CN206947336U - Small size EMC encapsulates lamp bead - Google Patents
Small size EMC encapsulates lamp bead Download PDFInfo
- Publication number
- CN206947336U CN206947336U CN201720460662.6U CN201720460662U CN206947336U CN 206947336 U CN206947336 U CN 206947336U CN 201720460662 U CN201720460662 U CN 201720460662U CN 206947336 U CN206947336 U CN 206947336U
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- substrate
- emc
- base materials
- lamp bead
- small size
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Abstract
It the utility model is related to LED lamp bead technical field,Disclose small size EMC encapsulation lamp beads,Including substrate and EMC base materials,Substrate includes the first substrate and the second substrate as electrode,First substrate and second substrate are arranged side by side,And connected by the EMC base materials,The outer rim of first substrate and second substrate is respectively embedded into the EMC base materials,The EMC base materials enclose the edge of the first substrate and the second substrate and form a groove,Fluorescent glue is filled with the groove,Due to only having substrate outer edge to be embedded in EMC base materials,And substrate includes the first substrate and the second substrate that can be electrically connected,The cost for reducing EMC base materials uses,And it can make very thin,When substrate is arranged to reduced size,Equally reach radiating effect,The appearance and size setting such as above-mentioned lamp bead can be made smaller,Satisfaction uses needs.
Description
Technical field
It the utility model is related to the technical field of LED lamp bead, especially small size EMC encapsulation lamp beads.
Background technology
LED lamp bead is widely used in every field with the advantages that its is durable, environmentally friendly, energy-conservation, with people pursue it is more next
It is higher, LED technology it is growing, its heat dissipation problem also increasingly highlights.
At present, traditional LED lamp bead is radiated using aluminium base, but the technical scheme cost of aluminium base is very high, existing
Have in technology, also there is the technical scheme that substrate base material is done using EMC, i.e., copper sheet is embedded in EMC base materials to solve dissipating for chip
Heat problem, but the packaging worked it out is all very thick, size is larger, it is difficult to reaches the use of needs in application field
Effect.
Utility model content
The purpose of this utility model is to provide small size EMC encapsulation lamp beads, it is intended to solves due to the LED of EMC encapsulation
Pearl profile is thicker, size is larger, so as to not reach the technical problem of requirement.
The utility model is achieved in that small size EMC encapsulates lamp bead, including substrate and EMC base materials, the substrate
Including the first substrate and the second substrate as electrode, first substrate and second substrate are arranged side by side, and pass through institute
State EMC base materials to connect, the outer rim of first substrate and second substrate is respectively embedded into the EMC base materials, the EMC base materials
The edge for enclosing substrate forms a groove, is filled with fluorescent glue in the groove, multiple LED are bonded with first substrate
Chip, the fluorescent glue are covered in the LED chip.
Further, the outer rim of first substrate and second substrate is respectively by reduction processing formed with thinned
Area, the thinning area are embedded in the EMC base materials.
Further, first substrate and second substrate are respectively set to two isometric rectangles, and described
The width of first substrate is bigger than the width of second substrate.
Further, first substrate and second substrate are arranged side by side, and connect to be formed by the EMC base materials
One square substrate.
Further, the length of side of the square substrate is arranged to 2mm-10mm.
Further, the LED chip is arranged in array.
Further, the groove is circular or fillet square.
Further, the substrate is nickel-plated and silver-plated by copper and be made.
Compared with prior art, small size EMC, which encapsulates lamp bead, includes substrate and EMC base materials, and substrate includes that electricity can be formed
Property connection the first substrate and the second substrate so that lamp bead described above need not interior welding electrode again, reduce manufacturing procedure
And material cost is reduced, also allow lamp bead described above to make very thin, and only substrate outer edge insertion EMC base materials, subtract
The cost for having lacked EMC base materials uses, and can further reduce the size of lamp bead described above, and when substrate is arranged to smaller chi
When very little, equally reach radiating effect, satisfaction uses needs.
Brief description of the drawings
Fig. 1 is the diagrammatic cross-section for the small size EMC encapsulation lamp beads that the utility model embodiment provides；
Fig. 2 is the schematic top plan view for the small size EMC encapsulation lamp beads that the utility model embodiment provides.
Embodiment
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining
The utility model, it is not used to limit the utility model.
Realization of the present utility model is described in detail below in conjunction with specific embodiment.
Referring to figs. 1 to shown in Fig. 2, being preferred embodiment provided by the utility model.
In the present embodiment, small size EMC encapsulation lamp beads, including substrate and EMC base materials 20, substrate includes the as electrode
One substrate 101 and the second substrate 102, can allow as described above lamp bead be electrically connected, the first substrate 101 and the second substrate
102 are arranged side by side, and the gap between the first substrate 101 and the second substrate 102 is filled with EMC base materials 20, and pass through EMC base materials 20
The outer rim of connection, the first substrate 101 and the second substrate 102 is respectively embedded into EMC base materials 20, so as to complete the encapsulation of EMC base materials 20,
EMC base materials 20 enclose the edge of substrate and form a groove 201, and fluorescent glue 30, the first substrate 101 are filled with groove 201
On be bonded with multiple LED chips 40, in the LED chip 40 that fluorescent glue 30 covers.
So because substrate includes the first substrate 101 and the second substrate 102 that can be electrically connected so that as described above
Lamp bead need not interior welding electrode again, reduce manufacturing procedure and reduce material cost, also make it that lamp bead described above can be with
Making is very thin, and only substrate outer edge insertion EMC base materials 20, the cost for reducing EMC base materials 20 are used, can further subtracted
The size of small lamp bead described above, and when substrate is arranged to reduced size, equally reach radiating effect, satisfaction uses need
Will.
In the present embodiment, in order to such as above-mentioned lamp bead be more prone to make, size it is more accurate, the first substrate 101 and second
The outer rim of substrate 102 is respectively by reduction processing and formed with thinning area 103, result in formation of low level table top, when thinning area 103
In embedded EMC base materials 20, the bonding dynamics of EMC base materials 20 and substrate is added.
In the present embodiment, in order to manufacture suitable size, the first substrate 101 and the second substrate 102 are respectively set to two
Isometric rectangle, and be arranged side by side along width；The width of first substrate 101 is bigger than the width of the second substrate 102,
That is the upper surface of the first substrate 101 is bigger than the upper surface of the second substrate 102, and multiple LED chips 40 are arranged on the first substrate 101
Upper surface, area of dissipation can be made bigger, so, not only cause as above-mentioned lamp bead light efficiency more preferably, and it is more preferable to radiate.
In the present embodiment, in the width direction, the first substrate 101 and the second substrate 102 are arranged side by side, and in the first substrate
101 and second are filled with EMC base materials 20 between substrate 102, are connected by EMC base materials 20 and form a square substrate, so that
Size such as above-mentioned lamp bead is more prone to install, meets requirement.
As other embodiment, according to actual requirement, the first substrate 101 and the second substrate 102 can also be along its length
It is arranged side by side, and is connected by EMC base materials 20 and form a strip.
As other embodiment, the first substrate 101 and second substrate 102 can also be respectively set to that square or other are not advised
Then shape, and as above-mentioned lamp bead can be electrically connected by the first substrate 101 and the second substrate 102.
In order to meet the installation requirement of a variety of small size lamps, the side size range of square substrate could be arranged to 2 millimeters to 10
Between millimeter.
Preferably, the length of side of square substrate is arranged to 3 millimeters or 5 millimeters.
In the present embodiment, the upper surface of the first substrate 101 is bonded with multiple LED chips 40, to make such as the light of above-mentioned lamp bead
More preferably, multiple LED chips 40 are arranged in array effect, and fluorescent glue 30 is filled in groove 201, and are covered in LED chip 40.
Specifically, the multiple arrangements of the rectangular array of LED chip 40 or circular array arrangement.
In the present embodiment, EMC base materials 20 enclose the groove 201 that the edge of substrate is formed, and could be arranged to circular or circle
Angle square, groove 201 is interior to be filled with fluorescent glue 30, and when LED chip 40 is luminous, some light is reflected by groove 201, so as to
So that light efficiency described above is more preferably.
As other embodiment, groove 201 is it can also be provided that ellipse or other irregular shapes.
In the present embodiment, substrate is made by copper is nickel-plated and silver-plated, and copper is nickel-plated and silver-plated than copper better heat-radiation effect, and electric conductivity
More preferably.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (8)
1. small size EMC encapsulates lamp bead, it is characterised in that including substrate and EMC base materials, the substrate is included as electrode
First substrate and the second substrate, first substrate and second substrate are arranged side by side, and are connected by the EMC base materials,
The outer rim of first substrate and second substrate is respectively embedded into the EMC base materials, and the EMC base materials enclose the edge of substrate
A groove is formed, fluorescent glue is filled with the groove, multiple LED chips, the fluorescence is bonded with first substrate
Glue is covered in the LED chip.
2. small size EMC as claimed in claim 1 encapsulates lamp bead, it is characterised in that first substrate and second substrate
Outer rim respectively by reduction processing formed with thinning area, the thinning area is embedded in the EMC base materials.
3. small size EMC as claimed in claim 1 encapsulates lamp bead, it is characterised in that first substrate and second substrate
Two isometric rectangles are respectively set to, and the width of first substrate is bigger than the width of second substrate.
4. small size EMC encapsulates lamp bead as described in any one of claims 1 to 3, it is characterised in that first substrate and described
Second substrate is arranged side by side, and connects to form a square substrate by the EMC base materials.
5. small size EMC as claimed in claim 4 encapsulates lamp bead, it is characterised in that the length of side of the square substrate is arranged to
2mm-10mm。
6. small size EMC as claimed in claim 4 encapsulates lamp bead, it is characterised in that the LED chip is arranged in array.
7. small size EMC as claimed in claim 4 encapsulates lamp bead, it is characterised in that the groove is circular or fillet square.
8. small size EMC as claimed in claim 4 encapsulates lamp bead, it is characterised in that the substrate is nickel-plated and silver-plated by copper and is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720460662.6U CN206947336U (en) | 2017-04-27 | 2017-04-27 | Small size EMC encapsulates lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720460662.6U CN206947336U (en) | 2017-04-27 | 2017-04-27 | Small size EMC encapsulates lamp bead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206947336U true CN206947336U (en) | 2018-01-30 |
Family
ID=61358816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720460662.6U Expired - Fee Related CN206947336U (en) | 2017-04-27 | 2017-04-27 | Small size EMC encapsulates lamp bead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206947336U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110440156A (en) * | 2019-08-30 | 2019-11-12 | 新月光电（深圳）股份有限公司 | The ruggedized construction of LED lamp bead pedestal |
-
2017
- 2017-04-27 CN CN201720460662.6U patent/CN206947336U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110440156A (en) * | 2019-08-30 | 2019-11-12 | 新月光电（深圳）股份有限公司 | The ruggedized construction of LED lamp bead pedestal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180130 Termination date: 20200427 |
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| CF01 | Termination of patent right due to non-payment of annual fee |