CN205122636U - Integrated support of COB - Google Patents
Integrated support of COB Download PDFInfo
- Publication number
- CN205122636U CN205122636U CN201520998379.XU CN201520998379U CN205122636U CN 205122636 U CN205122636 U CN 205122636U CN 201520998379 U CN201520998379 U CN 201520998379U CN 205122636 U CN205122636 U CN 205122636U
- Authority
- CN
- China
- Prior art keywords
- conductive layer
- layer
- cob
- integrated stand
- injection molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000003854 Surface Print Methods 0.000 claims abstract description 16
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 25
- 238000001746 injection moulding Methods 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 230000004888 barrier function Effects 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000005538 encapsulation Methods 0.000 abstract description 5
- 238000000465 moulding Methods 0.000 abstract 2
- 229920003023 plastic Polymers 0.000 abstract 2
- 239000004033 plastic Substances 0.000 abstract 2
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses an integrated support of COB, the insulating layer, conducting layer, surface printing layer and the support of moulding plastics that from bottom to top set gradually on radiating basal plate and radiating basal plate, the insulating layer is separated radiating basal plate with the conducting layer is insulating, and the conducting layer comprises a plurality of mutual spaced line layers, and surface printing layer coats in the conducting layer upper surface, and surface printing layer has a plurality of vacancies, and the vacancy makes the exposed conductive electrode of formation of conducting layer, and surface printing layer upper surface is located to the support of moulding plastics, and be used for holding the LED paster. Technical scheme's integrated support of COB more than adopting, simple structure, good heat dissipation has not only improved production efficiency greatly, and is when later stage encapsulation LED chip, very convenient moreover.
Description
Technical field
The utility model relates to LED light source accessory, particularly COB integrated stand.
Background technology
COB (ChipOnBoard) be also chip on board, is the integrated area source technology of the specular removal be directly attached to by LED chip on the mirror metal substrate of high reflecting rate.This technology eliminates support concept, electroless plating, without Reflow Soldering, without paster operation, and therefore operation reduces nearly 1/3rd, and cost also saves 1/3rd.
First COB technical process is cover silicon chip at substrate surface heat-conduction epoxy resin (generally with the epoxy resin mixing Argent grain) to lay a little, then silicon chip is directly placed in substrate surface, be heat-treated to till silicon chip is securely fixed in substrate, between silicon chip and substrate, directly set up electrical connection by the method for wire bond more subsequently.
China Patent No. be 201220472094.1 utility model patent disclose a kind of COB-LED light source, described COB-LED light source is made up of heat-radiating substrate (aluminium base) and the LED chip be located on aluminium base.The open slot that the wherein pair of horns end of aluminium base sets to the concave respectively, for fixing for screw.The aluminium base edge being positioned at described aluminium base open slot side is provided with the socket composition connected to complete electric component for the docking of heart yearn interface.During use, it is by electric interfaces support and screw lamp socket.
When current industry produces COB-LED, cover dielectric isolation layer at chip rest area periphery, conductive layer is covered again in the conductive welding region of specifying, to make conductive welding region and heat-radiating substrate electrical isolation, during encapsulation, first LED chip is set in chip rest area, with gold thread, the extraction of the positive and negative electrode of LED chip is bonded to conductive welding region, then with the technology mode of a glue, fluorescent colloid is clicked and entered this around in the chip rest area of LED chip, to guarantee reliability.
Above-mentioned COB-LED is due to the restriction of structure, and there is multiple deficiency, be mainly reflected in production cost too high: aluminium base is thick and heavy, cost of material is high; Processed complex when producing in addition, increases human cost, material cost and processing cost.
Utility model content
The purpose of this utility model is to provide a kind of COB integrated stand.
According to an aspect of the present utility model, provide a kind of COB integrated stand, comprise insulating barrier, conductive layer, surface printing layer and injection molding support that heat-radiating substrate and heat-radiating substrate from bottom to top set gradually, insulating barrier is by heat-radiating substrate and conductive layer dielectric separation, conductive layer is made up of multiple spaced line layer, surface printing layer is coated on conductive layer upper surface, surface printing layer has some rooms, room makes the exposed formation conductive electrode of conductive layer, injection molding support is located at surface printing layer upper surface, and for holding LED paster.
Adopt the COB integrated stand of above technical scheme, structure is simple, and thermal diffusivity is good, not only substantially increases production efficiency, and when later stage packaging LED chips, very convenient.
In some embodiments, conductive electrode comprises link electrode and LED patch electrode, link electrode is located at this COB integrated stand both sides, and for being connected with driving power, LED patch electrode is located at injection molding support inside, and for being connected with LED paster, each LED patch electrode includes contact exposed on two adjacent line layers.Thus, the structure of this COB integrated stand is more reasonable, encapsulates also convenient.
In some embodiments, conductive layer is Copper Foil conductive layer.Thus, conductive layer electric conductivity is better, more durable, the COB light source longer service life that encapsulation is formed.
In some embodiments, the circuit etching layer that conductive layer is formed after etching by Copper Foil forms.Thus, conductive layer processing and manufacturing is convenient, and cost is lower.
In some embodiments, also comprise the installing hole for installing this COB integrated stand, mounting hole site in heat-radiating substrate surrounding, and runs through heat-radiating substrate.Thus, the COB light source of this COB integrated stand encapsulation formation is easier for installation.
In some embodiments, the heat-radiating substrate position corresponding with injection molding support is also provided with rack positioning hole, enters in rack positioning hole during injection molding support injection molding.Thus, injection molding support location is more accurate, and firmness between heating panel is larger.
Accompanying drawing explanation
Fig. 1 is the structural representation of the COB integrated stand of a kind of execution mode of the utility model.
Fig. 2 is the internal structure schematic diagram of the integrated stand of COB shown in Fig. 1.
Fig. 3 is the hierarchy schematic diagram of the integrated stand of COB shown in Fig. 1.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail.
Fig. 1 to Fig. 3 show schematically show the COB integrated stand according to a kind of execution mode of the present utility model.As shown in the figure, this device comprises insulating barrier 2, conductive layer 3, surface printing layer 4 and injection molding support 5 that heat-radiating substrate 1 and heat-radiating substrate 1 from bottom to top set gradually.
Wherein, insulating barrier 2 is by heat-radiating substrate 1 and conductive layer 3 dielectric separation.
Conductive layer 3 is made up of multiple spaced line layer 31.
Surface printing layer 4 is coated on conductive layer 3 upper surface.Surface printing layer 4 has some rooms 41.Room 41 makes the exposed formation conductive electrode 32 of conductive layer 3.
Injection molding support 5 is located at surface printing layer 4 upper surface, and for holding LED paster.
Conductive electrode 32 comprises link electrode 321 and LED patch electrode 322.Link electrode 321 is located at this COB integrated stand both sides, and for being connected with driving power.It is inner that LED patch electrode 322 is located at injection molding support 5, and for being connected with LED paster.
Each LED patch electrode 322 includes contact 322a exposed on two adjacent line layers 31.Thus, the structure of this COB integrated stand is more reasonable, encapsulates also convenient.
Conductive layer 3 is Copper Foil conductive layer, and the circuit etching layer formed after etching by Copper Foil forms.Thus, conductive layer processing and manufacturing is convenient, and cost is lower.
This COB integrated stand also comprises the installing hole 11 for installing.Mounting hole site 11 in heat-radiating substrate 1 surrounding, and runs through heat-radiating substrate 1.Thus, the COB light source of this COB integrated stand encapsulation formation is easier for installation.
Heat-radiating substrate 1 position corresponding with injection molding support 5 is also provided with rack positioning hole 12.Enter during injection molding support 5 injection molding in rack positioning hole 12.Thus, it is more accurate that injection molding support 5 is located, and firmness between heating panel 1 is larger.
Adopt the COB integrated stand of above technical scheme, structure is simple, and thermal diffusivity is good, not only substantially increases production efficiency, and when later stage packaging LED chips, very convenient.
Above-described is only some execution modes of the utility model.For the person of ordinary skill of the art, under the prerequisite not departing from the utility model creation design, can also make some distortion and improvement, these all belong to protection range of the present utility model.
Claims (6)
1.COB integrated stand, it is characterized in that, comprise the insulating barrier that heat-radiating substrate and described heat-radiating substrate from bottom to top set gradually, conductive layer, surface printing layer and injection molding support, described insulating barrier is by described heat-radiating substrate and described conductive layer dielectric separation, described conductive layer is made up of multiple spaced line layer, described surface printing layer is coated on described conductive layer upper surface, described surface printing layer has some rooms, described room makes the exposed formation conductive electrode of described conductive layer, described injection molding support is located at described surface printing layer upper surface, and for holding LED paster.
2. COB integrated stand according to claim 1, it is characterized in that, described conductive electrode comprises link electrode and LED patch electrode, described link electrode is located at this COB integrated stand both sides, and for being connected with driving power, it is inner that described LED patch electrode is located at described injection molding support, and for being connected with LED paster, and each described LED patch electrode includes contact exposed on two adjacent line layers.
3. COB integrated stand according to claim 1 and 2, is characterized in that, described conductive layer is Copper Foil conductive layer.
4. COB integrated stand according to claim 3, is characterized in that, the circuit etching layer that described conductive layer is formed after etching by Copper Foil forms.
5. COB integrated stand according to claim 1, is characterized in that, also comprises the installing hole for installing this COB integrated stand, and described mounting hole site in described heat-radiating substrate surrounding, and runs through described heat-radiating substrate.
6. COB integrated stand according to claim 1, is characterized in that, the described heat-radiating substrate position corresponding with described injection molding support is also provided with rack positioning hole, enters in described rack positioning hole during described injection molding support injection molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520998379.XU CN205122636U (en) | 2015-12-03 | 2015-12-03 | Integrated support of COB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520998379.XU CN205122636U (en) | 2015-12-03 | 2015-12-03 | Integrated support of COB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205122636U true CN205122636U (en) | 2016-03-30 |
Family
ID=55578217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520998379.XU Active CN205122636U (en) | 2015-12-03 | 2015-12-03 | Integrated support of COB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205122636U (en) |
-
2015
- 2015-12-03 CN CN201520998379.XU patent/CN205122636U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Lin Guangpeng Inventor after: Yang Liming Inventor before: Lin Guangpeng |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20170526 Address after: The new lux Plaza No. 3 Fu Road 528400 Guangdong province Zhongshan Guzhen Town 2 2 to 3 floor Patentee after: Zhongshan Chengyuan Photoelectric Technology Co., Ltd. Address before: 528400 Guangdong city in Zhongshan Province town of Tong Fu Road No. 3 Building 3 floor 3 Patentee before: Lin Guangpeng |