CN201715318U - LED area light source - Google Patents
LED area light source Download PDFInfo
- Publication number
- CN201715318U CN201715318U CN2010202450166U CN201020245016U CN201715318U CN 201715318 U CN201715318 U CN 201715318U CN 2010202450166 U CN2010202450166 U CN 2010202450166U CN 201020245016 U CN201020245016 U CN 201020245016U CN 201715318 U CN201715318 U CN 201715318U
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- CN
- China
- Prior art keywords
- led
- led chip
- line layer
- area source
- module line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to an LED area light source, which comprises a heat conducting planar metal base plate, a modular line layer and an LED chip group that are arranged layer by layer. The modular line layer is bonded on the metal base plate through high-heat conductivity adhesive. The LED chip group comprises a plurality of LED chips that are bonded and fixed on the modular line layer with high-heat conductivity adhesive, wherein each LED chip is electronically connected with the modular line layer through a wire. A light transmitting packaging frame is arranged on the modular line layer, the LED chips are uniformly distributed at the bottom of the packaging frame, and light-transmitting sealant for sealing the LED chips is filled inside the packaging frame. The LED area light source has large light illumination area and good heat conductivity.
Description
[technical field]
The utility model relates to illuminating LED lamp, a kind of furtherly LED area source.
[background technology]
Under the background that the worry of current global energy shortage raises once again, energy savings is the important problem that we shall face future, at lighting field, the application of LED luminous product is just attracting common people's sight, LED is as a kind of novel green light source product, must be developing tendency in future, it be the novel illumination light source epoch of representative that 21st century will enter with LED, and replacing traditional glass bulb lighting sources such as incandescent lamp and fluorescent lamp with the LED solid state lamp has become the LED developing goal.Therefore, the research and development of power-type LED and industrialization will become another important directions of Future Development, and its key problem in technology is the luminous flux that improves constantly luminous efficiency and each apparatus assembly.
[utility model content]
Problem to be solved in the utility model provides the LED area source that a kind of luminous irradiation area is big, thermal conductivity is good.
The utility model is realized its purpose by following technical proposal:
A kind of LED area source, comprise successively sheet metal substrate, module line layer and led chip group that the heat conduction of arranging is used, the module line layer sticks on the metal substrate with high heat conduction viscose glue, the led chip group comprises a plurality of led chips, led chip is adhesively fixed on the module line layer with high heat conduction bonded adhesives, each led chip is electrically connected with the module line layer by lead, on the module line layer, also be provided with the encapsulation frame of printing opacity, each led chip is distributed at the bottom of the encapsulation frame frame, also is filled with the printing opacity colloid that is used for the sealing LED chip in the encapsulation frame.
A kind of as mentioned above LED area source is characterized in that described encapsulation frame is that liquid glue solidifies the transparent closed circle that forms.
A kind of as mentioned above LED area source is characterized in that each the led chip matrix form on the described led chip group is arranged.
A kind of as mentioned above LED area source is characterized in that each the led chip circular arrangement on the described led chip group.
A kind of as mentioned above LED area source is characterized in that the described metal substrate side of being sheet, and metal substrate four corners are respectively equipped with installing hole.
A kind of as mentioned above LED area source is characterized in that described lead is a gold thread.
The beneficial effects of the utility model are:
1, the module line layer sticks on the metal substrate with high heat conduction viscose glue, led chip is fixedly connected on the module line layer by bonded adhesives, each led chip is electrically connected with the module line layer by lead, on the module line layer, also be provided with the encapsulation frame of printing opacity, each led chip is distributed at the bottom of the encapsulation frame frame, in the encapsulation frame, also be filled with the printing opacity colloid that is used for the sealing LED chip, adopt this structure, because metal substrate is provided with the encapsulation frame of printing opacity, the LED lighting angle is big, and the zone of LED irradiation can be spent between 180 degree 0.
2, owing to the bonded adhesives that also is provided with high heat conduction between led chip and the module line layer, and the module line layer sticks on the metal substrate with high heat conduction viscose glue, and bonded adhesives is a highly heat-conductive material, practical safety, and radiating effect might as well.
3, because the led chip matrix form is arranged or circular arrangement, therefore, can change the uniformity consistency of light, also can choose rising angle by secondary lens according to actual needs, be convenient to optical design.
[description of drawings]
Below in conjunction with accompanying drawing the utility model is described in further detail.
Fig. 1 is the utility model front view;
Fig. 2 is the utility model cross section structure schematic diagram;
Fig. 3 is an A enlarged drawing among Fig. 2;
Fig. 4 is the utility model circuit connection structure schematic diagram.
[specific embodiment]
Below in conjunction with the accompanying drawing and the specific embodiment the utility model is described in further detail:
As Fig. 1, shown in 2 and 3, a kind of LED area source, comprise successively the sheet metal substrate 1 that the heat conduction of arranging is used, module line layer 3 and led chip group 4, the high heat conduction viscose glue 2 of module line layer 3 usefulness sticks on the metal substrate 1, led chip group 4 comprises a plurality of led chips 41, can be serial or parallel connection between each led chip 41, particular circuit configurations can design voluntarily according to actual conditions, also be provided with the bonded adhesives 8 of high heat conduction between led chip 41 and the module line layer 3, led chip 41 is fixedly connected on the module line layer 3 by bonded adhesives 8, each led chip 41 is electrically connected with module line layer 3 by lead 5, on module line layer 3, also be provided with the encapsulation frame 6 of printing opacity, each led chip 41 is distributed at the bottom of encapsulation frame 6 frames, also is filled with the printing opacity colloid 7 that is used for sealing LED chip 41 in encapsulation frame 6.
In the utility model, each led chip 41 adopts the circuit structure (as shown in Figure 4) of connecting again after the grouping side by side on the led chip group, metal substrate 1 side's of being sheet, and metal substrate 1 four corners are respectively equipped with installing hole 11.Each led chip 41 matrix form on the led chip group 4 are arranged or circular arrangement.Lead 5 is a gold thread.The transparent closed circle that encapsulation frame 6 forms for liquid glue solidifies.
Claims (6)
1. LED area source, it is characterized in that comprising successively the sheet metal substrate (1) that the heat conduction of arranging is used, module line layer (3) and led chip group (4), module line layer (3) sticks on the metal substrate (1) with high heat conduction viscose glue (2), led chip group (4) comprises a plurality of led chips (41), led chip (41) is adhesively fixed on the module line layer (3) with high heat conduction bonded adhesives (8), each led chip (41) is electrically connected with module line layer (3) by lead (5), on module line layer (3), also be provided with the encapsulation frame (6) of printing opacity, each led chip (41) is distributed at the bottom of encapsulation frame (6) frame, also is filled with the printing opacity colloid (7) that is used for sealing LED chip (41) in encapsulation frame (6).
2. according to the described a kind of LED area source of claim 1, it is characterized in that the transparent closed circle that described encapsulation frame (6) forms for liquid glue solidifies.
3. according to the described a kind of LED area source of claim 1, it is characterized in that each led chip (41) matrix form on the described led chip group (4) is arranged.
4. according to the described a kind of LED area source of claim 1, it is characterized in that each led chip (41) circular arrangement on the described led chip group (4).
5. according to the described a kind of LED area source of claim 1, it is characterized in that described metal substrate (1) is square sheet, metal substrate (1) four corner is respectively equipped with installing hole (11).
6. according to the described a kind of LED area source of claim 1, it is characterized in that described lead (5) is a gold thread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202450166U CN201715318U (en) | 2010-06-26 | 2010-06-26 | LED area light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202450166U CN201715318U (en) | 2010-06-26 | 2010-06-26 | LED area light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201715318U true CN201715318U (en) | 2011-01-19 |
Family
ID=43461320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202450166U Expired - Lifetime CN201715318U (en) | 2010-06-26 | 2010-06-26 | LED area light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201715318U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103459916A (en) * | 2011-03-25 | 2013-12-18 | 夏普株式会社 | Lighting device and light source device |
| CN103956358A (en) * | 2014-05-08 | 2014-07-30 | 中国科学院半导体研究所 | Heat dissipation structure and heat dissipation method of LED module |
| CN113448074A (en) * | 2020-03-25 | 2021-09-28 | 北京威斯顿亚太光电仪器有限公司 | Illumination light source of disposable hard tube mirror |
-
2010
- 2010-06-26 CN CN2010202450166U patent/CN201715318U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103459916A (en) * | 2011-03-25 | 2013-12-18 | 夏普株式会社 | Lighting device and light source device |
| CN104747944A (en) * | 2011-03-25 | 2015-07-01 | 夏普株式会社 | Lighting device and light source device |
| CN103956358A (en) * | 2014-05-08 | 2014-07-30 | 中国科学院半导体研究所 | Heat dissipation structure and heat dissipation method of LED module |
| CN113448074A (en) * | 2020-03-25 | 2021-09-28 | 北京威斯顿亚太光电仪器有限公司 | Illumination light source of disposable hard tube mirror |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 528400 Building No. first, Guangming North Road, No. 30, Shenghui north industrial area, Nantou Town, Zhongshan, Guangdong Patentee after: Zhongshan Shiyao Intelligent Technology Co., Ltd. Address before: 528400 No. 30 Guangming Guangming Road North Nantou Hui Industrial Zone, Zhongshan, Guangdong Patentee before: Seewill Optoelectronics Technology Co., Ltd. Address after: 528400 Building No. first, Guangming North Road, No. 30, Shenghui north industrial area, Nantou Town, Zhongshan, Guangdong Patentee after: Zhongshan Shiyao Intelligent Technology Co., Ltd. Address before: 528400 No. 30 Guangming Guangming Road North Nantou Hui Industrial Zone, Zhongshan, Guangdong Patentee before: Seewill Optoelectronics Technology Co., Ltd. |
|
| CP03 | Change of name, title or address | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110119 |
|
| CX01 | Expiry of patent term |