CN217768374U

CN217768374U - High efficiency mini LED packaging hardware

Info

Publication number: CN217768374U
Application number: CN202221558811.XU
Authority: CN
Inventors: 童和俊; 李泉涌; 彭友; 丁磊
Original assignee: Coreach Electronic Technology Co ltd
Current assignee: Coreach Electronic Technology Co ltd
Priority date: 2022-06-21
Filing date: 2022-06-21
Publication date: 2022-11-08
Anticipated expiration: 2032-06-21

Abstract

The utility model discloses a high-efficiency miniLED packaging device, which comprises a miniLED whole plane bracket, wherein the miniLED whole plane bracket consists of a plurality of miniLED single plane brackets which are arranged in a rectangular array; a bracket bonding pad is arranged on each miniLED single plane bracket, an LED wafer is arranged on the bracket bonding pad, the utility model adds electrical connection medium between the lamp plate and the wafer on the miniLED plane support, and the support pad is bigger, and the bigger pad is used in cooperation with the lamp plate, thus improving the problems of die bonding offset and the like; after the LED is die-bonded on the miniLED planar support, the dispensing speed can be greatly increased due to the small distance and the standardized arrangement matrix, or a mode of adding micro lenses into the whole injection molding sheet is adopted; after the LED is additionally provided with the planar support, the LED can be used on the lamp strip, and the cost is greatly reduced.

Description

High efficiency mini LED packaging hardware

Technical Field

The utility model relates to a mini LED technical field, concretely relates to high efficiency mini LED packaging hardware.

Background

Chinese patent CN114400278A discloses an LED package substrate and an LED package device using the same, including an LED base plate, a package frame, a metal heat sink, an LED chip and phosphor, wherein the bottom of the LED base plate is provided with the metal heat sink, the inside of the LED base plate is equidistantly provided with first grooves, the inside of the metal heat sink is equidistantly provided with second grooves, the top of the LED base plate is assembled with the package frame, the inside of the package frame is symmetrically and fixedly connected with package substrates, the tops of the two package substrates are both assembled with a printed circuit board, and the top of the LED base plate, which is located between the two package substrates, is assembled with the LED chip;

the existing mini LED lamp panel has low die bonding efficiency and low yield: because the LED wafer electrode and the lamp panel bonding pad are small, the defects of offset, leakage, fixation and the like are easy to occur in die bonding; the traditional dispensing process for adding the micro lenses to the existing mini LED lamp panel is low in efficiency due to the large gap of the lamp panel, limited stroke of a machine and limited number of dispensing valves; the existing mini LED is in a lamp panel form, the PCB cost is high, and a low-cost light bar form cannot be realized; after the LED is additionally provided with the planar support, the LED can be used on the lamp strip, so that the cost is greatly reduced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the problem of the above background art and providing a high efficiency mini LED packaging hardware.

The purpose of the utility model can be realized by the following technical scheme:

a high-efficiency mini LED packaging device comprises a mini LED integral plane support, wherein the mini LED integral plane support is composed of a plurality of mini LED single plane supports, and the mini LED single plane supports are arranged in a rectangular array mode; and two support bonding pads are arranged on each miniLED single plane support side by side, and the support bonding pads are provided with LED wafers.

As a further aspect of the present invention: the miniLED whole plane support is of a square structure.

As a further aspect of the present invention: the single planar support of miniLED is resin base, and size is 1.5mm 0.1mm.

As a further aspect of the present invention: the two support welding pads are of a square structure.

As a further aspect of the present invention: and the single plane bracket and the LED wafer are respectively provided with an electrical connection medium, and the electrical connection medium adopts solder paste or silver adhesive.

As a further aspect of the present invention: the mini LED single plane support is sleeved with a micro lens, and the LED wafer and the support bonding pad are both positioned in the micro lens.

As a further aspect of the present invention: the distance between the LED chips is controlled to be 10-30mm.

As a further aspect of the present invention: the LED wafer is also connected with the PCB lamp strip through the bracket bonding pad.

As a further aspect of the present invention: the distance between the LED wafers arranged on the PCB light bar is controlled to be 10-30mm.

The utility model has the advantages that:

(1) The utility model adds electrical connection medium between the lamp panel and the wafer on the mini LED plane support, and the support bonding pad is bigger, and the bigger bonding pad is used by matching with the lamp panel, thus improving the problems of die bonding offset and the like;

(2) The utility model discloses LED die bonding is behind mini LED plane support, because of its interval is little, the matrix of arranging is standardized, can accelerate the point dispensing speed by a wide margin, or adopt the whole piece of injection moulding to add the mirrolens mode;

(3) The utility model discloses after the LED installed the plane support additional, can use on the lamp strip, reduce cost by a wide margin.

Drawings

The present invention will be further described with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of the present invention;

FIG. 2 is a schematic diagram of the single mini LED structure of the present invention;

FIG. 3 is a schematic view of the connection relationship between the miniLED single planar support and the LED chip.

In the figure: 1. a miniLED whole-piece planar support; 2. a miniLED single planar support; 3. a microlens; 4. a bracket bonding pad; 5. an LED wafer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Example 1

Referring to fig. 1-3, the present invention relates to a high efficiency mini LED package device, which comprises a mini LED monolithic planar support 1, wherein the mini LED monolithic planar support 1 has a square structure, the mini LED monolithic planar support 1 is composed of a plurality of mini LED single planar supports 2, and the mini LED single planar supports 2 are arranged in a rectangular array; each miniLED single plane support 2 is provided with two support bonding pads 4, and the support bonding pads 4 are provided with LED wafers 5;

the miniLED single plane support 2 is a resin base, the size of the miniLED single plane support is 1.5mm 0.1mm, two support bonding pads 4 are of a square structure, the miniLED single plane support 2 and the LED wafer 5 are respectively provided with an electrical connection medium, the electrical connection medium adopts tin paste or silver glue, the miniLED single plane support 2 is sleeved with a micro lens 3, the LED wafer 5 and the support bonding pads 4 are both positioned in the micro lens 3, and the micro lens 3 adopts silica gel or epoxy resin material; the spacing between the LED chips 5 is controlled to be 10-30mm.

Example 2

Based on the above embodiment 1, the LED chip 5 in embodiment 1 is mounted on the mini LED planar support, the LED chip 5 can also be mounted on the PCB light bar, and the LED chip 5 is also connected to the PCB light bar through the support bonding pad 4, wherein the pitch of the strip mini LED is controlled within the range of 10-30mm.

Example 3

Based on the embodiment 1, the invention provides a high-efficiency mini LED packaging method, which comprises the following steps:

step 1: firstly, mounting a support bonding pad 4 on a miniLED single-particle planar support 2 in a conductive adhesive mode;

step 2: then, the LED wafer 5 is arranged on the bracket bonding pad 4 in a conductive adhesive mode, so that the mini LED packaging work is completed; wherein, in the packaging process, the distance between the Mini LEDs is controlled to be 10-30mm.

The utility model discloses a theory of operation: the utility model adds electrical connection medium between the lamp plate and the wafer on the mini LED plane support, and the support bonding pad 4 is bigger, and the bigger bonding pad is used in cooperation with the lamp plate, thus improving the problems of die bonding offset and the like; the utility model discloses LED die bonding is behind mini LED plane support, because of its interval is little, the matrix of arranging is standardized, can accelerate some glue speed by a wide margin, or adopt the whole piece of injection moulding to add the mirrolens mode; the utility model discloses after LED installs the planar support additional, can use on the lamp strip, reduce cost by a wide margin.

While one embodiment of the present invention has been described in detail, the description is only a preferred embodiment of the present invention, and should not be considered as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A high-efficiency mini LED packaging device is characterized by comprising a mini LED whole-sheet planar support (1), wherein the mini LED whole-sheet planar support (1) is composed of a plurality of mini LED single planar supports (2), and the mini LED single planar supports (2) are arranged in a rectangular array mode; support bonding pads (4) are arranged on each miniLED single plane support (2), two support bonding pads (4) are arranged side by side, and LED wafers (5) are arranged on the support bonding pads (4).

2. A high efficiency miniLED package according to claim 1, characterized in that the miniLED monolithic planar support (1) has a square structure.

3. A high efficiency miniLED package according to claim 2, characterized in that the single planar support (2) of the miniLED is a resin base with dimensions of 1.5mm by 0.1mm.

4. A high efficiency miniLED package according to claim 1, characterized in that the two support pads (4) have a square structure.

5. The high-efficiency miniLED packaging device as claimed in claim 1, wherein the single planar support (2) and the LED chip (5) are respectively provided with an electrical connection medium, and the electrical connection medium is solder paste or silver paste.

6. A high efficiency miniLED package according to claim 1, characterized in that the single planar support (2) of miniLED is covered with a micro lens (3), and the LED chip (5) and the support pads (4) are located inside the micro lens (3).

7. A high efficiency miniLED package as claimed in claim 1, characterized in that the pitch between the LED chips (5) is controlled to be 10-30mm.

8. A high efficiency miniLED package as claimed in claim 1, wherein the LED die (5) is also connected to the PCB strip via the support pads (4).

9. The high-efficiency miniLED packaging device as claimed in claim 8, wherein the distance between the LED chips (5) arranged on the PCB light bar is controlled to be 10-30mm.