CN201672376U - LED backlight light bar encapsulated in chip-on-board way - Google Patents
LED backlight light bar encapsulated in chip-on-board way Download PDFInfo
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- CN201672376U CN201672376U CN2010201630458U CN201020163045U CN201672376U CN 201672376 U CN201672376 U CN 201672376U CN 2010201630458 U CN2010201630458 U CN 2010201630458U CN 201020163045 U CN201020163045 U CN 201020163045U CN 201672376 U CN201672376 U CN 201672376U
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- graphite substrate
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- led backlight
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Abstract
The utility model discloses an LED backlight light bar encapsulated in a chip-on-board way, which comprises a graphite substrate and LED chips encapsulated on the graphite substrate in a chip-on-board way, wherein the surface of the graphite substrate is provided with a printed circuit, the LED chips are fixed on the graphite substrate by a chip bonding pad in an insulating way and connected with a pad on the printed circuit fixed on the surface of the graphite substrate by a lead. The LED backlight light bar encapsulated in a chip-on-board way realizes the direct arrangement of a plurality of LED chips on the graphite substrate with high heat conductivity, solves the problems of heat conduction and radiation, lightens the product mass and can prolong the service life of a backlight effectively.
Description
Technical field
The utility model relates to a kind of LED-backlit source lamp bar, relates in particular to a kind of LED-backlit source lamp bar of the COB of employing mode.
Background technology
The large scale TV will use a large amount of LED elements, and therefore heat radiation is the comparison stubborn problem.With the most popular current large scale LED-TV module backlight, the LED-backlit source input power of 40 inches and 60 inches is respectively 470W and 550W, with wherein 80% change into heat, required heat dissipation capacity is about about 360W and 440W.
Tradition LED power is little, heat dissipation problem is not serious, as long as the Copper Foil printed circuit board (PCB) that the general electronics of utilization is used promptly is enough to deal with, but along with high-capacity LED is more and more in vogue, this plate has been not enough to deal with radiating requirements, therefore needs printed circuit board (PCB) to be attached on the metallic plate to improve its heat-transfer path again.
Also have a kind of way directly directly to make insulating barrier or title dielectric layer on the aluminium base surface in addition, make circuit layer on the dielectric layer surface again, so led module can directly be bonded on lead on the circuit layer.Increase thermal impedance for avoiding because of the poor heat conduction of dielectric layer simultaneously, take perforation means sometimes, so that allow the equal backing of led module bottom directly touch metal substrate, promptly so-called chip directly sticks together, but there is the heavy problem of quality in metal substrate.
Except metal substrate, development for the substrate of directly adhering in response to high-capacity LED encapsulation and chip, selecting for use except that considering thermal diffusivity of baseplate material, also must consider thermal coefficient of expansion with the chip problem that is complementary, with thermal deformation and the reliability issues of avoiding thermal stress to cause, therefore at present both at home and abroad also at development ceramic substrate and metal composite substrate etc.These baseplate materials newly developed not only have good thermal diffusivity, and (all be complementary with led chip between 4~8ppm/K), unique shortcoming is that all the metal substrate than general is expensive for price to thermal coefficient of expansion simultaneously.
The utility model content
The technical problems to be solved in the utility model is,, thermal conductivity factor low, problem of ultra-high price heavy at the substrate quality that existing backlight is adopted provide a kind of light weight, thermal conductivity factor height, graphite substrate LED-backlit source lamp bar that cost is low.
The technical scheme that its technical problem that solves the utility model adopts is:
Construct a kind of chip on board mode encapsulated LED backlight lamp bar, wherein, comprise graphite substrate and be mounted on led chip on the described graphite substrate in the COB mode.
Chip on board mode encapsulated LED backlight lamp bar described in the utility model, wherein, described graphite substrate surface is provided with printed wiring, described led chip is fixed on the described graphite substrate by chip attach pad insulation, and is connected with pad on the printed wiring that is fixed on described graphite substrate surface by lead.
Chip on board mode encapsulated LED backlight lamp bar described in the utility model, wherein, described pad is gold, aluminium, silver, copper or alloy disc.
Chip on board mode encapsulated LED backlight lamp bar described in the utility model, wherein, described lead is gold thread, aluminum steel, silver-colored line or copper cash.
Chip on board mode encapsulated LED backlight lamp bar described in the utility model wherein, is provided with the elargol with both bondings between described led chip and the described chip attach pad.
Chip on board mode encapsulated LED backlight lamp bar described in the utility model, wherein, also comprise the framework that sticks on the graphite substrate surface, have the embedding hole of exposing on the described framework for described led chip, described chip attach pad, described pad and described lead.
Chip on board mode encapsulated LED backlight lamp bar described in the utility model, wherein, the material of described framework is metal or plastics.
Chip on board mode encapsulated LED backlight lamp bar described in the utility model, wherein, embedding has fluorescent glue in the described embedding hole.
Chip on board mode encapsulated LED backlight lamp bar described in the utility model, wherein, the thickness of described graphite substrate is 0.3mm-3mm.
Chip on board mode encapsulated LED backlight lamp bar described in the utility model, wherein, described led chip is blue led chip or the RGB-LED chip of packaging pin position at the top.
Chip on board mode encapsulated LED backlight lamp bar of the present utility model adopts the graphite substrate heat radiation, and led chip is mounted on the graphite substrate in the COB mode, well solved the substrate Heavy Weight, thermal conductivity factor is low, problem of ultra-high price, it is little to meet substrate weight, and heat conduction is good, the advantage that price is low.A plurality of led chips are directly placed on the graphite substrate with high thermal conductivity coefficient, solved heat conduction and heat dissipation problem, alleviated product weight, reduced the cost of whole high-powered LED lamp.
Chip on board mode encapsulated LED backlight lamp bar of the present utility model adopts chip attach pad, pad and conductor structure, and at described graphite substrate surface printed wiring, makes led chip can better be installed in the graphite substrate surface.Described pad and described lead can adopt multiple materials such as gold, aluminium, silver, copper according to client's needs.Be provided with the elargol with both bondings between described led chip and the described chip attach pad, it is better fixing that chip can be obtained.Described graphite substrate surface is pasted with framework and corresponding embedding hole, and receptacle material is metal or plastics, and embedding has fluorescent glue in the embedding hole, makes led chip can better install and obtain wanting the light of wave band.The thickness of described graphite substrate is 0.3mm-3mm, will influence radiating effect if graphite substrate is too thick, if too thin broken easily again, the radiating effect that 0.3mm-3mm will maximize substrate is difficult for broken simultaneously again.Described led chip is blue led chip or the RGB-LED chip of packaging pin position at the top, and convenient encapsulation can provide multiple luminous form.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the plan structure schematic diagram of a plurality of chip on board mode encapsulated LED backlight lamp bars of the utility model preferred embodiment;
Fig. 2 is the sectional structure schematic diagram of Fig. 1 of the utility model preferred embodiment along the AA cutting line.
The specific embodiment
Below in conjunction with diagram, preferred embodiment of the present utility model is described in detail.
Described chip on board mode encapsulated LED backlight lamp bar comprises graphite substrate 2, led chip 1, graphite substrate 2 surfaces are provided with printed wiring, led chip 1 is with chip on board encapsulation (chip on board, abbreviation COB) mode is mounted on the graphite substrate 2, led chip 1 is fixed on the graphite substrate 2 by chip attach pad 3 insulation, and led chip 1 is connected with pad 4 on the printed wiring that is fixed on graphite substrate 2 surfaces by lead 5.When led chip 1 was started working, because the graphite substrate 2 that is adopted has higher thermal conductivity factor, its thermal conductivity factor reached more than 400, and heat conduction is non-directional, and the heat that led chip 1 is produced can be derived by graphite substrate 2 very soon and be gone.As a plurality of led chips 1 are arranged on the graphite substrate 2, led chip 1 specification unanimity forms a line, and its watt level can be selected according to final needs.Connect by a plurality of led chips 1 are carried out certain series and parallel, can obtain having solved heat dissipation problem, alleviated weight, reduced the cost of whole LED backlight lamp bar than big power LED backlight source lamp bar.
As a preferred embodiment of the invention, graphite substrate 2 comprises substrate, graphite basic unit, insulating barrier and line layer, described substrate, graphite basic unit, insulating barrier and line layer press together successively, and insulating barrier is between graphite basic unit and line layer, and graphite basic unit is between insulating barrier and substrate.When design copper film graphite substrate 2, circuit has been arranged on graphite substrate 2 and has suffered, in concrete LED-backlit source lamp bar was made, after graphite substrate 2 designed, key was with the COB technology led chip 1 to be fixed on the graphite substrate 2 and with pad 4 to couple together.
As a preferred embodiment of the invention, pad 4 materials are gold, aluminium, silver, copper or alloy, and lead 5 also can be gold thread, aluminum steel, silver-colored line or copper cash.These all can not influence the function of high-powered LED lamp of the present utility model, and the designer can carry out optimal selection according to actual needs.
As a preferred embodiment of the invention, bond by elargol between led chip 1 and the chip attach pad 3, because elargol has good thermal diffusivity, improved the working environment of led chip 1, improved the service life and the operating efficiency of led chip 1.
As a preferred embodiment of the invention, described chip on board mode encapsulated LED backlight lamp bar also comprises framework 6, framework 6 sticks on graphite substrate 2 surfaces, have on the framework 6 for led chip 1, chip attach pad 3, the embedding hole 7 that pad 4 and lead 5 expose, be provided with the embedding layer that constitutes by fluorescent glue on the chip in embedding hole 7, and the height of embedding layer is not higher than the framework 6 that sticks on the graphite substrate 2, generally speaking, the material of framework 6 is plastics, fluorescent glue flows out when being used for preventing the stop fluorescent glue, the thickness of fluorescent glue can be adjusted as required, and the material of framework 6 also can be selected metal material according to user's needs.The light of wave band can better be installed and obtain wanting to the LED-backlit source lamp bar of this structure.
As a preferred embodiment of the invention, the thickness of graphite substrate 2 is 0.3mm-3mm, when graphite substrate 2 is 3mm, the radiating effect of graphite substrate 2 begins to occur descending, when graphite substrate 2 is 0.3mm, graphite substrate 2 beginnings are broken easily, to influence radiating effect if therefore graphite substrate 2 is too thick, if it is too thin broken easily again, when graphite substrate 2 is 1mm, can reach the best of breed of radiating effect and graphite substrate 2 firm values, can certainly do suitable adjustment according to customer requirement.
As a preferred embodiment of the invention, led chip 1 is blue led chip or the RGB-LED chip of packaging pin position at the top, and the convenient encapsulation of this structure can provide multiple luminous form.
Below by description of drawings led chip 1 connection procedure: earlier led chip 1 usefulness elargol is fixed on the graphite substrate 2, puts into the incubator baking, elargol is solidified with graphite substrate 2, pad 4; Be connected with pad 4 with lead 5 by the pin of COB technology again led chip, this lead 5 is a gold thread, can guarantee better that like this packaging pin of led chip 1 is connected with pad 4, avoid the long and relevant issues such as lead impedance brought of lead in other connection mode simultaneously; Last one deck fluorescent glue that covers on led chip 1 forms the embedding layer that highly is lower than frame, and lead 5 envelopes are wrapped.Wherein, adopt elargol that led chip 1 is fixed on the graphite substrate 2, firmly, stable and thermal diffusivity is good.
The above only is a preferred embodiment of the present utility model, not in order to restriction the utility model, all any modifications of being done in spirit of the present utility model and principle, is equal to and replaces or improvement etc., all should be included in the protection domain of the present utility model.
Claims (10)
1. a chip on board mode encapsulated LED backlight lamp bar is characterized in that, comprises graphite substrate (2) and encapsulates the led chip (1) that is mounted on the described graphite substrate (2) in the chip on board mode.
2. chip on board mode encapsulated LED backlight lamp bar according to claim 1, it is characterized in that, described graphite substrate (2) surface is provided with printed wiring, described led chip (1) is fixed on the described graphite substrate (2) by chip attach pad (3) insulation, and is connected by the pad (4) on lead (5) printed wiring surperficial with being fixed on described graphite substrate (2).
3. chip on board mode encapsulated LED backlight lamp bar according to claim 2 is characterized in that described pad (4) is gold, aluminium, silver, copper or alloy disc.
4. chip on board mode encapsulated LED backlight lamp bar according to claim 2 is characterized in that described lead (5) is gold thread, aluminum steel, silver-colored line or copper cash.
5. chip on board mode encapsulated LED backlight lamp bar according to claim 2 is characterized in that, is provided with the elargol with both bondings between described led chip (1) and the described chip attach pad (3).
6. chip on board mode encapsulated LED backlight lamp bar according to claim 2, it is characterized in that, also comprise the framework (6) that sticks on graphite substrate (2) surface, have the embedding hole (7) of exposing on the described framework (6) for described led chip (1), described chip attach pad (3), described pad (4) and described lead (5).
7. chip on board mode encapsulated LED backlight lamp bar according to claim 6 is characterized in that the material of described framework (6) is metal or plastics.
8. chip on board mode encapsulated LED backlight lamp bar according to claim 6 is characterized in that the interior embedding in described embedding hole (7) has fluorescent glue.
9. chip on board mode encapsulated LED backlight lamp bar according to claim 1 is characterized in that the thickness of described graphite substrate (2) is 0.3mm-3mm.
10. chip on board mode encapsulated LED backlight lamp bar according to claim 1 is characterized in that, described led chip (1) is blue led chip or the RGB-LED chip of packaging pin position at the top.
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CN2010201630458U CN201672376U (en) | 2010-04-19 | 2010-04-19 | LED backlight light bar encapsulated in chip-on-board way |
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CN2010201630458U CN201672376U (en) | 2010-04-19 | 2010-04-19 | LED backlight light bar encapsulated in chip-on-board way |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102628566A (en) * | 2012-03-27 | 2012-08-08 | 深圳市华星光电技术有限公司 | Backlight module, liquid crystal display device and light source of backlight module |
CN102802352A (en) * | 2012-08-22 | 2012-11-28 | 广州市鸿利光电股份有限公司 | Easy-to-be-electroplated COB (chip on board) substrate and manufacturing method thereof |
CN103322457A (en) * | 2013-06-26 | 2013-09-25 | 合肥京东方光电科技有限公司 | Light bar, backlight module and display device |
WO2014022977A1 (en) * | 2012-08-08 | 2014-02-13 | Feng Lin | Led lamp and manufacturing method therefor |
US8746947B2 (en) | 2012-03-27 | 2014-06-10 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Backlight module, LCD device and light source of backlight module |
CN106097907A (en) * | 2016-07-30 | 2016-11-09 | 深圳浩翔光电技术有限公司 | A kind of waterproof and dustproof COB lamp bar screen for LED display |
CN108050400A (en) * | 2012-12-19 | 2018-05-18 | 南安市鑫灿品牌运营有限公司 | Backlight module |
CN108799945A (en) * | 2018-07-13 | 2018-11-13 | 安徽芯瑞达科技股份有限公司 | A kind of ultrathin LED backlight module |
-
2010
- 2010-04-19 CN CN2010201630458U patent/CN201672376U/en not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102628566A (en) * | 2012-03-27 | 2012-08-08 | 深圳市华星光电技术有限公司 | Backlight module, liquid crystal display device and light source of backlight module |
US8746947B2 (en) | 2012-03-27 | 2014-06-10 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Backlight module, LCD device and light source of backlight module |
CN102628566B (en) * | 2012-03-27 | 2015-02-18 | 深圳市华星光电技术有限公司 | Backlight module, liquid crystal display device and light source of backlight module |
WO2014022977A1 (en) * | 2012-08-08 | 2014-02-13 | Feng Lin | Led lamp and manufacturing method therefor |
CN102802352A (en) * | 2012-08-22 | 2012-11-28 | 广州市鸿利光电股份有限公司 | Easy-to-be-electroplated COB (chip on board) substrate and manufacturing method thereof |
CN108050400A (en) * | 2012-12-19 | 2018-05-18 | 南安市鑫灿品牌运营有限公司 | Backlight module |
CN103322457A (en) * | 2013-06-26 | 2013-09-25 | 合肥京东方光电科技有限公司 | Light bar, backlight module and display device |
CN103322457B (en) * | 2013-06-26 | 2015-04-01 | 合肥京东方光电科技有限公司 | Light bar, backlight module and display device |
CN106097907A (en) * | 2016-07-30 | 2016-11-09 | 深圳浩翔光电技术有限公司 | A kind of waterproof and dustproof COB lamp bar screen for LED display |
CN108799945A (en) * | 2018-07-13 | 2018-11-13 | 安徽芯瑞达科技股份有限公司 | A kind of ultrathin LED backlight module |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101215 Termination date: 20160419 |
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CF01 | Termination of patent right due to non-payment of annual fee |