CN201892054U - Annular LED light source - Google Patents
Annular LED light source Download PDFInfo
- Publication number
- CN201892054U CN201892054U CN2010205415018U CN201020541501U CN201892054U CN 201892054 U CN201892054 U CN 201892054U CN 2010205415018 U CN2010205415018 U CN 2010205415018U CN 201020541501 U CN201020541501 U CN 201020541501U CN 201892054 U CN201892054 U CN 201892054U
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- CN
- China
- Prior art keywords
- encapsulation frame
- frame
- encapsulating
- light source
- inboard
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
The utility model discloses an annular LED light source, comprising LED chips, a module circuit layer and a metal substrate, wherein an outer encapsulating border and an inner encapsulating border which form an encapsulating area are mounted on the metal substrate, radiating holes are arranged in the inner encapsulating border area; the module circuit layer is fixed on the surface of the metal substrate by a high-heat-conductive adhesive layer for the module circuit layer, LED chips are uniformly arranged at the encapsulating area formed between the outer encapsulating border and the inner encapsulating border, a solid-crystal position and a bonding wire position are exposed from the module circuit layer in the encapsulating area formed between the outer encapsulating border and the inner encapsulating border, the LED chips are adhered to the solid-crystal position exposed from the module circuit layer through the high-heat-conductive adhesive, and each LED chip is electrically connected with the module circuit layer through a lead, transparent gel is filled in the encapsulating area formed between the outer encapsulating border and the inner encapsulating border. The annular LED light source has the advantages of good radiation effect, high glowing efficiency and long service life.
Description
Technical field
The utility model relates to lighting technical field, particularly a kind of annular LED light source.
Background technology
Under the background that the worry of current global energy shortage raises once again, energy savings is the important problem that we shall face future.At lighting field, the application of LED luminous product is just attracting common people's sight, LED (Light Emitting Diode) is the english abbreviation of light emitting diode, it is a kind of solid-state semiconductor devices, it can directly be converted into light to electric energy, so LED has numerous advantages such as light efficiency height, long service life, energy-saving and environmental protection, more and more widely be applied to various fields, as room lighting, outdoor lighting, backlight, medical treatment, traffic and special lighting etc.And present led light source comprises LED and wiring board, one big bottleneck of led light source is heat radiation, and the heat that led chip produces can not outwards distribute as soon as possible, and chip overheating is damaged, thereby influenced the service life of led light source, also influenced the luminous efficiency of LED when work simultaneously.
Summary of the invention
The purpose of this utility model provides a kind of annular LED light source, good heat dissipation, luminous efficiency height, long service life.
The utility model is achieved through the following technical solutions:
A kind of annular LED light source, it is characterized in that: described annular LED light source comprises led chip, module line layer and metal substrate, outside encapsulation frame and inboard encapsulation frame are installed on metal substrate, constitute a packaging area between outside encapsulation frame and the inboard encapsulation frame, in inboard encapsulation frame region, be provided with louvre, exterior lateral area at inboard encapsulation frame is provided with the bonding glue-line of high heat conduction that the module line layer is used, the bonding glue-line of high heat conduction that the module line layer is used by the module line layer is fixed on the metal substrate face, led chip evenly is arranged in the packaging area that constitutes between outside encapsulation frame and the inboard encapsulation frame, module line layer in the packaging area that constitutes between side seal rim frame and the inboard encapsulation frame exposes solid brilliant position and bonding wire position is arranged outside, led chip is bonded on the exposed solid brilliant position of module line layer by the high heat conduction bonded adhesives of chip, and each led chip is electrically connected with the module line layer by lead, be filled with the printing opacity colloid in the packaging area that constitutes between side seal rim frame and the inboard encapsulation frame outside, each led chip is arranged in the printing opacity colloid.
Described each led chip adopts the connection of the circuit structure of connecting again after the grouping side by side.
Described led chip is arranged by matrix form or circular form is arranged.
Described metal substrate is circular or square.
Described outside encapsulation frame is the metal circular frame with inboard encapsulation frame, and encapsulation frame in the outside is solidified to form a closed circle with inboard encapsulation frame, printing opacity colloid.
Described lead is a gold thread.
The utility model compared with prior art has the following advantages:
1) owing to each led chip is distributed between two encapsulation frames, also be filled with the printing opacity colloid that is used for the sealing LED chip in two encapsulation frames, adopt this structure, light was brighter around LED occurred, darker relatively the light distribution pattern of central point part is so can use on the special lighting such as mine lamp.
2) do not have any circuit of cloth in inboard encapsulation frame region, but be provided with louvre, can make the metal substrate center can pass through the aperture gaseous exchange, it is fast to make heat distribute speed, the prolongation LED lamp life-span.
3) because the medial surface of the encapsulation of the inboard on metal substrate frame is a metal, this metal covering has promptly increased the area of dissipation of lamp, increases the thermal capacity of metal substrate simultaneously.
4, owing to can be used for special lighting such as mine lamp, so opened up the application of LED lamp.
Description of drawings
Fig. 1 is the utility model annular LED light-source structure schematic diagram;
Fig. 2 is the structural representation that dissects at the A-A place of Fig. 1.
The specific embodiment
Below in conjunction with accompanying drawing the utility model annular LED light source embodiment is described further.
Shown in Fig. 1-2, the utility model annular LED light source, comprise led chip 3, module line layer 10 and metal substrate 1, outside encapsulation frame 2 and inboard encapsulation frame 5 are installed on metal substrate 1, constitute a packaging area between outside encapsulation frame 2 and the inboard encapsulation frame 5, in the zone of inboard encapsulation frame 5, be provided with louvre 6, be provided with the bonding glue-line 101 of high heat conduction of module line layer 10 usefulness in the exterior lateral area of inboard encapsulation frame 5, the bonding glue-line 101 of high heat conduction that module line layer 10 is used by the module line layer is fixed on 1 of the metal substrate, led chip 3 evenly is arranged in the packaging area that constitutes between outside encapsulation frame 2 and the inboard encapsulation frame 5, module line layer in the packaging area that constitutes between side seal rim frame 2 and the inboard encapsulation frame 5 exposes solid brilliant position 8 and bonding wire position is arranged outside, led chip 3 is bonded on the exposed solid brilliant position 8 of module line layer 10 by the high heat conduction bonded adhesives 9 of chip, and each led chip 3 is electrically connected with module line layer 10 by lead 4, be filled with printing opacity colloid 7 in the packaging area that constitutes between side seal rim frame 2 and the inboard encapsulation frame 5 outside, each led chip 3 is arranged in printing opacity colloid 7.Lead 4 is a gold thread.
In the utility model, as shown in Figure 1, led chip 3 adopts the circuit structure of connecting again after the grouping side by side, and matrix form is arranged or circular arrangement.Metal substrate 1 is round or square, and what the outside of metal substrate 1 encapsulation frame 2 outer zones were provided with the connection position 11 of positive source and negative polarity is connected position 12.Outside encapsulation frame 2 is the metal circular frame of concentric with inboard encapsulation frame 5, and outside encapsulation frame 2 is solidified to form a closed circle with inboard encapsulation frame 5, printing opacity colloid 7.
Claims (6)
1. annular LED light source, it is characterized in that: described annular LED light source comprises led chip, module line layer and metal substrate, outside encapsulation frame and inboard encapsulation frame are installed on metal substrate, constitute a packaging area between outside encapsulation frame and the inboard encapsulation frame, in inboard encapsulation frame region, be provided with louvre, exterior lateral area at inboard encapsulation frame is provided with the bonding glue-line of high heat conduction that the module line layer is used, the bonding glue-line of high heat conduction that the module line layer is used by the module line layer is fixed on the metal substrate face, led chip evenly is arranged in the packaging area that constitutes between outside encapsulation frame and the inboard encapsulation frame, module line layer in the packaging area that constitutes between side seal rim frame and the inboard encapsulation frame exposes solid brilliant position and bonding wire position is arranged outside, led chip is bonded on the exposed solid brilliant position of module line layer by the high heat conduction bonded adhesives of chip, and each led chip is electrically connected with the module line layer by lead, be filled with the printing opacity colloid in the packaging area that constitutes between side seal rim frame and the inboard encapsulation frame outside, each led chip is arranged in the printing opacity colloid.
2. annular LED light source according to claim 1 is characterized in that: described each led chip adopts the connection of the circuit structure of connecting again after the grouping side by side.
3. annular LED light source according to claim 2 is characterized in that: described led chip is arranged by matrix form or circular form is arranged.
4. according to claim 1 or 2 or 3 described annular LED light sources, it is characterized in that: described metal substrate is for circular or square.
5. annular LED light source according to claim 4 is characterized in that: described outside encapsulation frame is the metal circular frame with inboard encapsulation frame, and encapsulation frame in the outside is solidified to form a closed circle with inboard encapsulation frame, printing opacity colloid.
6. annular LED light source according to claim 5 is characterized in that: described lead is a gold thread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205415018U CN201892054U (en) | 2010-09-26 | 2010-09-26 | Annular LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205415018U CN201892054U (en) | 2010-09-26 | 2010-09-26 | Annular LED light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201892054U true CN201892054U (en) | 2011-07-06 |
Family
ID=44221528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205415018U Expired - Fee Related CN201892054U (en) | 2010-09-26 | 2010-09-26 | Annular LED light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201892054U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103644472A (en) * | 2013-12-02 | 2014-03-19 | 浙江师范大学 | LED crystal lamp |
-
2010
- 2010-09-26 CN CN2010205415018U patent/CN201892054U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103644472A (en) * | 2013-12-02 | 2014-03-19 | 浙江师范大学 | LED crystal lamp |
| CN103644472B (en) * | 2013-12-02 | 2017-01-04 | 浙江师范大学 | A kind of LED crystal lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110706 Termination date: 20150926 |
|
| EXPY | Termination of patent right or utility model |