CN108799945A - A kind of ultrathin LED backlight module - Google Patents
A kind of ultrathin LED backlight module Download PDFInfo
- Publication number
- CN108799945A CN108799945A CN201810772187.5A CN201810772187A CN108799945A CN 108799945 A CN108799945 A CN 108799945A CN 201810772187 A CN201810772187 A CN 201810772187A CN 108799945 A CN108799945 A CN 108799945A
- Authority
- CN
- China
- Prior art keywords
- chip
- circuit board
- backboard
- pcb circuit
- backlight module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
- F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
- F21V9/38—Combination of two or more photoluminescent elements of different materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V2200/00—Use of light guides, e.g. fibre optic devices, in lighting devices or systems
- F21V2200/20—Use of light guides, e.g. fibre optic devices, in lighting devices or systems of light guides of a generally planar shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The present invention discloses a kind of ultrathin LED backlight module, including backboard, lamp bar, reflecting paper, light guide plate, diffuser plate；The backboard includes backboard short side, backboard long side, and backboard short side inner surface is provided with lamp bar；It is provided with reflecting paper in backboard long side, is placed with light guide plate above reflecting paper, light guide plate upper surface is placed with diffuser plate；The lamp bar includes PCB circuit board, fluorescent adhesive layer, wiring pad, LED chip, and the shape of PCB circuit board is strip, and PCB circuit board one end upper surface is provided with wiring pad, and four wiring pads equidistantly arrange；PCB circuit board upper surface is provided with chip groove, and chip groove is rectangular channel；PCB circuit board upper surface in chip groove is provided with LED chip, and LED chip is equidistantly arranged along PCB circuit board；Fluorescent adhesive layer is filled in chip groove, fluorescent adhesive layer is covered in LED chip.The present invention has the characteristics that speed of production is fast, product yield is high, ultra-thin, heat-sinking capability is strong, long lifespan.
Description
Technical field
The present invention relates to a kind of ultrathin LED backlight modules, especially a kind of with speed of production is fast, product yield is high, super
Thin, heat-sinking capability is strong, long lifespan ultrathin LED backlight module.
Background technology
In recent years, LED (Light Emitting Diode, light emitting diode) is because its is pollution-free, color rendering is good, energy saving etc.
Advantage is widely used in lighting area, under the application field that LCD TV, laptop computer displays etc. show equipment,
LED also gradually instead of CCFL (Cold Cathode Fluorescent Lamp, Cold Cathode Fluorescent fluorescent tube), becomes mainstream
Back light.
With the development of backlight industry, existing lamp bar is welded on pcb board with tin cream by the LED after encapsulation, this
Kind of method comparative maturity, but process is too many, needs through holder come fixed wafer, and such method light emitting region has
Limit, needs to make light emitting region increase by many LED, while heat-sinking capability is weaker, reliability is relatively low.
Invention content
The purpose of the present invention is to provide one kind with speed of production is fast, product yield is high, ultra-thin, heat-sinking capability is strong, the longevity
Order long ultrathin LED backlight module.
The purpose of the present invention can be achieved through the following technical solutions：
A kind of ultrathin LED backlight module, including backboard, lamp bar, reflecting paper, light guide plate, diffuser plate；
The shape of the backboard is L-type, and backboard includes backboard short side, backboard long side, and backboard short side is perpendicular to backboard long side；
Backboard short side inner surface is provided with lamp bar；It is provided with reflecting paper in backboard long side, light guide plate is placed with above reflecting paper, it is guide-lighting
Plate upper surface is placed with diffuser plate；
The lamp bar includes PCB circuit board, fluorescent adhesive layer, wiring pad, LED chip, and the shape of PCB circuit board is strip
Shape, PCB circuit board one end upper surface are provided with wiring pad, and four wiring pads equidistantly arrange；PCB circuit board upper surface is set
It is equipped with chip groove, chip groove is rectangular channel；PCB circuit board upper surface in chip groove is provided with LED chip, LED core
Piece is equidistantly arranged along PCB circuit board；Fluorescent adhesive layer is filled in chip groove, fluorescent adhesive layer is covered in LED chip；
The PCB circuit board upper surface of the chip bottom portion of groove is provided with board pads, board pads and LED chip
The chip bonding pad of bottom coordinates, and LED chip is mounted on PCB circuits by chip bonding pad, board pads welding or eutectic mode
On plate；
Contain chip circuit in the PCB circuit board, chip circuit one end is connected on wiring pad, and chip circuit is another
End is by being connected in series or in parallel in board pads；
The material of the PCB circuit board is one kind in glass-fiber-plate, aluminum substrate；
The fluorescent adhesive layer is mixed by glue, fluorescent powder；The material of glue be epoxy resin, organic silica gel class,
One kind in polyurethanes；Fluorescent powder is one or more combinations in red fluorescence powder, green emitting phosphor, yellow fluorescent powder；
The material of fluorescent powder is one in YAG powder, silicate, nitride phosphor, KSF fluorescent powders, β-SiAlON, quantum dot fluorescence powder
Kind or multiple combinations；
The light guide plate lower surface is provided with site, and site is that semi-cylindrical hill, circular pit, annular protrusion or bar shaped are convex
One or more combinations of point；
The site is along one kind that the arrangement mode of light guide plate lower surface is in linear array, arcuate array, random number arrangement.
The present invention provides a kind of ultrathin LED backlight modules, with speed of production is fast, product yield is high, ultra-thin, heat radiation energy
The characteristics of power is strong, long lifespan.
Description of the drawings
In order to facilitate the understanding of those skilled in the art, the present invention will be further described below with reference to the drawings.
Fig. 1 is a kind of structural schematic diagram of ultrathin LED backlight module of the present invention；
Fig. 2 is a kind of lamp bar structural schematic diagram of ultrathin LED backlight module of the present invention；
Fig. 3 is a kind of lamp bar structural schematic diagram of ultrathin LED backlight module of the present invention.
Specific implementation mode
The purpose of the present invention can be achieved through the following technical solutions：
A kind of ultrathin LED backlight module, referring to Fig. 1-3, including backboard 1, lamp bar 2, reflecting paper 3, light guide plate 4, diffuser plate
5；
The shape of the backboard 1 be L-type, backboard 1 include backboard short side 11, backboard long side 12, backboard short side 11 perpendicular to
Backboard long side 12；11 inner surface of backboard short side is provided with lamp bar 2；Reflecting paper 3 is provided in backboard long side 12, in reflecting paper 3
Side is placed with light guide plate 4, and 4 upper surface of light guide plate is placed with diffuser plate 5；
The lamp bar 2 includes PCB circuit board 21, fluorescent adhesive layer 22, wiring pad 23, LED chip 24, PCB circuit board 21
Shape be strip, 21 one end upper surface of PCB circuit board is provided with wiring pad 23, and four wiring pads 23 are equidistantly arranged
Row；21 upper surface of PCB circuit board is provided with chip groove 211, and chip groove 211 is rectangular channel；PCB in chip groove 211
21 upper surface of circuit board is provided with LED chip 24, and LED chip 24 is equidistantly arranged along PCB circuit board 21；In chip groove 211
Filled with fluorescent adhesive layer 22, fluorescent adhesive layer 22 is covered in LED chip 24；
21 upper surface of PCB circuit board of 211 bottom of chip groove is provided with board pads, board pads with
The chip bonding pad of 24 bottom of LED chip coordinates, and LED chip 24 passes through chip bonding pad, board pads welding or eutectic mode, peace
In PCB circuit board 21；
Contain chip circuit in the PCB circuit board 21, chip circuit one end is connected on wiring pad 23, chip circuit
The other end is by being connected in series or in parallel in board pads；Wiring pad 23 is wired on power supply, and power supply will
Electric energy is transmitted to through board pads, chip bonding pad in LED chip 24 by conducting wire, wiring pad 23, chip circuit, control
The Current Voltage of LED chip 24；
The material of the PCB circuit board 21 is one kind in glass-fiber-plate, aluminum substrate；
The fluorescent adhesive layer 22 is mixed by glue, fluorescent powder；The material of glue is epoxy resin, organic silica gel
One kind in class, polyurethanes；Fluorescent powder is one or more groups in red fluorescence powder, green emitting phosphor, yellow fluorescent powder
It closes；The material of fluorescent powder is in YAG powder, silicate, nitride phosphor, KSF fluorescent powders, β-SiAlON, quantum dot fluorescence powder
One or more combinations；
4 lower surface of the light guide plate is provided with site 41, site 41 be semi-cylindrical hill, circular pit, annular protrusion or
One or more combinations of bar shaped salient point；
One during arrangement mode of the site 41 along 4 lower surface of light guide plate is linear array, arcuate array, random number arrange
Kind.
The operation principle of the present invention：
The present invention in 21 upper surface of PCB circuit board by being provided with chip groove 211, the PCB electricity of 211 bottom of chip groove
Plate 21 upper surface in road is provided with board pads, and board pads and the chip bonding pad of 24 bottom of LED chip coordinate, LED chip
24 are mounted on by welding or eutectic on chip bonding pad；Fluorescent glue is filled into chip groove 211 again, so that fluorescence is solidified into glimmering
Optical cement layer 22；
Traditional lamp bar is that LED chip is mounted in holder, forms LED lamp bead；Again by LED lamp bead bottom land and PCB
The pad solder of 21 upper surface of circuit board；Method in through the invention, gives up holder, is arranged in 21 upper surface of PCB circuit board
The chip groove 211 for accommodating LED chip 24, reduces the addition of holder, effectively reduces the thickness and width of lamp bar, realizes ultra-thin
LED backlight module；
Addition and the LED chip 24 for reducing holder are rack-mount, and holder is mounted on the mistake in PCB circuit board 21 again
Journey promotes the speed of production and yield of the backlight module；
In addition, LED chip 24 is directly installed in PCB circuit board 21, by the LED chip and holder of traditional lamp bar structure
Between, the heat transfer process between internal stent, holder and PCB circuit board, be reduced between LED chip and PCB circuit board
Heat transfer process effectively reduces hot journey, promotes the heat-sinking capability of lamp bar, promotes the service life of the backlight module.
The present invention provides a kind of ultrathin LED backlight modules, with speed of production is fast, product yield is high, ultra-thin, heat radiation energy
The characteristics of power is strong, long lifespan.
The present invention in PCB circuit board upper surface by being provided with chip groove, the PCB circuit board upper table of chip bottom portion of groove
Face is provided with board pads, and board pads and the chip bonding pad of LED chip bottom coordinate, and LED chip is by welding or altogether
Crystalline substance is mounted on chip bonding pad；Fluorescent glue is filled into chip groove again, fluorescence is made to be solidified into fluorescent adhesive layer；
Traditional lamp bar is that LED chip is mounted in holder, forms LED lamp bead；Again by LED lamp bead bottom land and PCB
The pad solder of circuit board upper surface；Method in through the invention, gives up holder, is arranged in PCB circuit board upper surface and accommodates
The chip groove of LED chip, reduces the addition of holder, effectively reduces the thickness and width of lamp bar, realizes ultrathin LED backlight mould
Group；
Addition and the LED chip for reducing holder are rack-mount, and holder is mounted on the process in PCB circuit board again, carries
Rise the speed of production and yield of the backlight module；
In addition, LED chip is directly installed in PCB circuit board, by the LED chip of traditional lamp bar structure and holder it
Between, the heat transfer process between internal stent, holder and PCB circuit board, the heat being reduced between LED chip and PCB circuit board
Conductive process effectively reduces hot journey, promotes the heat-sinking capability of lamp bar, promotes the service life of the backlight module.
Above content is only to structure of the invention example and explanation, affiliated those skilled in the art couple
Described specific embodiment does various modifications or additions or substitutes by a similar method, without departing from invention
Structure or beyond the scope defined by this claim, is within the scope of protection of the invention.
Claims (8)
1. a kind of ultrathin LED backlight module, including backboard (1), lamp bar (2), reflecting paper (3), light guide plate (4), diffuser plate (5),
It is characterized in that：
The shape of the backboard (1) is L-type, and backboard (1) includes backboard short side (11), backboard long side (12), backboard short side (11)
Perpendicular to backboard long side (12)；Backboard short side (11) inner surface is provided with lamp bar (2)；Backboard long side is provided with reflection on (12)
Paper (3), reflecting paper (3) top are placed with light guide plate (4), and light guide plate (4) upper surface is placed with diffuser plate (5).
2. a kind of ultrathin LED backlight module according to claim 1, which is characterized in that the lamp bar (2) includes PCB electricity
The shape of road plate (21), fluorescent adhesive layer (22), wiring pad (23), LED chip (24), PCB circuit board (21) is strip,
PCB circuit board (21) one end upper surface is provided with wiring pad (23), and four wiring pads (23) equidistantly arrange；PCB circuits
Plate (21) upper surface is provided with chip groove (211), and chip groove (211) is rectangular channel；PCB electricity in chip groove (211)
Road plate (21) upper surface is provided with LED chip (24), and LED chip (24) is equidistantly arranged along PCB circuit board (21)；Chip groove
(211) fluorescent adhesive layer (22) is filled in, fluorescent adhesive layer (22) is covered in LED chip (24).
3. a kind of ultrathin LED backlight module according to claim 2, which is characterized in that chip groove (211) bottom
PCB circuit board (21) upper surface be provided with board pads, board pads and the chip bonding pad of LED chip (24) bottom are matched
It closes, LED chip (24) is mounted on by chip bonding pad, board pads welding or eutectic mode in PCB circuit board (21).
4. a kind of ultrathin LED backlight module according to claim 2, which is characterized in that the PCB circuit board (21) includes
There are chip circuit, chip circuit one end to be connected on wiring pad (23), the chip circuit other end is by being connected in series or in parallel
Onto board pads.
5. a kind of ultrathin LED backlight module according to claim 2, which is characterized in that the material of the PCB circuit board (21)
Matter is one kind in glass-fiber-plate, aluminum substrate.
6. a kind of ultrathin LED backlight module according to claim 2, which is characterized in that the fluorescent adhesive layer (22) is by glue
Water, fluorescent powder are mixed；The material of glue is one kind in epoxy resin, organic silica gel class, polyurethanes；Fluorescent powder is
One or more combinations in red fluorescence powder, green emitting phosphor, yellow fluorescent powder；The material of fluorescent powder is YAG powder, silicic acid
One or more combinations in salt, nitride phosphor, KSF fluorescent powders, β-SiAlON, quantum dot fluorescence powder.
7. a kind of ultrathin LED backlight module according to claim 1, which is characterized in that light guide plate (4) lower surface is set
Be equipped with site (41), site (41) be semi-cylindrical hill, one or more groups of circular pit, annular protrusion or bar shaped salient point
It closes.
8. a kind of ultrathin LED backlight module according to claim 7, which is characterized in that the site (41) is along light guide plate
(4) arrangement mode of lower surface is one kind in linear array, arcuate array, random number arrangement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810772187.5A CN108799945A (en) | 2018-07-13 | 2018-07-13 | A kind of ultrathin LED backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810772187.5A CN108799945A (en) | 2018-07-13 | 2018-07-13 | A kind of ultrathin LED backlight module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108799945A true CN108799945A (en) | 2018-11-13 |
Family
ID=64076234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810772187.5A Pending CN108799945A (en) | 2018-07-13 | 2018-07-13 | A kind of ultrathin LED backlight module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108799945A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114429755A (en) * | 2020-10-15 | 2022-05-03 | 联咏科技股份有限公司 | LED backlight driver and LED display driver |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201672376U (en) * | 2010-04-19 | 2010-12-15 | 深圳市劲升迪龙科技发展有限公司 | LED backlight light bar encapsulated in chip-on-board way |
| CN203288590U (en) * | 2013-04-18 | 2013-11-13 | 深圳市聚飞光电股份有限公司 | LED light bar |
| CN103939810A (en) * | 2014-05-12 | 2014-07-23 | 苏州东山精密制造股份有限公司 | Backlight module and manufacturing technology thereof |
| CN206386707U (en) * | 2016-12-15 | 2017-08-08 | 惠州市华瑞光源科技有限公司 | LED/light source module |
| WO2018059599A1 (en) * | 2016-09-30 | 2018-04-05 | 深圳市玲涛光电科技有限公司 | Strip-shaped light source, manufacturing method therefor, and electronic device |
| CN107884869A (en) * | 2017-11-28 | 2018-04-06 | 合肥泰沃达智能装备有限公司 | A kind of backlight module of light leakage light guide plate |
-
2018
- 2018-07-13 CN CN201810772187.5A patent/CN108799945A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201672376U (en) * | 2010-04-19 | 2010-12-15 | 深圳市劲升迪龙科技发展有限公司 | LED backlight light bar encapsulated in chip-on-board way |
| CN203288590U (en) * | 2013-04-18 | 2013-11-13 | 深圳市聚飞光电股份有限公司 | LED light bar |
| CN103939810A (en) * | 2014-05-12 | 2014-07-23 | 苏州东山精密制造股份有限公司 | Backlight module and manufacturing technology thereof |
| WO2018059599A1 (en) * | 2016-09-30 | 2018-04-05 | 深圳市玲涛光电科技有限公司 | Strip-shaped light source, manufacturing method therefor, and electronic device |
| CN206386707U (en) * | 2016-12-15 | 2017-08-08 | 惠州市华瑞光源科技有限公司 | LED/light source module |
| CN107884869A (en) * | 2017-11-28 | 2018-04-06 | 合肥泰沃达智能装备有限公司 | A kind of backlight module of light leakage light guide plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114429755A (en) * | 2020-10-15 | 2022-05-03 | 联咏科技股份有限公司 | LED backlight driver and LED display driver |
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