CN206386707U - LED/light source module - Google Patents

LED/light source module Download PDF

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Publication number
CN206386707U
CN206386707U CN201621383353.5U CN201621383353U CN206386707U CN 206386707 U CN206386707 U CN 206386707U CN 201621383353 U CN201621383353 U CN 201621383353U CN 206386707 U CN206386707 U CN 206386707U
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China
Prior art keywords
led
backboard
light source
source module
pcb board
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CN201621383353.5U
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Chinese (zh)
Inventor
张国波
庞宏亮
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Huarui photoelectric (Huizhou) Co. Ltd.
TCL Very Lighting Technology Huizhou Co Ltd
Original Assignee
Huarui Photoelectric (huizhou) Co Ltd
HUIZHOU HUARUI LIGHT SOURCE SCIENCE & TECHNOLOGY Co Ltd
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Abstract

The utility model is related to a kind of LED/light source module, and the LED/light source module includes backboard, fluorescent material diaphragm and LED light bar;Backboard is connected with fluorescent material diaphragm and backboard is formed with cavity with fluorescent material diaphragm;LED light bar is contained in cavity and is arranged on the bottom surface of backboard;LED light bar includes pcb board, LED wafer and transparent colloid;Pad LED wafer is set to be fixedly installed on pcb board and be electrically connected with pcb board by crystal-bonding adhesive on pcb board;Transparent colloid is fixed on pcb board and coats LED wafer.Above-mentioned LED backlight module, it is no longer necessary to use package support, substitutes the light scattering that lens send LED wafer so that process flow is relatively easy, production cost is relatively low, while improving production efficiency by transparent colloid;In addition, the heat that LED wafer is produced is diffused in air after being directly passed to crystal-bonding adhesive, pcb board, the heat dissipation path of LED wafer is optimized, makes the radiating effect of LED/light source module more preferable.

Description

LED/light source module
Technical field
The utility model is related to LED technology field, more particularly to a kind of LED/light source module.
Background technology
LED (Light Emitting Diode, light emitting diode) have low power consumption, colour gamut is wide, saturation is adjustable and The advantage of environmental protection, uses, especially white light LEDs as light source, the backlight module of liquid crystal display is widely used in recent years In and lighting device in.Now in industry generally by by packaged white light SMD (Surface Mounted Devices, surface mount device) LED and lens pass through SMT (Surface Mount Technology, surface mounting technology) Technique is mounted on the design method on pcb board, to prepare lamp bar.A number of lamp bar is arranged on backboard at a certain distance again Row form LED matrix, other devices formation LED/light source module of then arranging in pairs or groups again.
However, in the design method, be coated in fluorescent material in LED wafer by being mixed with glue in SMD processes, it is glimmering Light powder mixed with glue it is uneven can make to produce aberration between obtained white light LEDs, need to be on LED also, in SMT processes Just cover the light homogenous diffusion for setting lens so that white light LEDs to be sent.I.e. the design method is needed by SMD processes and SMT processes, and And using the devices such as support, lens so that process is relative complex, production cost is higher, and production efficiency is relatively low.In addition, by LED Chip package is in the bracket so that heat dissipation path is complicated, and radiating effect is bad.
Utility model content
Based on this, it is necessary to which the preparation for existing LED/light source module is needed by SMD processes and SMT processes, and is made With devices such as support, lens so that process is relative complex, production cost is higher, and production efficiency is relatively low, and radiating effect is bad There is provided a kind of LED/light source module for technical problem.
A kind of LED/light source module, the LED/light source module includes backboard, fluorescent material diaphragm and LED light bar.The backboard with The fluorescent material diaphragm is connected and the backboard is formed with cavity with the fluorescent material diaphragm;The LED light bar is contained in described In cavity and it is arranged on the bottom surface of the backboard;The LED light bar includes pcb board, LED wafer and transparent colloid;The pcb board Upper setting pad, the LED wafer be fixedly installed on by crystal-bonding adhesive on the pcb board and with the pad of the pcb board It is electrically connected with;The transparent colloid is fixed on the pcb board and coats the LED wafer.
In one of the embodiments, the surface of the LED wafer is provided with positive pole and negative pole, and the pad includes positive pole Pad and negative terminal pad, the crystal-bonding adhesive are insulating cement, and the insulating cement part is fixedly installed on the positive terminal pad and described In negative terminal pad, the LED wafer is fixedly installed on the insulating cement, and the positive pole and negative pole of the LED wafer pass through respectively Conductive material is connected with the positive terminal pad and the negative terminal pad.
In one of the embodiments, the bottom of the LED wafer is provided with positive pole and negative pole, and the pad includes positive pole Pad and negative terminal pad, the crystal-bonding adhesive are conducting resinl, and the positive pole and negative pole of the LED wafer are solid by the conducting resinl respectively Surely it is arranged in the positive terminal pad and the negative terminal pad.
In one of the embodiments, the remote PCB of transparent colloid surface indentation is set.
In one of the embodiments, the remote PCB of transparent colloid rat is set.
In one of the embodiments, the fluorescent material diaphragm includes fluorescent powder grain and transparent base, the fluorescent material Particle is arranged on the transparent substrate surface, and the backboard is connected with the transparent base.
In one of the embodiments, the fluorescent powder grain is arranged on surface of the transparent base away from the backboard And/or the transparent base is close to the surface of the backboard.
In one of the embodiments, the fluorescent material diaphragm includes fluorescent powder grain and transparent base, the fluorescent material Particle scattering device is in the transparent base, and the backboard is connected with the transparent base.
In one of the embodiments, the quantity of the LED light bar is multiple, and multiple LED light bars, which are spaced, to be set Put in the backboard bottom surface.
In one of the embodiments, the LED/light source module also includes reflector plate, diffuser plate and blooming piece;It is described Reflector plate is contained in the cavity and is arranged on the pcb board, and the transparent colloid wears the reflector plate, the expansion Fall apart and be arranged on the fluorescent material diaphragm in the one side in the cavity, the blooming piece is arranged on the fluorescent powder membrane Piece is located in the one side outside the cavity.
Above-mentioned LED backlight module, by the way that LED wafer is directly produced on pcb board, it is no longer necessary to use package support, Transparent colloid is substituted into the light scattering that lens send LED wafer, and manufacturing process no longer needs SMD processes only in SMT processes It is middle to complete so that process flow is relatively easy, production cost is relatively low, while improving production efficiency;In addition, LED wafer is straight Connect and be welded on pcb board, the heat for producing LED wafer is diffused in air after being directly passed to crystal-bonding adhesive, pcb board, excellent The heat dissipation path of LED wafer is changed, has made the radiating effect of LED/light source module more preferable.
Brief description of the drawings
Fig. 1 is the structural representation of LED/light source module in one embodiment;
Fig. 2 is the enlarged drawing of a-quadrant in Fig. 1;
Fig. 3 is the top view of LED light bar in one embodiment;
The matrix schematic diagram that Fig. 4 is arranged in for some LED light bars in one embodiment;
Fig. 5 is the structural representation of LED/light source module in one embodiment;
Fig. 6 A be one embodiment in LED light bar side view;
Fig. 6 B be one embodiment in LED light bar side view.
Embodiment
To enable above-mentioned purpose of the present utility model, feature and advantage more obvious understandable, below in conjunction with the accompanying drawings to this The embodiment of utility model is described in detail.Elaborate many details in order to abundant in the following description Understand the utility model.But the utility model can be implemented with being much different from other manner described here, this area Technical staff can do similar improvement in the case of without prejudice to the utility model intension, therefore the utility model is not by following public affairs The limitation for the specific embodiment opened.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that indicating or implying relative importance Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or Implicitly include at least one this feature.In description of the present utility model, " multiple " are meant that at least two, such as two It is individual, three etc., unless otherwise specifically defined.
For example, a kind of LED/light source module, the LED/light source module includes backboard, fluorescent material diaphragm and LED light bar.Backboard with Fluorescent material diaphragm is connected and backboard is formed with cavity with fluorescent material diaphragm;LED light bar is contained in cavity and is arranged on backboard Bottom surface;LED light bar includes pcb board, LED wafer and transparent colloid;Pad is set on pcb board, and LED wafer is fixed by crystal-bonding adhesive It is arranged on pcb board and is electrically connected with the pad of pcb board;Transparent colloid is fixed on pcb board and coats LED wafer.
Refer to Fig. 1, Fig. 2 and Fig. 3, for example, a kind of LED/light source module 10 include backboard 130, fluorescent material diaphragm 120 and LED light bar 110.Backboard 130 is connected with fluorescent material diaphragm 120 and backboard 130 is formed with cavity, LED with fluorescent material diaphragm 120 Bar 110 is contained in cavity and is arranged on the bottom surface of backboard 130.LED light bar 110 include pcb board 111, LED wafer 112 and thoroughly Gelatin body 114;Pad 1111 is set on pcb board 111, and crystal-bonding adhesive 113 is fixedly installed on pad 1111, and LED wafer 112 is fixed It is arranged on crystal-bonding adhesive 113, i.e., LED wafer 110 is fixedly installed on the pcb board 111 by crystal-bonding adhesive 113;LED wafer 112 are electrically connected with the pad 1111 of pcb board 111;Transparent colloid 114 is fixed on pcb board 111 and coats LED wafer 112. For example, referring to Fig. 1, backboard be inner hollow truncated cone-shaped, or, backboard has the section of isosceles trapezoid, and backboard is larger Bottom surface it is vacant, fluorescent material diaphragm is connected to the larger bottom surface of backboard, and backboard is formed with cavity with fluorescent material diaphragm;LED light bar It is contained in cavity and is arranged on the less bottom surface of backboard.And for example, backboard is the bowl-type of inner hollow;And for example, backboard includes bottom Plate and side plate, side plate are set around the periphery of bottom plate, and side plate encloses the structure to form inner hollow with bottom plate, and fluorescent material diaphragm connects Side plate is connected to, fluorescent material diaphragm, side plate and bottom plate have been collectively forming cavity, and LED light bar is contained in cavity and is arranged on bottom plate On.
Above-mentioned LED backlight module, by the way that LED wafer is directly produced on pcb board, it is no longer necessary to use package support, Transparent colloid is substituted into the light scattering that lens send LED wafer, and manufacturing process no longer needs SMD processes only in SMT processes It is middle to complete so that process flow is relatively easy, production cost is relatively low, while improving production efficiency;In addition, LED wafer is straight Connect and be welded on pcb board, the heat for producing LED wafer is diffused in air after being directly passed to crystal-bonding adhesive, pcb board, excellent The heat dissipation path of LED wafer is changed, has made the radiating effect of LED/light source module more preferable.
For example, transparent colloid is solidify to form by epoxide-resin glue or silica gel.For example, epoxide-resin glue or silica gel pass through heating The mode of solidification is molded the transparent colloid to form given configuration by pressing mold.So, by transparent adhesive tape by solidification by way of The transparent colloid for forming given configuration can be used as astigmatism device, it is not necessary to reuse other astigmatism device, for example, lens, The light that can send LED wafer is scattered out by transparent colloid.
For example, LED wafer is blue light chip.For example, LED wafer is formal dress chip.For example, the surface of LED wafer is set There are positive pole and negative pole, pad includes positive terminal pad and negative terminal pad, and crystal-bonding adhesive is insulating cement, and insulating cement part is fixedly installed on just On pole pad and negative terminal pad, LED wafer is fixedly installed on insulating cement, and the positive pole and negative pole of LED wafer pass through conduction respectively Material is connected with positive terminal pad and negative terminal pad, so that LED wafer and pcb board are electrically connected with.So, crystal-bonding adhesive is insulating cement, LED wafer bottom and pads insulated are separated by insulating cement, then LED wafer is made by the positive pole and negative pole on LED wafer surface It is electrically connected with pad, production technology relative maturity, manufacture difficulty is smaller.For example, insulating cement is silica gel.
For example, LED wafer is flip chip.For example, the bottom of LED wafer is provided with positive pole and negative pole, pad is included just Pole pad and negative terminal pad, crystal-bonding adhesive are conducting resinl, and the positive pole and negative pole of LED wafer are fixedly installed on just by conducting resinl respectively On pole pad and negative terminal pad, and the positive pole and negative pole mutually insulated of LED wafer are set, so that LED wafer and pcb board electrically connect Connect.So, LED wafer is electrically connected with pad by the positive pole and negative pole of LED wafer bottom, improve LED wafer and light When heat-sinking capability.For example, conducting resinl is elargol or tin cream or scaling powder.
For example, fluorescent material diaphragm includes fluorescent powder grain and transparent base, fluorescent powder grain is arranged on transparent substrate surface, Backboard is connected with transparent base.Leaned on for example, fluorescent powder grain is arranged on surface and/or transparent base of the transparent base away from backboard The surface of nearly backboard.For example, fluorescent powder grain scattering device is in transparent base.For example, fluorescent powder grain part is arranged on Bright substrate surface, part scattering device is in transparent base.For example, transparent base is organic transparent material, send LED wafer Light project by fluorescent powder grain in excitated fluorescent powder diaphragm during fluorescent material diaphragm formation white light and from transparent base. For example, organic transparent material is polyethylene.For example, organic transparent material is makrolon.For example, when fluorescent powder grain needs to set In transparent substrate surface, fluorescent powder grain can be arranged on by transparent substrate surface by spin coating mode.For example, working as fluorescent material When particle needs scattering device in transparent base, can mix fluorescent powder grain in proportion with transparent material makes fluorescent powder grain It is dispersed in transparent material, and the transparent material that inner dispersion is provided with fluorescent powder grain is solidified into the saturating of tabular by solidification Bright base material.
For example, the LED/light source module with different performance parameter is produced using needs according to LED/light source module, The mixture of a kind of fluorescent material or a variety of fluorescent material is can select in the selection of fluorescent material.For example, fluorescent material can be yellow fluorescence Powder.For example, fluorescent material can be red fluorescence powder.For example, fluorescent material can be green emitting phosphor.For example, fluorescent material can be The mixture mixed by a certain percentage for any two or three between yellow fluorescent powder, red fluorescence powder and green emitting phosphor. For example, fluorescent material can be red quantum dot and the mixture of green quantum dot.The different application correspondence of different LED/light source modules Fluorescent material matched combined, as shown in table 1:
Table 1
For example, the quantity that pad is set on pcb board is multiple, multiple LED wafers are set correspondingly by crystal-bonding adhesive On multiple pads.So, by setting multiple LED wafers to add the light emitting region of LED light bar, LED light bar is also increased Luminosity.
Referring to Fig. 4, it is the matrix schematic diagram that is arranged in of some LED light bars in one embodiment, for example, LED light bar Quantity to be multiple, multiple LED light bars, which are spaced, is arranged on backboard bottom surface.For example, LED light bar is arranged in the back of the body at a certain distance Plate bottom, forms LED matrix, sends special angle and the light of scope.
In one of the embodiments, referring to Fig. 5, it is the structural representation of LED/light source module in one embodiment. For example, LED/light source module also includes reflector plate 140, diffuser plate 150 and blooming piece 160, reflector plate 140 is contained in cavity And be arranged on pcb board 111, and transparent colloid 114 wears reflector plate 140, diffuser plate 150 is arranged on 120, fluorescent material diaphragm In in the one side in cavity, blooming piece 160 is arranged on fluorescent material diaphragm 120 in the one side outside cavity.
For example, blooming piece can be the one or more in diffusion sheet, blast piece and composite membrane.According to LED/light source mould Group brightness demand selection is, it is necessary to make brightness increase in various degree, even if luminance gain is different.LED/light source module can pass through Arrange in pairs or groups to obtain the luminance gain of demand using different blooming pieces.Different blooming piece collocation mode corresponding brightness gains, As shown in table 2:
Blooming piece collocation mode Luminance gain/%
1* diffusion sheets 110
2* diffusion sheets 130
1* blast piece+1* diffusion sheets 166
1* blast piece+2* diffusion sheets 180
2* blast piece+1* diffusion sheets 200
1* composite membranes 150
2* composite membranes 190
Table 2
In one of the embodiments, through hole is additionally provided with pcb board, through hole is located at the periphery of pad, transparent colloid tool There is corners, corners is inlayed in through-holes.So, transparent colloid is made more to be firmly fixed on pcb board.For example, through hole Quantity be four.For example, four through holes are uniformly arranged on the periphery of pad.
For example, the central point of LED wafer and the central point of transparent colloid are overlapped.For example, transparent colloid has axisymmetric shape Shape.So, the light that LED wafer is sent passes through transparent colloid homogenous diffusion to both sides.
For example, the direction that the diameter of through hole is directed away from LED wafer gradually increases.For example, through hole include first through hole and Second through hole, first through hole is arranged at one side of the pcb board close to LED wafer, and the second through hole is arranged at pcb board away from LED wafer One side, first through hole connects with the second through hole, and the diameter of first through hole is less than the diameter of the second through hole.So, it will be close to LED The via design of the part of chip makes transparent colloid inlay more securely in through-holes into the through hole of minor diameter.
Refer to Fig. 6 A, its be one embodiment in LED light bar side view.For example, the remote PCB of transparent colloid Rat is set.For example, the remote PCB of transparent colloid surface forms arch.For example, in the surface of the transparent colloid of arch Slightly it is recessed at the heart, the light that LED light bar mainly sends LED wafer by the refraction action on transparent colloid surface uniformly scatters. Projected after the refraction that the wide part that i.e. LED wafer is sent passes through transparent colloid upper surface, the path of light is shortened, reduce The loss of luminosity, increases luminous efficiency.
Refer to Fig. 6 B, its be one embodiment in LED light bar side view.For example, the remote PCB of transparent colloid Surface indentation is set.For example, the remote PCB of transparent colloid surface forms groove.LED light bar mainly passes through transparent colloid surface The reflex light that sends LED wafer uniformly scatter.The wide part that i.e. LED wafer is sent passes through transparent colloid upper surface Project, or projected after the multiple total reflection of upper surface after total reflection, add the luminous scattering angle of LED light bar, realize big Angle astigmatism.
For example, the design requirement of the corresponding LED/light source module of transparent colloid profile is different.For example, Fig. 6 A and Fig. 6 B two The corresponding pcb board face of kind different profile transparent colloid is on the distance (OD, i.e. light mixing distance) of diffuser plate bottom, same pcb board Two LED of correspondence position on horizontal spacing (Px, i.e. LED wafer spacing), two adjacent pcb boards between two LED wafers Longitudinal pitch (Py, i.e. LED stripe pitch) between chip, as shown in table 3:
Table 3
A kind of preparation method of above-mentioned LED/light source module 10 presented below.The preparation method bag of the LED/light source module 10 Include:Pad is set on pcb board;LED wafer is fixedly installed on pad by crystal-bonding adhesive, and LED wafer and pad is electric Property connection;Transparent glue is molded by pressing mold and formed after solidifying in LED wafer the transparent colloid of preset profiles, complete The making of LED light bar;LED light bar is arranged on to the bottom surface of backboard;Fluorescent material diaphragm is connected with backboard makes backboard and fluorescent material Diaphragm is formed with cavity.For example, making LED wafer be fixedly installed on pad by the mode of being heating and curing LED wafer.For example, LED wafer is fixedly installed on pad to realize by SMT processes.
For example, LED wafer is the formal dress chip that surface is provided with positive pole and negative pole, pad includes positive terminal pad and negative pole is welded Disk, crystal-bonding adhesive is insulating cement, and LED wafer is fixed in positive terminal pad and negative terminal pad by insulating cement;And by LED wafer Positive pole and negative pole are connected by conductive material with positive terminal pad and negative terminal pad respectively.It is provided with just for example, LED wafer is bottom Pole and the flip chip of negative pole, pad include positive terminal pad and negative terminal pad, and crystal-bonding adhesive is conducting resinl, by the positive pole of LED wafer It is fixed on respectively by conducting resinl in positive terminal pad and negative terminal pad with negative pole.
For example, transparent colloid is injected in the mould that pressing mold is molded by the through hole set on pcb board, so that transparent colloid Filling in a mold, and forms the transparent colloid with preset profiles and forms the corners with shape of through holes, and corners It is embedded on pcb board.
For example, the transparent glue that transparent colloid is used is shadowless glue, solidifies transparent glue by the way of ultra-violet curing, obtain To the transparent colloid for being fixed on pcb board and coating LED wafer.For example, the transparent glue that uses of transparent colloid for silica gel or Epoxy resin, transparent glue is solidified using the mode of being heating and curing, and is secured on pcb board and coats the transparent adhesive tape of LED wafer Body.
Each technical characteristic of above example can be combined arbitrarily, to make description succinct, not to above-described embodiment In each technical characteristic it is all possible combination be all described, as long as however, the combination of these technical characteristics be not present lance Shield, is all considered to be the scope of this specification record.
Above example only expresses several embodiments of the present utility model, and it describes more specific and detailed, but simultaneously Therefore the limitation to utility model patent scope can not be interpreted as.It should be pointed out that for the ordinary skill people of this area For member, without departing from the concept of the premise utility, various modifications and improvements can be made, these belong to this reality With new protection domain.Therefore, the protection domain of the utility model patent should be determined by the appended claims.

Claims (10)

1. a kind of LED/light source module, it is characterised in that including:Backboard, fluorescent material diaphragm and LED light bar;
The backboard is connected with the fluorescent material diaphragm and the backboard is formed with cavity with the fluorescent material diaphragm;
The LED light bar is contained in the cavity and is arranged on the bottom surface of the backboard;
The LED light bar includes pcb board, LED wafer and transparent colloid;
Pad is set on the pcb board, the LED wafer be fixedly installed on by crystal-bonding adhesive on the pcb board and with the PCB The pad of plate is electrically connected with;
The transparent colloid is fixed on the pcb board and coats the LED wafer.
2. LED/light source module according to claim 1, it is characterised in that the surface of the LED wafer be provided with positive pole and Negative pole, the pad includes positive terminal pad and negative terminal pad, and the crystal-bonding adhesive is insulating cement, and the insulating cement part is fixedly installed In the positive terminal pad and the negative terminal pad, the LED wafer is fixedly installed on the insulating cement, the LED wafer Positive pole and negative pole be connected respectively by conductive material with the positive terminal pad and the negative terminal pad.
3. LED/light source module according to claim 1, it is characterised in that the bottom of the LED wafer be provided with positive pole and Negative pole, the pad includes positive terminal pad and negative terminal pad, and the crystal-bonding adhesive is conducting resinl, the positive pole of the LED wafer and negative Pole is fixedly installed in the positive terminal pad and the negative terminal pad by the conducting resinl respectively.
4. LED/light source module according to claim 1, it is characterised in that the remote PCB of transparent colloid table Face depression is set.
5. LED/light source module according to claim 1, it is characterised in that the remote PCB of transparent colloid table Face projection is set.
6. LED/light source module according to claim 1, it is characterised in that the fluorescent material diaphragm includes fluorescent powder grain And transparent base, the fluorescent powder grain is arranged on the transparent substrate surface, and the backboard is connected with the transparent base.
7. LED/light source module according to claim 6, it is characterised in that the fluorescent powder grain is arranged on described transparent Surface and/or the transparent base of the base material away from the backboard are close to the surface of the backboard.
8. LED/light source module according to claim 1, it is characterised in that the fluorescent material diaphragm includes fluorescent powder grain And transparent base, the fluorescent powder grain scattering device is in the transparent base, and the backboard is connected with the transparent base.
9. LED/light source module according to claim 1, it is characterised in that the quantity of the LED light bar be it is multiple, it is multiple The LED light bar, which is spaced, is arranged on the backboard bottom surface.
10. LED/light source module according to claim 1, it is characterised in that the LED/light source module also include reflector plate, Diffuser plate and blooming piece;The reflector plate is contained in the cavity and is arranged on the pcb board, and the transparent colloid The reflector plate is worn, the diffuser plate is arranged on the fluorescent material diaphragm in the one side in the cavity, the optics Diaphragm arrangement is located in the one side outside the cavity in the fluorescent material diaphragm.
CN201621383353.5U 2016-12-15 2016-12-15 LED/light source module Active CN206386707U (en)

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Application Number Priority Date Filing Date Title
CN201621383353.5U CN206386707U (en) 2016-12-15 2016-12-15 LED/light source module

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Application Number Priority Date Filing Date Title
CN201621383353.5U CN206386707U (en) 2016-12-15 2016-12-15 LED/light source module

Publications (1)

Publication Number Publication Date
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108767100A (en) * 2018-05-04 2018-11-06 惠州市华瑞光源科技有限公司 Backlight module and preparation method thereof
CN108799945A (en) * 2018-07-13 2018-11-13 安徽芯瑞达科技股份有限公司 A kind of ultrathin LED backlight module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108767100A (en) * 2018-05-04 2018-11-06 惠州市华瑞光源科技有限公司 Backlight module and preparation method thereof
CN108799945A (en) * 2018-07-13 2018-11-13 安徽芯瑞达科技股份有限公司 A kind of ultrathin LED backlight module

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Address after: 516000 No. 72 Huifeng 4th Road, Zhongkai High-tech Zone, Huizhou City, Guangdong Province (Factory Building)

Co-patentee after: Huarui photoelectric (Huizhou) Co. Ltd.

Patentee after: TCL Huarui Lighting Technology (Huizhou) Co., Ltd.

Address before: 516000 Zhongkai hi tech Development Zone 19, Huizhou, Guangdong

Co-patentee before: Huarui photoelectric (Huizhou) Co. Ltd.

Patentee before: HUIZHOU HUARUI LIGHT SOURCE SCIENCE & TECHNOLOGY CO., LTD.