CN201853746U - LED (light-emitting diode) and LED lighting device - Google Patents

Abstract

The utility model is applicable to the lighting field, and provides an LED and an LED lighting device. The LED includes a heat dissipation base and an electrode pin integrally formed by injection molding with the heat dissipation base. The heat dissipation base is fixed with an LED chip, the LED chip is electrically connected to the electrode pin. In the utility model, the LED chip is fixed on the heat dissipation base, and the electrode pin is electrically connected to the LED chip through the injection molding material to realize the packaging structure of thermoelectric separation, which greatly improves the heat dissipation performance of the LED and helps to prolong the service life of the LED. .

Description

A kind of LED and LED lighting device

technical field

The utility model belongs to the lighting field, in particular to an LED and an LED lighting device.

Background technique

As we all know, LED, as a new generation of green lighting source, has many advantages such as high luminous efficiency, long life, small size, energy saving, and environmental protection. plant growth etc.

Due to poor heat dissipation, the existing LEDs have a short service life and low luminous efficiency.

Utility model content

The purpose of the embodiments of the present invention is to provide an LED, aiming at solving the problem of poor heat dissipation effect of the existing LED.

The embodiment of the utility model is achieved in this way. An LED includes a heat dissipation base and an electrode pin integrally injection molded with the heat dissipation base. The heat dissipation base is fixed with an LED chip, and the LED chip is connected to the heat dissipation base. The electrode pins are electrically connected.

In the embodiment of the present utility model, the heat dissipation base is composed of a first base and a second base integrally formed with the first base, and the first base and the second base are flat , the length of the first base is smaller than the length of the second base.

As an embodiment of the present invention, the electrode pins have multiple bends and are arranged in steps.

Another object of the embodiments of the present utility model is to provide an LED lighting device, which adopts the above-mentioned LED.

In the embodiment of the utility model, the LED chip is fixed on the heat dissipation base, and the electrode pins are electrically connected to the LED chip through the injection molding material to realize the packaging structure of thermoelectric separation, which greatly improves the heat dissipation performance of the LED and helps to extend the life of the LED. service life.

Description of drawings

Fig. 1 is a transverse sectional view of an LED provided by an embodiment of the present invention;

Fig. 2 is a longitudinal sectional view of the LED provided by the embodiment of the present invention.

Detailed ways

In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the utility model.

In the embodiment of the utility model, the LED chip is fixed on the heat dissipation base, and the electrode pins are electrically connected to the LED chip through the injection molding material to realize the packaging structure of thermoelectric separation, which greatly improves the heat dissipation performance of the LED.

The LED provided by the embodiment of the utility model includes a heat dissipation base and an electrode pin integrally formed by injection molding with the heat dissipation base. The heat dissipation base is fixed with an LED chip, and the LED chip is electrically connected to the electrode pin. connect.

The realization of the utility model is described in detail below in conjunction with specific embodiments.

As shown in Fig. 1 and Fig. 2, the LED provided by the embodiment of the utility model has a heat dissipation base 1 composed of a first base 11 and a second base 12, and the first base 11 and the second base 12 are both It is flat, and the length of the first base 11 is smaller than the length of the second base 12 . The heat dissipation base 1 is preferably made of copper, and the first base 11 and the second base 12 are integrally formed.

In the embodiment of the present utility model, the electrode pin 2 is in a stepped shape, and is composed of a first bent portion 21 , a second bent portion 22 and a third bent portion 23 connected in sequence. Both ends of the second bent portion 22 are vertically connected to the first bent portion 21 and the third bent portion 23 respectively, and the LED using the electrode pin is suitable for SMD soldering in the use environment.

The heat dissipation base 1 is integrally molded with two electrode pins 2 , one of which is connected to the positive pole of the power supply, and the other electrode pin is connected to the negative pole of the power supply. When multiple LED chips need to be arranged on the heat dissipation base, the number of required electrode pins is correspondingly multiplied.

In the embodiment of the present invention, the outer surface of the injection molding material 3 is flush with the outer surface of the second base 12, so that the entire bottom surface of the LED is a heat dissipation surface, which enhances the heat dissipation effect of the LED. The injection molding material 3 covers the upper surface of the second base 12 and covers the lower side of the first base 11, the first bent portion 21 of the electrode pin 2 passes through the injection molding material 3, and the inner end surface of the first bent portion 21 It emerges from the injection molding compound 3 as a welding line region. The contact area between the injection molding material 3 and the heat dissipation base 1 and the electrode pin 2 is large, and the grasping is firm, which improves the reliability of the LED.

The above-mentioned injection molding material 3 is molded on the first bending portion 21 into a reflective cup 4 , and the inner surface of the reflective cup 4 is an inclined surface or a conical surface. The lower surface of the third bent portion 23 is flush with the lower surface of the second base 12 . The height difference between the upper surface of the first bending portion 21 and the upper surface of the first base 11 is the thickness of one LED chip. The injection molding material 3 is preferably various white thermoplastic polymer materials, such as PPA (Polyphosphoric Acid, polyphosphoric acid).

During packaging, the LED chip 5 is fixed on the upper surface of the heat dissipation base 1, the LED chip 5 is electrically connected to the welding wire area of the electrode pin 2 through the wire 6, and the heat emitted by the LED chip 5 is conducted to the outside through the heat dissipation base 1 , the driving power is electrically connected to the LED chip 5 through the electrode pin 2 and the wire 6 to realize thermoelectric separation, greatly improving the heat dissipation performance of the LED, and correspondingly increasing the service life of the LED. After die bonding, the upper surface of the LED chip 5 is flush with the upper surface of the first bending portion 21, and the required wire is relatively short. During wire bonding, the arc of the wire is easy to control, and the quality of the wire is high. The light emitted by the LED chip 5 is reflected by the reflective cup 4 , which improves the light extraction efficiency of the LED chip 5 .

The packaging material is filled in the reflective cup 4 to make a finished LED product. Of course, phosphor powder matching the LED chip 5 can be added into the packaging material to obtain light of a desired color.

As an embodiment of the present invention, the electrode pin 2 is straight, and the LED using the electrode pin is suitable for sinking welding in the use environment.

In the embodiment of the utility model, the LED chip is fixed on the heat dissipation base, and the electrode pins are electrically connected to the LED chip through the injection molding material to realize the packaging structure of thermoelectric separation, which greatly improves the heat dissipation performance of the LED and helps to extend the life of the LED. service life. When bonding wire after solid crystal, the arc of wire is easy to control, and the quality of bonding wire is high. In addition, the light emitted by the LED chip is reflected by the reflective cup formed by the injection molding material, which improves the light extraction efficiency of the LED chip.

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present utility model shall be included in this utility model. within the scope of protection of utility models.

Claims (10)

1. a LED is characterized in that, described LED comprises cooling base and the electrode pin that is one with described cooling base injection mo(u)lding, and described cooling base is installed with led chip, and described led chip is electrically connected with described electrode pin.

2. LED as claimed in claim 1, it is characterized in that, described cooling base constitutes by first pedestal with integrated second pedestal of described first pedestal, and described first pedestal and second pedestal all are flat, and the length of described first pedestal is less than the length of described second pedestal.

3. LED as claimed in claim 2 is characterized in that described electrode pin has a plurality of bendings, stepped arranging.

4. LED as claimed in claim 3 is characterized in that, described electrode pin is made of first bending part that joins successively, second bending part and the 3rd bending part, the two ends of described second bending part respectively with described first bending part and the 3rd bending part vertical connection.

5. LED as claimed in claim 4 is characterized in that, described electrode pin is shaped to one by injected plastics material and described cooling base, and the lateral surface of described injected plastics material is concordant with the lateral surface of described second pedestal.

6. LED as claimed in claim 5, it is characterized in that, described injected plastics material covers the upper surface of described second pedestal and coats the downside of described first pedestal, first bending part of described electrode pin passes described injected plastics material, and the inner end of described first bending part exposes from described injected plastics material as wire welding area.

7. LED as claimed in claim 5 is characterized in that, described injected plastics material is shaped to reflector on described first bending part, and the inner surface of described reflector is the inclined-plane or the conical surface.

8. LED as claimed in claim 5 is characterized in that the lower surface of described the 3rd bending part is concordant with the lower surface of described second pedestal, and the difference in height of the upper surface of the upper surface of described first bending part and described first pedestal is the thickness of a led chip.

9. LED as claimed in claim 1 is characterized in that, described electrode pin is a flat.

10. a LED lighting device is characterized in that, described LED lighting device adopts as each described LED of claim 1～9.

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