CN103855286A - LED supporting frame, manufacturing method of LED supporting frame and double-material belt LED supporting frame module - Google Patents
LED supporting frame, manufacturing method of LED supporting frame and double-material belt LED supporting frame module Download PDFInfo
- Publication number
- CN103855286A CN103855286A CN201410061413.0A CN201410061413A CN103855286A CN 103855286 A CN103855286 A CN 103855286A CN 201410061413 A CN201410061413 A CN 201410061413A CN 103855286 A CN103855286 A CN 103855286A
- Authority
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- China
- Prior art keywords
- copper
- lead foot
- plastic cement
- aluminium
- cement seat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000463 material Substances 0.000 title claims abstract description 64
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 96
- 229910052802 copper Inorganic materials 0.000 claims abstract description 95
- 239000010949 copper Substances 0.000 claims abstract description 95
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 86
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 81
- 229920003023 plastic Polymers 0.000 claims abstract description 55
- 239000004033 plastic Substances 0.000 claims abstract description 55
- 239000004411 aluminium Substances 0.000 claims description 70
- 239000004568 cement Substances 0.000 claims description 47
- 150000001879 copper Chemical class 0.000 claims description 14
- 150000001398 aluminium Chemical class 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 4
- 239000003550 marker Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 10
- 238000005987 sulfurization reaction Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 239000013078 crystal Substances 0.000 abstract 3
- 238000007711 solidification Methods 0.000 abstract 3
- 230000008023 solidification Effects 0.000 abstract 3
- 210000002683 foot Anatomy 0.000 description 59
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 5
- 238000002310 reflectometry Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001149 thermolysis Methods 0.000 description 1
Images
Classifications
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- H01L33/486—
-
- H01L33/62—
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- H01L2933/0066—
Landscapes
- Led Device Packages (AREA)
- Road Signs Or Road Markings (AREA)
Abstract
The invention discloses an LED supporting frame, a manufacturing method of the LED supporting frame and a double-material belt LED supporting frame module. The LED supporting frame comprises a plastic seat, an aluminum adhering sheet and a copper guide pin, wherein the aluminum adhering sheet and the copper guide pin are arranged on the plastic seat. A packaging cavity is formed in the plastic seat. The aluminum adhering sheet is provided with a crystal solidification part. The surface of the crystal solidification part is exposed in the packaging cavity and the bottom face of the aluminum adhering sheet is exposed out of the bottom face of the plastic seat. The copper guide pin comprises a welding wire part and a welding part which are integrally connected and formed. The welding wire part is exposed in the packaging cavity. The welding part is exposed on the outer side of the plastic seat. The double-material belt LED supporting frame module comprises an aluminum plate supporting frame, a copper plate supporting frame and multiple plastic seats. As the adhering sheet made of aluminum and the guide pin made of copper are adopted, under the condition that the heat dissipating effect is not affected, the sulfuration problem of a crystal solidification welding wire zone is effectively solved, the quality of a product is improved, the reflecting rate of the product is improved, the brightness of the product is improved, the wattage is improved to 14 W from 7 W in the past and the use performance of the product is better.
Description
Technical field
The present invention relates to LED art, refer in particular to a kind of LED support and preparation method thereof and double material strips LED support module.
Background technology
LED(Light Emitting Diode, light-emitting diode) be a kind of solid-state semiconductor device, it can be directly light by electric energy conversion, it has that volume is little, power consumption is low, long service life, high brightness, low in calories, environmental protection, the advantage such as sturdy and durable, is one of optimal light source.
As everyone knows, this LED support comprises the insulating base that employing plastic cement is made and the metallic support of being fixed by this insulating base; This metallic support includes metal patch and is arranged at the other metal lead foot of metal patch side, and this metal patch is for fixed L ED chip and can play thermolysis, and this metal lead foot is for being welded to connect with external circuit.But in the prior art, this metallic support entirety is copper material, causes die bond bonding wire region that sulfuration problem easily occurs, and affect product quality, and the reflectivity of product is low, the brightness of product is impacted, thereby make the serviceability of current product not good.In addition,, in prior art, the bonding wire portion of two metal lead foots lays respectively in two diagonal planes of insulating base, the bonding wire mode that makes metal lead foot can be only gradient mode bonding wire, gradient mode bonding wire can only adopt manual welding, can not carry out automatic welding, thereby is unfavorable for realizing fast assembling product.
Summary of the invention
In view of this, the present invention is directed to the disappearance of prior art existence, its main purpose is to provide a kind of LED support and preparation method thereof and double material strips LED support module, and it can effectively solve existing LED support die bond bonding wire region sulfuration and the low problem of product emissivity easily occur.
For achieving the above object, the present invention adopts following technical scheme:
A kind of LED support, includes plastic cement seat and is arranged at aluminium matter paster and the copper lead foot on plastic cement seat; On this plastic cement seat, be provided with package cavity; This aluminium matter paster has die bond portion, and the surface of this die bond portion is exposed in package cavity, and the bottom surface of aluminium matter paster is exposed to the bottom surface of plastic cement seat; This copper lead foot includes bonding wire portion and the weld part of one-body molded connection, and bonding wire portion is exposed in package cavity, and weld part is exposed to plastic cement seat outside.
As a kind of preferred version, described aluminium matter paster is specular aluminium material.
As a kind of preferred version, between described aluminium matter paster and copper lead foot, dislocation is formed with difference in height up and down, and aluminium matter paster is positioned at the below of copper lead foot.
As a kind of preferred version, described copper lead foot includes anodal lead foot and negative pole lead foot, the anodal weld part of lead foot and the weld part of negative pole lead foot are positioned at respectively two diagonal position places of plastic cement seat, and the bonding wire portion of anodal lead foot and the bonding wire portion of negative pole lead foot extend and symmetrical both sides that are positioned at die bond portion respectively along the two relative side of plastic cement seat respectively.
As a kind of preferred version, on described plastic cement seat, being provided with negative pole identification indicates, this negative pole identification indicates the top that is positioned at negative pole lead foot, this negative pole identification is denoted as a circular hole, and this plastic cement seat has the covering part for preventing creepage phenomenon, this covering part wraps the polarity marker location of copper lead foot.
As a kind of preferred version, on described aluminium matter paster and copper lead foot, be provided with the structure that gets stuck, on this aluminium matter paster and copper lead foot, be provided with the impermeable groove of red ink.
As a kind of preferred version, the bottom surface of described plastic cement seat is provided with the location hole for withstanding copper lead foot.
A kind of double material strips LED support module, includes aluminum bracket, copper coin support and multiple plastic cement seat; This aluminum bracket include aluminium material band and with the one-body molded multiple aluminium matter pasters that are connected of aluminium material band; This copper coin support include copper material strip and with the copper lead foot of one-body molded many groups of being connected of copper material strip, this copper material strip and aluminium material band are each other together with folded being located at, each is organized by the side of aluminium matter paster that copper lead foot is positioned at correspondence, one group of copper lead foot, an aluminium matter paster and a plastic cement seat produced by insert molding and form aforementioned LED support.
As a kind of preferred version, described copper material strip is folded in the top of aluminium material band.
A manufacture method for LED support, is characterized in that: include following steps:
(1) produce aluminum bracket and copper coin support by impact style, this aluminum bracket include aluminium material band and with the one-body molded multiple aluminium matter pasters that are connected of aluminium material band; This copper coin support include copper material strip and with the copper lead foot of one-body molded many groups of being connected of copper material strip;
(2) copper coin support folded in aluminum bracket and put into mould, each is organized by the side of aluminium matter paster that copper lead foot is positioned at correspondence;
(3) each is organized copper lead foot and corresponding aluminium matter paster and corresponding plastic cement seat produced by insert molding and forms LED support, thereby has obtained double material strips LED support module;
(4) each group of copper lead foot separated with the cut-out that is connected between copper material strip, and each aluminium matter paster is separated with the cut-out that is connected between aluminium material band.
The present invention compared with prior art has obvious advantage and beneficial effect, particularly, and as shown from the above technical solution:
One, by adopting aluminum material as paster, and coordinate employing copper material as lead foot, guaranteeing under the impregnable prerequisite of radiating effect, effectively prevent the sulfuration problem that die bond bonding wire region occurs, promote product quality, improved the reflectivity of product simultaneously, promoted the brightness of product, wattage can rise to 14W by original 7W, thereby makes the serviceability of product better.
Two, by the bonding wire portion of the bonding wire portion of anodal lead foot and negative pole lead foot is extended and symmetrical both sides that are positioned at die bond portion respectively along the two relative side of plastic cement seat respectively, so in the time of die bond bonding wire, can adopt left and right mode bonding wire, replace the gradient mode bonding wire of tradition, left and right mode bonding wire can adopt automatic welding to realize, realize fast assembling product thereby be beneficial to, improved assembling product efficiency.
Three, by copper coin support being folded in aluminum bracket and being put into mould injection mo(u)lding, make the manufacture method of product simple, be convenient to realize mass production, reduce production costs thereby be beneficial to.
For more clearly setting forth architectural feature of the present invention and effect, below in conjunction with accompanying drawing and specific embodiment, the present invention is described in detail.
Accompanying drawing explanation
Fig. 1 is the front schematic perspective view of LED support in the present invention's preferred embodiment;
Fig. 2 is the reverse side schematic perspective view of LED support in the present invention's preferred embodiment;
Fig. 3 is the exploded view of LED support in the present invention's preferred embodiment;
Fig. 4 is the front view of LED support in the present invention's preferred embodiment;
Fig. 5 is the sectional view of A-A direction in Fig. 4;
Fig. 6 is the sectional view of B-B direction in Fig. 4;
Fig. 7 is the schematic perspective view of plastic cement seat in the present invention's preferred embodiment;
Fig. 8 is the front schematic perspective view of double material strips LED support module in the present invention's preferred embodiment;
Fig. 9 is the reverse side schematic perspective view of double material strips LED support module in the present invention's preferred embodiment;
Figure 10 is the schematic perspective view of aluminum bracket in the present invention's preferred embodiment;
Figure 11 is the schematic perspective view of copper coin support in the present invention's preferred embodiment.
Accompanying drawing identifier declaration:
10, plastic cement seat 11, package cavity
12, negative pole identification sign 13, location hole
14, covering part 20, aluminium matter paster
21, die bond portion 30, copper lead foot
31, anodal lead foot 32, negative pole lead foot
301, bonding wire portion 302, weld part
101, get stuck structure 102, the impermeable groove of red ink
200, aluminum bracket 20 ', aluminium material band
300, copper coin support 30 ', copper material strip.
Embodiment
Please refer to shown in Fig. 1 to Fig. 7, the concrete structure that it has demonstrated LED support in the present invention's preferred embodiment, includes plastic cement seat 10 and is arranged at aluminium matter paster 20 and the copper lead foot 30 on plastic cement seat 10.
On this plastic cement seat 10, be provided with package cavity 11, this package cavity 11 is for holding and packaging LED chips (not shown),
This aluminium matter paster 20 has die bond portion 21, the surface of this die bond portion 21 is exposed in package cavity 11, this die bond portion 21 is for accepting LED chip, the bottom surface of aluminium matter paster 20 is exposed to the bottom surface of plastic cement seat 10, and in the present embodiment, this aluminium matter paster 20 is specular aluminium material, adopt specular aluminium material can more effectively prevent that die bond bonding wire region from sulfuration problem occurring, the reflectivity that simultaneously also can improve product, has promoted the brightness of product, and wattage can rise to 14W by original 7W.
This copper lead foot 30 includes bonding wire portion 301 and the weld part 302 of one-body molded connection, bonding wire portion 301 is exposed in package cavity 11, weld part 302 is exposed to plastic cement seat 10 outsides, particularly, in the present embodiment, this copper lead foot 30 includes anodal lead foot 31 and negative pole lead foot 32, the anodal weld part 302 of lead foot 31 and the weld part 302 of negative pole lead foot 32 lay respectively at two diagonal position places of plastic cement seat 10, the anodal bonding wire portion 301 of lead foot 31 and the bonding wire portion 301 of negative pole lead foot 31 extend and symmetrical both sides (as shown in Figure 4 and Figure 6) that are positioned at die bond portion 21 respectively along the two relative side of plastic cement seat 10 respectively, so in the time that being installed, LED chip can adopt left and right mode bonding wire, can be convenient to realize automatic welding, improve production efficiency.
And between this aluminium matter paster 20 and copper lead foot 30, dislocation is formed with difference in height up and down, and in the present embodiment, this aluminium matter paster 20 is positioned at the below of copper lead foot 30.In addition, on this aluminium matter paster 20 and copper lead foot 30, be provided with the structure 101 that gets stuck, this structure 101 that gets stuck is for abnormity, effectively to fix the position of plastic cement seat 10, prevent that plastic cement seat 10 from occurring loosening, and, on this aluminium matter paster 20 and copper lead foot 30, be provided with the impermeable groove 102 of red ink, to improve sealing effectiveness, prevent that red ink from permeating into.
In addition, be provided with negative pole identification and indicate 12 on this plastic cement seat 10, this negative pole identification sign 12 is positioned at the top of negative pole lead foot 32, to facilitate user to identify the both positive and negative polarity of product, prevents that user is anti-loaded.In the present embodiment, it is a circular hole that this negative pole identification indicates 12, not to be limited; And this plastic cement seat 10 has the covering part 14 for preventing creepage phenomenon, this covering part 14 wraps the polarity marker location of copper lead foot 30, makes product there will not be in the course of the work creepage phenomenon; The bottom surface of this plastic cement seat 10 is provided with the location hole 13 for withstanding copper lead foot 30, and when plastics produced by insert molding (molding), location hole 13 can prevent that plastics from swashing and affecting die bond bonding wire region and both positive and negative polarity bonding wire region.
Please refer to shown in Fig. 8 to Figure 11, it has demonstrated the concrete structure of double material strips LED support module in the present invention's preferred embodiment, and it includes aluminum bracket 200, copper coin support 300 and multiple plastic cement seat 10.
This aluminum bracket 200 include aluminium material band 20 ' and with aluminium material band 20 ' one-body molded multiple aluminium matter pasters 20 that are connected, this copper coin support 300 include copper material strip 30 ' and with the copper lead foot 30 of copper material strip 30 ' one-body molded many groups of being connected, this copper material strip 30 ' with aluminium material band 20 ' is each other folded be located at together with, in the present embodiment, this copper material strip 30 ' fold in aluminium material band 20 ' top, to make copper lead foot 30 be formed with difference in height with aluminium matter paster 20, each is organized by the side of aluminium matter paster 20 that copper lead foot 30 is positioned at correspondence, the number of the group number of this copper lead foot 30 and aluminium matter paster 20, the number of plastic cement seat 10 equates, one group of copper lead foot 30, an aluminium matter paster 20 and plastic cement seat 10 produced by insert molding and form aforementioned LED support.
When making, first, produce aluminum bracket 200 and copper coin support 300 by impact style; Then, copper coin support 300 folded in aluminum bracket 200 and put into mould; Then, each is organized copper lead foot 30 and corresponding aluminium matter paster 20 and corresponding plastic cement seat 10 produced by insert molding and forms LED support, thereby has obtained double material strips LED support module (as shown in Figure 8 and Figure 9); Then, by each group of copper lead foot 30 and copper material strip 30 ' between be connected to cut off and separate, and by each aluminium matter paster 20 and aluminium material band 20 ' between the cut-out that is connected separate, can obtain single led support finished product (as depicted in figs. 1 and 2).
Design focal point of the present invention is: first, by adopting aluminum material as paster, and coordinate employing copper material as lead foot, guaranteeing under the impregnable prerequisite of radiating effect, effectively preventing the sulfuration problem that die bond bonding wire region occurs, promoting product quality, improve the reflectivity of product simultaneously, promoted the brightness of product, wattage can rise to 14W by original 7W, thereby makes the serviceability of product better.Secondly, by the bonding wire portion of the bonding wire portion of anodal lead foot and negative pole lead foot is extended and symmetrical both sides that are positioned at die bond portion respectively along the two relative side of plastic cement seat respectively, so in the time of die bond bonding wire, can adopt left and right mode bonding wire, replace the gradient mode bonding wire of tradition, left and right mode bonding wire can adopt automatic welding to realize, and realizes fast assembling product thereby be beneficial to, and has improved assembling product efficiency.Moreover, by copper coin support being folded in aluminum bracket and being put into mould injection mo(u)lding, make the manufacture method of product simple, be convenient to realize mass production, reduce production costs thereby be beneficial to.
The above, it is only preferred embodiment of the present invention, not technical scope of the present invention is imposed any restrictions, therefore any trickle modification, equivalent variations and modification that every foundation technical spirit of the present invention is done above embodiment all still belong in the scope of technical solution of the present invention.
Claims (10)
1. a LED support, is characterized in that: include plastic cement seat and be arranged at aluminium matter paster and the copper lead foot on plastic cement seat; On this plastic cement seat, be provided with package cavity; This aluminium matter paster has die bond portion, and the surface of this die bond portion is exposed in package cavity, and the bottom surface of aluminium matter paster is exposed to the bottom surface of plastic cement seat; This copper lead foot includes bonding wire portion and the weld part of one-body molded connection, and bonding wire portion is exposed in package cavity, and weld part is exposed to plastic cement seat outside.
2. LED support according to claim 1, is characterized in that: described aluminium matter paster is specular aluminium material.
3. LED support according to claim 1, is characterized in that: between described aluminium matter paster and copper lead foot, dislocation is formed with difference in height up and down, and aluminium matter paster is positioned at the below of copper lead foot.
4. LED support according to claim 1, it is characterized in that: described copper lead foot includes anodal lead foot and negative pole lead foot, the anodal weld part of lead foot and the weld part of negative pole lead foot are positioned at respectively two diagonal position places of plastic cement seat, and the bonding wire portion of anodal lead foot and the bonding wire portion of negative pole lead foot extend and symmetrical both sides that are positioned at die bond portion respectively along the two relative side of plastic cement seat respectively.
5. LED support according to claim 4, it is characterized in that: on described plastic cement seat, be provided with negative pole identification and indicate, this negative pole identification indicates the top that is positioned at negative pole lead foot, this negative pole identification is denoted as a circular hole, and this plastic cement seat has the covering part for preventing creepage phenomenon, this covering part wraps the polarity marker location of copper lead foot.
6. LED support according to claim 1, is characterized in that: on described aluminium matter paster and copper lead foot, be provided with the structure that gets stuck, be provided with the impermeable groove of red ink on this aluminium matter paster and copper lead foot.
7. LED support according to claim 1, is characterized in that: the bottom surface of described plastic cement seat is provided with the location hole for withstanding copper lead foot.
8. a double material strips LED support module, is characterized in that: include aluminum bracket, copper coin support and multiple plastic cement seat; This aluminum bracket include aluminium material band and with the one-body molded multiple aluminium matter pasters that are connected of aluminium material band; This copper coin support include copper material strip and with the copper lead foot of one-body molded many groups of being connected of copper material strip, this copper material strip and aluminium material band are each other together with folded being located at, each is organized by the side of aluminium matter paster that copper lead foot is positioned at correspondence, one group of copper lead foot, an aluminium matter paster and a plastic cement seat produced by insert molding and form the LED support as described in claim 1 to 7 any one.
9. double material strips LED support module according to claim 8, is characterized in that: described copper material strip is folded in the top of aluminium material band.
10. a manufacture method for the LED support as described in claim 1 to 7 any one, is characterized in that: include following steps:
(1) produce aluminum bracket and copper coin support by impact style, this aluminum bracket include aluminium material band and with the one-body molded multiple aluminium matter pasters that are connected of aluminium material band; This copper coin support include copper material strip and with the copper lead foot of one-body molded many groups of being connected of copper material strip;
(2) copper coin support folded in aluminum bracket and put into mould, each is organized by the side of aluminium matter paster that copper lead foot is positioned at correspondence;
(3) each is organized copper lead foot and corresponding aluminium matter paster and corresponding plastic cement seat produced by insert molding and forms LED support, thereby has obtained double material strips LED support module;
(4) each group of copper lead foot separated with the cut-out that is connected between copper material strip, and each aluminium matter paster is separated with the cut-out that is connected between aluminium material band.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410061413.0A CN103855286B (en) | 2014-02-20 | 2014-02-24 | LED support and preparation method thereof and double material strips LED support module |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420073032X | 2014-02-20 | ||
| CN201420073032 | 2014-02-20 | ||
| CN201420073032.X | 2014-02-20 | ||
| CN201410061413.0A CN103855286B (en) | 2014-02-20 | 2014-02-24 | LED support and preparation method thereof and double material strips LED support module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103855286A true CN103855286A (en) | 2014-06-11 |
| CN103855286B CN103855286B (en) | 2016-09-21 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410061413.0A Active CN103855286B (en) | 2014-02-20 | 2014-02-24 | LED support and preparation method thereof and double material strips LED support module |
| CN201420077925.1U Expired - Lifetime CN203721766U (en) | 2014-02-20 | 2014-02-24 | LED bracket and double-belt LED bracket module |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420077925.1U Expired - Lifetime CN203721766U (en) | 2014-02-20 | 2014-02-24 | LED bracket and double-belt LED bracket module |
Country Status (1)
| Country | Link |
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| CN (2) | CN103855286B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104882524A (en) * | 2015-06-01 | 2015-09-02 | 木林森股份有限公司 | SMD type LED support based on aluminum base material, and lamp bead employing the support |
| CN109904147A (en) * | 2014-09-05 | 2019-06-18 | 光宝光电(常州)有限公司 | Substrate and light emitting device comprising the substrate |
| WO2019214490A1 (en) * | 2018-05-10 | 2019-11-14 | 京东方科技集团股份有限公司 | Light emitting diode and manufacturing method thereof, backlight and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2007250979A (en) * | 2006-03-17 | 2007-09-27 | Zeniya Sangyo Kk | Semiconductor package |
| KR20110111173A (en) * | 2010-04-02 | 2011-10-10 | 김경동 | Lead-frame for led light and method thereof |
| CN203260639U (en) * | 2013-04-03 | 2013-10-30 | 中山市光圣半导体科技有限责任公司 | High-luminous-efficiency and good-heat-dissipation COB light source |
| CN203260619U (en) * | 2013-04-03 | 2013-10-30 | 中山市光圣半导体科技有限责任公司 | Novel high-heat-conductivity COB substrate |
| CN103426998A (en) * | 2013-07-24 | 2013-12-04 | 博罗承创精密工业有限公司 | Light emitting diode (LED) support and copper plate support |
| CN203434194U (en) * | 2013-07-24 | 2014-02-12 | 博罗承创精密工业有限公司 | LED stent and copper plate stent |
-
2014
- 2014-02-24 CN CN201410061413.0A patent/CN103855286B/en active Active
- 2014-02-24 CN CN201420077925.1U patent/CN203721766U/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007250979A (en) * | 2006-03-17 | 2007-09-27 | Zeniya Sangyo Kk | Semiconductor package |
| KR20110111173A (en) * | 2010-04-02 | 2011-10-10 | 김경동 | Lead-frame for led light and method thereof |
| CN203260639U (en) * | 2013-04-03 | 2013-10-30 | 中山市光圣半导体科技有限责任公司 | High-luminous-efficiency and good-heat-dissipation COB light source |
| CN203260619U (en) * | 2013-04-03 | 2013-10-30 | 中山市光圣半导体科技有限责任公司 | Novel high-heat-conductivity COB substrate |
| CN103426998A (en) * | 2013-07-24 | 2013-12-04 | 博罗承创精密工业有限公司 | Light emitting diode (LED) support and copper plate support |
| CN203434194U (en) * | 2013-07-24 | 2014-02-12 | 博罗承创精密工业有限公司 | LED stent and copper plate stent |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109904147A (en) * | 2014-09-05 | 2019-06-18 | 光宝光电(常州)有限公司 | Substrate and light emitting device comprising the substrate |
| CN109904147B (en) * | 2014-09-05 | 2023-04-11 | 光宝光电(常州)有限公司 | Substrate and light emitting device comprising same |
| CN104882524A (en) * | 2015-06-01 | 2015-09-02 | 木林森股份有限公司 | SMD type LED support based on aluminum base material, and lamp bead employing the support |
| WO2019214490A1 (en) * | 2018-05-10 | 2019-11-14 | 京东方科技集团股份有限公司 | Light emitting diode and manufacturing method thereof, backlight and display device |
| US11322671B2 (en) | 2018-05-10 | 2022-05-03 | Boe Optical Science And Technology Co., Ltd. | Light-emitting diode, method for manufacturing the same, backlight source and display device for improving heat dissipation |
Also Published As
| Publication number | Publication date |
|---|---|
| CN203721766U (en) | 2014-07-16 |
| CN103855286B (en) | 2016-09-21 |
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