CN212156678U

CN212156678U - SMD type LED lamp

Info

Publication number: CN212156678U
Application number: CN202020351726.0U
Authority: CN
Inventors: 董新立; 尚海锋; 苏安
Original assignee: Jiangsu Alite Semiconductor Technology Co ltd
Current assignee: Jiangsu Alite Semiconductor Technology Co ltd
Priority date: 2020-03-19
Filing date: 2020-03-19
Publication date: 2020-12-15
Anticipated expiration: 2030-03-19

Abstract

The utility model discloses a SMD type LED lamp, which mainly comprises a heat dissipation bottom plate, a heat dissipation bracket and an LED chip arranged on the heat dissipation bracket; the heat dissipation bracket is fixed on the heat dissipation bottom plate; the heat dissipation support comprises a heat dissipation top plate and a heat dissipation shell in a trapezoidal round table shape; the heat dissipation shell is positioned between the heat dissipation top plate and the heat dissipation bottom plate; the LED chip is fixed on the heat dissipation top plate through an adhesive layer and is electrically connected as necessary; the heat dissipation support is utilized to increase the heat dissipation area of the LED chip, so that the heat dissipation efficiency is improved, and the service life of the whole SMD type LED is prolonged.

Description

SMD type LED lamp

Technical Field

The utility model relates to a LED lamp technical field especially relates to a SMD type LED lamp.

Background

With the development of the semiconductor illumination field, light emitting diodes (LEDs for short) are widely used in the illumination and display fields due to their characteristics of high brightness, low energy consumption, small size, long life, safety, reliability, etc., and are considered as a fourth generation light source to replace incandescent lamps, fluorescent lamps, and high-pressure gas discharge lamps; there are various kinds of LEDs, SMD is one of them, and SMD LEDs means surface mount light emitting diodes; the SMD type LED lamp has high production efficiency, but the heat is easy to concentrate in the use process, and if the heat dissipation effect is poor, the service life of the SMD type LED lamp is directly influenced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the main technical problem who solves is: the SMD type LED lamp can enhance the heat dissipation effect and prolong the service life.

In order to solve the main technical problems, the following technical scheme is adopted:

an SMD type LED lamp comprises a heat dissipation bottom plate, a heat dissipation bracket and an LED chip arranged on the heat dissipation bracket; the heat dissipation bracket is fixed on the heat dissipation bottom plate; the heat dissipation support comprises a heat dissipation top plate and a heat dissipation shell in a trapezoidal round table shape; the heat dissipation shell is positioned between the heat dissipation top plate and the heat dissipation bottom plate; the LED chip is fixed on the heat dissipation top plate.

Preferably, a plurality of radiating supports are uniformly distributed on the radiating bottom plate; a light-transmitting mirror is arranged on the outer side of each heat dissipation bracket; the inner side of the light-transmitting mirror is provided with a fluorescent layer.

Preferably, the heat dissipation bottom plate, the heat dissipation shell and the heat dissipation top plate are all made of metal or ceramic materials with good heat conduction performance.

Preferably, the outer circumferential surface of the heat dissipation housing is provided with evenly distributed fins.

Preferably, the top of the heat dissipation shell is provided with a plurality of claws which are uniformly distributed in a circular shape; the heat dissipation top plate is fixed at the top of the heat dissipation shell through the clamping jaws.

Compared with the prior art, the utility model discloses be applied to the actual utensil and possess following advantage:

(1) the added radiating bracket comprises a radiating shell and a radiating top plate of the trapezoidal round table; fixing the LED chip on the heat dissipation top plate through an adhesive layer, and performing necessary electrical connection; the heat dissipation support is utilized to increase the heat dissipation area of the LED chip, so that the heat dissipation efficiency is improved, and the service life of the whole SMD type LED is prolonged.

(2) The fins are uniformly distributed on the outer surface of the heat dissipation shell and extend from the bottom to the top of the heat dissipation shell, so that the heat dissipation area is increased; there is integrated into one piece's jack catch heat dissipation casing top, and the heat dissipation roof can directly be placed in the inboard of jack catch to accomplish being connected of heat dissipation roof and heat dissipation casing, the connection of jack catch can further increase heat radiating area, thereby further increase of service life.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some examples of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive work.

Fig. 1 is a schematic structural view of a single heat dissipation bracket of an SMD type LED lamp according to an embodiment of the present invention.

Fig. 2 is a schematic top view of a plurality of heat dissipation brackets of an SMD type LED lamp according to an embodiment of the present invention.

Fig. 3 is a schematic top view of a heat dissipation housing of an SMD type LED lamp according to an embodiment of the present invention.

Fig. 4 is a schematic distribution diagram of the claws of the SMD LED lamp according to the embodiment of the present invention.

Fig. 5 is a structural significance diagram of a claw of an SMD type LED lamp according to an embodiment of the present invention.

In the figure: the LED lamp comprises a heat dissipation bottom plate 1, a heat dissipation support 2, an LED chip 3, a heat dissipation top plate 21, a heat dissipation shell 22, a light-transmitting mirror 4, a fluorescent layer 5, fins 6 and clamping jaws 7.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, an SMD type LED lamp includes a heat dissipation base plate 1, a heat dissipation bracket 2, and an LED chip 3 disposed on the heat dissipation bracket; the heat dissipation bracket 2 is fixed on the heat dissipation bottom plate 1 in a welding mode and the like; the heat dissipation bracket 2 comprises a heat dissipation top plate 21 and a heat dissipation shell 22 in a trapezoidal truncated cone shape; the heat dissipation shell 22 is positioned between the heat dissipation top plate 21 and the heat dissipation bottom plate 1, the top of the heat dissipation shell 22 is fixedly connected with the heat dissipation top plate 21, the bottom of the heat dissipation shell 22 is fixedly connected with the heat dissipation bottom plate 1, and the heat dissipation top plate 21 is parallel to the heat dissipation bottom plate 1; LED chip 3 is fixed at heat dissipation roof 21 through solid brilliant glue film, and LED chip 3 passes through gold thread and heat dissipation support fixed connection to certain electricity is connected, has increased heat dissipation support 2 between LED chip 3 and heat dissipation bottom plate 1, increase heat transfer area that can be further, improves the radiating efficiency, and the help dispels the heat fast, promotes the life of LED chip.

Furthermore, a plurality of radiating supports 2 are uniformly distributed on the radiating bottom plate 1, the radiating supports 2 are equivalent to a plurality of bulges of the radiating bottom plate 1, and the number and the distribution number of the bulges can be reasonably arranged according to specific use conditions; the outer side of each heat dissipation support 2 is provided with a light-transmitting mirror 4, each light-transmitting mirror 4 is in a hill shape, and the light-transmitting mirrors 4 are buckled or packaged according to the existing injection molding process; the inner side of the light-transmitting mirror 4 is provided with a fluorescent layer 5, the fluorescent layer 5 is attached to the inner side of the light-transmitting mirror 4 in a coating mode, and the light-transmitting mirror 4 with the fluorescent layer 5 can be selected as required to help the LED lamp to transmit light.

Further, the heat dissipation bottom plate 1, the heat dissipation housing 22, and the heat dissipation top plate 21 are all made of metal or ceramic material with good heat conductivity, such as aluminum, copper, and the like.

Further, the outer peripheral surface of heat dissipation casing 22 is provided with evenly distributed's fin 6, and heat dissipation casing 22 is the trapezoidal round platform that the up end area is greater than the lower terminal surface area, and fin 6 extends to the top of heat dissipation casing 22 from the bottom of heat dissipation casing 22, and a plurality of fins 6 are around the surface a week of heat dissipation casing 22, and fin 6 can increase the radiating rate.

Furthermore, a plurality of clamping jaws 7 which are circular and evenly distributed are arranged at the top of the heat dissipation shell 22, the plurality of clamping jaws 7 are evenly distributed along the top of the heat dissipation shell 22, and the clamping jaws 7 and the heat dissipation shell 22 are integrally formed; the heat dissipation top plate 21 is fixed at the top of the heat dissipation shell 22 through the clamping jaws 7, and the outer diameter of the heat dissipation top plate 21 is the same as the inner diameter of the clamping jaws 7; the heat dissipation top plate 21 is welded or directly placed on the inner side of the clamping jaw 7, so that the heat dissipation top plate is connected with the heat dissipation shell 22 into a whole, the clamping jaw 7 is fixed, the contact area between the heat dissipation top plate 21 and the heat dissipation shell 22 can be increased, and the heat dissipation effect is further improved.

The working principle is as follows: fixing the heat dissipation shells 22 of the plurality of heat dissipation supports 2 on the heat dissipation bottom plate 1 by welding, fixing the LED chips 3 on the heat dissipation top plate 21 by glue layers, fixing the heat dissipation top plate 21 on the heat dissipation shells 22 and performing electrical connection; and fixing the light-transmitting mirror 4 at the outer side of the heat dissipation bracket 2 for packaging.

It should be noted that, in the present invention, "upper, lower, left and right" are defined based on the relative position of the components in the drawings, and are only for the clarity and convenience of the description of the technical solution, it should be understood that the application of the directional terms does not limit the protection scope of the present application.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or some of the technical features may be substituted by equivalent substitutions, modifications and the like, all of which are within the spirit and principle of the present invention.

Claims

1. An SMD type LED lamp characterized in that: the LED module comprises a heat dissipation bottom plate, a heat dissipation bracket and an LED chip arranged on the heat dissipation bracket; the heat dissipation bracket is fixed on the heat dissipation bottom plate; the heat dissipation support comprises a heat dissipation top plate and a heat dissipation shell in a trapezoidal round table shape; the heat dissipation shell is positioned between the heat dissipation top plate and the heat dissipation bottom plate; the LED chip is fixed on the heat dissipation top plate.

2. -an SMD type LED lamp as claimed in claim 1, wherein: a plurality of radiating supports are uniformly distributed on the radiating bottom plate; a light-transmitting mirror is arranged on the outer side of each heat dissipation bracket; the inner side of the light-transmitting mirror is provided with a fluorescent layer.

3. -an SMD type LED lamp as claimed in claim 1, wherein: the heat dissipation bottom plate, the heat dissipation shell and the heat dissipation top plate are all made of metal or ceramic materials with good heat conducting performance.

4. -an SMD type LED lamp as claimed in claim 1, wherein: the outer peripheral surface of the heat dissipation shell is provided with evenly distributed fins.

5. -an SMD type LED lamp as claimed in claim 1, wherein: the top of the heat dissipation shell is provided with a plurality of clamping jaws which are uniformly distributed in a circular shape; the heat dissipation top plate is fixed at the top of the heat dissipation shell through the clamping jaws.