CN113097366B - Inverted double-sided packaging full-circumference light-emitting LED bracket and preparation method thereof - Google Patents
Inverted double-sided packaging full-circumference light-emitting LED bracket and preparation method thereof Download PDFInfo
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- CN113097366B CN113097366B CN202110316274.1A CN202110316274A CN113097366B CN 113097366 B CN113097366 B CN 113097366B CN 202110316274 A CN202110316274 A CN 202110316274A CN 113097366 B CN113097366 B CN 113097366B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 230000017525 heat dissipation Effects 0.000 claims abstract description 21
- 239000000919 ceramic Substances 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 239000003292 glue Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 108010043121 Green Fluorescent Proteins Proteins 0.000 claims description 3
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a flip-chip double-sided packaging full-circumference luminous LED bracket and a preparation method thereof, the flip-chip double-sided packaging full-circumference luminous LED bracket comprises a bracket body, a buckling groove, a limiting block, a chip, a water hole, a chip mounting groove, a conductive substrate, cone head electrodes, heat dissipation micropores, an electrode plate, water passing grooves and a ceramic plate, wherein the buckling groove is formed around the upper end surface of the bracket body, the limiting block is fixedly connected inside the buckling groove, the water passing grooves are formed at the bottom of the inner wall of the buckling groove, the chip mounting groove is formed at the upper end surface of the bracket body, the chip is fixedly connected inside the chip mounting groove, the conductive substrates are connected at two groups of heights at two sides of the bottom of the chip mounting groove, the cone head electrodes are fixedly connected to the upper end surface of the conductive substrate, the water hole is formed at the front end surface of the bracket body, and the ceramic plate is fixedly connected inside the bracket body, thereby effectively improving the luminous effect of the chip, meanwhile, the heat dissipation capacity of the support is improved, and the service life of the LED chip is longer.
Description
Technical Field
The invention relates to the field of LED supports, in particular to an inverted double-sided packaging full-circumference light-emitting LED support and a preparation method thereof.
Background
An LED light emitting diode is a solid state semiconductor device which can directly convert electrical energy into light energy, the heart of the LED is a semiconductor wafer, one end of the wafer is attached to a support and is a cathode, the other end of the wafer is connected with an anode of a power supply, the whole wafer is encapsulated by epoxy resin, the semiconductor wafer is composed of two parts, one part is a P-type semiconductor, holes are dominant in the semiconductor wafer, the other end of the semiconductor wafer is an N-type semiconductor, electrons are mainly on the side, when the two semiconductors are connected, a P-N junction is formed between the two semiconductors, when current is applied to the wafer through a lead, the electrons are pushed to a P area, the electrons and the holes are combined in the P area, and then energy is emitted in the form of photons.
The LED of present many collocation support uses, current support is fixed the back to LED, a set of safety cover is connected through the mode of lid knot, the gas tightness of support is not good, the inside aqueous vapor of support is too much can influence the luminous effect and the life of chip, the support is generally through glue with the chip is fixed simultaneously, the heat dispersion of glue is relatively poor, the heat accumulation in the chip use, the chip performance can be amassed and decline rapidly along with the heat, and the support passes through the mode of bonding wire and the P and N electric connection of chip, but the P of chip and the less electrode of N machine are thinner, lead to the easy rosin joint of bonding wire, the easy chip scintillation or the not bright phenomenon of appearing, and the support also fixes the light-emitting zone of chip in the support, the unable whole effluvium of light that the chip sent, seriously influence the luminous efficiency of chip.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides an inverted double-sided packaging full-circumference light-emitting LED bracket and a preparation method thereof, which solve the problem that after the LED is fixed by the conventional bracket, the protective covers are connected in a cover buckle mode, the air tightness of the bracket is poor, the excessive moisture in the bracket can influence the luminous effect and the service life of the chip, meanwhile, the chip is fixed by the bracket through glue, the heat dissipation performance of the glue is poor, the heat is accumulated in the using process of the chip, the performance of the chip is rapidly declined along with the heat accumulation, the bracket is electrically connected with the P and N poles of the chip in a wire bonding mode, but the P and N poles of the chip are thinner, so that the wire bonding is easy to be insufficient soldered, the phenomenon of chip flicker or unlightness is easy to occur, and the luminous zone of the chip is also fixed in the support by the support, and the light emitted by the chip can not be completely scattered, so that the luminous efficiency of the chip is seriously influenced.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a flip-chip double-sided packaging all-around light-emitting LED bracket comprises a bracket body, a buckling groove, a limiting block, a chip, a water hole, a chip mounting groove, a conductive substrate, a cone head electrode, heat dissipation micropores, electrode plates, a water passing groove and a ceramic plate, wherein the buckling groove is formed around the upper end face of the bracket body, the limiting block is fixedly connected inside the buckling groove, the water passing groove is formed at the bottom of the inner wall of the buckling groove, the chip mounting groove is formed on the upper end face of the bracket body, the chip is fixedly connected inside the chip mounting groove, the conductive substrate is connected on two sides of the bottom of the chip mounting groove in two groups in height, the cone head electrode is fixedly connected on the upper end face of the conductive substrate, the water hole is formed on the front end face of the bracket body, the ceramic plate is fixedly connected inside the bracket body, the heat dissipation micropores are formed on the lower end face of the bracket body, and the electrode plates are fixedly connected on two sides of the lower end face of the bracket body, the upper end face of the support is fixedly connected with a light-transmitting cover.
Preferably, one side of the light-transmitting cover adjacent to the bracket is coated with a fluorescent layer, the color of the fluorescent layer is yellow and green, and the proportion of the yellow fluorescent layer is 46.32%, and the proportion of the green fluorescent layer is 53.68%.
Preferably, the size of the light-transmitting cover is matched with the buckle groove, and the lower end face of the light-transmitting cover is provided with a limit groove matched with the size and the position of the limit block.
Preferably, the buckle groove is of a 'mouth' shape, the water passing groove is formed in the bottom of the inner wall of one side, which is deviated from the two sides of the 'mouth' of the buckle groove, and the water passing groove is communicated with the water hole.
Preferably, the heights of the conductive substrates in the chip mounting grooves are different, and the height difference of the conductive substrates is equal to the height difference of the P pole and the N pole of the chip.
Preferably, the conical head electrode is made of silver materials, the bottom of the conical head electrode is embedded into the upper end face of the conductive substrate, the position of the conical head electrode is matched with the positions of the P pole and the N pole of the chip, and the tip of the conical head electrode is inserted into the electrode.
Preferably, there is insulating glue between two sets of electrically conductive substrates inside the chip mounting groove, and the chip mounting groove fixes the chip through insulating glue.
Preferably, the lower end face of the conductive substrate is fixedly connected with one end of a copper wire, the other end of the copper wire is fixedly connected with the end face of the electrode plate side in the bracket main body, and the copper wire part region penetrates through the inside of the ceramic plate.
Preferably, the ceramic plate is arranged in the bracket main body and right above the heat dissipation micropores, and at least one group of the heat dissipation micropores is arranged.
The invention relates to a preparation method of an inverted double-sided packaging full-circumference light-emitting LED bracket, which is characterized by comprising the following steps of: the method comprises the following steps:
the method comprises the following steps: obtaining a mold prepared by a support, respectively placing two groups of electrode plates with copper wires on two sides of the bottom of a groove of the mold, and placing a ceramic plate inside the groove;
step two: adding epoxy resin into the mold groove, filling the mold groove with the resin, and curing the resin;
step three: a buckle groove, a chip mounting groove and a water passing groove are formed in the solidified resin, a limiting block is fixed in the buckle groove, and a water hole communicated with the water passing groove is formed in the front end face of the solidified resin;
step four: fixedly connecting a conductive substrate with the other end of the copper wire in the chip mounting groove, coating insulating glue at the bottom of the chip mounting groove, connecting the P and N poles of the chip with the conical head electrode, and fixing the chip in the chip mounting groove through the insulating glue;
step five: and polishing the surface of the resin smoothly, and covering the light-transmitting cover coated with the fluorescent layer in the clamping groove.
(III) advantageous effects
The invention provides an inverted double-sided packaging full-circumference light-emitting LED bracket and a preparation method thereof, and the inverted double-sided packaging full-circumference light-emitting LED bracket has the following beneficial effects:
1. the device is through seting up the buckle groove at support main part up end, at buckle inslot portion fixed connection stopper, set up the spacing groove with stopper size adaptation in the bottom of printing opacity lid simultaneously, and printing opacity lid size and buckle groove looks adaptation, make the printing opacity lid fix at the support up end through the buckle groove, and then the support is splendid to the gas tightness of chip, the buckle groove is "mouth" type simultaneously, it has the basin to open to be equipped with at the side that deviates from on "mouth" both sides, the water hole is seted up to the preceding terminal surface of support, the water hole communicates with crossing the basin mutually, make buckle inslot portion intake can discharge through basin and water hole fast, make the waterproof performance of support good, thereby solved current support and fixed back to LED, connect a set of safety cover through the mode that the lid detained, the gas tightness of support is not good, lead to the inside aqueous vapor of support too much influence the luminous effect and the problem of life of chip.
2. Through the inside fixed connection potsherd at the support, and the potsherd is under the chip mounting groove, make the potsherd can assist the inside chip heat dissipation of chip mounting groove, there is one section copper line at the internal connection of potsherd, and the copper line is the connecting wire of conducting substrate and electrode slice, the fixed at least a set of heat dissipation micropore of having seted up of terminal surface under the support simultaneously, the heat dissipation micropore is under the potsherd, make the radiating efficiency of potsherd better, thereby it generally passes through glue with the chip fixation to have solved current support, the heat dispersion of glue is relatively poor, the heat accumulates the problem that leads to the chip performance to decline rapidly in the chip use.
3. Through at two sets of conductive substrate of chip mounting groove inside fixed connection, and the difference in height of two sets of conductive substrate is the same with the difference in height of chip P utmost point and N utmost point, make the luminous zone can keep the level when the chip is fixed in chip mounting groove inside, simultaneously at conductive substrate up end fixed connection conical head electrode, conical head electrode is made for silver-colored material, and the bottom embedding conductive substrate up end, the position of conical head electrode and the P and the N utmost point position looks adaptation of chip, the pointed end of conical head electrode inserts inside the electrode, make the P and the N utmost point of chip closely be connected with conical head electrode, thereby solve current support and pass through the mode of bonding wire and the P and the N electric connection of chip, but the P of chip and the less electrode of N machine are thinner, cause the easy rosin joint of bonding wire, lead to the problem that the chip glimmers or is not bright.
4. Through set up the chip mounting groove with chip size looks adaptation at the support up end, can fix fast inside the chip mounting groove through the insulating cement chip, make the installation of chip simple swift, the electrode of chip is inside the chip mounting groove simultaneously, the whole light zone of giving out light of chip is on support upper portion, make the chip give out light all around, luminous efficacy is good, thereby solved current support and also fixed the light zone of chip in the support, the unable whole effluvium of light that the chip sent, the luminous efficacy's of serious influence chip problem.
Drawings
FIG. 1 is a schematic view of the overall structure of the device body of the present invention;
FIG. 2 is a schematic view of a chip mounting structure of a device body bracket according to the present invention;
FIG. 3 is a schematic top view of the device body support of the present invention;
FIG. 4 is a schematic bottom view of the bracket of the device body of the present invention;
fig. 5 is a cross-sectional structural view of the device body support of the present invention.
In the figure: the light-transmitting cover comprises a light-transmitting cover 1, a support 2, a support main body 3, a buckling groove 4, a limiting block 5, a chip 6, a water hole 7, a chip mounting groove 8, a conductive substrate 9, a cone head electrode 10, a heat-radiating micropore 11, an electrode plate 12, a water passing groove 13 and a ceramic plate 14.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
The embodiment of the invention provides a flip-chip double-sided packaging full-periphery light-emitting LED bracket, which comprises a bracket 2, wherein the bracket 2 comprises a bracket main body 3, a buckling groove 4, a limiting block 5, a chip 6, a water hole 7, a chip mounting groove 8, a conductive substrate 9, a cone head electrode 10, a heat dissipation micropore 11, an electrode plate 12, a water passing groove 13 and a ceramic plate 14, the buckling groove 4 is formed around the upper end surface of the bracket main body 3, the limiting block 5 is fixedly connected inside the buckling groove 4, the water passing groove 13 is formed at the bottom of the inner wall of the buckling groove 4, the chip mounting groove 8 is formed on the upper end surface of the bracket main body 3, the chip 6 is fixedly connected inside the chip mounting groove 8, the conductive substrates 9 are connected to two groups of heights at two sides of the bottom of the chip mounting groove 8, the cone head electrode 10 is fixedly connected to the upper end surface of the conductive substrate 9, the water hole 7 is formed on the front end surface of the bracket main body 3, and the ceramic plate 14 is fixedly connected inside the bracket main body 3, heat dissipation micropore 11 sets up in support main part 3 terminal surface down, and electrode slice 12 is two sets of fixed connection in support main part 3 terminal surface both sides altogether, and support 2 up end fixedly connected with printing opacity lid 1.
The side of the light-transmitting cover 1 adjacent to the support 2 is coated with a fluorescent layer, the color of the fluorescent layer is yellow and green, the ratio of the yellow fluorescent layer is 46.32%, the ratio of the green fluorescent layer is 53.68%, the size of the light-transmitting cover 1 is matched with the size of the buckling groove 4, the lower end surface of the light-transmitting cover 1 is provided with a limiting groove matched with the size and the position of the limiting block 5, the buckling groove 4 is in a 'mouth' shape, the water passing groove 13 is arranged at the bottom of the inner wall of one side of the two sides of the 'mouth' of the buckling groove 4, the water passing groove 13 is communicated with the water hole 7, the heights of the conductive substrates 9 in the chip mounting groove 8 are different, the height difference of the conductive substrates 9 is equal to the height difference between the P pole and the N pole of the chip 6, the cone head electrode 10 is made of silver material, the bottom is embedded into the upper end surface of the conductive substrate 9, the position of the cone head electrode 10 is matched with the P pole and the N pole of the chip 6, the tip of the cone head electrode 10 is inserted into the electrode, and the two groups of the conductive substrates 9 in the chip mounting groove 8 are provided with insulating glue, and the chip 6 is fixed in the chip mounting groove 8 through the insulating cement, the lower end face of the conductive substrate 9 is fixedly connected with one end of a copper wire, the other end of the copper wire is fixedly connected with the end face of the side of the electrode plate 12 in the support main body 3, part of the area of the copper wire penetrates through the inside of the ceramic plate 14, the ceramic plate 14 is arranged in the support main body 3 and is right above the heat dissipation micropores 11, and at least one group of the heat dissipation micropores 11 is arranged.
The preparation method of the flip double-sided packaging full-circumference light-emitting LED support comprises the following steps:
the method comprises the following steps: obtaining a mold prepared by a bracket, respectively placing two groups of electrode plates 12 with copper wires at two sides of the bottom of a groove of the mold, and placing a ceramic plate 14 inside the groove;
step two: adding epoxy resin into the mold groove, filling the mold groove with the resin, and curing the resin;
step three: a buckle groove 4, a chip mounting groove 8 and a water passing groove 13 are formed in the solidified resin, a limiting block 5 is fixed in the buckle groove 4, and a water hole 7 communicated with the water passing groove 13 is formed in the front end face of the solidified resin;
step four: fixedly connecting a conductive substrate 9 with the other end of the copper wire in the chip mounting groove 8, coating insulating glue at the bottom of the chip mounting groove 8, connecting the P and N poles of the chip 6 with the cone head electrode 10, and fixing the chip 6 in the chip mounting groove 8 through the insulating glue;
step five: the surface of the resin is polished smooth, and the light-transmitting cover 1 coated with the fluorescent layer is covered inside the buckling groove 4.
The working principle is as follows: when the support uses, at first at the inside insulating cement that adds of chip mounting groove 8, then place the P utmost point of chip 6 at the inside higher conductive substrate 9 up end of chip mounting groove 8, the N utmost point is at lower conductive substrate 9 up end, rethread conical head electrode 10 is fixed with the PN utmost point of chip 6, fix chip 6 inside chip mounting groove 8, then through buckle groove 4 with 1 fixed connection of printing opacity lid at 2 up end of support, accomplish the equipment of LED chip and support promptly.
In summary, the flip-chip double-sided packaging all-around light-emitting LED bracket comprises a bracket main body 3, a buckle groove 4 arranged on the upper end surface of the bracket main body, a limiting block 5 fixedly connected inside the buckle groove 4, a limiting groove matched with the limiting block 5 in size arranged at the bottom of a light-transmitting cover 1, and a light-transmitting cover 1 matched with the buckle groove 4 in size, so that the light-transmitting cover 1 is fixed on the upper end surface of a bracket 2 through the buckle groove 4, the bracket has excellent air tightness to a chip, the buckle groove 4 is in a 'mouth' shape, a water passing groove 13 is arranged on the deviating side of the two sides of the 'mouth', a water hole 7 is arranged on the front end surface of the bracket 2, the water hole 7 is communicated with the water passing groove 13, water entering the inside the buckle groove 4 can be quickly discharged through the water passing groove 13 and the water hole 7, the waterproof performance of the bracket is good, thereby solving the problem that after the existing bracket is fixed to an LED, a group of protective covers are connected in a buckling mode, and the air tightness of the bracket is poor, the problem that the luminous effect and the service life of the chip are influenced by excessive moisture in the bracket is caused.
Secondly, through the inside fixed connection potsherd 14 at support 2, and potsherd 14 is under chip mounting groove 8, make potsherd 14 can assist the inside chip heat dissipation of chip mounting groove 8, there is one section copper line at potsherd 14's internal connection, and the copper line is the connecting wire of conducting substrate 9 and electrode slice 12, the terminal surface is fixed to be seted up at support 2 simultaneously and is had at least a set of heat dissipation micropore 11, heat dissipation micropore 11 is under potsherd 14, make potsherd 14's radiating efficiency better, thereby solved current support with the chip fixation generally through glue, the heat dispersion of glue is relatively poor, the heat accumulates the problem that leads to the chip performance to decline rapidly in the chip use.
And, through fixedly connecting two sets of conductive substrates 9 in the chip mounting groove 8, and the height difference of two sets of conductive substrates 9 is the same as the height difference of the P pole and the N pole of the chip, make the chip can keep the light-emitting zone level when the chip is fixed in the chip mounting groove 8, at the same time, fixedly connect the conical head electrode 10 on the upper end surface of the conductive substrate 9, the conical head electrode 10 is made of silver material, and the bottom imbeds the upper end surface of the conductive substrate 9, the position of the conical head electrode 10 is matched with the P pole and the N pole position of the chip 6, the tip of the conical head electrode 10 is inserted into the electrode, make the P pole and the N pole of the chip and the conical head electrode 10 connect closely, thus solve the problem that the existing support connects electrically with the P pole and the N pole of the chip through the mode of bonding wire, but the P pole and the N pole of the chip are thinner, cause the bonding wire to be easy to rosin joint, cause the chip to flicker or not bright.
And, through set up chip mounting groove 8 with chip size looks adaptation at 2 up end of support, can fix fast inside chip mounting groove 8 through the insulating cement chip, make the installation of chip simple swift, the electrode of chip is inside chip mounting groove 8 simultaneously, the whole light-emitting zone of chip is on 2 upper portions of support, make the chip give out light all around, luminous efficacy is good, thereby it also fixes the light-emitting zone of chip in the support to have solved current support, the unable whole effluvium of light that the chip sent, seriously influence the luminous efficacy's of chip problem.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a luminous LED support of flip-chip double-sided encapsulation whole week, includes support (2), its characterized in that: the support (2) comprises a support main body (3), a buckling groove (4), a limiting block (5), a chip (6), a water hole (7), a chip mounting groove (8), a conductive substrate (9), a cone head electrode (10), a heat dissipation micropore (11), an electrode plate (12), a water passing groove (13) and a ceramic plate (14), wherein the buckling groove (4) is formed around the upper end face of the support main body (3), the limiting block (5) is fixedly connected inside the buckling groove (4), the water passing groove (13) is formed at the bottom of the inner wall of the buckling groove (4), the chip mounting groove (8) is formed in the upper end face of the support main body (3), the chip (6) is fixedly connected inside the chip mounting groove (8), the conductive substrate (9) is connected to two sides of the bottom of the chip mounting groove (8) at two sets of heights, and the cone head electrode (10) is fixedly connected to the upper end face of the conductive substrate (9), the water holes (7) are formed in the front end face of the support main body (3), the ceramic plates (14) are fixedly connected inside the support main body (3), the heat dissipation micropores (11) are formed in the lower end face of the support main body (3), two groups of electrode plates (12) are fixedly connected to two sides of the lower end face of the support main body (3), and the upper end face of the support (2) is fixedly connected with the light-transmitting cover (1);
the buckle groove (4) is of a mouth shape, the water passing groove (13) is formed in the bottom of the inner wall of one side, deviating from the mouth shape, of two sides of the buckle groove (4), and the water passing groove (13) is communicated with the water hole (7);
the heights of the conductive substrates (9) in the chip mounting grooves (8) are different, and the height difference of the conductive substrates (9) is equal to the height difference of the P pole and the N pole of the chip (6);
the conical head electrode (10) is made of silver materials, the bottom of the conical head electrode is embedded into the upper end face of the conductive substrate (9), the position of the conical head electrode (10) is matched with the positions of the P pole and the N pole of the chip (6), and the tip of the conical head electrode (10) is inserted into the electrode.
2. The flip-chip double-sided package full-perimeter light-emitting LED support according to claim 1, wherein: one surface of the light-transmitting cover (1) adjacent to the support (2) is coated with a fluorescent layer, the colors of the fluorescent layer are yellow and green, the proportion of the yellow fluorescent layer is 46.32%, and the proportion of the green fluorescent layer is 53.68%.
3. The flip-chip double-sided package full-perimeter light-emitting LED support according to claim 1, wherein: the size of the light-transmitting cover (1) is matched with the clamping groove (4), and the lower end face of the light-transmitting cover (1) is provided with a limiting groove matched with the size and the position of the limiting block (5).
4. The flip-chip double-sided package full-perimeter light-emitting LED support according to claim 1, wherein: and an insulating adhesive is arranged between two groups of conductive substrates (9) in the chip mounting groove (8), and the chip (6) is fixed in the chip mounting groove (8) through the insulating adhesive.
5. The flip-chip double-sided package full-perimeter light-emitting LED support according to claim 1, wherein: the lower end face of the conductive substrate (9) is fixedly connected with one end of a copper wire, the other end of the copper wire is fixedly connected with the side end face of the electrode plate (12) in the bracket main body (3), and the copper wire part region penetrates through the inside of the ceramic plate (14).
6. The flip-chip double-sided package full-perimeter light-emitting LED support according to claim 1, wherein: the ceramic plate (14) is arranged in the bracket main body (3) and right above the heat dissipation micropores (11), and at least one group of heat dissipation micropores (11) is arranged.
7. A preparation method of a flip double-sided packaging full-circumference light-emitting LED bracket is characterized by comprising the following steps: the method comprises the following steps:
the method comprises the following steps: obtaining a mould prepared by a bracket, respectively placing two groups of electrode plates (12) with copper wires on two sides of the bottom of a groove of the mould, and placing a ceramic plate (14) in the groove;
step two: adding epoxy resin into the mold groove, filling the mold groove with the resin, and curing the resin;
step three: a buckle groove (4), a chip mounting groove (8) and a water passing groove (13) are formed in the solidified resin, a limiting block (5) is fixed in the buckle groove (4), and a water hole (7) communicated with the water passing groove (13) is formed in the front end face of the solidified resin;
step four: fixedly connecting a conductive substrate (9) with the other end of a copper wire in a chip mounting groove (8), coating insulating glue at the bottom of the chip mounting groove (8), connecting a P pole and an N pole of a chip (6) with a conical head electrode (10), and fixing the chip (6) in the chip mounting groove (8) through the insulating glue;
step five: and polishing the surface of the resin smoothly, and covering the light-transmitting cover (1) coated with the fluorescent layer in the clamping groove (4).
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| CN206931621U (en) * | 2017-07-18 | 2018-01-26 | 杭州宇隆科技有限公司 | A kind of New LED packaging system |
| CN207458999U (en) * | 2017-11-06 | 2018-06-05 | 深圳辰达行电子有限公司 | The assembling structure of diode |
| CN108321279A (en) * | 2018-03-16 | 2018-07-24 | 江苏鸿利国泽光电科技有限公司 | A kind of deep ultraviolet LED light source inorganic encapsulated structure |
| CN208385451U (en) * | 2018-07-24 | 2019-01-15 | 广州米珈尼电子科技有限公司 | A kind of LED package device |
| CN110277478B (en) * | 2019-06-28 | 2021-03-30 | 旭宇光电（深圳）股份有限公司 | Light emitting diode device and light emitting apparatus |
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| CN111446350B (en) * | 2020-04-13 | 2021-05-18 | 江门市跨越电子科技有限公司 | Support assembly for packaging LED chip |
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