased steam and has got into the inside flow of light source, great improvement the gas tightness of product to promote the reliability and the life-span of product.
Description
Technical Field
The utility model relates to a LED lighting device field especially relates to a LED lamp pearl. Furthermore, the utility model discloses still relate to a LED lamp device including above-mentioned LED lamp pearl.
Background
Along with the popularization of LED lamp beads in many ways, LED illumination has penetrated various scenes that people need light for living, and accordingly the requirements of people on the light emitting quality of an LED light source are improved, the reliability and the service life of a product are continuously improved, more and more details are excavated in the direction of extracting the light emitting rate, and therefore all dimensions of the LED light source are improved.
In the prior art, there are two kinds of LED light source mainstream, one kind is horizontal heat radiation structure, this structure product heat-sinking capability is general, the use electric current of lamp pearl is smaller, another kind is vertical heat radiation structure, this kind of structure product is copper heat sink direct conduction downwards for the radiator, the radiating rate is very fast, power can be done higher usually, but its shortcoming is also more obvious, it is very thin exactly that the product height is, the gas tightness is relatively poor, steam permeates to the lamp pearl inside very easily, cause bad or even die the lamp, and because highly restricted, the bowl cup structure of lamp pearl can not do too much design yet, in the application that requires higher to the light-emitting light type, the degree of difficulty and the cost of secondary optics also increase thereupon.
Therefore, how to improve the light-emitting effect of the LED lamp bead is a technical problem that needs to be solved by those skilled in the art at present.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a LED lamp pearl, this LED lamp pearl luminous effectual, the gas tightness is good moreover, the reliability of product is high, longe-lived. Another object of the utility model is to provide an LED lamp device including above-mentioned LED lamp pearl.
In order to achieve the above object, the utility model provides a following technical scheme:
an LED lamp bead comprises an anode conducting strip, a cathode conducting strip, a wafer and a support, wherein the support is bowl-shaped, a first inclined plane part is arranged on the inner wall surface of the support to form a reflecting surface, the wafer is installed on the upper side of the bottom of the support, and the anode conducting strip and the cathode conducting strip are insulated from each other; the two poles of the wafer are respectively and electrically connected with the contacts on the positive conducting strip and the negative conducting strip; the positive conducting plate and the negative conducting plate are respectively electrically connected with the positive bonding pad and the negative bonding pad of the circuit board after being bent at the position, close to the bowl edge of the bracket, of the positive conducting plate and the negative conducting plate.
Preferably, the inner surface of the bracket is provided with the first inclined surface part, the transition surface and the second inclined surface part from top to bottom, and the bottoms of the positive conducting strip and the negative conducting strip are exposed on the transition surface after being bent to form the contact.
Preferably, the top height of the second bevel portion is higher than the top height of the wafer.
Preferably, the cross section of the inner cavity of the bracket is circular, oval, square or polygonal.
Preferably, the transition surface extends in a horizontal direction; the positive conducting plate and the negative conducting plate are respectively bent towards the outer side along the horizontal direction at the position close to the bowl edge of the bracket.
Preferably, the positive conducting strip and the negative conducting strip are Z-shaped, and the positive conducting strip and the negative conducting strip are symmetrically arranged; the middle inclined plane part of the positive conducting plate and the negative conducting plate is inclined from the bowl edge of the bracket to the bowl bottom from top to bottom; the wafer is connected to the bottom bent edges of the positive conducting plate and the negative conducting plate, and the top bent edges of the positive conducting plate and the negative conducting plate are respectively connected with the positive bonding pad and the negative bonding pad of the circuit board.
Preferably, the wafer further comprises a heat dissipation support member, the wafer is mounted on the upper portion of the heat dissipation support member, and the heat dissipation support member is fixedly arranged at the bottom of the support and is insulated from the positive conductive sheet and the negative conductive sheet; the bottom surface of the heat dissipation supporting component is exposed on the surface of the support.
Preferably, the heat dissipation support component is connected with the shell in a contact mode.
Preferably, the heat dissipation support member is a copper block.
The utility model also provides a LED lamp device, including above-mentioned arbitrary one LED lamp pearl and circuit board, be equipped with the confession on the circuit board the fretwork part that LED lamp pearl put into.
The utility model provides a LED lamp bead, including anodal conducting strip, negative pole conducting strip, wafer and support, the support is the bowl form, and the internal face is equipped with first inclined plane part in order to form the reflecting surface, the wafer is installed in the bottom upside of support, anodal conducting strip and negative pole conducting strip are insulated from each other; the two poles of the wafer are respectively and electrically connected with the contacts on the positive conducting strip and the negative conducting strip; the positive conducting plate and the negative conducting plate are respectively electrically connected with the positive bonding pad and the negative bonding pad of the circuit board after being bent at the position, close to the bowl edge of the bracket, of the positive conducting plate and the negative conducting plate. The utility model provides a LED lamp pearl utilizes the bowl dress structural design of support, and the internal face is equipped with first inclined plane part in order to form the reflection of light face, improves luminous effect, on the other hand, still utilizes anodal conducting strip with the setting of buckling of negative pole conducting strip, convenient with when the circuit board is connected, increased steam and got into the inside flow of light source, great improvement the gas tightness of product to promote the reliability and the life-span of product.
In a preferred embodiment, the wafer further comprises a heat dissipation support member, the wafer is mounted on the upper portion of the heat dissipation support member, and the heat dissipation support member is fixedly arranged at the bottom of the support and is insulated from the positive conductive sheet and the negative conductive sheet; the bottom surface of the heat dissipation supporting component is exposed on the surface of the support. By the arrangement, the thermoelectric separation of the bottom of the bowl cup of the support is realized, and the heat dissipation supporting part in the middle die bonding area only conducts heat and is not electrified, so that the heat conduction speed can be greatly increased, the reliability of a product is improved, and the service life of the product is prolonged.
The utility model provides a LED lamp device is equipped with above-mentioned LED lamp pearl, because LED lamp pearl has above-mentioned technological effect, consequently, the LED lamp device that is equipped with this LED lamp pearl should also have corresponding technological effect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a specific embodiment of an LED lamp bead provided by the present invention;
fig. 2 is a schematic structural diagram of an embodiment of an LED lamp device provided in the present invention;
fig. 3 is a schematic structural diagram of a specific embodiment of a circuit board in an LED lamp device according to the present invention;
fig. 4 is a top view of the LED lamp bead provided by the present invention;
fig. 5 is a schematic structural diagram of another embodiment of the positive conductive sheet and the negative conductive sheet of the LED lamp bead provided by the present invention;
fig. 6 is a schematic structural diagram of a third embodiment of the positive conductive sheet and the negative conductive sheet of the LED lamp bead provided by the present invention;
wherein: a circuit board-100; hollow-out part-101; a pad-102; a lens-201; a positive electrode conductive sheet-202; a wafer-203; a bracket-204; a heat dissipation support member-205; a negative conductive tab-206; gold wire-207; a housing-300.
Detailed Description
The core of the utility model is to provide a LED lamp pearl, this LED lamp pearl is luminous effectual, and the gas tightness is good moreover, and the reliability of product is high, longe-lived. The other core of the utility model is to provide a LED lamp device including above-mentioned LED lamp pearl.
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 6, fig. 1 is a schematic structural diagram of a specific embodiment of an LED lamp bead provided in the present invention; fig. 2 is a schematic structural diagram of an embodiment of an LED lamp device provided in the present invention; fig. 3 is a schematic structural diagram of a specific embodiment of a circuit board in an LED lamp device according to the present invention; fig. 4 is a top view of the LED lamp bead provided by the present invention; fig. 5 is a schematic structural diagram of another specific embodiment of the positive conductive sheet and the negative conductive sheet of the LED lamp bead provided by the present invention; fig. 6 is a schematic structural view of a third embodiment of the anode conducting strip and the cathode conducting strip of the LED lamp bead.
In this embodiment, a positive conductive sheet 202, a negative conductive sheet 206, a wafer 203, and a holder 204 are included.
The bracket 204 is bowl-shaped, a first inclined surface part is arranged on the inner wall surface of the bracket 204 to form a reflecting surface, the outer surface of the first inclined surface part faces the bowl opening direction of the bracket 204, specifically, the cross section of an inner cavity of the bracket 204 can be circular, oval, square or polygonal, preferably circular, the first inclined surface part is preferably a first circular table surface, of course, the cross section of the inner cavity of the bracket 204 can also be polygonal, namely the first inclined surface part is divided into a plurality of different inclined surfaces along the circumferential direction, the wafer 203 is arranged on the upper side of the bottom of the bracket 204, and the positive conducting strip 202 and the negative conducting strip 206 are mutually insulated and can be respectively arranged on two; the two poles of the wafer 203 are respectively and electrically connected with the contacts on the positive conducting strip 202 and the negative conducting strip 206, and particularly, the wafer 203 is connected to the bottoms of the positive conducting strip 202 and the negative conducting strip 206; the positive conducting strip 202 and the negative conducting strip 206 are respectively electrically connected with the positive pad 102 and the negative pad 102 of the circuit board 100 after being bent at the position close to the bowl edge of the bracket 204, so that the circuit board 100, the positive conducting strip 202, the negative conducting strip 206 and the wafer 203 are electrically connected. Specifically, the positive conductive sheet 202 and the negative conductive sheet 206 are connected to the circuit board 100 near the bowl edge of the bracket 204, the lens 201 is mounted at the outer edge of the positive conductive sheet 202 and the negative conductive sheet 206 and located on the upper side of the circuit board 100, and the positive conductive sheet 202 and the negative conductive sheet 206 are folded upwards to make the height of the bonding pad on the positive conductive sheet 202 and the negative conductive sheet 206 approach the light-emitting surface.
The utility model provides a LED lamp pearl utilizes the bowl dress structural design of support 204, and the internal face is equipped with first inclined plane part in order to form the reflection of light face, improves luminous effect, and on the other hand still utilizes the setting of buckling of anodal conducting strip 202 and negative pole conducting strip 206, when conveniently being connected with circuit board 100, has increased steam and has got into the inside flow of light source, great improvement the gas tightness of product to promote the reliability and the life-span of product.
On the basis of the above embodiments, the inner surface of the support 204 is provided with a first inclined surface portion, a transition surface and a second inclined surface portion from top to bottom, that is, the inner surface of the support 204 has two inclined surface portions, preferably, the bottoms of the positive conductive sheet 202 and the negative conductive sheet 206 are bent and exposed on the transition surface to form contacts, the wafer 203 and the contacts of the positive conductive sheet 202 and the negative conductive sheet 206 are respectively connected through the gold wire 207, and the bent positions of the bottoms of the positive conductive sheet 202 and the negative conductive sheet 206 are close to the wafer 203, so as to facilitate the connection of the wafer 203. The transition surface can divide the inner surface of the bracket 204 into two parts to form two inclined surface parts, namely, a light source structure for realizing the superposition of double bowls and cups is realized.
Further, the top height of the second inclined plane part is higher than that of the wafer 203, so that the light reflecting effect of the second inclined plane part is improved, and the light emitting effect of the whole lamp bead is further improved.
In the arrangement, the die bonding area and the wire bonding area are designed to be different in height, a small bowl formed by the second inclined surface part can be formed firstly, the depth of the small bowl is larger than or equal to the height of the wafer 203, and the bowl formed by the first inclined surface part of the support 204 is used for realizing the double-bowl design, secondary optical matching can be completed in the LED light source by the double-bowl design, and the reflector cup or the lens 201 is matched in the application process, so that the double-bowl design is easy to realize and has lower cost.
On the basis of the above embodiments, the inner surface of the bracket 204 further includes a third inclined surface portion located at the bottom of the second inclined surface portion, and further, the positive conductive sheet 202 and the negative conductive sheet 206 affect the number of times of increasing the folded angle, and the air tightness of the product is improved by folding the legs for multiple times.
Of course, the die bonding area and the wire bonding area may be maintained at the same height without performing a dislocation process, that is, only the first slope portion may be provided, and the circuit board 100 may be provided with a heat dissipation plate to distinguish the power-on area from the heat dissipation area and to dissipate heat.
In addition to the above embodiments, the transition surface extends in the horizontal direction; the positive conductive sheet 202 and the negative conductive sheet 206 are respectively bent outward along the horizontal direction near the bowl edge of the bracket 204.
On the basis of the above embodiments, the positive conductive sheet 202 and the negative conductive sheet 206 are both Z-shaped, and the positive conductive sheet 202 and the negative conductive sheet 206 are symmetrically arranged; the middle inclined planes of the positive conducting strip 202 and the negative conducting strip 206 are inclined from the bowl edge of the bracket 204 to the bowl bottom from top to bottom; the wafer 203 is connected to the bottom bent edges of the positive conductive sheet 202 and the negative conductive sheet 206, and the top bent edges of the positive conductive sheet 202 and the negative conductive sheet 206 are respectively connected to the positive pad 102 and the negative pad 102 of the circuit board 100.
It is specific, design through the structure to the bonding wire region, after keeping the regional position of bonding wire, through the mode of the foot of bending, up roll over anodal conducting strip 202 and negative pole conducting strip 206, make the pad welding position on anodal conducting strip 202 and the negative pole conducting strip 206 highly be close with the light emitting area, need sink the lamp pearl when can make things convenient for the customer to use, anodal conducting strip 202 and negative pole conducting strip 206 are positive, the negative pad just in time with circuit board 100 just in the positive, negative pad 102 matches and pastes flatly, be favorable to realizing the ultra-thinness of whole lamp like this.
In addition to the above embodiments, the solar cell further includes a heat dissipation support member 205, the wafer 203 is mounted on the heat dissipation support member 205, the heat dissipation support member 205 is fixedly mounted on the bottom of the support 204 and is insulated from the positive conductive sheet 202 and the negative conductive sheet 206; the bottom surface of the heat dissipation support member 205 is exposed on the surface of the bracket 204.
By the arrangement, thermoelectric separation of the bottom of the bowl cup of the support 204 is realized, and the heat dissipation support part 205 in the middle die bonding area only conducts heat and is not electrified, so that the heat conduction speed can be greatly increased, and the reliability and the service life of the product are improved.
On the basis of the above embodiments, the heat dissipation device further includes a housing 300, the heat dissipation support member 205 is in contact connection with the housing 300, and the heat dissipation support member 205 is directly communicated with the heat dissipation housing 300 on the back side, so that the heat dissipation effect is good.
Preferably, the heat dissipation support member 205 is a copper block, which has a good heat dissipation effect.
On the basis of each embodiment, the outer tip of anodal conducting strip 202 and/or negative pole conducting strip 206 cuts and is equipped with a plurality of bellyings, so set up, because the LED lamp pearl that provides in this application, because its formula design that sinks, make anodal conducting strip 202 and/or negative pole conducting strip 206 be used for the position size of being connected with circuit board 100 great, in order to guarantee joint strength, the aforesaid sets up, setting through a plurality of bellyings, can further improve anodal conducting strip 202 and the fastness of being connected between negative pole conducting strip 206 and the circuit board, and electrically conductive reliability, further guarantee this LED lamp pearl's installation stability.
Specifically, the outer end structures of the positive conductive plate 202 and the negative conductive plate 206 may be the same or different, and preferably have a plurality of protrusions, and a through hole is formed in the middle of the protrusion, as shown in fig. 5, or the outer end edge of the positive conductive plate 202 is provided with a broken line edge formed by cutting to form a plurality of triangular protrusions, and the outer end edge of the negative conductive plate 206 is provided with an arc-shaped edge formed by cutting to form a plurality of arc-shaped protrusions, and of course, the outer end structures of the positive conductive plate 202 and the negative conductive plate 206 may be freely combined, or at least one of the structures may not be cut.
The utility model provides a LED lamp pearl through the design of the height drop between solid brilliant region and the bonding wire region, makes plastic material can be more comprehensive inseparable live anodal conducting strip 202 and negative pole conducting strip 206 parcel, assists the mode extraction electrode that upwards bends with the pin again, has increased steam and has got into the inside flow of light source, great improvement the gas tightness of product to promote the reliability and the life-span of product.
Except that above-mentioned LED lamp pearl, the utility model also provides an LED lamp device including above-mentioned LED lamp pearl, other each partial structures of this LED lamp device please refer to prior art, and this text is no longer repeated.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
It is right above the utility model provides a LED lamp pearl has carried out detailed introduction. The principles and embodiments of the present invention have been explained herein using specific examples, and the above descriptions of the embodiments are only used to help understand the method and its core ideas of the present invention. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.
Claims (10)
1. An LED lamp bead comprises an anode conducting strip (202), a cathode conducting strip (206), a wafer (203) and a bracket (204), and is characterized in that the bracket (204) is bowl-shaped, a first inclined surface part is arranged on the inner wall surface of the bracket to form a reflecting surface, the wafer (203) is installed on the upper side of the bottom of the bracket (204), and the anode conducting strip (202) and the cathode conducting strip (206) are insulated from each other; the two poles of the wafer (203) are respectively and electrically connected with the contacts on the positive conducting strip (202) and the negative conducting strip (206); the positive conducting strip (202) and the negative conducting strip (206) are respectively and electrically connected with the positive and negative pads (102) of the circuit board (100) after being bent at the position close to the bowl edge of the bracket (204).
2. The LED lamp bead according to claim 1, wherein the inner surface of the bracket (204) is provided with the first inclined surface portion, the transition surface and the second inclined surface portion from top to bottom, and the bottoms of the positive conductive sheet (202) and the negative conductive sheet (206) are bent and exposed on the transition surface to form a contact.
3. The LED lamp bead according to claim 2, wherein the top height of the second slope portion is higher than the top height of the wafer (203).
4. The LED lamp bead according to claim 1, wherein the cross section of the inner cavity of the support (204) is circular, oval or polygonal.
5. The LED lamp bead according to claim 2, wherein the transition surface extends in a horizontal direction; the positive conducting strip (202) and the negative conducting strip (206) are bent outwards along the horizontal direction at the positions close to the bowl edge of the support (204).
6. The LED lamp bead according to claim 2, wherein the positive conductive sheet (202) and the negative conductive sheet (206) are Z-shaped, and the positive conductive sheet (202) and the negative conductive sheet (206) are symmetrically arranged; the middle inclined plane parts of the positive conducting strip (202) and the negative conducting strip (206) are inclined from top to bottom from the bowl edge of the bracket (204) to the bowl bottom; the wafer (203) is connected with the bottom bent edges of the positive conducting strip (202) and the negative conducting strip (206), and the top bent edges of the positive conducting strip (202) and the negative conducting strip (206) are respectively connected with the positive bonding pad (102) and the negative bonding pad (102) of the circuit board (100).
7. The LED lamp bead according to any one of claims 1 to 6, further comprising a heat dissipation support member (205), wherein the wafer (203) is mounted on the upper portion of the heat dissipation support member (205), and the heat dissipation support member (205) is fixedly arranged at the bottom of the bracket (204) and is insulated from the positive conductive sheet (202) and the negative conductive sheet (206); the bottom surface of the heat dissipation support part (205) is exposed on the surface of the bracket (204).
8. The LED lamp bead according to claim 7, further comprising a housing (300), wherein the heat dissipation support member (205) is in contact connection with the housing (300).
9. The LED lamp bead according to any one of claims 1 to 6, wherein a plurality of protrusions are cut at the outer end of the positive conductive sheet (202) and/or the negative conductive sheet (206).
10. An LED lamp device comprises an LED lamp bead and a circuit board (100), and is characterized in that the LED lamp bead is the LED lamp bead in any one of claims 1 to 9, and a hollow part (101) for placing the LED lamp bead is arranged on the circuit board (100).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021591227.5U CN212485323U (en) | 2020-08-04 | 2020-08-04 | LED lamp device and LED lamp bead thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021591227.5U CN212485323U (en) | 2020-08-04 | 2020-08-04 | LED lamp device and LED lamp bead thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212485323U true CN212485323U (en) | 2021-02-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021591227.5U Active CN212485323U (en) | 2020-08-04 | 2020-08-04 | LED lamp device and LED lamp bead thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212485323U (en) |
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2020
- 2020-08-04 CN CN202021591227.5U patent/CN212485323U/en active Active
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